IRFH5104TRPBF [INFINEON]

Power Field-Effect Transistor, 24A I(D), 40V, 0.0035ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, 6 X 5 MM, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, QFN-8;
IRFH5104TRPBF
型号: IRFH5104TRPBF
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, 24A I(D), 40V, 0.0035ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, 6 X 5 MM, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, QFN-8

开关 脉冲 光电二极管 晶体管
文件: 总8页 (文件大小:317K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IRFH5104PbF  
HEXFET® Power MOSFET  
VDS  
40  
V
RDS(on) max  
(@VGS = 10V)  
Qg (typical)  
3.5  
m
53  
nC  
RG (typical)  
1.4  
ID  
100  
A
(@Tc(Bottom) = 25°C)  
PQFN 5X6 mm  
Applications  
Secondary Side Synchronous Rectification  
Inverters for DC Motors  
DC-DC Brick Applications  
Boost Converters  
Features and Benefits  
Features  
Benefits  
Low RDSon (3.5m)  
Low Thermal Resistance to PCB (1.1°C/W)  
100% Rg tested  
Lower Conduction Losses  
Enables better thermal dissipation  
Increased Reliability  
Low Profile (0.9 mm)  
results in Increased Power Density  
Industry-Standard Pinout  
Multi-Vendor Compatibility  
Easier Manufacturing  
Environmentally Friendlier  
Increased Reliability  
Compatible with Existing Surface Mount Techniques  
RoHS Compliant Containing no Lead, no Bromide and no Halogen  
MSL1, Industrial Qualification  
Orderable part number  
Package Type  
Standard Pack  
Note  
Form  
Tape and Reel  
Tape and Reel  
Quantity  
4000  
1000  
IRFH5104TRPBF  
IRFH5104TR2PBF  
PQFN 5mm x 6mm  
PQFN 5mm x 6mm  
EOL notice #259  
Absolute Maximum Ratings  
Parameter  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
Max.  
40  
Units  
VDS  
V
VGS  
±20  
24  
ID @ TA = 25°C  
ID @ TA = 70°C  
ID @ TC(Bottom) = 25°C  
ID @ TC(Bottom) = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
19  
100  
86  
A
400  
3.6  
114  
Power Dissipation  
PD @TA = 25°C  
PD @ TC(Bottom) = 25°C  
W
W/°C  
°C  
Power Dissipation  
Linear Derating Factor  
0.029  
-55 to + 150  
TJ  
Operating Junction and  
Storage Temperature Range  
TSTG  
Notes  through † are on page 8  
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1
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January 6, 2014  
IRFH5104PbF  
Static @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
40 ––– –––  
––– 0.05 ––– V/°C Reference to 25°C, ID = 1mA  
Conditions  
VGS = 0V, ID = 250µA  
BVDSS  
Drain-to-Source Breakdown Voltage  
Breakdown Voltage Temp. Coefficient  
Static Drain-to-Source On-Resistance  
Gate Threshold Voltage  
V
V
∆Β  
/ T  
J
DSS  
RDS(on)  
VGS(th)  
VGS(th)  
IDSS  
–––  
2.0  
2.9  
–––  
-8.9  
–––  
–––  
–––  
3.5  
4.0  
VGS = 10V, ID = 50A  
mΩ  
V
VDS = VGS, ID = 100µA  
Gate Threshold Voltage Coefficient  
Drain-to-Source Leakage Current  
–––  
–––  
–––  
–––  
–––  
56  
––– mV/°C  
20  
µA  
V
V
V
V
V
DS = 40V, VGS = 0V  
DS = 40V, VGS = 0V, TJ = 125°C  
GS = 20V  
250  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Forward Transconductance  
Total Gate Charge  
100  
nA  
––– -100  
GS = -20V  
gfs  
Qg  
–––  
53  
–––  
80  
S
DS = 15V, ID = 50A  
–––  
–––  
–––  
–––  
Qgs1  
Qgs2  
Qgd  
Qgodr  
Qsw  
Qoss  
Pre-Vth Gate-to-Source Charge  
Post-Vth Gate-to-Source Charge  
Gate-to-Drain Charge  
10  
–––  
–––  
–––  
VDS = 20V  
VGS = 10V  
4.8  
19  
nC  
ID = 50A  
Gate Charge Overdrive  
Switch Charge (Qgs2 + Qgd)  
Output Charge  
––– 19.2 –––  
––– 23.8 –––  
See Fig.17 & 18  
–––  
22  
–––  
nC  
VDS = 16V, VGS = 0V  
RG  
td(on)  
tr  
Gate Resistance  
Turn-On Delay Time  
Rise Time  
–––  
–––  
–––  
–––  
–––  
1.4  
9.5  
15  
20  
10  
–––  
–––  
–––  
–––  
–––  
V
DD = 20V, VGS = 10V  
ID = 50A  
R =1.7  
ns  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
G
See Fig.15  
Ciss  
Coss  
Crss  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
––– 3120 –––  
V
GS = 0V  
–––  
–––  
650  
310  
–––  
–––  
VDS = 25V  
pF  
ƒ = 1.0MHz  
Avalanche Characteristics  
Parameter  
Typ.  
–––  
–––  
Max.  
120  
50  
Units  
mJ  
Single Pulse Avalanche Energy  
EAS  
IAR  
Avalanche Current  
A
Diode Characteristics  
Parameter  
Min. Typ. Max. Units  
Conditions  
IS  
D
S
Continuous Source Current  
MOSFET symbol  
–––  
–––  
–––  
–––  
100  
400  
(Body Diode)  
showing the  
integral reverse  
A
G
ISM  
Pulsed Source Current  
(Body Diode)  
p-n junction diode.  
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
Forward Turn-On Time  
–––  
–––  
–––  
–––  
31  
1.3  
47  
V
TJ = 25°C, IS = 50A, VGS = 0V  
ns TJ = 25°C, IF = 50A, VDD = 20V  
di/dt = 500A/µs  
nC  
Qrr  
ton  
130  
195  
Time is dominated by parasitic Inductance  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
–––  
Max.  
1.1  
15  
Units  
Junction-to-Case  
Junction-to-Case  
Junction-to-Ambient  
Junction-to-Ambient  
RθJC (Bottom)  
RθJC (Top)  
°C/W  
Rθ  
35  
JA  
RθJA (<10s)  
22  
2
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January 6, 2014  
IRFH5104PbF  
1000  
100  
10  
1000  
100  
10  
VGS  
10V  
VGS  
10V  
TOP  
TOP  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
4.8V  
4.5V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
4.8V  
4.5V  
BOTTOM  
BOTTOM  
1
4.5V  
60µs PULSE WIDTH  
Tj = 25°C  
60µs PULSE WIDTH  
Tj = 150°C  
4.5V  
0.1  
1
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
1000  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
1000  
1.8  
I
= 50A  
D
V
= 10V  
GS  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
100  
10  
1
T
= 150°C  
J
T
= 25°C  
J
V
= 15V  
DS  
60µs PULSE WIDTH  
0.1  
3
4
5
6
7
8
9
10  
-60 -40 -20  
0
20 40 60 80 100 120140 160  
T
J
, Junction Temperature (°C)  
V
, Gate-to-Source Voltage (V)  
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance vs. Temperature  
14.0  
100000  
10000  
1000  
V
= 0V,  
= C  
f = 1 MHZ  
GS  
I
= 50A  
D
C
C
C
+ C , C  
SHORTED  
iss  
gs  
gd  
ds  
12.0  
10.0  
8.0  
= C  
rss  
oss  
gd  
= C + C  
V
V
= 32V  
= 20V  
DS  
DS  
ds  
gd  
VDS= 8.0V  
C
iss  
C
6.0  
oss  
C
rss  
4.0  
2.0  
0.0  
100  
0
10  
20  
30  
40  
50  
60  
70  
1
10  
, Drain-to-Source Voltage (V)  
100  
Q , Total Gate Charge (nC)  
V
G
DS  
Fig 5. Typical Capacitance vs.Drain-to-Source Voltage  
Fig 6. Typical Gate Charge vs.Gate-to-Source Voltage  
3
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January 6, 2014  
IRFH5104PbF  
1000  
100  
10  
1000  
100  
10  
OPERATION IN THIS AREA  
LIMITED BY R (on)  
DS  
100µsec  
T
= 150°C  
J
1msec  
10msec  
T
= 25°C  
J
Tc = 25°C  
Tj = 150°C  
Single Pulse  
DC  
V
GS  
= 0V  
1.0  
1
0.2  
0.4  
V
0.6  
0.8  
1.0  
1.2  
1.4  
0
1
10  
, Drain-to-Source Voltage (V)  
DS  
100  
, Source-to-Drain Voltage (V)  
V
SD  
Fig 7. Typical Source-Drain Diode Forward Voltage  
Fig 8. Maximum Safe Operating Area  
150  
5.0  
Limited By Package  
125  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
100  
75  
50  
25  
0
I
I
I
I
= 100µA  
= 500µA  
= 1.0mA  
= 1.0A  
D
D
D
D
25  
50  
T
75  
100  
125  
150  
-75 -50 -25  
0
25 50 75 100 125 150  
, Case Temperature (°C)  
T
, Temperature ( °C )  
C
J
Fig 10. Threshold Voltage vs. Temperature  
Fig 9. Maximum Drain Current vs.  
Case(Bottom)Temperature  
10  
1
D = 0.50  
0.20  
0.10  
0.1  
0.05  
0.02  
0.01  
0.01  
Notes:  
SINGLE PULSE  
( THERMAL RESPONSE )  
1. Duty Factor D = t1/t2  
2. Peak Tj = P dm x Zthjc + Tc  
0.001  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
t
, Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case (Bottom)  
4
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January 6, 2014  
IRFH5104PbF  
10  
8
500  
400  
300  
200  
100  
0
I
= 50A  
I
D
D
TOP  
8.3A  
19A  
BOTTOM 50A  
6
T
T
= 125°C  
= 25°C  
J
4
2
J
0
4
6
8
10 12 14  
16 18 20  
25  
50  
75  
100  
125  
150  
Starting T , Junction Temperature (°C)  
J
V
Gate -to -Source Voltage (V)  
GS,  
Fig 13. Maximum Avalanche Energy vs. Drain Current  
Fig 12. On-Resistance vs. Gate Voltage  
V
(BR)DSS  
t
p
15V  
DRIVER  
+
L
V
DS  
D.U.T  
AS  
R
G
V
DD  
-
I
A
I
AS  
20V  
0.01  
t
p
Fig 14b. Unclamped Inductive Waveforms  
Fig 14a. Unclamped Inductive Test Circuit  
RD  
VDS  
VDS  
90%  
VGS  
D.U.T.  
RG  
+VDD  
-
10%  
VGS  
VGS  
Pulse Width ≤ 1 µs  
Duty Factor ≤ 0.1  
td(on)  
td(off)  
tr  
tf  
Fig 15a. Switching Time Test Circuit  
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Fig 15b. Switching Time Waveforms  
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IRFH5104PbF  
Driver Gate Drive  
P.W.  
P.W.  
Period  
D.U.T  
Period  
D =  
+
*
=10V  
V
GS  
ƒ
Circuit Layout Considerations  
Low Stray Inductance  
Ground Plane  
Low Leakage Inductance  
Current Transformer  
-
D.U.T. I Waveform  
SD  
+
‚
-
Reverse  
Recovery  
Current  
Body Diode Forward  
„
Current  
di/dt  
-
+
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  

V
DD  
VDD  
Re-Applied  
Voltage  
dv/dt controlled by RG  
RG  
+
-
Body Diode  
Forward Drop  
Driver same type as D.U.T.  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
Inductor Curent  
I
SD  
Ripple  
5%  
* VGS = 5V for Logic Level Devices  
Fig 16. Peak Diode Recovery dv/dt Test Circuit for N-Channel  
HEXFET® Power MOSFETs  
Id  
Vds  
Vgs  
L
VCC  
DUT  
0
Vgs(th)  
1K  
Qgs1  
Qgs2  
Qgd  
Qgodr  
Fig 18. Gate Charge Waveform  
Fig 17. Gate Charge Test Circuit  
6
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January 6, 2014  
IRFH5104PbF  
PQFN 5x6 Outline "B" Package Details  
For more information on board mounting, including footprint and stencil recommendation, please refer to application note AN-1136:  
http://www.irf.com/technical-info/appnotes/an-1136.pdf  
For more information on package inspection techniques, please refer to application note AN-1154:  
http://www.irf.com/technical-info/appnotes/an-1154.pdf  
PQFN 5x6 Outline "B" Part Marking  
INTERNATIONAL  
RECTIFIER LOGO  
DATE CODE  
PART NUMBER  
XXXX  
XYWWX  
XXXXX  
ASSEMBLY  
SITE CODE  
(Per SCOP 200-002)  
MARKING CODE  
(Per Marking Spec)  
PIN 1  
IDENTIFIER  
LOT CODE  
(Eng Mode - Min last 4 digits of EATI#)  
(Prod Mode - 4 digits of SPN code)  
Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/  
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January 6, 2014  
IRFH5104PbF  
PQFN 5x6 Outline "B" Tape and Reel  
Qualification information†  
Industrial††  
(per JEDEC JES D47F ††† guidelines )  
Qualification level  
MS L 1  
Moisture Sensitivity Level  
RoHS compliant  
PQFN 5mm x 6mm  
(per JEDEC J-ST D-020D†††  
)
Yes  
†
Qualification standards can be found at International Rectifier’s web site  
http://www.irf.com/product-info/reliability  
††  
Higher qualification ratings may be available should the user have such requirements.  
Please contact your International Rectifier sales representative for further information:  
http://www.irf.com/whoto-call/salesrep/  
††† Applicable version of JEDEC standard at the time of product release.  
Notes:  
 Repetitive rating; pulse width limited by max. junction temperature.  
‚ Starting TJ = 25°C, L = 0.098mH, RG = 25, IAS = 50A.  
ƒ Pulse width 400µs; duty cycle 2%.  
„ R is measured at TJ of approximately 90°C.  
θ
When mounted on 1 inch square 2 oz copper pad on 1.5x1.5 in. board of FR-4 material.  
† Calculated continuous current based on maximum allowable junction temperature. Package is limited to 100A by production test  
capability.  
Revision History  
Date  
Comment  
12/16/2013  
Updated ordering information to reflect the End-Of-Life (EOL) of the mini-reel option (EOL notice #259).  
Updated data sheet with the new IR corporate template.  
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA  
To contact International Rectifier, please visit http://www.irf.com/whoto-call/  
8
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Submit Datasheet Feedback  
January 6, 2014  

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