IRG7PH42U-EP [INFINEON]

INSULATED GATE BIPOLAR TRANSISTOR; 绝缘栅双极晶体管
IRG7PH42U-EP
型号: IRG7PH42U-EP
厂家: Infineon    Infineon
描述:

INSULATED GATE BIPOLAR TRANSISTOR
绝缘栅双极晶体管

晶体 晶体管 栅
文件: 总10页 (文件大小:399K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD - 96233A  
IRG7PH42UPbF  
IRG7PH42U-EP  
INSULATED GATE BIPOLAR TRANSISTOR  
Features  
• Low VCE (ON) trench IGBT technology  
C
VCES = 1200V  
IC = 60A, TC = 100°C  
TJ(max) =175°C  
• Low switching losses  
• Maximum junction temperature 175 °C  
• SquareRBSOA  
• 100% of the parts tested for ILM  
• Positive VCE (ON) temperature co-efficient  
• Tightparameterdistribution  
• Lead-Free  
G
E
V
CE(on) typ. = 1.7V  
n-channel  
Benefits  
• High efficiency in a wide range of applications  
• Suitable for a wide range of switching frequencies due to  
low VCE (ON) and low switching losses  
C
C
• Ruggedtransientperformanceforincreasedreliability  
• Excellent current sharing in parallel operation  
E
E
C
C
G
G
TO-247AD  
IRG7PH42U-EP  
TO-247AC  
IRG7PH42UPbF  
Applications  
• U.P.S  
• Welding  
• Solarinverter  
• Inductionheating  
G
Gate  
C
E
Collector  
Emitter  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VCES  
Collector-to-Emitter Voltage  
1200  
90  
V
IC @ TC = 25°C  
Continuous Collector Current (Silicon Limited)  
Continuous Collector Current (Silicon Limited)  
Nominal Current  
IC @ TC = 100°C  
60  
INOMINAL  
A
30  
ICM  
Pulse Collector Current, VGE = 15V  
Clamped Inductive Load Current, VGE = 20V  
90  
ILM  
120  
VGE  
V
Continuous Gate-to-Emitter Voltage  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction and  
±30  
385  
PD @ TC = 25°C  
W
PD @ TC = 100°C  
192  
TJ  
-55 to +175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 sec.  
Mounting Torque, 6-32 or M3 Screw  
°C  
300 (0.063 in. (1.6mm) from case)  
10 lbf·in (1.1 N·m)  
Thermal Resistance  
Parameter  
Min.  
–––  
–––  
–––  
Typ.  
–––  
0.24  
40  
Max.  
0.39  
–––  
Units  
Rθ (IGBT)  
Thermal Resistance Junction-to-Case-(each IGBT) TO-247AC  
Thermal Resistance, Case-to-Sink (flat, greased surface)  
Thermal Resistance, Junction-to-Ambient (typical socket mount)  
JC  
°C/W  
Rθ  
CS  
Rθ  
–––  
JA  
1
www.irf.com  
02/18/10  
IRG7PH42UPbF/IRG7PH42U-EP  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
Conditions  
V(BR)CES  
VGE = 0V, IC = 100µA  
Collector-to-Emitter Breakdown Voltage  
1200  
1.2  
1.7  
2.1  
2.2  
V
V(BR)CES/TJ  
VGE = 0V, IC = 1mA (25°C-150°C)  
IC = 30A, VGE = 15V, TJ = 25°C  
IC = 30A, VGE = 15V, TJ = 150°C  
IC = 30A, VGE = 15V, TJ = 175°C  
VCE = VGE, IC = 1mA  
Temperature Coeff. of Breakdown Voltage  
V/°C  
2.0  
VCE(on)  
Collector-to-Emitter Saturation Voltage  
V
VGE(th)  
VGE(th)/TJ  
gfe  
Gate Threshold Voltage  
3.0  
6.0  
V
mV/°C  
S
VCE = VGE, IC = 1mA (25°C - 175°C)  
Threshold Voltage temp. coefficient  
Forward Transconductance  
-16  
32  
VCE = 50V, IC = 30A, PW = 80µs  
VGE = 0V, VCE = 1200V  
ICES  
Collector-to-Emitter Leakage Current  
1
150  
µA  
nA  
VGE = 0V, VCE = 1200V, TJ = 175°C  
VGE = ±20V  
700  
IGES  
Gate-to-Emitter Leakage Current  
±100  
Switching Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Total Gate Charge (turn-on)  
Gate-to-Emitter Charge (turn-on)  
Gate-to-Collector Charge (turn-on)  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On delay time  
Rise time  
Min. Typ. Max. Units  
Conditions  
IC = 30A  
Qg  
157  
236  
Qge  
Qgc  
Eon  
Eoff  
Etotal  
td(on)  
tr  
VGE = 15V  
21  
32  
nC  
µJ  
ns  
VCC = 600V  
69  
104  
IC = 30A, VCC = 600V, VGE = 15V  
RG = 10, L = 200µH,TJ = 25°C  
2105 2374  
1182 1424  
3287 3798  
Energy losses include tail & diode reverse recovery  
Diode clamp the same as IRG7PH42UDPbF  
25  
32  
34  
41  
271  
86  
td(off)  
tf  
Turn-Off delay time  
Fall time  
229  
63  
Eon  
Eoff  
Etotal  
td(on)  
tr  
IC = 30A, VCC = 600V, VGE=15V  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On delay time  
Rise time  
3186  
2153  
5339  
20  
RG=10, L=200µH, TJ = 175°C  
µJ  
ns  
pF  
Energy losses include tail & diode reverse recovery  
Diode clamp the same as IRG7PH42UDPbF  
31  
td(off)  
tf  
Turn-Off delay time  
Fall time  
310  
162  
3338  
124  
75  
Cies  
Coes  
Cres  
VGE = 0V  
VCC = 30V  
f = 1.0Mhz  
IC = 120A  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
VCC = 960V, Vp =1200V  
RBSOA  
Reverse Bias Safe Operating Area  
FULL SQUARE  
Rg = 10 , VGE = +20V to 0V, TJ =175°C  
Notes:  
 VCC = 80% (VCES), VGE = 20V, L = 22µH, RG = 10Ω  
‚ Pulse width 400µs; duty cycle 2%.  
ƒ Refer to AN-1086 for guidelines for measuring V(BR)CES safely.  
„ Rθ is measured at TJ of approximately 90°C.  
Calculated continuous current based on maximum allowable junction  
temperature. Bond wire current limit is 78A. Note that current  
limitations arising from heating of the device leads may occur with  
some lead mounting arrangements.  
2
www.irf.com  
IRG7PH42UPbF/IRG7PH42U-EP  
60  
50  
40  
30  
20  
10  
0
For both:  
Duty cycle : 50%  
Tj = 150°C  
Tsink = 90°C  
Gate drive as specified  
Power Dissipation = 95W  
Square wave:  
60% of rated  
voltage  
I
Ideal diodes  
0.1  
1
10  
100  
f , Frequency ( kHz )  
Fig. 1 - Typical Load Current vs. Frequency  
(Load Current = IRMS of fundamental)  
100  
80  
60  
40  
20  
0
400  
350  
300  
250  
200  
150  
100  
50  
0
0
20 40 60 80 100 120 140 160 180  
(°C)  
25  
50  
75  
100  
(°C)  
125  
150  
175  
T
C
T
C
Fig. 2 - Maximum DC Collector Current vs.  
Fig. 3 - Power Dissipation vs. Case  
CaseTemperature  
Temperature  
1000  
1000  
100  
10µsec  
100  
10  
1
100µsec  
10  
1msec  
DC  
1
Tc = 25°C  
Tj = 175°C  
Single Pulse  
0.1  
10  
100  
1000  
10000  
1
10  
100  
(V)  
1000  
10000  
V
(V)  
V
CE  
CE  
Fig. 4 - Forward SOA  
TC = 25°C, TJ 175°C; VGE =15V  
Fig. 5 - Reverse Bias SOA  
TJ = 175°C; VGE =20V  
www.irf.com  
3
IRG7PH42UPbF/IRG7PH42U-EP  
120  
120  
100  
80  
60  
40  
20  
0
V
= 18V  
100  
80  
GE  
VGE = 15V  
VGE = 12V  
VGE = 10V  
VGE = 8.0V  
V
= 18V  
GE  
VGE = 15V  
VGE = 12V  
VGE = 10V  
VGE = 8.0V  
60  
40  
20  
0
0
2
4
6
8
10  
0
2
4
6
8
10  
V
(V)  
V
(V)  
CE  
CE  
Fig. 6 - Typ. IGBT Output Characteristics  
Fig. 7 - Typ. IGBT Output Characteristics  
TJ = -40°C; tp =20µs  
TJ = 25°C; tp = 20µs  
12  
10  
8
120  
100  
80  
I
I
I
= 15A  
= 30A  
= 60A  
CE  
CE  
CE  
60  
6
4
2
0
V
= 18V  
GE  
VGE = 15V  
VGE = 12V  
VGE = 10V  
VGE = 8.0V  
40  
20  
0
0
2
4
6
8
10  
4
8
12  
16  
20  
V
(V)  
CE  
V
(V)  
GE  
Fig. 9 - Typical VCE vs. VGE  
Fig. 8 - Typ. IGBT Output Characteristics  
TJ = -40°C  
TJ = 175°C; tp = 20µs  
12  
10  
8
12  
10  
8
I
I
I
= 15A  
= 30A  
= 60A  
I
I
I
= 15A  
CE  
CE  
CE  
CE  
CE  
CE  
= 30A  
= 60A  
6
4
2
0
6
4
2
0
4
8
12  
16  
20  
4
8
12  
16  
20  
V
(V)  
GE  
V
(V)  
GE  
Fig. 10 - Typical VCE vs. VGE  
Fig. 11 - Typical VCE vs. VGE  
TJ = 25°C  
TJ = 175°C  
4
www.irf.com  
IRG7PH42UPbF/IRG7PH42U-EP  
120  
100  
80  
60  
40  
20  
0
7000  
6000  
5000  
4000  
T
= 25°C  
J
T
= 175°C  
J
E
ON  
3000  
E
OFF  
2000  
1000  
0
0
10  
20  
30  
(A)  
40  
50  
60  
4
6
8
10  
12  
V
, Gate-to-Emitter Voltage (V)  
GE  
I
C
Fig. 12- Typ. Transfer Characteristics  
Fig. 13 - Typ. Energy Loss vs. IC  
TJ = 175°C; L = 200µH; VCE = 600V, RG = 10; VGE = 15V  
VCE = 50V; tp = 20µs  
1000  
6000  
5500  
5000  
4500  
td  
t
OFF  
100  
10  
1
E
F
ON  
4000  
E
OFF  
3500  
3000  
2500  
2000  
1500  
1000  
t
R
td  
ON  
0
25  
50  
75  
100  
0
10  
20  
30  
(A)  
40  
50  
60  
)
Rg (  
I
C
Fig. 14 - Typ. Switching Time vs. IC  
TJ = 175°C; L = 200µH; VCE = 600V, RG = 10; VGE = 15V  
Fig. 15 - Typ. Energy Loss vs. RG  
TJ = 175°C; L = 200µH; VCE = 600V, ICE = 30A; VGE = 15V  
10000  
1000  
td  
OFF  
t
F
100  
t
R
td  
ON  
10  
0
20  
40  
60  
()  
80  
100  
R
G
Fig. 16 - Typ. Switching Time vs. RG  
TJ = 175°C; L = 200µH; VCE = 600V, ICE = 30A; VGE = 15V  
www.irf.com  
5
IRG7PH42UPbF/IRG7PH42U-EP  
10000  
16  
14  
12  
10  
8
Cies  
V
V
= 600V  
= 400V  
CES  
CES  
1000  
6
100  
Coes  
4
2
Cres  
10  
0
0
100  
200  
300  
(V)  
400  
500  
600  
0
25  
50  
75 100 125 150 175  
V
CE  
Q
, Total Gate Charge (nC)  
G
Fig. 18- Typical Gate Charge vs. VGE  
ICE = 30A; L = 600µH  
Fig. 17 - Typ. Capacitance vs. VCE  
VGE= 0V; f = 1MHz  
1
D = 0.50  
0.1  
0.20  
0.10  
0.05  
0.01  
0.02  
R1  
R1  
R2  
R2  
R3  
R3  
R4  
R4  
Ri (°C/W) τi (sec)  
0.1306  
0.1752  
0.0814  
0.0031  
0.000313  
0.002056  
0.008349  
0.0431  
0.01  
τ
τ
J τJ  
τ
Cτ  
1τ1  
Ci= τi/Ri  
τ
τ
τ
2 τ2  
3τ3  
4τ4  
0.001  
SINGLE PULSE  
( THERMAL RESPONSE )  
Notes:  
1. Duty Factor D = t1/t2  
2. Peak Tj = P dm x Zthjc + Tc  
0.0001  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
t
, Rectangular Pulse Duration (sec)  
1
Fig 19. Maximum Transient Thermal Impedance, Junction-to-Case (IGBT) TO-247AC  
6
www.irf.com  
IRG7PH42UPbF/IRG7PH42U-EP  
L
L
80 V  
+
-
DUT  
VCC  
DUT  
Vclamped  
Rg  
0
1K  
Fig.C.T.1 - Gate Charge Circuit (turn-off)  
Fig.C.T.2 - RBSOA Circuit  
R = VCC  
ICM  
L
DIODE CLAMP  
DUT  
VCC  
DUT /  
DRIVER  
VCC  
Rg  
Rg  
Fig.C.T.3 - Switching Loss Circuit  
Fig.C.T.4 - Resistive Load Circuit  
C fo rce  
100K  
D1  
22K  
C sen se  
E sense  
0.0075µ  
G force  
DUT  
E force  
Fig.C.T.5 - BVCES Filter Circuit  
www.irf.com  
7
IRG7PH42UPbF/IRG7PH42U-EP  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
tf  
tr  
TEST CURRENT  
90% ICE  
90% test  
current  
5% VCE  
5% ICE  
10% test  
current  
5% VCE  
Eoff Los s  
-100  
-10  
Eon Loss  
-100  
-10  
-0.5  
0
0.5  
1
1.5  
2
9.3  
9.5  
9.7  
9.9  
10.1 10.3  
time(µs)  
time (µs)  
Fig. WF1 - Typ. Turn-off Loss Waveform  
Fig. WF2 - Typ. Turn-on Loss Waveform  
@ TJ = 175°C using Fig. CT.4  
@ TJ = 175°C using Fig. CT.4  
8
www.irf.com  
IRG7PH42UPbF/IRG7PH42U-EP  
TO-247AC Package Outline  
Dimensions are shown in millimeters (inches)  
TO-247AC Part Marking Information  
TO-247AC package is not recommended for Surface Mount Application.  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
www.irf.com  
9
IRG7PH42UPbF/IRG7PH42U-EP  
TO-247AD Package Outline  
Dimensions are shown in millimeters (inches)  
TO-247AD Part Marking Information  
TO-247AD package is not recommended for Surface Mount Application.  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
Data and specifications subject to change without notice.  
This product has been designed and qualified for Industrial market.  
Qualification Standards can be found on IR’s Web site.  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7903  
Visit us at www.irf.com for sales contact information. 02/2010  
10  
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