TLE8104E [INFINEON]

Smart Quad Channel Powertrain Switch; 智能四通道开关动力总成
TLE8104E
型号: TLE8104E
厂家: Infineon    Infineon
描述:

Smart Quad Channel Powertrain Switch
智能四通道开关动力总成

开关
文件: 总27页 (文件大小:1490K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TLE8104E  
Smart Quad Channel Powertrain Switch  
coreFLEX TLE8104E  
Data Sheet  
V1.4, 2010-04-26  
Automotive Power  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Table of Contents  
Table of Contents  
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
1
2
3
3.1  
3.2  
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
4
4.1  
4.2  
Maximum Ratings and Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
5
Electrical and Functional Description of Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Parallel Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Power Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Inductive Output Clamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Protection Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Over Load Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Over Temperature Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Reverse Polarity Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Diagnostic Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
SPI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
SPI Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Daisy Chain Capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
FAULT pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
5.1  
5.2  
5.3  
5.3.1  
5.3.2  
5.3.3  
5.3.4  
5.3.4.1  
5.3.4.2  
5.3.5  
5.4  
5.5  
5.5.1  
5.5.2  
5.5.3  
5.6  
6
SPI Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
SPI Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Example: Diagnosis Only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Example: Read Back Input and 1-bit Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Example: Echo Function of SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Example: OR Operation and Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Example: AND Operation and Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Example: All Other Command Words . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
6.1  
6.1.1  
6.1.2  
6.1.3  
6.1.4  
6.1.5  
6.1.6  
7
8
9
Application Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
Data Sheet  
2
V1.4, 2010-04-26  
Smart Quad Channel Powertrain Switch  
coreFLEX  
TLE8104E  
1
Overview  
Features  
Overload Protection  
DMOS Overtemperature protection  
Overvoltage protection  
Open load detection  
Low quiescent current mode  
Electrostatic discharge (ESD) protection  
IC Overtemperature warning  
8-Bit SPI (for diagnosis and control)  
Short to GND detection  
PG-DSO-20  
Green Product (RoHS compliant)  
AEC Qualified  
Description  
Quad Low-Side Switch in Smart Power Technology (SPT) with four open drain DMOS output stages. The  
TLE8104E is protected by embedded protection functions and designed for automotive applications. The output  
stages can be controlled directly by parallel inputs for PWM applications (e.g. gasoline port injection) or by SPI.  
The parallel inputs can be programmed to be active high or active low. Diagnosis can be read from an 8-bit SPI  
or by the external fault pin.  
Type  
Package  
Marking  
TLE8104E  
PG-DSO-20  
TLE8104E  
Data Sheet  
3
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Overview  
Table 1  
Product Summary  
Operating voltage  
Drain source voltage  
Typical On-state resistance CH 1 - 4  
at Tj = 25°C  
VS  
VDS(AZ)  
RDS(ON)  
4.5 … 5.5 V  
45 … 60 V  
320 mΩ  
Maximum On-state resistance CH 1 - 4  
at Tj = 150°C  
RDS(ON)  
650 mΩ  
Nominal load current CH 1 - 4  
Minimum current limitation CH 1 - 4  
ID  
ID (lim)  
1 A  
3 A  
VS  
OUT1  
OUT2  
OUT3  
OUT4  
IN1  
IN2  
IN3  
input control  
IN4  
PRG  
temperature  
sensor  
RESET  
reset / stand-by  
CS  
SCLK  
SI  
control,  
short circuit  
detection  
diagnostic  
and  
hardware  
SPI  
configuration  
protective  
functions  
gate  
SO  
control  
output monitor  
open load  
detection  
FAULT  
diagnosis register  
GND  
Figure 1  
Block Diagram  
Data Sheet  
4
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Terms  
2
Terms  
Figure 2 shows all terms used in this Data Sheet.  
Vbat  
IVS  
VS  
IRESET  
IFAULT  
IPRG  
IIN1  
VS  
VRESET  
VFAULT  
______  
RESET  
______  
FAULT  
PRG  
IN1  
IN2  
IN3  
IN4  
ID1  
VPRG  
V
OUT1  
IIN2  
ID2  
ID3  
ID4  
VDS1  
VDS2  
VDS3  
VDS4  
IN1  
OUT2  
OUT3  
OUT4  
IIN3  
VIN2  
IIN4  
V
IN3  
ICS  
VIN4  
VCS  
VSCLK  
VSI  
VSO  
___  
CS  
ISCLK  
ISI  
SCLK  
SI  
ISO  
SO  
GND  
IGND  
Figure 2  
Terms  
The following is valid for all electrical characteristics cables: Channel related symbols without channel number are  
valid for each channel separately (e.g. VDS specification is valid for VDS1, VDS2, VDS3 and VDS4).  
Data Sheet  
5
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Pin Configuration  
3
Pin Configuration  
3.1  
Pin Assignment  
(top view)  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
GND  
IN2  
OUT1  
VS  
RESET  
CS  
PRG  
OUT2  
IN1  
GND  
IN3  
OUT4  
SI  
SCLK  
SO  
FAULT  
OUT3  
IN4  
GND  
GND  
Figure 3  
Pin Configuration (top view)  
All GND pins and the heat sink must be connected to GND externally.  
3.2  
Pin Definitions and Functions  
Pin  
1
Symbol  
GND  
Function  
Ground  
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
IN2  
OUT1  
VS  
RESET  
CS  
PRG  
OUT2  
IN1  
GND  
GND  
IN4  
OUT3  
FAULT  
SO  
SCLK  
SI  
OUT4  
IN3  
Input Channel 2  
Power Output Channel 1  
Supply Voltage  
Reset Input  
SPI Chip Select  
Program Input  
Power Output Channel 1  
Input Channel 1  
Ground  
Ground  
Input Channel 4  
Power Output Channel 3  
Fault Output  
SPI Signal Out  
SPI Clock  
SPI Signal In  
Power Output Channel 4  
Input Channel 3  
Ground  
GND  
Data Sheet  
6
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Maximum Ratings and Operating Conditions  
4
Maximum Ratings and Operating Conditions  
4.1  
Absolute Maximum Ratings  
Absolute Maximum Ratings 1)  
Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin  
(unless otherwise specified)  
Pos. Parameter  
Symbol  
Limit Values  
Unit Conditions  
Min.  
-0.3  
Max.  
7
4.1.1 Supply Voltage  
4.1.2 Continuous Drain Source Voltage  
(OUT1 to OUT4)  
VS  
VDS  
V
V
-0.3  
45  
4.1.3 Input Voltage, All Inputs and Data  
outputs, Sense Lines  
VIN  
-0.3  
7
V
4.1.4 Output Current per Channel2)  
ID  
0
3
30  
A
V
Output ON  
4.1.5 Maximum Voltage for short circuit  
VSC, single  
Protection (single event)3)  
4.1.6 Electrostatic Discharge Voltage  
(human body model) according to  
EIA/JESD22-A114-E  
VESD  
-2000  
2000  
V
1) Not subject to production test, specified by design.  
2) Output current rating as long as maximum junction temperature is not exceeded. The maximum output current in the  
application has to be calculated using RthJA depending on mounting conditions.  
3) Device mounted on PCB (100 mm × 100 mm × 1.5 mm epoxy, FR4); PCB in test chamber without blown air. All channels  
have identical loads.  
Note:Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute  
maximum rating conditions for extended periods may affect device reliability.  
Note:Integrated protection functions are designed to prevent IC destruction under fault conditions described in the  
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are  
not designed for continuous repetitive operation.  
Note:The TLE8104E fulfils the AEC standard requirements for latch-up on all pins except on pin 14-FAULT and  
on pin 15-SO  
Data Sheet  
7
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Maximum Ratings and Operating Conditions  
4.2  
Operating Conditions  
Pos.  
4.2.1  
Parameter  
Symbol  
Limit Values  
Unit  
Conditions  
Min.  
Typ.  
Max.  
Output Clamping Energy (single  
event), linearly decreasing current1)  
EAS  
50  
mJ  
I
D(0) = 1 A,  
J(0) = 150 °C  
T
Thermal Resistance  
4.2.2  
4.2.3  
Junction to case  
RthJSP  
RthJA  
2.1  
26  
3
K/W  
K/W  
PV = 3 W  
PV = 3 W  
Junction to ambient, all channels  
active2)  
Temperature Range  
4.2.4  
4.2.5  
Operating Temperature Range  
Storage Temperature Range  
Tj  
Tstg  
-40  
-55  
150  
150  
°C  
°C  
1) Pulse shape represents inductive switch off: ID(t) = ID(0) × (1 - t / tpulse); 0 < t < tpulse  
2) PCB set-up according Figure 4  
PCB Dimensions: 76.2 x 114.3 x 1.5 mm³, FR4  
Thermal Vias: diameter = 0.3 mm; plating 25 µm; 24 pcs.  
Metallisation according JEDEC 2s2p (JESD 51-7) + (JESD 51-5)  
70µm modeled (traces)  
35µm, 90% metalization  
35µm, 90% metalization  
70µm, 5% metalization  
Thermal_Setup.vsd  
Figure 4  
Thermal Simulation - PCB setup  
Note:Within the functional range, the IC operates as described in the circuit description. The electrical  
characteristics are specified within the conditions given by the related electrical characteristics table.  
Data Sheet  
8
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Electrical and Functional Description of Blocks  
5
Electrical and Functional Description of Blocks  
5.1  
Power Supply  
The TLE8104E is supplied by power supply line VS, used for the digital as well as the analog functions of the device  
including the gate control of the power stages. A capacitor between pins VS to GND is recommended.  
A RESET pin is available. When a low level is applied to this pin, the device enters sleep mode. In this case, all  
registers are set to their default values and the quiescent supply current is minimized.  
After start-up of the power supply, the RESET pin should be kept low until the Reset Duration Time has expired,  
reseting all SPI registers to their default values.  
Electrical Characteristics: Power Supply  
VS = 4.5 V to 5.5 V, Tj = -40 °C to +150 °C, (unless otherwise specified)  
all voltages with respect to ground, positive current flowing into pin  
Pos.  
Parameter  
Symbol  
Limit Values  
Unit  
Conditions  
Min.  
4.5  
Typ.  
1
Max.  
5.5  
2
1.0  
VS +0.3 V  
-20  
5.1.1  
5.1.2  
5.1.3  
5.1.4  
5.1.5  
Supply Voltage  
Supply Current  
Input Low Voltage of pin RESET  
Input High Voltage of pin RESET  
VS  
IS(ON)  
V
mA  
V
all channels ON  
VRESET(L) -0.3  
VRESET(H) 2.0  
IRESET(L) -100  
High Input Pull-up Current  
through pin RESET  
-50  
µA  
V
RESET = 2 V,  
5.1.6  
Reset duration time1)  
tRESET(L) 10  
µs  
1) For proper startup, after the supply VS has reached its final voltage, the RESET pin should be held low until the reset  
duration time has expired.  
5.2  
Parallel Inputs  
Each input signal controls the output stages of its assigned channel. For example, IN1 controls OUT1, IN2 controls  
OUT2, etc. Please refer to Figure 4 for details.  
The PRG pin selects if the input pins are active high or active low and activates either a pull-down or pull-up current  
source. If PRG is high, the input pins are active high and the pull-down current source is active. If PRG is low, the  
input pins are active low and the pull-up current source is active. The respective current sources at the input pin  
ensure that the channels switch off in case of an unconnected pin. The zener diode protects the input circuit  
against ESD pulses.  
The BOLbit can be set via SPI. This bit determines if a Boolean OR or AND operation is performed on the INn  
signals and their corresponding data bits CHnIN . The default setting of the BOLbit programs the device to perform  
an OR operation.  
Data Sheet  
9
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Electrical and Functional Description of Blocks  
PRG  
IN1  
channel 4  
channel 3  
channel 1  
channel 2  
IIN1(L)  
Closed if  
PRG = 0  
OR  
gate  
control  
IIN1(H)  
&
PRG = 1: Active High  
PRG = 0: Active Low  
Closed if  
PRG = 1  
CH1  
BOL  
IN  
Figure 4  
Input Control and Boolean Operator  
Electrical Characteristics: Parallel Inputs  
VS = 4.5 V to 5.5 V, Tj = -40 °C to +150 °C, (unless otherwise specified)  
all voltages with respect to ground, positive current flowing into pin (unless for pin SO)  
Pos.  
Parameter  
Symbol  
Limit Values  
Unit  
Conditions  
Min.  
-0.3  
2.0  
50  
-100  
Typ.  
100  
-50  
Max.  
1.0  
VS+0.3 V  
200  
-20  
5.2.1  
5.2.2  
5.2.3  
5.2.4  
Input Low Voltage of pin INn  
Input High Voltage of pin INn  
Input Voltage Hysteresis1)  
Low Input Pull-up Current  
through pin INn  
VIN(L)  
VIN(H)  
VIN(Hys)  
IIN(L)  
V
mV  
µA  
VIN = 0 V,  
PRG = 0  
5.2.5  
High Input Pull-down Current  
through pin INn  
Input Low Voltage of pin PRG  
Input High Voltage of pin PRG  
IIN(L)  
20  
50  
100  
1.0  
µA  
VIN = VS,  
PRG = 1  
5.2.6  
5.2.7  
VPRG(L)  
VPRG(H)  
-0.3  
2.0  
V
V
VS  
+0.3  
5.2.8  
Low Input Pull-up Current  
through pin PRG  
IPRG(L)  
-100  
-50  
-20  
µA  
V
PRG = 0 V,  
1) Not subject to production test, specified by design.  
Data Sheet  
10  
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Electrical and Functional Description of Blocks  
5.3  
Power Outputs  
5.3.1  
Electrical Characteristics  
Electrical Characteristics: Power Outputs  
VS = 4.5 V to 5.5 V, Tj = -40 °C to +150 °C, (unless otherwise specified)  
all voltages with respect to ground, positive current flowing into pin (unless for pin SO)  
Pos.  
Parameter  
Symbol  
Limit Values  
Unit  
Conditions  
Min.  
Typ.  
Max.  
5.3.1  
ON Resistance  
RDS(ON)  
0.32  
TJ = 25 °C,  
VS = 5 V,  
ID = 1A  
0.52  
0.65  
TJ = 150 °C,  
VS = 5 V,  
ID = 1A  
5.3.2  
5.3.3  
5.3.4  
Output Clamping Voltage  
Over load current limitation  
Output Leakage Current  
VDS(AZ)  
ID(lim)  
ID(lkg)  
45  
3
53  
4.5  
60  
6
10  
V
A
µA  
output OFF  
V
DS = 12 V  
TJ = 150 °C,  
V
DS = 35 V,  
VS = 5 V,  
RESET = 0  
5.3.5  
5.3.6  
5.3.7  
5.3.8  
Turn-On Time  
Turn-Off Time  
tON  
5
10  
10  
200  
µs  
µs  
°C  
K
ID = 1 A,  
resistive load  
tOFF  
5
ID = 1 A,  
resistive load  
Over temperature shutdown  
threshold1)  
Over temperature restart  
hysteresis  
Tj(OT)  
Tj(OT)  
170  
<
10  
1) Not subject to production test, specified by design.  
5.3.2  
Timing Diagrams  
The power transistors are switched on and off with a dedicated slope either via the parallel inputs or by  
the CHnIN bits of the serial peripheral interface SPI. The switching times tON and tOFF are designed equally. See  
Figure 5 for details  
CS  
SPI:ON  
SPI:OFF  
t
tON  
tOFF  
VDS  
80%  
20%  
Figure 5  
Switching a Resistive Load  
Data Sheet  
11  
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Electrical and Functional Description of Blocks  
5.3.3  
Inductive Output Clamp  
When switching off inductive loads, the potential at pin OUT rises to VDS(CL), as the inductance continues to drive  
current. The inductive output clamp is necessary to prevent destruction of the device. See Figure 6 for details.  
The maximum allowed load inductance and current, however, are limited.  
Vbat  
L,  
RL  
ID  
OUT  
VDS  
VDS(CL)  
GND  
Figure 6  
Inductive Output Clamp  
Maximum Load Inductance  
During demagnetization of inductive loads, energy has to be dissipated in the TLE8104E. This energy can be  
calculated with following equation:  
V
bat VDS(CL)  
RL ID  
bat V  
L
------------------------------------  
------  
E = VDS(CL)  
ln 1 ------------------------------------ + ID  
RL  
RL  
V
DS(CL)   
The equation simplifies under the assumption of RL = 0:  
Vbat  
2
1
--  
E = LID 1 ------------------------------------  
2
V
bat V  
DS(CL)   
The energy, which is converted into heat, is limited by the thermal design of the component.  
5.3.4  
Protection Functions  
The TLE8104E provides embedded protective functions. Integrated protection functions are designed to prevent  
IC destruction under fault conditions described in this data sheet. Fault conditions are considered “outside” the  
normal operating range. Protection functions are not designed for continuous repetitive operation.  
Over load and over temperature protections are implemented in the TLE8104E. Figure 7 gives an overview of the  
protective functions.  
OUTn  
Tn  
INn  
Input Control  
temperature  
monitor  
T
gate control  
CS  
SCLK  
SI  
current  
limitation  
SPI  
SO  
CLn  
GND  
Figure 7  
Protection Functions  
Data Sheet  
12  
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Electrical and Functional Description of Blocks  
5.3.4.1  
Over Load Protection  
The TLE8104E is protected in case of over load or short circuit of the load. The current is limited to IDS(lim). After  
time td(fault), the corresponding over load flag CLnis set. The channel may shut down due to over temperature.  
The over load flag (CLn) of the affected channel is cleared by the rising edge of the CS signal after a successful  
SPI transmission. For timing information, please refer to Figure 8 for details.  
IN  
t
FAULT  
t
CS  
t
ID  
ID(lim)  
td(fault)  
td(fault)  
t
CL  
=
1b  
CL  
=
0b  
CL  
=
1b  
CL = 0b  
Figure 8  
Over Load Behavior  
5.3.4.2  
Over Temperature Protection  
A dedicated temperature sensor for each channel detects if the temperature of its channel exceeds the over  
temperature shutdown threshold. If the channel temperature exceeds the over temperature shutdown threshold,  
the overheated channel is switched off immediately to prevent destruction. At the same time (no delay), the over  
temperature flag Tnis set. After cooling down, the channel is switched on again with thermal hysteresis Tj.  
The over temperature flag of the affected channel is cleared by the rising edge of the CS signal after a successful  
SPI transmission.  
5.3.5  
Reverse Polarity Protection  
In the case of reverse polarity when outputs are turned off, the intrinsic body diode of the power transistor causes  
power dissipation. The reverse current through the intrinsic body diode has to be limited by the connected load.  
The VS supply pin must be protected against reverse polarity externally. Please note that neither the over load nor  
over temperature are functional in reverse current operation.  
Data Sheet  
13  
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Electrical and Functional Description of Blocks  
5.4  
Diagnostic Functions  
The TLE8104E provides diagnosis information about the device and about the load. The following diagnosis  
functions are implemented:  
The protective functions (flags CLnand Tn) of channel n are registered in the diagnosis flag Pn.  
The open load diagnosis of channel n is registered in the diagnosis flag OLn.  
The short to ground monitor information of channel n is registered in the diagnosis flag SGn  
The diagnosis information of the TLE8104E can either be accessed by the SPI interface or FAULT pin. With the  
exception of over temperature, a fault is only recognized if it lasts longer than the fault delay time td(fault). When  
using the SPI interface and fault pin, diagnosis flags are latched in the diagnosis register of the SPI interface. In  
this case, diagnosis flags are cleared by the rising edge of the CS signal after a successful SPI transmission.  
Please see Figure 9 for details.  
VS  
VDS(SG)  
IDS(SG)  
MUX  
00  
SPI  
OUTn  
SGn  
OLn  
CHn  
01  
10  
VDS(OL)  
IDS(PD)  
FAULT  
OR  
gate control  
CLn  
protective functions  
Pn  
OR  
Tn  
GND  
Figure 9  
Block Diagram of Diagnostic Functions  
Electrical Characteristics: Diagnostic Functions  
VS = 4.5 V to 5.5 V, Tj = -40 °C to +150 °C, (unless otherwise specified)  
all voltages with respect to ground, positive current flowing into pin  
Pos.  
Parameter  
Symbol  
Limit Values  
Typ. Max.  
VS - 2.5 VS - 2.0 VS - 1.3 V  
50 90 150 µA  
Unit  
Conditions  
Min.  
5.4.1  
5.4.2  
5.4.3  
5.4.4  
5.4.5  
Open Load Detection Voltage  
Output Pull-down Current  
Short to Ground Detection Voltage VDS(SHG) VS - 3.3 VS - 2.9 VS - 2.5 V  
Short to Ground Detection Current ISHG  
Fault Filtering Time  
VDS(OL)  
IPD(OL)  
V
V
DS = 32 V 1)  
2)  
-150  
-100  
-50  
µA  
DS = VDS(SHG)  
50  
110  
200  
µs  
td(FAULT)  
1) Channel turned off (INx, PRG, data bit, BOL), RESET =1  
2) Channel turned off (INx, PRG, data bit, BOL), RESET =1 or Channel turned off (INx, PRG), RESET =0  
Data Sheet  
14  
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Electrical and Functional Description of Blocks  
5.5  
SPI Interface  
The diagnosis and control interface is based on a serial peripheral interface (SPI).  
The SPI is a full duplex synchronous serial slave interface, which uses four lines: SO, SI, SCLK and CS. Data is  
transferred by the lines SI and SO at the data rate given by SCLK. The falling edge of CS indicates the beginning  
of a data access. Data is sampled in on line SI at the falling edge of SCLK and shifted out on line SO at the rising  
edge of SCLK. Each access must be terminated by a rising edge of CS. A modulo 8 counter ensures that data is  
taken only, when a multiple of 8 bit has been transferred. The interface provides daisy chain capability.  
MSB  
MSB  
6
6
5
5
4
4
3
3
2
2
1
1
LSB  
LSB  
SO  
SI  
CS  
SCLK  
time  
Figure 10 Serial Peripheral Interface  
The SPI protocol is described in Section 6. All registers are reset to default values after power-on reset or if the  
chip is programmed via SPI to enter sleep mode.  
5.5.1  
SPI Signal Description  
CS - Chip Select: The system micro controller selects the TLE8104E by means of the CS pin. Whenever the pin  
is in low state, data transfer can take place. When CS is in high state, any signals at the SCLK and SI pins are  
ignored and SO is forced into a high impedance state.  
CS High to Low transition:  
The diagnosis information is transferred into the shift register.  
CS Low to High transition:  
Command decoding is only done after the falling edge of CS and a exact multiple (1, 2, 3, …) of eight SCLK  
signals have been detected.  
Data from shift register is transferred into the input matrix register.  
The diagnosis flags are cleared.  
SCLK - Serial Clock: This input pin clocks the internal shift register. The serial input (SI) transfers data into the  
shift register on the falling edge of SCLK while the serial output (SO) shifts diagnostic information out on the rising  
edge of the serial clock. It is essential that the SCLK pin is in low state whenever chip select CS makes any  
transition.  
SI - Serial Input: Serial input data bits are shifted in at this pin, the most significant bit first. SI information is read  
on the falling edge of SCLK. The 8 bit input data consist of two parts (control and data). Please refer to Section 6  
for further information.  
SO - Serial Output: Data is shifted out serially at this pin, the most significant bit first. SO is in high impedance  
state until the CS pin goes to low state. New data will appear at the SO pin following the rising edge of SCLK.  
Please refer to Section 6 for further information.  
Data Sheet  
15  
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Electrical and Functional Description of Blocks  
5.5.2  
Daisy Chain Capability  
The SPI of TLE8104E is daisy chain capable. In this configuration several devices are activated by the same signal  
CS. The SI line of one device is connected with the SO line of another device (see Figure 11), which builds a  
chain. The ends of the chain are connected with the output and input of the master device, SO and SI respectively.  
The master device provides the master clock SCLK, which is connected to the SCLK line of each device in the  
chain.  
device 1  
device 2  
device 3  
SI  
SO SI  
SO SI  
SO  
SO  
SPI  
SPI  
SPI  
SI  
CS  
SCLK  
Figure 11 Daisy Chain Configuration  
In the SPI block of each device, there is one shift register where one bit from SI line is shifted in each SCLK. The  
bit shifted out can be seen at SO. After 8 SCLK cycles, the data transfer for one device has been finished. In single  
chip configuration, the CS line must go high to make the device accept the transferred data. In daisy chain  
configuration the data shifted out at device 1 has been shifted in to device 2. When using three TLE8104E devices  
in daisy chain, three times 8 bits have to be shifted through the devices. After that, the CS line must go high (see  
Figure 12).  
SO device 3  
SI device 3  
SO device 2  
SI device 2  
SO device 1  
SI device 1  
SI  
SO  
CS  
CLK  
time  
Figure 12 Data Transfer in Daisy Chain Configuration  
Electrical Characteristics: SPI Interface  
VS = 4.5 V to 5.5 V, Tj = -40 °C to +150 °C, (unless otherwise specified)  
all voltages with respect to ground, positive current flowing into pin  
Pos.  
Parameter  
Symbol  
Limit Values  
Unit  
Conditions  
Min.  
Input Pull-down Current (SI, SCLK) IIN(SI,SCLK) 10  
Typ.  
20  
-20  
Max.  
50  
-10  
0.4  
5
5.5.1  
5.5.2  
5.5.3  
5.5.4  
5.5.5  
µA  
µA  
V
V
MHz  
V
V
SI,SCLK = VS  
CS = 0 V  
Input Pull-up Current (CS)  
IIN(CS)  
VSO(H)  
VSO(L)  
fSCLK  
-50  
SO High State Output Voltage  
SO Low State Output Voltage  
VS - 0.4 –  
I
I
SOH = 2 mA  
SOL = -2.5 mA  
Serial Clock Frequency  
(depending on SO load)  
DC  
Data Sheet  
16  
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Electrical and Functional Description of Blocks  
Electrical Characteristics: SPI Interface (cont’d)  
VS = 4.5 V to 5.5 V, Tj = -40 °C to +150 °C, (unless otherwise specified)  
all voltages with respect to ground, positive current flowing into pin  
Pos.  
Parameter  
Symbol  
Limit Values  
Unit  
Conditions  
Min.  
Typ.  
Max.  
5.5.6  
Serial Clock Period (1/fsclk  
)
tpSCLK  
200  
ns  
(depending on SO load)  
5.5.7  
5.5.8  
5.5.9  
Serial Clock High Time  
Serial Clock Low Time  
tSCLK(H)  
tSCLK(L)  
50  
50  
250  
ns  
ns  
ns  
Enable Lead Time (falling edge of tlead  
CS to rising edge of SCLK)  
5.5.10 Enable Lag Time (falling edge of  
SCLK to rising edge of CS)  
tlag  
250  
20  
ns  
ns  
ns  
5.5.11 Data Setup Time (required time SI tSU  
to falling of SCLK)  
5.5.12 Data Hold Time (falling edge of  
SCLK to SI)  
tH  
20  
5.5.13 Disable Time1)  
tDIS  
200  
150  
ns  
ns  
5.5.14 Transfer Delay Time2) (CS high time tdt  
between two accesses)  
5.5.15 Data Valid Time1)  
tvalid  
110  
120  
150  
160  
170  
200  
ns  
V
CL = 50 pF  
CL = 100 pF  
CL = 220 pF  
5.5.16 Input Low Voltage  
VSI(L)  
VCS(L)  
VSCLK(L)  
VSI(H)  
VCS(H)  
VSCLK(H)  
VSI(Hys)  
VCS(Hys)  
VSCLK(Hys)  
ISOlkg  
,
-0.3  
2.0  
50  
1.0  
,
5.5.17 Input High Voltage  
,
VS+0.3 V  
,
5.5.18 Input Voltage Hysteresis1)  
5.5.19 SO Tri-state leakage current  
,
100  
200  
10  
mV  
,
-10  
µA  
CS = 1,  
0 V VSO VS  
1) Not subject to production test, specified by design.  
2) This time is necessary between two write accesses. To get the correct diagnostic information, the transfer delay time has  
to be extended to the maximum fault delay time td(fault)max = 200 µs.  
Data Sheet  
17  
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Electrical and Functional Description of Blocks  
5.5.3  
Timing Diagrams  
tlead  
tlag  
tdt  
tpSCLK  
tSC LK (L)  
0.7VS  
0.2VS  
CS  
tSCLK (H)  
0.7V  
0.2VS  
S
SCLK  
SI  
tSU  
tH  
0.7VS  
0.2VS  
tvalid  
tDIS  
0.7VS  
0.2VS  
SO  
Figure 13 Serial Interface Timing Diagram  
5.6  
FAULT pin  
There is a general fault pin (open drain) which shows a high to low transition as soon as an error occurs for any  
one of the four channels. This fault indication can be used to generate a µC interrupt. Therefore a ‘diagnosis’  
interrupt routine need only be called after this fault indication.  
This saves processor time compared to a cyclic reading of the SO information.  
Refer to Figure 9 for the block diagram of the diagnostic functions.  
Electrical Characteristics: SPI Interface  
VS = 4.5 V to 5.5 V, Tj = -40 °C to +150 °C, (unless otherwise specified)  
all voltages with respect to ground, positive current flowing into pin  
Pos.  
Parameter  
Symbol  
Limit Values  
Unit  
Conditions  
Min.  
0
Typ.  
Max.  
0.4  
5.6.20 Low level output voltage of pin  
FAULT  
V
IFAULT = 1.6 mA  
VFAULT(L)  
Data Sheet  
18  
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
SPI Control  
6
SPI Control  
The SPI protocol of the TLE8104E provides two types of registers: control and diagnosis. After power-on reset, all  
register bits are set to default values.  
Serial Input  
Default Value: 00H  
7
6
5
4
3
2
1
0
DATA  
CMD  
(CH4IN CH3IN CH2IN CH1IN)  
w
w
w
w
w
w
w
w
Field  
CMD  
Bits  
7:4  
Type  
w
Description  
Command  
0000 Diagnosis only  
1100 Read back input and 1-bit diagnosis  
1010 Echo function of SPI  
0011 BOLbit set for logic OR operation of INnand data bits.  
The default value for the BOLbit is logic OR.  
1111 BOLbit set for logic AND operation of INnand data bits  
XXXX All other command words are accepted as an OR or AND  
command with valid data bits depending on the previously  
programmed Boolean operation.  
DATA  
3:0  
w
Data  
If Command is 0000Data bits are ignored.  
If Command is 1100Data bits are ignored.  
If Command is 1010Data bits will appear as bits 3:0 at SO during  
the next CS period.  
If Command is 0011Each of the data bits is OR’ed with its  
corresponding input signal INn.  
If Command is 1111Each of the data bits is AND’ed with its  
corresponding input signal INn.  
All other CommandsEach of the data bits is OR’ed or AND’ed  
with its corresponding input signal INn,  
depending on the previously programmed  
Boolean operation.  
E
Serial Output (Standard Diagnosis)  
Default Value: FFH  
7
6
5
4
r
3
r
2
r
1
r
0
r
CH4  
CH3  
CH2  
CH1  
(CH41 CH40)  
(CH31 CH30)  
(CH21 CH20)  
(CH11 CH10)  
r
r
r
Field  
Bits  
Type  
Description  
CHn  
2n-2  
r
Standard Diagnosis for Channel n  
00 Short circuit to ground  
01 Open load  
:2n-1  
10 Over load / over temperature  
11 Normal operation  
Data Sheet  
19  
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
SPI Control  
6.1  
SPI Examples  
Below are examples of the different SPI command words and the resulting behavior of the output channels and  
Seiral Output pin.  
6.1.1  
Example: Diagnosis Only  
The contents of the diagnosis register will be returned during the next SPI access. This command is only active  
once unless the next control command is again “Diagnosis only” (see Figure 14).  
In the example shown in Figure 14, the standard diagnosis reports short circuit to ground for channel 1 (00), open  
load for channel 2 (01), over load / over temperature for channel 3 (10) and normal operation for channel 4 (11).  
CS  
t
Diagnosis Only  
SI  
0
0
0
0
X
X
X
X
X
X
X
X
X
1
X
1
X
X
X
X
X
0
X
0
t
t
Standard Diagnosis  
SO  
X
X
X
X
1
0
0
1
Figure 14 Diagnosis Only  
6.1.2  
Example: Read Back Input and 1-bit Diagnosis  
The first four bits of SO during the next SPI access give the state of the parallel inputs, denoted by INn. The  
second four-bit word fed out at SO contains 1-bit diagnosis information of the output (1 = no fault, 0 = fault),  
denoted by Fn(see Figure 15).  
CS  
t
Read Back Input and 1-bit Diagnosis  
SI  
1
0
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
t
t
States of INn  
1-bit Diagnosis  
F3 F2 F1  
IN4 IN3 IN2 IN1 F4  
SO  
X
X
X
X
X
X
Figure 15 Read Back Input and 1-bit Diagnosis  
6.1.3  
Example: Echo Function of SPI  
This function can be used to check the proper function of the serial interface. This command connects directly the  
SI to the SO during the next CS period. This internal connection is only active once unless the next control  
command is again “Echo function of SPI” (see Figure 16).  
Data Sheet  
20  
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
SPI Control  
CS  
SI  
t
Echo Function of SPI  
SI word  
1
0
1
0
X
X
X
X
X
X
X
t
t
SI word  
SO  
X
X
X
X
X
Figure 16 Echo Function of SPI  
6.1.4  
Example: OR Operation and Diagnosis  
Sets the BOLbit to perform an OR operation on the INnsignals and their corresponding data bits CHnIN . The  
contents of the diagnosis register will be returned during the next SPI access (see Figure 17). If the OR operation  
is programmed, it is latched until overwritten by an AND operation. This is the default operation after the device  
emerges from power-up or Reset mode.  
CS  
t
BOL set toOR  
OR with INn signals  
CH4IN CH3IN CH2IN CH1IN  
SI  
0
0
1
1
X
X
X
X
X
X
X
X
X
t
t
Standard Diagnosis  
CH41 CH40 CH31 CH30 CH21 CH20 CH11 CH10  
SO  
X
X
X
X
X
X
X
Figure 17 OR Operation and Diagnosis  
6.1.5  
Example: AND Operation and Diagnosis  
Sets the BOLbit to perform an AND operation on the INnsignals and their corresponding data bits CHnIN . The  
contents of the diagnosis register will be returned during the next SPI access (see Figure 18). If the AND operation  
is programmed, it is latched until overwritten by an OR operation, the device enters Reset mode or becomes shut  
down.  
CS  
t
BOL set toAND AND with INn signals  
CH4CH3INCH2CH1
IN
SI  
1111
X
X
X
X
X
X
X
X
IN
IN
t
t
Standard Diagnosis  
CH41 CH40 CH31 CH30 CH21 CH20 CH11 CH10  
SO  
X
X
X
X
X
X
X
X
Figure 18 AND Operation and Diagnosis  
Data Sheet  
21  
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
SPI Control  
6.1.6  
Example: All Other Command Words  
All other control words except for Diagnosis Only, Read Back Input and Echo Function will be accepted as an OR  
or an AND command with valid data bits, depending on the Boolean operation which was previously programmed  
(see Figure 19).  
CS  
t
BOL set toAND  
AND with INn signals  
AND with INn signals  
CH4INCH3INCH2INCH1
CH4IN CH3IN CH2IN CH1IN  
SI  
1111
X
X
X
X
IN
t
t
Standard Diagnosis  
CH41 CH40 CH31 CH30 CH21 CH20 CH11 CH10  
SO  
X
X
X
X
X
X
X
X
Figure 19 All Other Command Words (with previously programmed AND command)  
Data Sheet  
22  
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Application Description  
7
Application Description  
Note:The following information is given as a hint for the implementation of the device only and shall not be  
regarded as a description or warranty of a certain functionality, condition or quality of the device.  
VBatt  
LDO  
TLE4262  
5V  
Vs  
OUT1  
OUT2  
OUT3  
OUT4  
10µF  
10k  
______  
FAULT  
______  
RESET  
___  
CS  
SCLK  
SI  
SO  
µC  
SPI  
XC167  
IN1  
IN2  
IN3  
IN4  
PWM  
PRG  
Figure 20 Application Circuit  
Note:This is a very simplified example of an application circuit. The function must be verified in the real application.  
Data Sheet  
23  
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Package Outlines  
8
Package Outlines  
0.35 x 45˚  
1)  
7.6-0.2  
+0.09  
0.23  
1.27  
0.2  
0.7  
0.1 C 20x  
C
2)  
0.3  
10.3  
0.08  
0.4  
D
M
0.25 A-B C D 20x  
Bottom View  
Ejector Mark 11  
20  
A
11  
Ejector Mark  
Exposed Diepad  
20  
Index Marking  
10  
B
1
10  
1
Index Marking  
7
1)  
12.8-0.2  
1) Does not include plastic or metal protrusion of 0.15 max. per side  
2) Does not include dambar protrusion of 0.05 max. per side  
Figure 21 PG-DSO-20 (Plastic Dual Small Outline Package) Green Product  
Green Product (RoHS compliant)  
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with  
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e  
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).  
You can find all of our packages, sorts of packing and others in our  
Dimensions in mm  
V1.4, 2010-04-26  
Infineon Internet Page “Products”: http://www.infineon.com/products.  
Data Sheet  
24  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Revision History  
9
Revision History  
Table 2  
Version  
V1.3 -> V1.4: 2010-04-07  
V1.4 2010-04-07  
Date  
Changes  
New cover graphics  
Package name changed to PG-DSO-20  
Figure 2: parameters naming corrected to match pin naming  
Chapter 4.1: added note to absolute maximum ratings  
Item 4.2.3: typ. value changed, 26.2 K/W ->26 K/W  
Item 5.1.5: parameter name changed “Low input pull-up current through pin RESET” ->  
“High input pull-up current through pin RESET”  
Item 5.1.5: conditions changed VRESET = 0 V -> VRESET = 2 V,  
Item 5.1.5: values corrected according to terms  
Item 5.2.1: parameter renamed VINL -> VIN(L)  
Item 5.2.2: parameter renamed VINH -> VIN(H)  
Item 5.2.3: parameter renamed VINHys -> VIN(Hys)  
Item 5.2.4: values corrected according to terms  
Item 5.2.8: values corrected according to terms  
Item 5.4.1, Item 5.4.2 and Item 5.4.4: parameter renamed to fit new test conditions  
Item 5.4.2 and Item 5.4.4: test conditions adapted  
Item 5.4.4: min and max value corrected  
Item 5.4.5 and Item 5.4.6: parameter moved to Chapter 5.6  
Item 5.4.6: parameter renamed VFAULT -> VFAULT(L)  
Item 5.5.2: values corrected according to terms  
Item 5.5.3: parameter renamed VSOH -> VSO(H)  
Item 5.5.4: parameter renamed VSOL -> VSO(L)  
Item 5.5.4: test conditions corrected according to terms  
Item 5.5.5: parameter renamed fSCLK  
Item 5.5.6: added “(depending on SO load)”  
Item 5.5.6: parameter renamed tpSCLK  
Item 5.5.7: parameter renamed tSCKH -> tSCLK(H)  
Item 5.5.8: parameter renamed tSCKL -> tSCLK(L)  
Value changed for tvalid (Item 5.5.15) with CL = 50 pF  
Added tvalid (Item 5.5.15) with CL = 100 pF and CL = 220 pF  
Item 5.5.16: parameter added  
Item 5.5.17: parameter added  
Item 5.5.18: parameter added  
Item 5.5.19: parameter added  
Chapter 5.5.3: numbering changed 5.6 -> 5.5.3  
Figure 13: parameters naming corrected to match naming in upper electrical  
characteristics table  
Chapter 5.6: chapter added  
Figure 20: Vdd changed to Vs  
Chapter 7: notes added  
V1.2 -> V1.3: 2009-01-16  
Data Sheet  
25  
V1.4, 2010-04-26  
TLE8104E  
Smart Quad Channel Powertrain Switch  
Revision History  
Table 2  
Version  
V1.3  
Date  
2009-01-16  
Changes  
Reduced device stand-off in Figure 21  
V1.1 -> V1.2: 2008-09-02  
V1.2  
2008-09-02  
Removed parameter “Supply Current in Sleep Mode” on page 9  
V1.0 -> V1.1: 2008-03-02  
V1.1  
2008-03-03  
typo corrected page 3: from “Description / Quad Current Sense Low-Side Switch in Smart  
Power Technology (SPT) with four open drain DMOS output stages....” to “Description /  
Quad Low-Side Switch in Smart Power Technology (SPT) with four open drain DMOS  
output stages. ...  
V0.5 -> V1.0: 2007-06-11 Version Change to “Final” Data Sheet  
V1.0  
2007-06-11  
Information under Maximum Ratings about “DIN Humidity Category” and “IEC Climatic  
Category” according data sheet standards removed.  
V1.0  
V1.0  
2007-07-10  
2007-07-26  
Thermal Information Chapter 4.2 added  
Fig 21 updated  
Data Sheet  
26  
V1.4, 2010-04-26  
Edition 2010-04-26  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© 2010 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions or  
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any  
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties  
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights  
of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact the nearest  
Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information on the types in  
question, please contact the nearest Infineon Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems only with the express written  
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure  
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support  
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain  
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may  
be endangered.  

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