IN74LV174 [INTEGRAL]

Hex D-type flip-flop with reset; positive edge-trigger; 六路D型触发器与复位;正边沿触发
IN74LV174
型号: IN74LV174
厂家: INTEGRAL CORP.    INTEGRAL CORP.
描述:

Hex D-type flip-flop with reset; positive edge-trigger
六路D型触发器与复位;正边沿触发

触发器
文件: 总6页 (文件大小:54K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TECHNICAL DATA  
IN74LV174  
Hex D-type flip-flop with reset; positive edge-trigger  
The 74LV174 is a low–voltage Si–gate CMOS device and is pin and  
function compatible with the 74HC/HCT174.  
The 74LV174 has six edge–triggered D–type flip–flops with individual D  
inputs and Q outputs. The common clock (CP) and master reset (MR)  
inputs load and reset (clear) all flip–flops simultaneously.  
The register is fully edge–triggered. The state of each D input, one set–  
up time prior to the LOW–to–HIGH clock transition, is transferred to the  
corresponding output of the flip–flop.  
A LOW level on the MR input forces all outputs LOW, independently of  
clock or data inputs.  
The device is useful for applications requiring true outputs only and  
clock and master reset inputs that are common to all storage elements.  
ORDERING INFORMATION  
·
Output voltage levels are compatible with input levels of CMOS,  
NMOS and TTL ICS  
IN74LV174N Plastic  
IN74LV174D SOIC  
IZ74LV174 Chip  
·
·
·
·
Supply voltage range: 1.2 to 5.5 V  
Low input current: 1.0 mÀ; 0.1 mÀ at Ò = 25 °Ñ  
Output current: 6 mA at Vcc = 3.0 V; 12 mA at Vcc = 4.5 V  
High Noise Immunity Characteristic of CMOS Devices  
TA = -40° to 125° C for all packages  
PIN ASSIGNMENT  
MR  
Q0  
1
2
3
4
5
6
7
8
16  
V
CC  
15 Q5  
14 D5  
13 D4  
12 Q4  
LOGIC DIAGRAM  
D0  
D1  
Q1  
D2  
11  
10 Q3  
CP  
D3  
Q2  
GND  
9
FUNCTION TABLE  
Inputs  
CP  
Outputs  
CP  
MR  
L
Dn  
X
H
L
Qn  
X
L
MR  
H
H
PIN 16=VCC  
PIN 08 = GND  
H
L
H
L
X
X
no change  
no change  
H
H= high level  
L = low level  
X = don’t care  
INTEGRAL  
1
IN74LV174  
MAXIMUM RATINGS*  
Symbol  
Parameter  
Value  
-0.5 to +5.0  
±20  
Unit  
V
VCC  
DC supply voltage  
Input diode current  
Output diode current  
1
IIK  
*
mA  
mA  
mA  
mA  
mA  
mW  
2
IOK  
*
±50  
IO *3  
Output source or sink current  
VCC current  
±25  
ICC  
±50  
IGND  
PD  
GND current  
±50  
Power dissipation per package: *4  
Plastic DIP  
SO  
750  
500  
Tstg  
TL  
Storage Temperature  
-65 to +150  
260  
°C  
°C  
Lead Temperature, 1.5 mm (Plastic DIP Package), 0.3 mm (SO  
Package) from Case for 4 Seconds  
*Maximum Ratings are those values beyond which damage to the device may occur.  
Functional operation should be restricted to the Recommended Operating Conditions.  
*1 V < -0.5 V or V > VCC + 0.5 V  
I
I
*2 VO < -0.5 V or VO > VCC + 0.5 V  
*3 -0.5 V < VO < VCC + 0.5 V  
*4 Derating - Plastic DIP: - 12 mW/°C from 70° to 125°C  
SO Package: : - 8 mW/°C from 70° to 125°C  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
1.2  
0
Max  
5.5  
Unit  
V
VCC  
DC Supply Voltage  
DC Input Voltage  
DC Output Voltage  
V
IN  
VCC  
V
VOUT  
TA  
0
VCC  
V
Operating Temperature, All Package Types  
-40  
+125  
°C  
tr, tf  
Input Rise and Fall Time (Figure 1) 1.0 Â £VCC <2.0 Â  
0
0
0
0
500  
200  
100  
50  
ns/V  
2.0 Â £VCC <2.7 Â  
2.7 Â £VCC <3.6 Â  
3.6 Â £VCC £5.5 Â  
This device contains protection circuitry to guard against damage due to high static voltages or electric  
fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages  
to this high-impedance circuit. For proper operation, V and VOUT should be constrained to the range GND£(V or  
IN  
IN  
VOUT)£VCC.  
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused  
outputs must be left open.  
INTEGRAL  
2
IN74LV174  
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)  
Test  
VCC  
V
Guaranteed Limit  
Symbol  
Parameter  
conditions  
-40°C to 25°C  
85°C  
125°C  
Unit  
min  
max  
min  
max  
min  
max  
V
IH  
HIGH level input  
voltage  
1.2  
2.0  
2.7  
3.0  
3.6  
4.5  
5.5  
0.9  
1.4  
2.0  
2.0  
2.0  
-
-
-
-
-
-
-
0.9  
1.4  
2.0  
2.0  
2.0  
-
-
-
-
-
-
-
0.9  
1.4  
2.0  
2.0  
2.0  
-
-
-
-
-
-
-
V
3.15  
3.85  
3.15  
3.85  
3.15  
3.85  
V
LOW level input  
voltage  
1.2  
2.0  
2.7  
3.0  
3.6  
4.5  
5.5  
-
-
-
-
-
-
-
0.3  
0.6  
0.8  
0.8  
0.8  
-
-
-
-
-
-
-
0.3  
0.6  
0.8  
0.8  
0.8  
-
-
-
-
-
-
-
0.3  
0.6  
0.8  
0.8  
0.8  
V
V
IL  
1.35  
1.65  
1.35  
1.65  
1.35  
1.65  
VOH  
HIGH level output V = V or V  
IL  
voltage  
1.2  
2.0  
2.7  
3.0  
3.6  
4.5  
5.5  
1.05  
1.85  
2.55  
2.85  
3.45  
4.35  
5.35  
-
-
-
-
-
-
-
1.0  
1.8  
2.5  
2.8  
3.4  
4.3  
5.3  
-
-
-
-
-
-
-
1.0  
1.8  
2.5  
2.8  
3.4  
4.3  
5.3  
-
-
-
-
-
-
-
I
IH  
IO = -100 mÀ  
V = V or V  
IL  
3.0  
2.48  
-
2.34  
-
2.20  
-
V
V
V
I
IH  
IO = -6 mÀ  
V = V or V  
IL  
4.5  
3.70  
-
3.60  
-
3.50  
-
I
IH  
IO = -12 mÀ  
LOW level output V = V or V  
IL  
VOL  
1.2  
2.0  
2.7  
3.0  
3.6  
4.5  
5.5  
-
-
-
-
-
-
-
0.15  
0.15  
0.15  
0.15  
0.15  
0.15  
0.15  
-
-
-
-
-
-
-
0.2  
0.2  
0.2  
0.2  
0.2  
0.2  
0.2  
-
-
-
-
-
-
-
0.2  
0.2  
0.2  
0.2  
0.2  
0.2  
0.2  
I
IH  
voltage  
IO = 100 mÀ  
V = V or V  
IL  
3.0  
-
0.33  
-
0.40  
-
0.50  
V
V
I
IH  
IO = 6 mÀ  
V = V or V  
IL  
4.5  
-
0.40  
-
0.55  
-
0.65  
I
IH  
IO = 12 mÀ  
II  
Input current  
V = VCC or 0 V  
5.5  
5.5  
-
-
±0.1  
-
-
±1.0  
-
-
±1.0  
mÀ  
mÀ  
I
ICC  
Supply current  
V =VCC or 0 V  
I
8.0  
80  
160  
IO = 0 mÀ  
ICC1  
Additional  
quiescent supply  
V =VCC – 0.6 V  
I
2.7  
3.6  
-
0.2  
0.2  
-
0.5  
0.5  
-
0.85  
0.85  
mA  
INTEGRAL  
3
IN74LV174  
current per input  
AC ELECTRICAL CHARACTERISTICS (CL=50 pF, RL = 1 kW, tr=tf=2.5 ns)  
Test  
VCC  
V
Guaranteed Limit  
-40°C to 25°C 85°C  
Symbol  
Parameter  
conditions  
125°C  
Unit  
min  
max  
min  
max  
min max  
tPHL, tPLH Propagation delay CP to V = 0 V or VCC  
1.2  
2.0  
2.7  
3.0  
4.5  
-
-
-
-
-
200  
34  
24  
20  
17  
-
-
-
-
-
230  
43  
31  
25  
21  
-
-
-
-
-
260  
53  
39  
31  
26  
ns  
I
Qn  
Figure 1, 4  
tPHL  
Propagation delay MR to V = 0 V or VCC  
1.2  
2.0  
2.7  
3.0  
4.5  
-
-
-
-
-
160  
34  
24  
20  
17  
-
-
-
-
-
190  
43  
31  
25  
21  
-
-
-
-
-
220  
53  
39  
31  
26  
ns  
ns  
ns  
ns  
ns  
ns  
I
Qn  
Figure 2, 4  
tW  
Clock pulse width HIGH or V = 0 V or VCC  
1.2  
2.0  
2.7  
3.0  
4.5  
100  
28  
21  
17  
14  
-
-
-
-
-
140  
34  
25  
20  
17  
-
-
-
-
-
180  
41  
30  
24  
20  
-
-
-
-
-
I
LOW  
Figure 1, 4  
tW  
Master reset pulse width  
LOW  
V = 0 V or VCC  
Figure 1, 4  
1.2  
2.0  
2.7  
3.0  
4.5  
100  
28  
21  
17  
14  
-
-
-
-
-
140  
34  
25  
20  
17  
-
-
-
-
-
180  
41  
30  
24  
20  
-
-
-
-
-
I
tREM  
tSU  
th  
Removal time MR to CP  
Set-up time Dn to CP  
Hold time Dn to CP  
Input capacitance  
V = 0 V or VCC  
Figure 3, 4  
1.2  
2.0  
2.7  
3.0  
4.5  
40  
19  
13  
11  
9
-
-
-
-
-
60  
22  
16  
13  
11  
-
-
-
-
-
80  
26  
19  
15  
13  
-
-
-
-
-
I
V = 0 Â or VCC  
1.2  
2.0  
2.7  
3.0  
4.5  
50  
5
5
5
5
-
-
-
-
-
50  
5
5
5
5
-
-
-
-
-
50  
5
5
5
5
-
-
-
-
-
I
Ðèñóí î ê 3, 4  
V = 0 Â or VCC  
1.2  
2.0  
2.7  
3.0  
4.5  
50  
5
5
5
5
-
-
-
-
-
50  
5
5
5
5
-
-
-
-
-
50  
5
5
5
5
-
-
-
-
-
I
Ðèñóí î ê 2, 4  
CI  
ÒA = 25°C  
5.0  
5.5  
-
-
7.0  
34  
-
-
-
-
-
-
-
-
pF  
pF  
CPD  
Power dissipation  
V = 0 V or VCC  
I
capacitance (per flip-flop)  
TA = 25°C  
fmax  
Maximum clock pulse  
frequency  
V = 0 Â or VCC  
Ðèñóí î ê 1  
1.2  
2.0  
2.7  
3.0  
4.5  
-
-
-
-
-
2.0  
16  
22  
27  
32  
-
-
-
-
-
1.0  
14  
19  
24  
27  
-
-
-
-
-
1.0 MHz  
I
12  
16  
20  
24  
INTEGRAL  
4
IN74LV174  
tw  
(2)  
V1  
t
t
r
f
(2)  
(1)  
V1  
MR  
Q
VM  
90%  
CP  
(1 )  
VM  
GND  
10%  
GND  
tPHL  
t w  
VOH  
VOL  
( 1)  
VM  
1/f  
max  
tPLH  
tPHL  
VOH  
t rec  
Q
(1 )  
VM  
(2)  
V1  
VOL  
(1)  
CP  
VM  
GND  
Figure 1. Switching Waveforms  
Figure 2. Switching Waveforms  
TEST POINT  
VALID  
(2)  
V
1
(1 )  
OUTPUT  
VM  
DEVICE  
UNDER  
TEST  
DATA  
GND  
t
t
h
su  
*
R
L
(2)  
C
L
V
1
( 1)  
CP  
VM  
GND  
* Includes all probe and jig capacitance  
Figure 3. Switching Waveforms  
(1)  
Figure 4. Test Circuit  
Note:  
VM = 1.5 V at VCC = 2.7 V  
VM = 0.5 ×VCC at VCC =1.2 V, 2.0 V, 3.0 V, 4.5 V  
(2)  
V = VCC at VCC =1.2 V, 2.0 V, 2.7 V, 4.5 V  
1
V = 2.7 V at VCC = 3.0 V  
1
INTEGRAL  
5
IN74LV174  
CHIP PAD DIAGRAM  
10  
14  
11  
15  
13  
12  
09  
08  
16  
01  
02  
03  
04  
05  
Chip marking  
LV174  
06  
07  
Y
(0,0)  
X
1.53 + 0.03  
Location of marking (mm): left lower corner x=1.080, y=0.296  
Chip thickness: 0.46 ± 0.02 mm.  
PAD LOCATION  
Location (left lower corner), mm  
Pad No  
Symbol  
Pad size, mm  
X
Y
0.295  
0.127  
0.127  
0.127  
0.127  
0.127  
0.127  
0.741  
1.079  
1.247  
1.247  
1.247  
1.247  
1.247  
1.247  
0.633  
01  
02  
03  
04  
05  
06  
07  
08  
09  
10  
11  
12  
13  
14  
15  
16  
MR  
Q0  
D0  
D1  
Q1  
D2  
Q2  
GND  
CP  
Q3  
D3  
Q4  
D4  
D5  
Q5  
VCC  
0.132  
0.100 x0.100  
0.100 x0.100  
0.100 x0.100  
0.100 x0.100  
0.100 x0.100  
0.100 x0.100  
0.100 x0.100  
0.100 x0.100  
0.100 x0.100  
0.100 x0.100  
0.100 x0.100  
0.100 x0.100  
0.100 x0.100  
0.100 x0.100  
0.100 x0.100  
0.100 x0.100  
0.132  
0.430  
0.667  
0.902  
1.080  
1.315  
1.315  
1.315  
1.315  
1.017  
0.780  
0.545  
0.367  
0.132  
0.132  
Note: Pad location is given as per metallization layer  
INTEGRAL  
6

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