HS-1115RH_02 [INTERSIL]
Radiation Hardened, High Speed, Low Power Output Limiting, Closed-Loop-Buffer Amplifier; 抗辐射，高速，低功率输出限制，闭环，缓冲放大器
| 型号： | HS-1115RH_02 |
| 厂家： | 
Intersil |
| 描述： | Radiation Hardened, High Speed, Low Power Output Limiting, Closed-Loop-Buffer Amplifier |
| 文件： | 总4页 (文件大小：133K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
®
HS-1115RH
Radiation Hardened, High Speed, Low Power
Output Limiting, Closed-Loop-Buffer Amplifier
August 1996
Features
Description
• Electrically Screened to SMD 5962F9678501VPA
• MIL-PRF-38535 Class V Compliant
The HS-1115RH is a radiation hardened, high speed closed
loop buffer featuring both user programmable gain and out-
put limiting. They are QML approved and processed in full
compliance with MIL-PRF-38535. Manufactured in propri-
etary, complementary bipolar UHF-1 (DI bonded wafer) pro-
cess, the HS-1115RH also offers a wide -3dB bandwidth of
225MHz, very fast slew rate, excellent gain flatness and high
output current.
• User Programmable Output Voltage Limiting
• User Programmable For Closed-Loop Gains of +1, -1
or +2 Without Use of External Resistors
• Standard Operational Amplifier Pinout
• Fast Overdrive Recovery . . . . . . . . . . . . . . . <1ns (Typ)
• Low Supply Current. . . . . . . . . . . . . . . . . . 6.9mA (Typ)
• Excellent Gain Accuracy. . . . . . . . . . . . . .0.99V/V (Typ)
• Wide -3dB Bandwidth . . . . . . . . . . . . . . . 225MHz (Typ)
• Fast Slew Rate . . . . . . . . . . . . . . . . . . . . 1135V/μs (Typ)
• High Input Impedance . . . . . . . . . . . . . . . . . . 1MΩ (Typ)
• Excellent Gain Flatness (to 50MHz) . . . . . ±0.1dB (Typ)
• Total Gamma Dose . . . . . . . . . . . . . . . . . 300K RAD (Si)
This buffer is the ideal choice for high frequency applications
requiring output limiting, especially those needing ultra fast
overload recovery times. The limiting function allows the
designer to set the maximum positive and negative output
levels, thereby protecting later stages from damage or input
saturation. The HS-1115RH also allows for voltage gains of
+2, +1, and -1, without the use of external resistors. Gain
selection is accomplished via connections to the inputs, as
described in the “Application Information” text. The result is a
• Neutron Damage . . . . . . . TBD (When Tests Complete) more flexible product, fewer part types in inventory, and
more efficient use of board space.
• Latch Up . . . . . . . . . . . . . . . . . . . None (DI Technology)
Compatibility with existing op amp pinouts provides flexibility to
Applications
upgrade low gain amplifiers, while decreasing component
count. Unlike most buffers, the standard pinout provides an
upgrade path should a higher closed loop gain be needed at a
future date.
• Flash A/D Driver
• Video Switching and Routing
• Pulse and Video Amplifiers
• Wideband Amplifiers
• RF/IF Signal Processing
• Imaging Systems
Detailed electrical specifications are contained in SMD
5962F9678501VPA, available on the Intersil Website.
A Cross Reference Table is available on the Intersil Website
for conversion of Intersil Part Numbers to SMDs. The address is:
www.intersil.com/military/crossref.asp
Ordering Information
SMD numbers must be used to order Radiation Hardened
Products.
TEMP.
PART NUMBER
RANGE (oC)
-55 to 125
-40 to 85
PACKAGE
8 Ld CERDIP
8 Ld PDIP
PKG. NO.
GDIP1-T8
E8.3
5962F9678501VPA
HFA1115IP
(Sample)
HFA11XXEVAL
Evaluation Board
Pinout
HS-1115RH
MIL-STD-1835, GDIP1-T8
(PDIP, CERDIP)
TOP VIEW
350
NC
-IN
+IN
V-
1
2
3
4
8
7
6
5
V
H
350
V+
-
+
OUT
V
L
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
FN4098.1
Copyright © Intersil Americas Inc. 2002. All Rights Reserved
1
PRISM® is a registered trademark of Intersil Americas Inc. PRISM
and design is a trademark of Intersil Americas Inc.
HS-1115RH
Application Information
Closed Loop Gain Selection
The HS-1115RH features a novel design which allows the Another straightforward approach is to add a 620Ω resistor
user to select from three closed loop gains, without any in series with the positive input. This resistor and the
external components. The result is a more flexible product, HS-1115RH input capacitance form a low pass filter which
fewer part types in inventory, and more efficient use of board rolls off the signal bandwidth before gain peaking occurs.
space.
This configuration was employed to obtain the datasheet AC
and transient parameters for a gain of +1.
This “buffer” operates in closed loop gains of -1, +1, or +2, and
gain selection is accomplished via connections to the ±inputs.
Applying the input signal to +IN and floating -IN selects a gain
of +1 (see next section for layout caveats), while grounding -IN
selects a gain of +2. A gain of -1 is obtained by applying the
input signal to -IN with +IN grounded.
PC Board Layout
The frequency response of this amplifier depends greatly on
the amount of care taken in designing the PC board. The
use of low inductance components such as chip resis-
tors and chip capacitors is strongly recommended,
while a solid ground plane is a must!
The table below summarizes these connections:
CONNECTIONS
GAIN
Attention should be given to decoupling the power supplies.
A large value (10μF) tantalum in parallel with a small value
(0.1μF) chip capacitor works well in most cases.
(ACL
)
+INPUT (PIN 3)
-INPUT (PIN 2)
-1
GND
Input
+1
Input
NC (Floating)
GND
+2
Input
Terminated microstrip signal lines are recommended at the
input and output of the device. Capacitance directly on the
output must be minimized, or isolated as discussed in the
next section.
Unity Gain Considerations
Unity gain selection is accomplished by floating the -Input of
the HS-1115RH. Anything that tends to short the -Input to
GND, such as stray capacitance at high frequencies, will
cause the amplifier gain to increase toward a gain of +2. The
result is excessive high frequency peaking, and possible
instability. Even the minimal amount of capacitance associ-
ated with attaching the -Input lead to the PCB results in
approximately 3dB of gain peaking. At a minimum this
requires due care to ensure the minimum capacitance at the
-Input connection.
For unity gain applications, care must also be taken to
minimize the capacitance to ground seen by the amplifier’s
inverting input. At higher frequencies this capacitance will
tend to short the -INPUT to GND, resulting in a closed loop
gain which increases with frequency. This will cause
excessive high frequency peaking and potentially other
problems as well.
An example of a good high frequency layout is the
Evaluation Board shown in Figure 1.
Table 1 lists five alternate methods for configuring the
HS-1115RH as a unity gain buffer, and the corresponding
performance. The implementations vary in complexity and
involve performance trade-offs. The easiest approach to
implement is simply shorting the two input pins together, and
applying the input signal to this common node. The amplifier
bandwidth drops from 400MHz to 200MHz, but excellent
gain flatness is the benefit. Another drawback to this
approach is that the amplifier input noise voltage and input
offset voltage terms see a gain of +2, resulting in higher
noise and output offset voltages. Alternately, a 100pF
capacitor between the inputs shorts them only at high
frequencies, which prevents the increased output offset
voltage but delivers less gain flatness.
Driving Capacitive Loads
Capacitive loads, such as an A/D input, or an improperly
terminated transmission line will degrade the amplifier’s
phase margin resulting in frequency response peaking and
possible oscillations. In most cases, the oscillation can be
avoided by placing a resistor (RS) in series with the output
prior to the capacitance.
RS and CL form a low pass network at the output, thus limit-
ing system bandwidth well below the amplifier bandwidth of
225MHz. By decreasing RS as CLincreases the maximum
bandwidth is obtained without sacrificing stability.
TABLE 1. UNITY GAIN PERFORMANCE FOR VARIOUS IMPLEMENTATIONS
±0.1dB GAIN FLATNESS
APPROACH
PEAKING (dB)
BW (MHz)
400
+SR/-SR (V/μs)
1200/850
1125/800
1050/775
875/550
(MHz)
Remove Pin 2
2.5
0.6
0
20
25
65
45
19
+RS = 620Ω
170
+RS = 620Ω and Remove Pin 2
Short Pins 2, 3
165
0
200
100pF cap. between pins 2, 3
0.2
190
900/550
FN4098.1
2
HS-1115RH
Evaluation Board
The performance of the HS-1115RH may be evaluated using The layout and modified schematic of the board are shown
the HFA11XX Evaluation Board, slightly modified as follows: in Figure 1.
1. Remove the 500Ω feedback resistor (R2), and leave the
To order evaluation boards, please contact your local sales
office.
connection open.
2. a. For AV = +1 evaluation, remove the 500Ω gain setting
resistor (R1), and leave pin 2 floating.
b. For AV = +2, replace the 500Ω gain setting resistor with
a 0Ω resistor to GND.
∞ (A = +1)
V
or 0Ω (A = +2)
V
V
H
R1
V
H
1
2
3
4
8
7
6
5
0.1μF
50Ω
10μF
+5V
50Ω
1
IN
OUT
+IN
OUT
V+
V
L
V
L
V-
10μF
0.1μF
GND
GND
GND
-5V
FIGURE 1A. SCHEMATIC
FIGURE 1B. TOP LAYOUT
FIGURE 1C. BOTTOM LAYOUT
FIGURE 1. EVALUATION BOARD SCHEMATIC AND LAYOUT
Burn-In Circuit
Irradiation Circuit
HS-1115RH CERDIP
HS-1115RH CERDIP
R
1
R
1
1
2
3
8
7
6
5
1
2
3
4
8
7
6
5
D
3
V+
V+
-
-
C
+
+
D
1
1
C
D
4
1
4
V-
V-
C
D
1
C
2
2
NOTES:
R1 = 100Ω, ±5% (Per Socket)
C1 = C2 = 0.01μF (Per Socket) or 0.1μF (Per Row) Minimum
D1 = D2 = 1N4002 or Equivalent (Per Board)
D3 = D4 = 1N4002 or Equivalent (Per Socket)
V+ = +5.5V ±0.5V
NOTES:
R1 = 100Ω, ±5%
C1 = 0.01μF
V+ = +5.0V ±0.5V
V- = -5.0V ±0.5V
V- = -5.5V ±0.5V
FN4098.1
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HS-1115RH
Die Characteristics
DIE DIMENSIONS:
GLASSIVATION:
59 mils x 58.2 mils x 19 mils ±1 mil
1500μm x 1480μm x 483μm ±25.4μm
Type: Nitride
Thickness: 4kÅ ±0.5kÅ
METALLIZATION:
Type: Metal 1: AICu(2%)/TiW
Thickness: Metal 1: 8kÅ ±0.4kÅ
Type: Metal 2: AICu(2%)
Thickness: Metal 2: 16kÅ ±0.8kÅ
WORST CASE CURRENT DENSITY:
< 2 x 105 A/cm2
TRANSISTOR COUNT: 89
SUBSTRATE POTENTIAL (Powered Up): Floating
Metallization Mask Layout
HS-1115RH
-IN
V
H
V+
OUT
+IN
V-
V
L
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reli-
able. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
FN4098.1
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