KT-2117QB24ZS-VFS [KINGBRIGHT]
SINGLE COLOR LED, BLUE, 1.75mm, 2.15 X 1.70 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, CERAMIC, SMD, 2 PIN;
| 型号： | KT-2117QB24ZS-VFS |
| 厂家： | 
KINGBRIGHT CORPORATION |
| 描述： | SINGLE COLOR LED, BLUE, 1.75mm, 2.15 X 1.70 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, CERAMIC, SMD, 2 PIN 光电 |
| 文件： | 总8页 (文件大小：335K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2.15X1.7mm SMD LED WITH CERAMIC
SUBSTRATE
Part Number: KT-2117QB24ZS-VFS
數位簽署者：yal
：cn=yal n,o,ou=SPEC 專
用,emai =sjhou@ cn.
kingbrightcom,c=<無>
Blue
PRELIMINARY SPEC
in
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yalin日期 2008.11.0314:27:00
+08'00'
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Features
z Dimension: 2.15mmX 1.7mm X 0.8mm.
z Low thermal resistance.
Application Note
z Ceramic package with silicone resin.
z Small package with high efficiency.
z Surface mount technology.
z ESD protection.
Static electricity and surge damage the LEDs.
It is recommended to use a wrist band or anti-electrostatic
glove when handling the LEDs.
All devices, equipment and machinery must be electrically
grounded.
z Package : 2000pcs / reel.
z Moisture sensitivity level : level 2a.
z Soldering methods: IR reflow soldering.
z RoHS compliant.
Typical Applications
Room lighting
Architectural lighting
Decorative/pathway lighting
Front panel backlight
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Specifications are subject to change without notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAI8156
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/30/2008
DRAWN: Y.F.Lu
PAGE: 1 OF 8
CHECKED: Allen Liu
ERP: 1212000071
Absolute Maximum Ratings at TA=25°C
Parameter
Symbol
Top
Tstg
TJ
Value
-40 To +100
-40 To +110
110
Unit
°C
Operating Temperature
Storage Temperature
°C
Junction temperature[1]
DC Forward Current [1]
Peak Forward Current [2]
°C
IF
150
mA
mA
IFM
270
not designed for
reverse operation
Reverse Voltage
VR
Pt
V
Power dissipation
0.555
8000
170
W
V
Electrostatic Discharge Threshold (HBM)
Thermal resistance [1] (Junction/ambient)
Rth j-a
Rth j-s
°C/W
°C/W
Thermal resistance [1] (Junction/solder point)
Notes:
55
1. Results from mounting on PC board FR4,mounted on pc board-metal core PCB is recommend
for lowest thermal resistance.
2. 1/10 Duty Cycle, 0.1ms Pulse Width.
Electrical / Optical Characteristics at TA=25°C
Parameter
Symbol
λ peak
λ dom [1]
Δλ
Value
450
Unit
Wavelength at peak emission IF=140mA
[Typ.]
nm
nm
nm
Dominant Wavelength IF=140mA [Typ.]
457
Spectral Line Half-width IF=140mA [Typ.]
Forward Voltage IF=140mA [Min.]
Forward Voltage IF=140mA [Typ.]
Forward Voltage IF=140mA [Max.]
20
2.7
VF [2]
IR
3.17
3.7
V
not designed for
reverse operation
Reverse Current
μ A
Optical efficiency
9
lm/W
η
opt
Temperature coefficient of λ peak
TC λ peak
TC λ dom
TCV
0.13
nm/° C
nm/° C
mV/° C
IF=140mA, -10 ° C≤ T≤100 ° C
[Typ.]
Temperature coefficient of λ dom
0.1
IF=140mA, -10 ° C≤ T≤100 ° C
[Typ.]
Temperature coefficient of VF
-3.1
IF=140mA, -10 ° C≤ T≤100 ° C [Typ.]
Notes:
1.Wavelength is measured with a current pulse of 20ms at a tolerance of ±1nm.
2.Forward voltage is measured with a current pulse of 10ms at a tolerance of ±0.1V.
SPEC NO: DSAI8156
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/30/2008
DRAWN: Y.F.Lu
PAGE: 2 OF 8
CHECKED: Allen Liu
ERP: 1212000071
Selection Guide
Part No.
Viewing
Angle [1]
Luminous Intensity [2]
Iv(cd)@ 140mA
Φv (lm) [3]
@ 140mA
Dice
Lens Type
Min.
Typ.
Typ.
2 θ 1/2
120 °
KT-2117QB24ZS-VFS
BLUE (InGaAlN)
WATER CLEAR
0.48
0.75
4
Brightness codes
luminous Intensity [2]
Iv(cd) @ 140mA
Φv (lm) [3]
@ 140mA
Code.
Min.
0.48
0.65
0.9
Max.
0.75
1.1
Typ.
3
S
T
4.5
6
U
1.5
Notes:
1.θ 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
2.Luminous intensity is measured by a current pulse of 10ms at a tolerance of ±15%.
3.The typical data of Luminous Flux can only reflect statistical figures, actual parameters of individual product could differ from the typical data.
For the purpose of product enhancement, the typical data is subject to change without prior notice.
Shipment may contain more than one of the light intensity groups.
Orders for single light intensity group are generally not accepted.
Forward Voltage Groups
Forward Voltage
Unit
Min.
2.7
Max.
2.9
V
V
V
2.9
3.1
3.1
3.3
3.3
3.5
3.5
3.7
V
V
Notes:
Forward voltage is measured with a current pulse of 10ms at a tolerance of ±0.1V.
Shipment may contain more than one of the forward voltage groups.
Orders for single forward voltage group are generally not accepted.
Wavelength Groups
Wavelength
Unit
Code.
Min.
Max.
1
2
443
448
453
458
452
457
462
465
nm
nm
nm
nm
3
1A
Note:
Wavelength is measured with a current pulse of 20ms at a tolerance of ±1nm.
Shipment may contain more than one of the wavelength groups.
Orders for single wavelength group are generally not accepted.
SPEC NO: DSAI8156
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/30/2008
DRAWN: Y.F.Lu
PAGE: 3 OF 8
CHECKED: Allen Liu
ERP: 1212000071
KT-2117QB24ZS-VFS
SPEC NO: DSAI8156
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/30/2008
DRAWN: Y.F.Lu
PAGE: 4 OF 8
CHECKED: Allen Liu
ERP: 1212000071
SPEC NO: DSAI8156
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/30/2008
DRAWN: Y.F.Lu
PAGE: 5 OF 8
CHECKED: Allen Liu
ERP: 1212000071
KT-2117QB24ZS-VFS
Reflow soldering is recommended and the soldering profile is shown below.
Other soldering methods are not recommended as they might cause damage to the product.
Recommended Soldering Pattern
(Units : mm; Tolerance: ± 0.1)
Heat Generation:
1.Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making
the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the
circuit board and density of LED placement on the board ,as well as other components. It is necessary to avoid intense heat gen-
eration and operate within the maximum ratings given in this specification.
2.Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot
of Permissible Forward current vs. Ambient temperature on CHARACTERISTICS in this specification. Please also take meas-
ures to remove heat from the area near the LED to improve the operational characteristics on the LED.
3.The equation ① indicates correlation between Tj and Ta ,and the equation ② indicates correlation between Tj and Ts
Tj = Ta + Rthj-a *W ………
Tj = Ts + Rthj-s *W ………
①
②
Tj = dice junction temperature: °C
Ta = ambient temperature:°C
Ts = solder point temperature:°C
Rthj-a = heat resistance from dice junction temperature to ambient temperature : °C / W
Rthj-s = heat resistance from dice junction temperature to Ts measuring point : °C / W
W = inputting power (IFx VF) : W
SPEC NO: DSAI8156
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/30/2008
DRAWN: Y.F.Lu
PAGE: 6 OF 8
CHECKED: Allen Liu
ERP: 1212000071
Tape Specifications (Units : mm)
PACKING & LABEL SPECIFICATIONS
KT-2117QB24ZS-VFS
SPEC NO: DSAI8156
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/30/2008
DRAWN: Y.F.Lu
PAGE: 7 OF 8
CHECKED: Allen Liu
ERP: 1212000071
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might leads to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter
of the nozzle should be as large as possible.
5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
SPEC NO: DSAI8156
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/30/2008
DRAWN: Y.F.Lu
PAGE: 8 OF 8
CHECKED: Allen Liu
ERP: 1212000071
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