LTM4623IY#PBF [Linear]

LTM4623 - Ultrathin 20VIN, 3A Step-Down DC/DC µModule (Power Module) Regulator; Package: BGA; Pins: 25; Temperature Range: -40°C to 85°C;
LTM4623IY#PBF
型号: LTM4623IY#PBF
厂家: Linear    Linear
描述:

LTM4623 - Ultrathin 20VIN, 3A Step-Down DC/DC µModule (Power Module) Regulator; Package: BGA; Pins: 25; Temperature Range: -40°C to 85°C

文件: 总28页 (文件大小:389K)
中文:  中文翻译
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LTM4623  
Ultrathin 20VIN, 3A Step-Down  
DC/DC µModule Regulator  
FeaTures  
DescripTion  
2
n
<2mm Height, Complete Solution in <1cm  
The LTM®4623 is a complete 3A step-down switching  
mode µModule (micromodule) regulator in a tiny ultrathin  
6.25mm×6.25mm×1.82mmLGAand6.25mm×6.25mm  
× 2.42mm BGA packages. Included in the package are the  
switching controller, power FETs, inductor and support  
components. Operating over an input voltage range of  
4V to 20V or 2.375V to 20V with an external bias supply,  
the LTM4623 supports an output voltage range of 0.6V to  
5.5V, set by a single external resistor. Its high efficiency  
designdelivers3Acontinuousoutputcurrent.Onlyceramic  
input and output capacitors are needed.  
2
(Single-Sided PCB) or 0.5cm (Dual-Sided PCB)  
Wide Input Voltage Range: 4V to 20V  
Input Voltage Down to 2.375V with External Bias  
0.6V to 5.5V Output Voltage  
n
n
n
n
n
n
n
n
n
n
n
n
n
3A DC Output Current  
1.5% Maximum TotalDC OutputVoltageError  
Current Mode Control, Fast Transient Response  
Low EMI EN55022 Class B Compliant  
External Frequency Synchronization  
Multiphase Operation with Current Sharing  
Output Voltage Tracking  
Selectable Discontinuous Mode  
Power Good Indicator  
Overvoltage, Overcurrent and Overtemperature Pro-  
tection  
The LTM4623 supports selectable discontinuous mode  
operation and output voltage tracking for supply rail se-  
quencing. Its high switching frequency and current mode  
control enable a very fast transient response to line and  
load changes without sacrificing stability.  
n
Ultrathin (6.25mm × 6.25mm × 1.82mm) LGA Package  
and (6.25mm × 6.25mm × 2.42mm) BGA Package  
Fault protection features include overvoltage, overcurrent  
and overtemperature protection.  
applicaTions  
The LTM4623 is available with SnPb (BGA) or RoHS  
compliant terminal finish.  
L, LT, LTC, LTM, µModule, Linear Technology and the Linear logo are registered trademarks  
and LTpowerCAD is a trademark of Linear Technology Corporation. All other trademarks are the  
property of their respective owners.  
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PCIe and Backside PCB Mounting  
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Telecom, Datacom, Networking and Industrial  
Equipment  
n
Data Storage Rack Units and Cards  
Typical applicaTion  
1.5V Output Efficiency vs Load Current  
3A, 1.5V Output DC/DC µModule® Step-Down Regulator  
95  
90  
85  
80  
75  
70  
65  
V
1.5V  
3A  
CLKIN  
CLKOUT  
OUT  
V
IN  
V
SV  
V
OUT  
IN  
4V TO 20V  
10µF  
25V  
47µF  
6.3V  
IN  
RUN  
INTV  
LTM4623  
PGOOD  
COMP  
FB  
CC  
MODE  
PHMODE  
TRACK/SS  
FREQ  
0.1µF  
40.2k  
V
V
= 5V  
IN  
IN  
GND SGND  
= 12V  
60  
1
2
0
0.5  
1.5  
2.5  
3
4623 TA01a  
LOAD CURRENT (A)  
4623 TA01b  
4623fc  
1
For more information www.linear.com/LTM4623  
LTM4623  
absoluTe MaxiMuM raTings  
pin conFiguraTion  
(Note 1)  
(See Pin Functions, Pin Configuration Table)  
V , SV .................................................... –0.3V to 22V  
IN  
IN  
TOP VIEW  
CLKOUT  
V
.................................................–0.3V to SV or 6V  
OUT  
IN  
CLKIN  
SV  
IN  
RUN ........................................................... –0.3V to 22V  
V
5
4
3
2
1
IN  
INTV ...................................................... –0.3V to 3.6V  
CC  
SGND  
FREQ  
MODE  
INTV  
PGOOD, MODE, TRACK/SS, FREQ,  
CC  
RUN  
PHMODE, CLKIN.................................. –0.3V to INTV  
GND  
PGOOD  
CC  
PHMODE  
TRACK/SS  
FB  
Internal Operating Junction Temperature Range  
V
OUT  
(Notes 2, 5)............................................ –40°C to 125°C  
Storage Temperature Range .................. –55°C to 125°C  
Peak Solder Reflow Body Temperature.................260°C  
COMP  
A
B
C
D
E
LGA PACKAGE 25-LEAD (6.25mm × 6.25mm × 1.82mm)  
BGA PACKAGE 25-LEAD (6.25mm × 6.25mm × 2.42mm)  
T
= 125°C, θ  
= 17°C/W, θ  
= 11°C/W,  
JMAX  
JCtop  
JCbottom  
θ
+ θ = 22°C/W, θ = 22°C/W,  
JB  
BA JA  
θ
DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS  
JA  
θ VALUES DETERMINED PER JESD51-12, WEIGHT = 0.5g  
http://www.linear.com/product/LTM4623#orderinfo  
orDer inForMaTion  
PART MARKING*  
PACKAGE  
TYPE  
MSL  
RATING  
TEMPERATURE RANGE  
(Note 2)  
PART NUMBER  
LTM4623EV#PBF  
LTM4623IV#PBF  
LTM4623EY#PBF  
LTM4623IY#PBF  
LTM4623IY  
PAD OR BALL FINISH  
Au (RoHS)  
DEVICE  
FINISH CODE  
LTM4623V  
LTM4623V  
LTM4623Y  
LTM4623Y  
LTM4623Y  
e4  
e4  
e1  
e1  
e0  
LGA  
LGA  
BGA  
BGA  
BGA  
3
3
3
3
3
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
Au (RoHS)  
SAC305 (RoHS)  
SAC305 (RoHS)  
SnPb (63/37)  
Consult Marketing for parts specified with wider operating temperature  
ranges. *Device temperature grade is indicated by a label on the shipping  
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.  
Recommended LGA and BGA PCB Assembly and Manufacturing  
Procedures:  
www.linear.com/umodule/pcbassembly  
Pb-free and Non-Pb-free Part Markings:  
www.linear.com/leadfree  
LGA and BGA Package and Tray Drawings:  
www.linear.com/packaging  
4623fc  
2
For more information www.linear.com/LTM4623  
LTM4623  
elecTrical characTerisTics The l denotes the specifications which apply over the full internal  
operating temperature range (Note 2), otherwise specifications are at TA = 25°C. VIN = SVIN = 12V per the typical application shown on  
the front page.  
SYMBOL  
PARAMETER  
CONDITIONS  
SV = V  
MIN  
4
TYP  
MAX  
20  
UNITS  
l
l
V
V
V
Input DC Voltage  
Output Voltage Range  
Output Voltage, Total  
V
V
IN  
IN  
IN  
0.6  
5.5  
OUT(RANGE)  
OUT(DC)  
C
= 22µF, C  
= 100µF Ceramic, R = 40.2k,  
CC OUT  
IN  
OUT FB  
Variation with Line and Load MODE = INTV , I  
= 0A to 3A (Note 3)  
l
–40°C to 125°C  
Rising  
RUN  
1.477  
1.1  
1.50  
1.2  
1.523  
1.3  
V
V
V
RUN Pin On Threshold  
V
RUN  
I
Input Supply Bias Current  
V
V
= 12V, V  
= 12V, V  
= 1.5V, MODE = INTV  
= 1.5V, MODE = GND  
6
2
11  
mA  
mA  
µA  
Q(SVIN)  
IN  
IN  
OUT  
OUT  
CC  
Shutdown, RUN = 0, V = 12V  
IN  
I
I
Input Supply Current  
V
V
= 12V, V  
= 12V, V  
= 1.5V, I  
= 1.5V  
= 3A  
OUT  
0.5  
A
A
S(VIN)  
IN  
IN  
OUT  
OUT  
Output Continuous Current  
Range  
0
3
OUT(DC)  
l
l
ΔV  
ΔV  
(Line)/V  
Line Regulation Accuracy  
Load Regulation Accuracy  
Output Ripple Voltage  
V
V
= 1.5V, V = 4V to 20V, I = 0A  
OUT  
0.04  
0.5  
5
0.15  
1.5  
%/V  
%
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
IN  
(Load)/V  
= 1.5V, I  
= 0A to 3A  
OUT  
OUT  
V
I
V
= 0A, C  
= 1.5V  
= 100µF Ceramic, V = 12V,  
mV  
OUT(AC)  
OUT  
IN  
OUT  
ΔV  
Turn-On Overshoot  
Turn-On Time  
I
= 0A, C  
= 100µF Ceramic, TRACK/SS = 0.01µF,  
= 1.5V  
30  
2.5  
80  
40  
mV  
ms  
mV  
µs  
OUT(START)  
OUT  
IN  
OUT  
V
= 12V, V  
OUT  
t
C
V
= 100µF Ceramic, No Load, TRACK/SS = 0.01µF,  
OUT  
= 12V, V  
START  
= 1.5V  
IN  
OUT  
ΔV  
Peak Deviation for Dynamic  
Load  
Load: 0% to 50% to 0% of Full Load, C  
Ceramic, V = 12V, V  
= 47µF  
= 47µF  
OUTLS  
OUT  
OUT  
= 1.5V  
IN  
OUT  
t
Settling Time for Dynamic  
Load Step  
Load: 0% to 50% to 0% of Full Load, C  
Ceramic, V = 12V, V = 1.5V  
SETTLE  
IN  
OUT  
I
Output Current Limit  
Voltage at FB Pin  
Current at FB Pin  
V
= 12V, V  
= 1.5V  
3.5  
5
A
V
OUTPK  
IN  
OUT  
OUT  
l
V
I
= 0A, V  
= 1.5V, –40°C to 125°C  
0.592  
0.60  
0.606  
30  
FB  
OUT  
I
(Note 4)  
nA  
kΩ  
FB  
R
Resistor Between V  
and  
OUT  
60.05  
2.4  
60.40  
2
60.75  
FBHI  
FB Pins  
I
Track Pin Soft-Start Pull-Up  
Current  
TRACK/SS = 0V  
4
µA  
TRACK/SS  
V
V
Undervoltage Lockout  
V
V
Falling, SV = V  
IN  
Hysteresis, SV = V  
2.6  
350  
2.8  
V
mV  
IN(UVLO)  
IN  
IN  
IN  
IN  
IN  
IN  
t
t
Minimum On-Time  
Minimum Off-Time  
PGOOD Trip Level  
(Note 4)  
(Note 4)  
40  
70  
ns  
ns  
ON(MIN)  
OFF(MIN)  
V
V
With Respect to Set Output  
Ramping Negative  
Ramping Positive  
PGOOD  
FB  
V
V
–15  
7
–10  
10  
–7  
15  
%
%
FB  
FB  
4623fc  
3
For more information www.linear.com/LTM4623  
LTM4623  
elecTrical characTerisTics The l denotes the specifications which apply over the full internal  
operating temperature range (Note 2), otherwise specifications are at TA = 25°C. VIN = SVIN = 12V per the typical application shown on  
the front page.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
2
UNITS  
µA  
I
PGOOD Leakage  
PGOOD Voltage Low  
PGOOD  
V
V
V
I
= 1mA  
PGOOD  
0.02  
3.3  
0.5  
1
0.1  
3.4  
V
PGL  
Internal V Voltage  
SV = 4V to 20V  
IN  
3.1  
V
INTVCC  
INTVCC  
OSC  
CC  
Load Reg INTV Load Regulation  
I
CC  
= 0mA to 20mA  
%
CC  
f
Oscillator Frequency  
FREQ = OPEN  
MHz  
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
Note 3: See output current derating curves for different V , V  
Note 4: 100% tested at wafer level.  
Note 5: This IC includes overtemperature protection that is intended  
to protect the device during momentary overload conditions. Junction  
temperature will exceed 125°C when overtemperature protection is active.  
Continuous operation above the specified maximum operating junction  
temperature may impair device reliability.  
and T .  
IN OUT A  
Note 2: The LTM4623 is tested under pulsed load conditions such that  
T ≈ T . The LTM4623E is guaranteed to meet performance specifications  
J
A
over the 0°C to 125°C internal operating temperature range. Specifications  
over the –40°C to 125°C internal operating temperature range are assured  
by design, characterization and correlation with statistical process  
controls. The LTM4623I is guaranteed to meet specifications over the  
full –40°C to 125°C internal operating temperature range. Note that the  
maximum ambient temperature consistent with these specifications is  
determined by specific operating conditions in conjunction with board  
layout, the rated package thermal resistance and other environmental  
factors.  
4623fc  
4
For more information www.linear.com/LTM4623  
LTM4623  
Typical perForMance characTerisTics  
Efficiency vs Load Current  
with 5VIN  
Efficiency vs Load Current  
with 12VIN  
Efficiency vs Load Current  
with 16VIN  
95  
90  
85  
80  
75  
70  
65  
60  
100  
95  
90  
85  
80  
75  
70  
65  
95  
90  
85  
80  
75  
70  
65  
60  
V
V
V
V
V
V
= 5V, 2MHz  
= 3.3V, 2MHz  
= 2.5V  
V
V
V
V
V
V
= 5V, 2MHz  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
V
V
V
V
V
= 3.3V, 2MHz  
= 2.5V  
= 3.3V, 2MHz  
= 2.5V  
OUT  
OUT  
OUT  
OUT  
OUT  
= 1.5V  
= 1.5V  
= 1.5V  
= 1.2V  
= 1.0V  
= 1.2V  
= 1.0V  
= 1.2V  
= 1.0V  
60  
1
0
2
3
4623 G03  
1
0
1
2
3
0
2
3
LOAD CURRENT (A)  
LOAD CURRENT (A)  
LOAD CURRENT (A)  
4623 G01  
4623 G02  
DCM Mode Efficiency with 12VIN,  
1.5VOUT  
1.2V Output Transient Response  
1.0V Output Transient Response  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
V
OUT  
OUT  
50mV/DIV  
50mV/DIV  
DCM  
AC-COUPLED  
AC-COUPLED  
CCM  
LOAD STEP  
1A/DIV  
LOAD STEP  
1A/DIV  
4623 G06  
4623 G05  
V
V
= 12V  
20µs/DIV  
V
V
= 12V  
20µs/DIV  
IN  
OUT  
IN  
OUT  
= 1.2V  
= 1.0V  
FREQ = 1MHz  
FREQ = 1MHz  
OUTPUT CAPACITOR = 1 × 47µF CERAMIC CAP  
LOAD STEP = 2A TO 3A WITH 1A/µS SLEW RATE  
FEED FORWARD CAP = 100pF  
OUTPUT CAPACITOR = 1 × 47µF CERAMIC CAP  
LOAD STEP = 2A TO 3A WITH 1A/µS SLEW RATE  
FEED FORWARD CAP = 100pF  
0.01  
0.1  
1
LOAD CURRENT (A)  
4623 G03  
1.5V Output Transient Response  
2.5V Output Transient Response  
1.8V Output Transient Response  
V
V
V
OUT  
OUT  
OUT  
50mV/DIV  
50mV/DIV  
50mV/DIV  
AC-COUPLED  
AC-COUPLED  
AC-COUPLED  
LOAD STEP  
1A/DIV  
LOAD STEP  
1A/DIV  
LOAD STEP  
1A/DIV  
4623 G07  
4623 G09  
4623 G08  
V
V
= 12V  
20µs/DIV  
V
V
= 12V  
20µs/DIV  
V
V
= 12V  
20µs/DIV  
IN  
OUT  
IN  
OUT  
IN  
OUT  
= 1.5V  
= 2.5V  
= 1.8V  
FREQ = 1MHz  
FREQ = 1MHz  
FREQ = 1MHz  
OUTPUT CAPACITOR = 1 × 47µF CERAMIC CAP  
LOAD STEP = 2A TO 3A WITH 1A/µS SLEW RATE  
FEED FORWARD CAP = 100pF  
OUTPUT CAPACITOR = 1 × 47µF CERAMIC CAP  
LOAD STEP = 2A TO 3A WITH 1A/µS SLEW RATE  
FEED FORWARD CAP = 100pF  
OUTPUT CAPACITOR = 1 × 47µF CERAMIC CAP  
LOAD STEP = 2A TO 3A WITH 1A/µS SLEW RATE  
FEED FORWARD CAP = 100pF  
4623fc  
5
For more information www.linear.com/LTM4623  
LTM4623  
Typical perForMance characTerisTics  
3.3V Output Transient Response  
5V Output Transient Response  
Start-Up with No Load Applied  
V
V
OUT  
OUT  
I
IN  
50mV/DIV  
50mV/DIV  
0.5A/DIV  
AC-COUPLED  
AC-COUPLED  
V
OUT  
LOAD STEP  
1A/DIV  
LOAD STEP  
1A/DIV  
0.5V/DIV  
4623 G10  
4623 G11  
4623 G12  
V
V
= 12V  
20µs/DIV  
V
V
= 12V  
OUT  
FREQ = 1MHz  
20µs/DIV  
IN  
OUT  
IN  
V
V
= 12V  
5ms/DIV  
IN  
OUT  
= 3.3V  
= 5V  
= 1.5V  
FREQ = 1MHz  
FREQ = 1MHz  
OUTPUT CAPACITOR = 1 × 47µF CERAMIC CAP  
LOAD STEP = 2A TO 3A WITH 1A/µS SLEW RATE  
FEED FORWARD CAP = 100pF  
OUTPUT CAPACITOR = 1 × 47µF CERAMIC CAP  
LOAD STEP = 2A TO 3A WITH 1A/µS SLEW RATE  
FEED FORWARD CAP = 100pF  
INPUT CAPACITOR = 1 × 22µF CERAMIC CAP  
OUTPUT CAPACITOR = 1 × 47µF CERAMIC CAP  
SOFT START = 0.1µF  
Short Circuit with No Load  
Applied  
Short Circuit with 3A Load  
Applied  
Start-Up with 3A Load Applied  
I
IN  
I
I
IN  
0.5A/DIV  
IN  
0.5A/DIV  
0.5A/DIV  
V
OUT  
0.5V/DIV  
V
OUT  
0.5V/DIV  
V
OUT  
0.5V/DIV  
4623 G14  
4623 G15  
4623 G13  
V
V
= 12V  
5ms/DIV  
V
V
= 12V  
20µs/DIV  
V
V
= 12V  
5ms/DIV  
IN  
OUT  
IN  
OUT  
IN  
OUT  
= 1.5V  
= 1.5V  
= 1.5V  
FREQ = 1MHz  
FREQ = 1MHz  
FREQ = 1MHz  
INPUT CAPACITOR = 1 × 22µF CERAMIC CAP  
OUTPUT CAPACITOR = 1 × 47µF CERAMIC CAP  
INPUT CAPACITOR = 1 × 22µF CERAMIC CAP  
OUTPUT CAPACITOR = 1 × 47µF CERAMIC CAP  
INPUT CAPACITOR = 1 × 22µF CERAMIC CAP  
OUTPUT CAPACITOR = 1 × 47µF CERAMIC CAP  
SOFT START = 0.1µF  
Short Circuit with 3A Load  
Applied  
Start into Pre-Biased Output  
Output Ripple  
V
IN  
2V/DIV  
I
IN  
0.5A/DIV  
V
OUT  
V
OUT  
5mV/DIV  
V
OUT  
0.5V/DIV  
AC-COUPLED  
1V/DIV  
PRE-BIASED V  
= 2.5V  
OUT  
4623 G16  
4623 G18  
4623 G17  
V
V
= 12V  
20µs/DIV  
V
V
= 12V  
= 5V  
500ns/DIV  
= 2.5V  
V
V
= 12V  
= 5V  
500ns/DIV  
IN  
OUT  
IN  
OUT  
IN  
OUT  
FREQ = 1MHz  
= 1.5V  
FREQ = 1MHz  
FREQ = 1MHz  
PRE-BIASED V  
INPUT CAPACITOR = 1 × 22µF CERAMIC CAP  
OUTPUT CAPACITOR = 1 × 47µF CERAMIC CAP  
INPUT CAPACITOR = 1 × 22µF CERAMIC CAP  
OUTPUT CAPACITOR = 1 × 47µF CERAMIC CAP  
OUT  
INPUT CAPACITOR = 1 × 22µF CERAMIC CAP  
OUTPUT CAPACITOR = 1 × 47µF CERAMIC CAP  
4623fc  
6
For more information www.linear.com/LTM4623  
LTM4623  
pin FuncTions  
PACKAGE ROW AND COLUMN LABELING MAY VARY  
SGND (B4): Signal Ground Connection. Tie to GND with  
minimum distance. Connect FREQ resistor, COMP com-  
ponent, MODE, TRACK/SS component, FB resistor to this  
pin as needed.  
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE  
LAYOUT CAREFULLY.  
COMP(A1):CurrentControlThresholdandErrorAmplifier  
CompensationPoint.Thecurrentcomparator’stripthresh-  
old is linearly proportional to this voltage, whose normal  
range is from 0.3V to 1.8V. Tie the COMP pins together for  
parallel operation. The device is internally compensated.  
This is an output pin. Do not force a voltage on this pin.  
V
(C1, D1-D2, E1-E2): Power Output Pins. Apply out-  
OUT  
put load between these pins and GND pins. Recommend  
placing output decoupling capacitance directly between  
these pins and GND pins.  
PGOOD (C2): Output Power Good with Open-Drain Logic.  
PGOOD is pulled to ground when the voltage on the FB pin  
is not within 10% of the internal 0.6V reference.  
TRACK/SS (A2): Output Tracking and Soft-Start Input.  
Allows the user to control the rise time of the output volt-  
age. Putting a voltage below 0.6V on this pin bypasses the  
internal reference input to the error amplifier, and servos  
the FB pin to match the TRACK/SS voltage. Above 0.6V,  
the tracking function stops and the internal reference  
resumes control of the error amplifier. There’s an internal  
MODE (C4): Operation Mode Select. Tie this pin to INTV  
CC  
to force continuous synchronous operation at all output  
loads. Tying it to SGND enables discontinuous mode  
operation at light loads. Do not leave floating.  
2µA pull-up current from INTV on this pin, so putting a  
capacitor here provides a soft-start function.  
CC  
SV (C5): Signal V . Input voltage to the on-chip 3.3V  
IN  
IN  
regulator. Tie this pin to the V pin in most applications.  
IN  
Otherwise connect SV to an external voltage supply of  
RUN (A3): Run Control Input of the Switching Mode  
Regulator. Enables chip operation by tying RUN above  
1.2V. Pulling it below 1.1V shuts down the part. Do not  
leave floating.  
IN  
at least 4V which must also be greater than V  
.
OUT  
V
(D5, E5): Power Input Pins. Apply input voltage be-  
IN  
tween these pins and GND pins. Recommend placing  
input decoupling capacitance directly between V pins  
and GND pins.  
FREQ (A4): Frequency is set internally to 1MHz. An ex-  
IN  
ternal resistor can be placed from this pin to SGND to  
increase frequency, or from this pin to INTV to reduce  
CC  
INTV (E4): Internal 3.3V Regulator Output. The internal  
CC  
frequency. See the Applications Information section for  
power drivers and control circuits are powered from this  
voltage. This pin is internally decoupled to GND with a  
1µF low ESR ceramic capacitor.  
frequency adjustment.  
FB(B1):TheNegativeInputoftheErrorAmplifier.Internally,  
this pin is connected to V  
with a 60.4k precision resis-  
OUT  
CLKIN (A5): External Synchronization Input to Phase  
Detector of the Switching Mode Regulator. This pin is  
internally terminated to SGND with 20k. The phase-locked  
loop will force the top power NMOS’s turn-on signal to  
be synchronized with the rising edge of the CLKIN signal.  
tor. Different output voltages can be programmed with an  
additional resistor between the FB and SGND pins. Tying  
the FB pins together allows for parallel operation. See the  
Applications Information section for details.  
PHMODE (B2): Control Input to Phase Selector of the  
Switching Mode Regulator Channel. This pin determines  
the phase relationship between internal oscillator and  
CLKOUT (B5): Output Clock Signal for PolyPhase Op-  
eration of the Switching Mode Regulator. The phase of  
CLKOUT with respect to CLKIN is determined by the state  
of the PHMODE pin. CLKOUT’s peak-to-peak amplitude  
CLKOUT signal. Tie it to INTV for 2-phase operation, tie  
CC  
it to SGND for 3-phase operation, and tie it to INTV /2  
CC  
is INTV to GND. This is an output pin. Do not force a  
CC  
for 4-phase operation.  
voltage on this pin.  
GND (B3, C3, D3-D4, E3): Power Ground Pins for Both  
Input and Output Returns.  
4623fc  
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For more information www.linear.com/LTM4623  
LTM4623  
block DiagraM  
V
OUT  
60.4k  
10k  
PGOOD  
FB  
INTV  
CC  
R
FB  
SV  
IN  
IN  
40.2k  
INTV  
CC  
V
V
IN  
1µF  
4V TO 20V  
C
IN  
0.1µF  
10µF  
CLKIN  
CLKOUT  
PHMODE  
MODE  
1µH  
V
1.5V  
3A  
V
OUT  
OUT  
POWER CONTROL  
C
OUT  
1µF  
GND  
47µF  
TRACK/SS  
RUN  
0.1µF  
COMP  
INTERNAL  
COMP  
INTERNAL  
FILTER  
162k  
FREQ  
SGND  
4623 BD  
Figure 1. Simplified LTM4623 Block Diagram  
Decoupling requireMenTs  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
C
C
External Input Capacitor Requirement  
I
= 3A  
4.7  
10  
µF  
IN  
OUT  
(V = 4V to 20V, V  
= 1.5V)  
IN  
OUT  
External Output Capacitor Requirement  
(V = 4V to 20V, V = 1.5V)  
I
= 3A  
22  
47  
µF  
OUT  
OUT  
IN  
OUT  
4623fc  
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For more information www.linear.com/LTM4623  
LTM4623  
operaTion  
TheLTM4623isastandalonenonisolatedswitchmodeDC/  
DC power supply. It can deliver up to 3A DC output current  
withfewexternalinputandoutputcapacitors.Thismodule  
provides precisely regulated output voltage adjustable  
between 0.6V to 5.5V via one external resistor over a 4V  
to 20V input voltage range. With an external bias supply  
comparators pull the open-drain PGOOD output low if the  
output feedback voltage exits a 10% window around the  
regulationpoint.ContinuousoperationisforcedduringOV  
and UV condition except during start-up when the TRACK  
pin is ramping up to 0.6V.  
Furthermore,inordertoprotecttheinternalpowerMOSFET  
devices against transient voltage spikes, the LTM4623  
above 4V connected to SV , this module operates with  
IN  
an input voltage down to 2.375V. The typical application  
constantly monitors the V pin for an overvoltage condi-  
IN  
schematic is shown in Figure 24.  
tion. When V rises above 23.5V, the regulator suspends  
IN  
The LTM4623 contains an integrated constant on-time  
valley current mode regulator, power MOSFETs, inductor,  
and other supporting discrete components. The default  
switchingfrequencyis1MHz.Foroutputvoltagesbetween  
3.3Vand5.5V,anexternal162kresistorisrequiredbetween  
FREQ and SGND pins to set the operating frequency to  
2MHz to optimize inductor current ripple. For switching  
noise-sensitive applications, the switching frequency can  
beadjustedbyexternalresistorsandtheμModuleregulator  
can be externally synchronized to a clock within 30% of  
thesetfrequency.SeetheApplicationsInformationsection.  
operation by shutting off both power MOSFETs. Once V  
IN  
drops below 21.5V, the regulator immediately resumes  
normal operation. The regulator does not execute its  
soft-start function when exiting an overvoltage condition.  
Multiphase operation can be easily employed with the  
synchronizationandphasemodecontrols.Upto12phases  
can be cascaded to run simultaneously with respect to  
each other by programming the PHMODE pin to different  
levels. The LTM4623 has CLKIN and CLKOUT pins for  
PolyPhase operation of multiple devices or frequency  
synchronization.  
With current mode control and internal feedback loop  
compensation, the LTM4623 module has sufficient stabil-  
ity margins and good transient performance with a wide  
range of output capacitors, even with all ceramic output  
capacitors.  
Pulling the RUN pin below 1.1V forces the controller into  
its shutdown state, turning off both power MOSFETs  
and most of the internal control circuitry. At light load  
currents, discontinuous mode (DCM) operation can be  
enabled to achieve higher efficiency compared to continu-  
ous mode (CCM) by pulling the MODE pin to SGND. The  
TRACK/SS pin is used for power supply tracking and  
soft-start programming. See the Applications Informa-  
tion section.  
Current mode control provides cycle-by-cycle fast cur-  
rent limiting. Foldback current limiting is provided in an  
overcurrent condition indicated by a drop in V reducing  
FB  
inductor valley current to approximately 40% of the origi-  
nal value. Internal output overvoltage and undervoltage  
4623fc  
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For more information www.linear.com/LTM4623  
LTM4623  
applicaTions inForMaTion  
The typical LTM4623 application circuit is shown in  
Figure 24. External component selection is primarily  
determined by the input voltage, the output voltage and  
the maximum load current. Refer to Table 7 for specific  
externalcapacitorrequirementsforaparticularapplication.  
For parallel operation of N-channels LTM4623, tie all the  
FB pins together and use the following equation to solve  
for R :  
FB  
0.6V  
VOUT 0.6V  
60.4k  
N
RFB =  
V to V  
Step-Down Ratios  
IN  
OUT  
There are restrictions in the maximum V and V  
step-  
Input Decoupling Capacitors  
IN  
OUT  
down ratios that can be achieved for a given input voltage  
due to the minimum off-time and minimum on-time limits  
of the regulator. The minimum off-time limit imposes a  
maximum duty cycle which can be calculated as:  
The LTM4623 module should be connected to a low AC  
impedance DC source. For the regulator, a 10µF input  
ceramic capacitor is required for RMS ripple current de-  
coupling. Bulk input capacitance is only needed when the  
inputsourceimpedanceiscompromisedbylonginductive  
leads, traces or not enough source capacitance. The bulk  
capacitor can be an aluminum electrolytic capacitor or  
polymer capacitor.  
D
= 1 – (t  
f  
)
MAX  
OFF(MIN) SW  
where t  
is the minimum off-time, typically 70ns  
OFF(MIN)  
for LTM4623, and f (Hz) is the switching frequency.  
SW  
Converselytheminimumon-timelimitimposesaminimum  
duty cycle of the converter which can be calculated as:  
Without considering the inductor ripple current, the RMS  
current of the input capacitor can be estimated as:  
D
MIN  
= t  
f  
ON(MIN) SW  
IOUT(MAX)  
where t  
is the minimum on-time, typically 40ns  
ON(MIN)  
ICIN(RMS)  
=
D(1D)  
for LTM4623. In the rare cases where the minimum duty  
cycle is surpassed, the output voltage will still remain  
in regulation, but the switching frequency will decrease  
from its programmed value. Note that additional thermal  
derating may be applied. See the Thermal Considerations  
and Output Current Derating section in this data sheet.  
η%  
whereη%istheestimatedefficiencyofthepowermodule.  
Output Decoupling Capacitors  
Withanoptimizedhighfrequency, highbandwidthdesign,  
only a single low ESR output ceramic capacitor is required  
for the LTM4623 to achieve low output ripple voltage and  
very good transient response. Additional output filtering  
mayberequiredbythesystemdesigneriffurtherreduction  
of output ripple or dynamic transient spikes is required.  
Table 7 shows a matrix of different output voltages and  
output capacitors to minimize the voltage droop and  
overshoot during a 1A load-step transient. The Linear  
Technology LTpowerCAD™ design tool is available to  
download online for output ripple, stability and transient  
response analysis for further optimization.  
Output Voltage Programming  
ThePWMcontrollerhasaninternal0.6Vreferencevoltage.  
As shown in the Block Diagram, a 60.4k internal feedback  
resistor connects the V  
and FB pins together. Adding a  
OUT  
resistor, R , from FB pin to SGND programs the output  
FB  
voltage:  
0.6V  
OUT 0.6V  
RFB =  
60.4k  
V
Table 1. RFB Resistor Table vs Various Output Voltages  
Discontinuous Current Mode (DCM)  
V
(V)  
0.6  
1.0  
1.2  
1.5  
1.8  
2.5  
3.3  
5.0  
OUT  
R
(kΩ) OPEN 90.9 60.4 40.2 30.1 19.1 13.3 8.25  
FB  
Inapplicationswherelowoutputrippleandhighefficiency  
at intermediate current are desired, discontinuous current  
mode (DCM) should be used by connecting the MODE pin  
Pease note that for 3.3V and 5V output, a higher operating frequency  
(2MHz) is required to optimize inductor current ripple. See Operating  
Frequency section.  
4623fc  
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For more information www.linear.com/LTM4623  
LTM4623  
applicaTions inForMaTion  
to SGND. At light loads the internal current comparator  
may remain tripped for several cycles and force the top  
MOSFETtostayoffforseveralcycles,thusskippingcycles.  
The inductor current does not reverse in this mode.  
The programmable operating frequency range is from  
800kHz to 4MHz.  
Please note a minimum switching frequency is required  
for given V , V  
operating conditions to keep a maxi-  
IN OUT  
mum peak-to-peak inductor ripple current below 2A for  
Forced Continuous Current Mode (CCM)  
the LTM4623.  
In applications where fixed frequency operation is more  
critical than low current efficiency, and where the lowest  
outputrippleisdesired,forcedcontinuousoperationshould  
be used. Forced continuous operation can be enabled by  
Thepeak-to-peakinductorripplecurrentcanbecalculated  
as:  
VOUT  
1
ΔIP-P = VOUT 1−  
tyingtheMODEpintoINTV .Inthismode,inductorcurrent  
CC  
V
fSW(MHz)  
IN  
is allowed to reverse during low output loads, the COMP  
voltage is in control of the current comparator threshold  
throughout,andthetopMOSFETalwaysturnsonwitheach  
oscillator pulse. During start-up, forced continuous mode  
is disabled and inductor current is prevented from revers-  
ing until the LTM4623’s output voltage is in regulation.  
The maximum 2A peak-to-peak inductor ripple current  
is enforced due to the nature of the valley current mode  
control to maintain output voltage regulation at no load.  
Frequency Synchronization and Clock In  
The power module has a phase-locked loop comprised  
of an internal voltage controlled oscillator and a phase  
detector.ThisallowstheinternaltopMOSFETturn-ontobe  
lockedtotherisingedgeoftheexternalclock. Theexternal  
clock frequency range must be within 30% around the  
set operating frequency. A pulse detection circuit is used  
to detect a clock on the CLKIN pin to turn on the phase-  
locked loop. The pulse width of the clock has to be at least  
100ns. The clock high level must be above 2V and clock  
low level below 0.3V. During the start-up of the regulator,  
the phase-locked loop function is disabled.  
Operating Frequency  
The operating frequency of the LTM4623 is optimized to  
achieve the compact package size and the minimum out-  
put ripple voltage while still keeping high efficiency. The  
default operating frequency is internally set to 1MHz. In  
most applications, no additional frequency adjusting is  
required.  
If any operating frequency other than 1MHz is required  
by application, the operating frequency can be increased  
by adding a resistor, RFSET, between the FREQ pin and  
SGND, as shown in Figure 28. The operating frequency  
can be calculated as:  
Multiphase Operation  
For output loads that demand more than 3A of current,  
multiple LTM4623s can be paralleled to run out of phase  
to provide more output current without increasing input  
and output voltage ripples.  
1.6e11  
162k ||RFSET(Ω)  
f(Hz)=  
To reduce switching current ripple, 2MHz operating fre-  
quencyisrequiredfor3.3Vto5.5VoutputwithR  
to SGND.  
=162k  
The CLKOUT signal can be connected to the CLKIN pin of  
thefollowingLTM4623stagetolineupboththefrequency  
and the phase of the entire system. Tying the PHMODE pin  
FSET  
The operating frequency can also be decreased by adding  
aresistorbetweentheFREQpinandINTV ,calculatedas:  
to INTVCC, SGND or INTV /2 generates a phase differ-  
CC  
CC  
ence (between CLKIN and CLKOUT) of 180°, 120°, or 90°  
respectively, which corresponds to 2-phase, 3-phase or  
4-phase operation. A total of 12 phases can be cascaded  
2.8e11  
RFSET(Ω)  
f(Hz)= 1MHz −  
4623fc  
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For more information www.linear.com/LTM4623  
LTM4623  
applicaTions inForMaTion  
0
90  
180  
270  
+90  
+90  
+90  
CLKIN CLKOUT  
CLKIN CLKOUT  
CLKIN CLKOUT  
CLKIN CLKOUT  
INTV /2  
INTV /2  
CC  
INTV /2  
CC  
INTV /2  
CC  
PHMODE  
PHASE 1  
PHMODE  
PHASE 2  
PHMODE  
PHASE 3  
PHMODE  
PHASE 4  
CC  
(420)  
60  
0
120  
240  
180  
300  
+120  
+120  
+180  
+120  
+120  
CLKIN CLKOUT  
CLKIN CLKOUT  
CLKIN CLKOUT  
CLKIN CLKOUT  
CLKIN CLKOUT  
CLKIN CLKOUT  
PHMODE  
PHASE 1  
PHMODE  
PHASE 3  
INTV  
PHMODE  
PHASE 5  
PHMODE  
PHASE 2  
PHMODE  
PHASE 4  
INTV  
PHMODE  
PHASE 6  
CC  
CC  
4623 F02  
Figure 2. 4-Phase, 6-Phase Operation  
0.60  
0.55  
0.50  
0.45  
0.40  
0.35  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
1 PHASE  
2 PHASE  
3 PHASE  
4 PHASE  
6 PHASE  
0
0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7 0.75 0.8 0.85 0.9  
DUTY FACTOR (V /V  
)
OUT IN  
4623 F03  
Figure 3. RMS Input Ripple Current to DC Load Current Ratio as a Function of Duty Cycle  
to run simultaneously out-of-phase with respect to each  
other by programming the PHMODE pin of each LTM4623  
to different levels. Figure 2 shows a 4-phase design and  
a 6-phase design example for clock phasing.  
A multiphase power supply significantly reduces the  
amount of ripple current in both the input and output ca-  
pacitors. The RMS input ripple current is reduced by, and  
the effective ripple frequency is multiplied by, the number  
of phases used (assuming that the input voltage is greater  
thanthenumberofphasesusedtimestheoutputvoltage).  
Theoutputrippleamplitudeisalsoreducedbythenumber  
of phases used when all of the outputs are tied together  
to achieve a single high output current design.  
Table 2. PHMODE Pin Status and Corresponding Phase  
Relationship (Relate to CLKIN)  
PHASMD  
INTV  
SGND  
INTV /2  
CC  
CC  
CLKOUT  
180°  
120°  
90°  
4623fc  
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For more information www.linear.com/LTM4623  
LTM4623  
applicaTions inForMaTion  
The LTM4623 device is an inherently current mode con-  
trolled device, so parallel modules will have very good  
current sharing. This will balance the thermals on the  
design. Please tie the RUN, TRACK/SS, FB and COMP pins  
of each paralleling module together. Figure 26 shows an  
example of parallel operation and pin connection.  
rate of the output voltage. An internal 2µA current source  
will charge up the external soft-start capacitor towards  
INTV voltage. When the TRACK/SS voltage is below  
CC  
0.6V, it will take over the internal 0.6V reference voltage  
to control the output voltage. The total soft-start time can  
be calculated as:  
CSS  
2µA  
Input RMS Ripple Current Cancellation  
t
SS = 0.6 •  
Application Note 77 provides a detailed explanation of  
multiphase operation. The input RMS ripple current can-  
cellation mathematical derivations are presented, and a  
graph is displayed representing the RMS ripple current  
reductionasafunctionofthenumberofinterleavedphases.  
Figure 3 shows this graph.  
where C is the capacitance on the TRACK/SS pin. Cur-  
rent foldback and forced continuous mode are disabled  
during the soft-start process.  
SS  
Outputvoltagetrackingcanalsobeprogrammedexternally  
using the TRACK/SS pin. The output can be tracked up  
and down with another regulator. Figure 4 and Figure 5  
show an example waveform and schematic of ratiometric  
tracking where the slave regulator’s output slew rate is  
proportional to the master’s.  
Soft-Start And Output Voltage Tracking  
The TRACK/SS pin provides a means to either soft start  
the regulator or track it to a different power supply. A  
capacitor on the TRACK/SS pin will program the ramp  
MASTER OUTPUT  
SLAVE OUTPUT  
TIME  
4623 F04  
Figure 4. Output Ratiometric Tracking Waveform  
V
IN  
4V TO 15V  
CLKIN FREQ CLKOUT  
CLKIN FREQ CLKOUT  
V
1.5V  
3A  
V
1.2V  
3A  
OUT(MA)  
OUT(SL)  
V
V
V
IN  
V
IN  
OUT  
OUT  
10µF  
16V  
47µF  
6.3V  
10µF  
16V  
47µF  
6.3V  
SV  
SV  
IN  
IN  
RUN LTM4623  
INTV  
RUN LTM4623  
INTV  
CC  
CC  
R
TR(TOP)  
60.4k  
MODE  
MODE  
TRACK/SS  
PGOOD  
FB  
COMP  
SGND  
TRACK/SS  
PGOOD  
FB  
COMP  
SGND  
R
TR(BOT)  
C
SS  
R
R
FB(SL)  
60.4k  
FB(MA)  
40.2k  
GND  
GND  
40.2k  
4623 F05  
Figure 5. Example Schematic of Ratiometric Output Voltage Tracking  
4623fc  
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LTM4623  
applicaTions inForMaTion  
Since the slave regulator’s TRACK/SS is connected to  
The TRACK/SS pin will have the 2µA current source on  
when a resistive divider is used to implement tracking  
on the slave regulator. This will impose an offset on the  
TRACK/SSpininput.Smallervalueresistorswiththesame  
ratios as the resistor values calculated from the above  
equation can be used. For example, where the 60.4k is  
used then a 6.04k can be used to reduce the TRACK/SS  
pin offset to a negligible value.  
the master’s output through a R  
/R  
resistor  
TR(TOP) TR(BOT)  
divider and its voltage used to regulate the slave output  
voltage when TRACK/SS voltage is below 0.6V, the slave  
outputvoltageandthemasteroutputvoltageshouldsatisfy  
the following equation during start-up:  
RFB(SL)  
VOUT(SL)  
=
R
FB(SL) +60.4k  
RTR(BOT)  
TR(TOP) +RTR(BOT)  
The coincident output tracking can be recognized as a  
special ratiometric output tracking in which the master’s  
output slew rate (MR) is the same as the slave’s output  
slew rate (SR), waveform as shown in Figure 6.  
VOUT(MA)  
R
The R  
TR(BOT)  
is the feedback resistor and the R  
/
TR(TOP)  
From the equation, we could easily find that, in coincident  
tracking,theslaveregulator’sTRACK/SSpinresistordivider  
is always the same as its feedback divider:  
FB(SL)  
R
is the resistor divider on the TRACK/SS pin of  
the slave regulator, as shown in Figure 5.  
Following the previous equation, the ratio of the master’s  
output slew rate (MR) to the slave’s output slew rate (SR)  
is determined by:  
RFB(SL)  
FB(SL) +60.4k  
RTR(BOT)  
=
R
R
TR(TOP) +RTR(BOT)  
For example, R  
= 60.4k and R  
= 60.4k is a  
TR(TOP)  
TR(BOT)  
RFB(SL)  
good combination for coincident tracking for a V  
OUT(MA)  
R
FB(SL) +60.4k  
= 1.5V and V  
= 1.2V application.  
MR  
SR  
OUT(SL)  
=
RTR(BOT)  
Power Good  
R
TR(TOP) +RTR(BOT)  
The PGOOD pin is an open-drain pin that can be used to  
monitor valid output voltage regulation. This pin is pulled  
low when the output voltage exceeds a 10% window  
around the regulation point. To prevent unwanted PGOOD  
Forexample,V  
=1.5V,MR=1.5V/1msandV  
OUT(SL)  
OUT(MA)  
= 1.2V, SR = 1.2V/1ms. From the equation, we could solve  
that R = 60.4k and R = 40.2k are a good  
TR(TOP)  
TR(BOT)  
glitches during transients or dynamic V  
changes, the  
combination for the ratiometric tracking.  
OUT  
LTM4623’s PGOOD falling edge includes a blanking delay  
of approximately 52 switching cycles.  
MASTER OUTPUT  
Stability Compensation  
TheLTM4623’sinternalcompensationloopisdesignedand  
optimizedforusewithlowESRceramicoutputcapacitors.  
Table 7 is provided for most application requirements. In  
case more phase margin is required for the application,  
SLAVE OUTPUT  
an additional 100pF feedforward capacitor (C ) can be  
FF  
placed between the V  
and FB pins. The LTpowerCAD  
OUT  
design tool is available for control loop optimization.  
TIME  
4623 F06  
Figure 6. Output Coincident Tracking Waveform  
4623fc  
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For more information www.linear.com/LTM4623  
LTM4623  
applicaTions inForMaTion  
RUN Enable  
Overtemperature Protection  
Pulling the RUN pin to ground forces the LTM4623 into  
its shutdown state, turning off both power MOSFETs and  
most of its internal control circuitry. Bringing the RUN pin  
above 0.7V turns on the internal reference only, while still  
keeping the power MOSFETs off. Increasing the RUN pin  
voltage above 1.2V will turn on the entire chip.  
The internal overtemperature protection monitors the  
junction temperature of the module. If the junction  
temperature reaches approximately 160°C, both power  
switches will be turned off until the temperature drops  
about 15°C cooler.  
Radiated EMI Noise  
Low Input Application  
High radiated EMI noise is a disadvantage for switching  
regulators by nature. Fast switching turn-on and turn-off  
make the large di/dt change in the converters, which act  
as the radiation sources in most systems. LTM4623 in-  
tegrates the feature to minimize the radiated EMI noise to  
meet the most applications with low noise requirements.  
It is fully compliant with the EN55022 Class B Standard.  
TheLTM4623modulehasaseparateSVIN pinwhichmakes  
itsuitableforlowinputvoltageapplicationsdownto2.375V.  
TheSVIN pinisthesingleinputofthewholecontrolcircuitry  
while the VIN pin is the power input which directly connects  
to the drain of the top MOSFET. In most applications where  
VIN is greater than 4V, connect SVIN directly to VIN with a  
short trace. An optional filter, consisting of a resistor (1Ω  
to 10Ω) between SVIN and VIN along with a 0.1µF bypass  
capacitor between SVIN and ground, can be placed for  
additional noise immunity. This filter is not necessary in  
most cases if good PCB layout practices are followed (see  
Figure 23). In a low input voltage application (2.375V to  
4V), connect SVIN to an external voltage higher than 4V  
with 1µF local bypass capacitor. See Operating Frequency  
section. Figure 25 shows an example of a low input voltage  
application. Please note the SVIN voltage cannot go below  
the VOUT voltage.  
Thermal Considerations and Output Current Derating  
The thermal resistances reported in the Pin Configuration  
section of the data sheet are consistent with those param-  
eters defined by JESD 51-12 and are intended for use with  
finite element analysis (FEA) software modeling tools that  
leverage the outcome of thermal modeling, simulation,  
and correlation to hardware evaluation performed on a  
µModule package mounted to a hardware test board.  
The motivation for providing these thermal coefficients is  
found in JESD 51-12 (Guidelines for Reporting and Using  
Electronic Package Thermal Information).  
Pre-Biased Output Start-Up  
Many designers may opt to use laboratory equipment  
and a test vehicle such as the demo board to anticipate  
the µModule regulator’s thermal performance in their ap-  
plicationatvariouselectricalandenvironmentaloperating  
conditions to compliment any FEA activities. Without FEA  
software, the thermal resistances reported in the Pin Con-  
figurationsectionare,inandofthemselves,notrelevantto  
providing guidance of thermal performance; instead, the  
derating curves provided in this data sheet can be used  
in a manner that yields insight and guidance pertaining to  
one’s application usage, and can be adapted to correlate  
thermal performance to one’s own application.  
There may be situations that require the power supply to  
start up with a pre-bias on the output capacitors. In this  
case, it is desirable to start up without discharging that  
output pre-bias. The LTM4623 can safely power up into  
a pre-biased output without discharging it.  
TheLTM4623accomplishesthisbyforcingdiscontinuous  
mode (DCM) operation until the TRACK/SS pin voltage  
reaches 0.6V reference voltage. This will prevent the BG  
from turning on during the pre-biased output start-up  
which would discharge the output.  
Please do not pre-bias LTM4623 with a voltage higher  
than INTVCC (3.3V) voltage or a voltage higher than the  
output voltage set by the feedback resistor (RFB).  
4623fc  
15  
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LTM4623  
applicaTions inForMaTion  
The Pin Configuration section gives four thermal coeffi-  
cients explicitly defined in JESD 51-12; these coefficients  
are quoted or paraphrased next:  
4. θ , the thermal resistance from junction to the printed  
JB  
circuitboard,isthejunction-to-boardthermalresistance  
where almost all of the heat flows through the bottom  
oftheµModulepackageandintotheboard, andisreally  
1. θ , the thermal resistance from junction to ambient, is  
JA  
the sum of the θ  
and the thermal resistance of  
JCbottom  
the natural convection junction-to-ambient air thermal  
resistance measured in a one cubic foot sealed enclo-  
sure. This environment is sometimes referred to as  
“still air” although natural convection causes the air to  
move. This value is determined with the part mounted  
to a 95mm × 76mm PCB with four layers.  
the bottom of the part through the solder joints and  
through a portion of the board. The board temperature  
is measured a specified distance from the package.  
A graphical representation of the aforementioned ther-  
mal resistances is given in Figure 7; blue resistances are  
contained within the μModule regulator, whereas green  
resistances are external to the µModule package.  
2. θ  
, the thermal resistance from junction to the  
JCbottom  
bottom of the product case, is determined with all of  
the component power dissipation flowing through the  
bottomofthepackage.InthetypicalµModuleregulator,  
the bulk of the heat flows out the bottom of the pack-  
age, but there is always heat flow out into the ambient  
environment. As a result, this thermal resistance value  
may be useful for comparing packages, but the test  
conditionsdon’tgenerallymatchtheuser’sapplication.  
As a practical matter, it should be clear to the reader that  
no individual or sub-group of the four thermal resistance  
parameters defined by JESD 51-12 or provided in the  
Pin Configuration section replicates or conveys normal  
operating conditions of a μModule regulator. For example,  
in normal board-mounted applications, never does 100%  
of the device’s total power loss (heat) thermally conduct  
exclusively through the top or exclusively through bot-  
tom of the µModule package—as the standard defines  
3. θ  
, the thermal resistance from junction to top of  
JCtop  
the product case, is determined with nearly all of the  
componentpowerdissipationflowingthroughthetopof  
the package. As the electrical connections of the typical  
µModule regulator are on the bottom of the package, it  
is rare for an application to operate such that most of  
the heat flows from the junction to the top of the part.  
for θ  
and θ , respectively. In practice, power  
JCbottom  
JCtop  
loss is thermally dissipated in both directions away from  
the package—granted, in the absence of a heat sink and  
airflow, a majority of the heat flow is into the board.  
Within the LTM4623 be aware there are multiple power  
devices and components dissipating power, with a con-  
sequence that the thermal resistances relative to different  
junctions of components or die are not exactly linear with  
As in the case of θ  
, this value may be useful  
JCbottom  
for comparing packages but the test conditions don’t  
generally match the user’s application.  
JUNCTION-TO-AMBIENT THERMAL RESISTANCE COMPONENTS  
JUNCTION-TO-CASE (TOP)  
RESISTANCE  
CASE (TOP)-TO-AMBIENT  
RESISTANCE  
JUNCTION-TO-BOARD RESISTANCE  
JUNCTION  
AMBIENT  
JUNCTION-TO-CASE  
(BOTTOM) RESISTANCE  
CASE (BOTTOM)-TO-BOARD  
RESISTANCE  
BOARD-TO-AMBIENT  
RESISTANCE  
4623 F07  
µMODULE DEVICE  
Figure 7. Graphical Representation of JESD 51-12 Thermal Coefficients  
4623fc  
16  
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LTM4623  
applicaTions inForMaTion  
respect to total package power loss. To reconcile this  
complicationwithoutsacrificingmodelingsimplicity—but  
also,notignoringpracticalrealities—anapproachhasbeen  
taken using FEA software modeling along with laboratory  
testing in a controlled environment chamber to reason-  
ably define and correlate the thermal resistance values  
supplied in this data sheet: (1) Initially, FEA software is  
used to accurately build the mechanical geometry of the  
LTM4623 and the specified PCB with all of the correct  
materialcoefficientsalongwithaccuratepowerlosssource  
definitions; (2) this model simulates a software-defined  
JEDECenvironmentconsistentwithJESD51-12topredict  
powerlossheatflowandtemperaturereadingsatdifferent  
interfacesthatenablethecalculationoftheJEDEC-defined  
thermalresistance values; (3)themodeland FEA software  
isusedtoevaluatetheLTM4623withheatsinkandairflow;  
(4)havingsolvedforandanalyzedthesethermalresistance  
values and simulated various operating conditions in the  
softwaremodel,athoroughlaboratoryevaluationreplicates  
the simulated conditions with thermocouples within a  
controlledenvironmentchamberwhileoperatingthedevice  
at the same power loss as that which was simulated. An  
outcome of this process and due diligence yields the set  
of derating curves shown in this data sheet. After these  
laboratory tests have been performed and correlated to  
then the load current is lowered to maintain the junction at  
120°C while increasing ambient temperature up to 120°C.  
The derating curves are plotted with the output current  
starting at 3A and the ambient temperature at 30°C. The  
output voltages are 1.0V, 1.5V, 3.3V and 5V. These are  
chosen to include the lower and higher output voltage  
ranges for correlating the thermal resistance. Thermal  
models are derived from several temperature measure-  
ments in a controlled temperature chamber along with  
thermal modeling analysis. The junction temperatures are  
monitored while ambient temperature is increased with  
and without airflow. The power loss increase with ambient  
temperature change is factored into the derating curves.  
The junctions are maintained at 120°C maximum while  
lowering output current or power with increasing ambient  
temperature.Thedecreasedoutputcurrentwilldecreasethe  
internal module loss as ambient temperature is increased.  
The monitored junction temperature of 120°C minus the  
ambientoperatingtemperaturespecifieshowmuchmodule  
temperature rise can be allowed. As an example, in Figure  
16 the load current is derated to 2.5A at ~95°C with no air  
flow or heat sink and the power loss for the 12V to 1.5V  
at 2.5A output is about 1.0W. The 1.0W loss is calculated  
with the ~0.8W room temperature loss from the 12V to  
1.5V power loss curve at 2.5A in Figure 9, and the 1.3  
multiplying factor at 120°C junction temperature. If the  
95°C ambient temperature is subtracted from the 120°C  
junction temperature, then the difference of 25°C divided  
the LTM4623 model, then the θ and θ are summed  
JB  
BA  
together to provide a value that should closely equal the  
θ
value because approximately 100% of power loss  
JA  
flows from the junction through the board into ambient  
with no airflow or top mounted heat sink.  
by 1.0W equals a 25°C/W θ thermal resistance. Table 4  
JA  
specifies a 25°C/W value which is very close. Table 3 to  
Table 6 provide equivalent thermal resistances for 1.0V to  
5V outputs with and without airflow. The derived thermal  
resistances in Table 3 to Table 6 for the various condi-  
tions can be multiplied by the calculated power loss as  
a function of ambient temperature to derive temperature  
rise above ambient, thus maximum junction temperature.  
Room temperature power loss can be derived from the ef-  
ficiencycurvesintheTypicalPerformanceCharacteristics  
section and adjusted with the above ambient temperature  
multiplicativefactors.Theprintedcircuitboardisa1.6mm  
thick4-layerboardwithtwoouncecopperforthetwoouter  
layers and one ounce copper for the two inner layers. The  
PCB dimensions are 95mm × 76mm.  
The 1.0V, 1.5V, 3.3V and 5V loss curves in Figures 8 to 11  
can be used in coordination with the load current derating  
curves in Figures 12 to 22 for calculating an approximate  
θ
thermal resistance for the LTM4623 with various air-  
JA  
flow conditions. The power loss curves are taken at room  
temperature, andareincreasedwithamultiplicativefactor  
according to the ambient temperature. This approximate  
factor is: 1.3 for 120°C at junction temperature. Maximum  
load current is achievable while increasing ambient tem-  
perature as long as the junction temperature is less than  
120°C, whichisa5°Cguardbandfrommaximumjunction  
temperature of 125°C. When the ambient temperature  
reaches a point where the junction temperature is 120°C,  
4623fc  
17  
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LTM4623  
applicaTions inForMaTion  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
V
IN  
V
IN  
V
IN  
= 16V  
= 12V  
= 5V  
V
IN  
V
IN  
V
IN  
= 16V  
= 12V  
= 5V  
V
IN  
V
IN  
V
IN  
= 16V  
= 12V  
= 5V  
2
3
0
1
2
3
0
1
2
3
0
1
LOAD CURRENT (A)  
LOAD CURRENT (A)  
LOAD CURRENT (A)  
4623 F08  
4623 F09  
4623 F10  
Figure 8. 1.0V Output Power Loss  
Figure 9. 1.5V Output Power Loss  
Figure 10. 3.3V Output Power Loss  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
3.5  
3
3.5  
3
V
IN  
V
IN  
= 16V  
= 12V  
2.5  
2
2.5  
2
1.5  
1
1.5  
1
0LFM  
200LFM  
400LFM  
0LFM  
200LFM  
400LFM  
0.5  
0
0.5  
0
2
3
100 110  
130  
100 110  
130  
120  
0
1
30 40 50 60 70 80 90  
120  
30 40 50 60 70 80 90  
LOAD CURRENT (A)  
AMBIENT TEMPERATURE (°C)  
AMBIENT TEMPERATURE (°C)  
4623 F11  
4623 F12  
4623 F13  
Figure 11. 5V Output Power Loss  
Figure 12. 5V to 1V Derating Curve,  
No Heat Sink  
Figure 13. 12V to 1V Derating Curve,  
No Heat Sink  
3.5  
3
3.5  
3
3.5  
3
2.5  
2
2.5  
2
2.5  
2
1.5  
1
1.5  
1
1.5  
1
0LFM  
0LFM  
0LFM  
200LFM  
400LFM  
200LFM  
400LFM  
200LFM  
400LFM  
0.5  
0
0.5  
0
0.5  
0
100 110  
130  
100 110  
130  
100 110  
130  
120  
30 40 50 60 70 80 90  
120  
30 40 50 60 70 80 90  
120  
30 40 50 60 70 80 90  
AMBIENT TEMPERATURE (°C)  
AMBIENT TEMPERATURE (°C)  
AMBIENT TEMPERATURE (°C)  
4623 F14  
4623 F15  
4623 F16  
Figure 14. 16V to 1V Derating Curve,  
No Heat Sink  
Figure 15. 5V to 1.5V Derating Curve,  
No Heat Sink  
Figure 16. 12V to 1.5V Derating Curve,  
No Heat Sink  
4623fc  
18  
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applicaTions inForMaTion  
3.5  
3.5  
3.5  
3
3
3
2.5  
2
2.5  
2
2.5  
2
1.5  
1
1.5  
1
1.5  
1
0LFM  
0LFM  
0LFM  
200LFM  
400LFM  
200LFM  
400LFM  
200LFM  
400LFM  
0.5  
0
0.5  
0
0.5  
0
100 110  
130  
120  
30 40 50 60 70 80 90  
100 110  
130  
120  
30 40 50 60 70 80 90  
100 110 120  
30 40 50 60 70 80 90  
AMBIENT TEMPERATURE (°C)  
AMBIENT TEMPERATURE (°C)  
AMBIENT TEMPERATURE (°C)  
4623 F17  
4623 F18  
4623 F25  
Figure 17. 16V to 1.5V Derating Curve,  
No Heat Sink  
Figure 18. 5V to 3.3V Derating Curve,  
No Heat Sink  
Figure 19. 12V to 3.3V Derating Curve,  
No Heat Sink  
3.5  
3
3.5  
3
3.5  
3
2.5  
2
2.5  
2
2.5  
2
1.5  
1
1.5  
1
1.5  
1
0LFM  
0LFM  
0LFM  
200LFM  
400LFM  
200LFM  
400LFM  
200LFM  
400LFM  
0.5  
0
0.5  
0
0.5  
0
100 110 120  
100 110 120  
100 110 120  
30 40 50 60 70 80 90  
30 40 50 60 70 80 90  
30 40 50 60 70 80 90  
AMBIENT TEMPERATURE (°C)  
AMBIENT TEMPERATURE (°C)  
AMBIENT TEMPERATURE (°C)  
4623 F26  
4623 F27  
4623 F28  
Figure 20. 16V to 3.3V Derating Curve,  
No Heat Sink  
Figure 21. 12V to 5V Derating Curve,  
No Heat Sink  
Figure 22. 16V to 5V Derating Curve,  
No Heat Sink  
Table 3. 1.0V Output, No Heat Sink  
DERATING CURVE  
Figures 12, 13, 14  
Figures 12, 13, 14  
Figures 12, 13, 14  
V
(V)  
POWER LOSS CURVE  
Figure 8  
AIR FLOW (LFM)  
HEAT SINK  
None  
θ
IN  
JA(°C/W)  
5, 12, 16  
5, 12, 16  
5, 12, 16  
0
25  
Figure 8  
200  
400  
None  
22  
22  
Figure 8  
None  
Table 4. 1.5V Output, No Heat Sink  
DERATING CURVE  
Figures 15, 16, 17  
Figures 15, 16, 17  
Figures 15, 16, 17  
V
(V)  
POWER LOSS CURVE  
Figure 9  
AIR FLOW (LFM)  
HEAT SINK  
None  
θ
IN  
JA(°C/W)  
5, 12, 16  
5, 12, 16  
5, 12, 16  
0
25  
Figure 9  
200  
400  
None  
22  
22  
Figure 9  
None  
4623fc  
19  
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Table 5. 3.3V Output, No Heat Sink  
DERATING CURVE  
Figures 18, 19, 20  
Figures 18, 19, 20  
Figures 18, 19, 20  
V
(V)  
POWER LOSS CURVE  
Figure 10  
AIR FLOW (LFM)  
HEAT SINK  
None  
θ
θ
IN  
JA(°C/W)  
5, 12, 16  
5, 12, 16  
5, 12, 16  
0
25  
Figure 10  
200  
400  
None  
22  
22  
Figure 10  
None  
Table 6. 5V Output, No Heat Sink  
DERATING CURVE  
Figures 21, 22  
Figures 21, 22  
Figures 21, 22  
V
IN  
(V)  
POWER LOSS CURVE  
Figure 11  
AIR FLOW (LFM)  
HEAT SINK  
None  
JA(°C/W)  
12, 16  
12, 16  
12, 16  
0
25  
Figure 11  
200  
400  
None  
22  
22  
Figure 11  
None  
Table 7. Output Voltage Response vs Component Matrix (Refer to Figure 24)  
C
PART NUMBER  
VALUE  
C
PART NUMBER  
VALUE  
IN  
OUT1  
Murata  
GRM21BR61E106KA73L  
TMK212BBJ106KG-T  
GRM31CR61C226ME15L  
TMK316BBJ226ML-T  
10µF, 25V, 0805, X5R  
10µF, 25V, 0805, X5R  
22µF, 25V, 1206, X5R  
22µF, 25V, 1206, X5R  
Murata  
GRM21BR60J476ME15  
JMK212BJ476MG-T  
47µF, 6.3V, 0805, X5R  
47µF, 6.3V, 0805, X5R  
Taiyo Yuden  
Murata  
Taiyo Yuden  
Taiyo Yuden  
C
C
LOAD STEP  
IN  
OUT1  
V
(CERAMIC) (CERAMIC)  
C
V
DROOP P-P DERIVATION RECOVERY  
LOAD  
SLEW RATE  
(A/µs)  
R
FB  
FREQ  
(MHz)  
OUT  
FF  
IN  
(V)  
(µF)  
10  
10  
10  
10  
10  
10  
10  
(µF)  
47  
47  
47  
47  
47  
47  
47  
(pF)  
100  
100  
100  
100  
100  
100  
100  
(V)  
(mV)  
(mV)  
59  
TIME (µs) STEP (A)  
()  
90.9  
60.4  
40.2  
30.1  
19.1  
13.3  
8.25k  
1
5, 12  
5, 12  
5, 12  
5, 12  
5, 12  
5, 12  
12  
1
1
1
1
2
3
5
40  
40  
40  
40  
50  
60  
60  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
1.2  
1.5  
1.8  
2.5  
3.3  
5
59  
66  
75  
108  
111  
156  
Safety Considerations  
The LTM4623 modules do not provide galvanic isolation  
from V to V . There is no internal fuse. If required,  
a slow blow fuse with a rating twice the maximum input  
current needs to be provided to protect each unit from  
catastrophic failure. The device does support thermal  
shutdown and overcurrent protection.  
Use large PCB copper areas for high current paths,  
including V , GND and V . It helps to minimize the  
IN  
OUT  
PCB conduction loss and thermal stress.  
IN  
OUT  
Place high frequency ceramic input and output capaci-  
tors next to the V , PGND and V  
pins to minimize  
IN  
OUT  
high frequency noise.  
Placeadedicatedpowergroundlayerunderneaththeunit.  
Layout Checklist/Example  
Tominimizetheviaconductionlossandreducemodule  
thermal stress, use multiple vias for interconnection  
between top layer and other power layers.  
The high integration of LTM4623 makes the PCB board  
layoutverysimpleandeasy.However,tooptimizeitselectri-  
cal and thermal performance, some layout considerations  
are still necessary.  
Do not put via directly on the pad, unless they are  
capped or plated over.  
4623fc  
20  
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applicaTions inForMaTion  
Use a separated SGND ground copper area for com-  
ponents connected to signal pins. Connect the SGND  
to GND underneath the unit.  
Bring out test points on the signal pins for monitoring.  
Figure23givesagoodexampleoftherecommendedlayout.  
GND  
V
IN  
V
OUT  
C
GND  
C
OUT  
IN  
4623 F19  
Figure 23. Recommended PCB Layout  
1.31MΩ  
FREQ CLKIN CLKOUT  
V
FREQ CLKIN CLKOUT  
V
1.5V  
3A  
V
1V  
3A  
OUT  
OUT  
V
IN  
V
IN  
V
OUT  
V
OUT  
IN  
V
IN  
4V TO 20V  
2.375V TO 4V  
10µF  
25V  
47µF  
4V  
47µF  
4V  
SV  
IN  
5V  
SV  
IN  
10µF  
6.3V  
1µF  
6.3V  
RUN  
INTV  
RUN  
INTV  
LTM4623  
LTM4623  
CC  
CC  
MODE  
MODE  
PHMODE  
TRACK/SS  
PGOOD  
GND  
PHMODE  
TRACK/SS  
PGOOD  
FB  
COMP  
FB  
90.9k  
0.1µF  
0.1µF  
COMP  
40.2k  
SGND  
GND  
SGND  
4623 F20  
4623 F21  
Figure 24. 4VIN to 20VIN, 1.5V Output at 3A Design  
Figure 25. 2.375VIN to 4VIN, 1V Output at 3A Design  
with 800kHz Reduced Frequency  
4623fc  
21  
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applicaTions inForMaTion  
FREQ CLKIN CLKOUT  
V
V
1.5V  
6A  
OUT  
V
IN  
V
OUT  
IN  
4V TO 20V  
10µF  
25V  
×2  
SV  
IN  
47µF  
RUN  
INTV  
LTM4623  
4V  
×2  
CC  
MODE  
PHMODE  
FB  
TRACK/SS  
COMP  
0.1µF  
PGOOD  
GND  
SGND  
FREQ CLKIN CLKOUT  
V
V
OUT  
IN  
SV  
IN  
RUN  
INTV  
LTM4623  
CC  
MODE  
PHMODE  
FB  
TRACK/SS  
COMP  
PGOOD  
GND  
20.1k  
SGND  
4623 F22  
Figure 26. 4VIN to 20VIN, Two Phases, 1.5V at 6A Design  
4623fc  
22  
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LTM4623  
applicaTions inForMaTion  
FREQ CLKIN CLKOUT  
V
V
1.5V  
3A  
OUT  
V
IN  
V
OUT  
IN  
4V TO 20V  
10µF  
25V  
×2  
47µF  
4V  
SV  
IN  
RUN  
INTV  
LTM4623  
CC  
MODE  
PHMODE  
TRACK/SS  
PGOOD  
FB  
40.2k  
COMP  
0.1µF  
GND  
SGND  
FREQ CLKIN CLKOUT  
V
V
1.2V  
3A  
OUT2  
V
OUT  
IN  
47µF  
4V  
SV  
IN  
RUN  
INTV  
LTM4623  
CC  
MODE  
60.4k  
PHMODE  
TRACK/SS  
PGOOD  
GND  
FB  
60.4k  
COMP  
60.4k  
SGND  
4623 F23  
Figure 27. 4VIN to 20VIN, 1.2V and 1.5V with Coincident Tracking  
2MHz  
CLOCK  
162k  
FREQ CLKIN CLKOUT  
V
V
3.3V  
3A  
OUT  
V
IN  
V
OUT  
IN  
5V TO 20V  
10µF  
25V  
47µF  
6.3V  
SV  
IN  
RUN  
INTV  
LTM4623  
CC  
MODE  
PHMODE  
TRACK/SS  
PGOOD  
GND  
FB  
0.1µF  
COMP  
13.3k  
SGND  
4623 F24  
Figure 28. 5VIN to 20VIN, 3.3V Output with 2MHz External Clock  
4623fc  
23  
For more information www.linear.com/LTM4623  
LTM4623  
package DescripTion  
PACKAGE ROW AND COLUMN LABELING MAY VARY  
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE  
LAYOUT CAREFULLY.  
LTM4623 Component LGA and BGA Pinout  
PIN ID  
A1  
FUNCTION  
COMP  
FB  
PIN ID  
A2  
FUNCTION  
TRACK/SS  
PHMODE  
PGOOD  
PIN ID  
A3  
FUNCTION  
RUN  
PIN ID  
A4  
FUNCTION  
FREQ  
PIN ID  
A5  
FUNCTION  
CLKIN  
B1  
B2  
B3  
GND  
B4  
SGND  
B5  
CLKOUT  
C1  
V
OUT  
V
OUT  
V
OUT  
C2  
C3  
GND  
C4  
MODE  
GND  
C5  
SV  
IN  
D1  
D2  
V
OUT  
V
OUT  
D3  
GND  
D4  
D5  
V
IN  
V
IN  
E1  
E2  
E3  
GND  
E4  
INTV  
E5  
CC  
4623fc  
24  
For more information www.linear.com/LTM4623  
LTM4623  
package DescripTion  
Please refer to http://www.linear.com/product/LTM4623#packaging for the most recent package drawings.  
Z
/ / b b b Z  
2 . 5 4 0  
1 . 2 7 0  
0 . 3 1 7 5  
0 . 0 0 0  
0 . 3 1 7
1 . 2 7 0  
2 . 5 4 0  
4623fc  
25  
For more information www.linear.com/LTM4623  
LTM4623  
package DescripTion  
Please refer to http://www.linear.com/product/LTM4623#packaging for the most recent package drawings.  
Z
/ / b b b Z  
2 . 5 4 0  
1 . 2 7 0  
0 . 3 1 7 5  
0 . 0 0 0  
0 . 3 1 7
1 . 2 7 0  
2 . 5 4 0  
4623fc  
26  
For more information www.linear.com/LTM4623  
LTM4623  
revision hisTory  
REV  
DATE  
DESCRIPTION  
PAGE NUMBER  
10, 22  
A
7/15  
Corrected R  
in the Operating Frequency section from 161k to 162k  
FSET  
B
10/15 Added BGA package  
1, 2, 26  
C
06/16 Updated Absolute Maximum Rating section. Peak body temperature from 245°C to 260°C  
Added the description about minimum switching frequency in the Operating Frequency section  
2
11  
23  
Changed minimum V voltage in Figure 28 from 4V to 5V  
IN  
4623fc  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-  
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.  
27  
LTM4623  
package phoTos  
Design resources  
SUBJECT  
DESCRIPTION  
µModule Design and Manufacturing Resources  
Design:  
Manufacturing:  
Selector Guides  
Quick Start Guide  
Demo Boards and Gerber Files  
Free Simulation Tools  
PCB Design, Assembly and Manufacturing Guidelines  
Package and Board Level Reliability  
µModule Regulator Products Search  
1. Sort table of products by parameters and download the result as a spread sheet.  
2. Search using the Quick Power Search parametric table.  
TechClip Videos  
Quick videos detailing how to bench test electrical and thermal performance of µModule products.  
Digital Power System Management  
Linear Technology’s family of digital power supply management ICs are highly integrated solutions that  
offer essential functions, including power supply monitoring, supervision, margining and sequencing,  
and feature EEPROM for storing user configurations and fault logging.  
relaTeD parTs  
PART NUMBER DESCRIPTION  
COMMENTS  
LTM4625  
Higher Current than LTM4623, BGA Package, Taller 5A, 4V < V < 20V  
IN MAX  
but Same Footprint  
Dual 4A  
LTM4619  
LTM4644  
LTM4649  
LTM8020  
4.5V < V < 28V  
, 15mm × 15mm × 2.82mm LGA  
IN  
MAX  
Quad 4A  
Configurable up to 16A, 4V < V < 16V  
, 9mm × 15mm × 5.01mm BGA  
IN  
MAX  
10A  
4.5V < V < 18V  
, 9mm × 15mm × 4.92mm  
IN  
MAX  
200mA, Higher V than LTM4625, Same Package 4V < V < 40V , 6.25mm × 6.25mm × 2.32mm LGA  
MAX  
IN  
IN  
Footprint  
4623fc  
LT 0616 REV C • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
28  
(408)432-1900 FAX: (408) 434-0507 www.linear.com/LTM4623  
LINEAR TECHNOLOGY CORPORATION 2014  

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