MRF18060AS [MOTOROLA]

L BAND, Si, N-CHANNEL, RF POWER, MOSFET, CASE 465A-06, 3 PIN;
MRF18060AS
型号: MRF18060AS
厂家: MOTOROLA    MOTOROLA
描述:

L BAND, Si, N-CHANNEL, RF POWER, MOSFET, CASE 465A-06, 3 PIN

放大器 CD 晶体管
文件: 总6页 (文件大小:186K)
中文:  中文翻译
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M OT O RO LA  
SEMICONDUCTOR TECHNICAL DATA  
The RF MOSFET Line  
M
R
F
1
8
0
6
0
A
R
F
P
o
w
e
r
F
i
e
l
d
E
f
f
e
c
t
T
r
a
n
s
i
s
t
o
r
s
MR F 1806 0A R 3  
MR F 1806 0A S  
MR F 1806 0AS R 3  
N–Channel Enhancement–Mode Lateral MOSFETs  
Designed for PCN and PCS base station applications with frequencies from  
1.8 to 2.0 GHz. Suitable for FM, TDMA, CDMA and multicarrier amplifier  
applications. To be used in class AB for PCN–PCS/cellular radio and WLL  
applications. Specified for GSM1805 – 1880 MHz.  
1.80 – 1.88 GHz, 60 W, 26 V  
LATERAL N–CHANNEL  
RF POWER MOSFETs  
Typical GSM Performance, Full Frequency Band (1805 – 1880 MHz)  
Power Gain — 13 dB (Typ) @ 60 Watts  
Efficiency — 45% (Typ) @ 60 Watts  
Internally Matched, Controlled Q, for Ease of Use  
High Gain, High Efficiency and High Linearity  
Integrated ESD Protection  
Designed for Maximum Gain and Insertion Phase Flatness  
Capable of Handling 10:1 VSWR, @ 26 Vdc, 60 Watts (CW) Output Power  
Excellent Thermal Stability  
Available in Tape and Reel. R3 Suffix = 250 Units per 56 mm,  
13 Inch Reel.  
CASE 465–06, STYLE 1  
(NI–780)  
(MRF18060A)  
CASE 465A–06, STYLE 1  
(NI–780S)  
(MRF18060AS)  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
65  
Unit  
Drain–Source Voltage  
Gate–Source Voltage  
V
DSS  
Vdc  
Vdc  
V
GS  
+15, –0.5  
Total Device Dissipation @ T 25°C  
P
D
180  
Watts  
C
Derate above 25°C  
1.03  
W/°C  
Storage Temperature Range  
Operating Junction Temperature  
T
–65 to +150  
200  
°C  
°C  
stg  
T
J
ESD PROTECTION CHARACTERISTICS  
Test Conditions  
Class  
Human Body Model  
Machine Model  
2 (Minimum)  
M3 (Minimum)  
THERMAL CHARACTERISTICS  
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
0.97  
°C/W  
θ
JC  
NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
REV 4  
MOTOROLA WIRELESS  
RF PRODUCT DEVICE DATA  
MRF18060A MRF18060AR3 MRF18060AS MRF18060ASR3  
5.2–213  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain–Source Breakdown Voltage  
(V = 0 Vdc, I = 10 µAdc)  
V
65  
6
Vdc  
µAdc  
µAdc  
(BR)DSS  
GS  
D
Zero Gate Voltage Drain Current  
(V = 26 Vdc, V = 0 Vdc)  
I
DSS  
DS  
GS  
Gate–Source Leakage Current  
(V = 5 Vdc, V = 0 Vdc)  
I
1
GSS  
GS  
DS  
ON CHARACTERISTICS  
Gate Threshold Voltage  
V
V
2
3.9  
4
Vdc  
Vdc  
Vdc  
S
GS(th)  
GS(Q)  
DS(on)  
(V = 10 Vdc, I = 300 µAdc)  
DS  
D
Gate Quiescent Voltage  
(V = 26 Vdc, I = 500 mAdc)  
2.5  
4.5  
DS  
D
Drain–Source On–Voltage  
(V = 10 Vdc, I = 2 Adc)  
V
0.27  
4.7  
GS  
D
Forward Transconductance  
(V = 10 Vdc, I = 2 Adc)  
g
fs  
DS  
D
DYNAMIC CHARACTERISTICS  
Input Capacitance (Including Input Matching Capacitor in Package) (1)  
C
160  
740  
2.7  
pF  
pF  
pF  
iss  
(V = 26 Vdc ± 30 mV(rms)ac @ 1 MHz, V = 0 Vdc)  
DS  
GS  
Output Capacitance (1)  
C
oss  
(V = 26 Vdc ± 30 mV(rms)ac @ 1 MHz, V = 0 Vdc)  
DS  
GS  
Reverse Transfer Capacitance  
C
rss  
(V = 26 Vdc ± 30 mV(rms)ac @ 1 MHz, V = 0 Vdc)  
DS  
GS  
FUNCTIONAL TESTS (In Motorola Test Fixture)  
Common–Source Amplifier Power Gain @ 60 W (2)  
G
dB  
%
ps  
(V = 26 Vdc, I = 500 mA, f = 1805 – 1880 MHz)  
11.5  
13  
DD  
DQ  
Drain Efficiency @ 60 W (2)  
(V = 26 Vdc, I = 500 mA, f = 1805 – 1880 MHz)  
η
43  
45  
DD  
DQ  
Input Return Loss (2)  
(V = 26 Vdc, P = 60 W CW, I = 500 mA,  
IRL  
–10  
dB  
DD  
out  
DQ  
f = 1805 – 1880 MHz)  
Output Mismatch Stress  
Ψ
No Degradation In Output Power  
Before and After Test  
(V = 26 Vdc, P = 60 W CW, I = 500 mA VSWR = 10:1,  
DD  
out  
DQ  
All Phase Angles at Frequency of Tests)  
(1) Part is internally matched both on input and output.  
(2) To meet application requirements, Motorola test fixtures have been designed to cover the full GSM1800 band, ensuring batch–to–batch  
consistency.  
MRF18060A MRF18060AR3 MRF18060AS MRF18060ASR3  
5.2–214  
MOTOROLA WIRELESS  
RF PRODUCT DEVICE DATA  
R
R
2
1
T1  
Z
6
V
D D  
+
R3  
C4  
C
3
R
4
V
G G  
C
1
C2  
RF  
O
UT  
P
UT  
R
5
Z4  
Z5  
Z7  
R
F
I NP UT  
C7  
Z1  
Z2  
Z3  
C6  
C5  
D
U
T
C1  
C2, C4, C7  
C3  
C5  
C6  
R1, R3  
R2, R4  
R5  
100 nF Chip Capacitor (1203)  
10 pF Chip Capacitors  
10 mF, 35 V Electrolytic Tantalum Capacitor  
1.2 pF Chip Capacitor  
Z1  
Z2  
Z3  
Z4  
Z5  
Z6  
Z7  
0.47x 0.09Microstrip  
1.16x 0.09Microstrip  
0.57x 0.95Microstrip  
0.59x 1.18Microstrip  
1.26x 0.15Microstrip  
1.15x 0.09Microstrip  
0.37x 0.09Microstrip  
1.0 pF Chip Capacitor  
2.2 kChip Resistors (0805)  
2.7 kChip Resistors (0805)  
1.1 kChip Resistor (0805)  
BC847 Transistor SOT–23  
T1  
Figure 1. 1805 – 1880 MHz Test Fixture Schematic  
V
V
SU PP LY  
BI  
AS  
C
3
C
R
1
4
R2  
R3  
C4  
R
1
C
2
T1  
R5  
C7  
C
6
C
5
G
r
o
u
n
d
G
r
o
u
n
d
MRF18060  
Figure 2. 1805 – 1880 MHz Test Fixture Component Layout  
MOTOROLA WIRELESS  
RF PRODUCT DEVICE DATA  
MRF18060A MRF18060AR3 MRF18060AS MRF18060ASR3  
5.2–215  
V
bi as  
C
1
T1  
R1  
R5  
R2  
V
s upp l y  
+
C
C
2
3
C4  
R
3
T2  
R
4
C5  
R
6
R
F
RF  
I
N
P
UT  
O
U
T
P
UT  
Z
6
Z
7
Z1  
Z2  
Z3  
Z4  
Z5  
C
7
C8  
C
6
C1  
C2  
C3, C5, C8  
C4  
C6  
C7  
R1  
R2, R6  
R3  
1 mF Chip Capacitor (0805)  
100 nF Chip Capacitor (0805)  
T1  
T2  
Z1  
Z2  
Z3  
Z4  
Z5  
Z6  
Z7  
LP2951 Micro–8 Voltage Regulator  
BC847 SOT–23 NPN Transistor  
0.159x 0.055Microstrip  
0.982x 0.055Microstrip  
0.087x 0.055Microstrip  
0.512x 0.787Microstrip  
0.433x 1.220Microstrip  
1.039x 0.118Microstrip  
0.268x 0.055Microstrip  
10 pF Chip Capacitors, ACCU–P (0805)  
10 mF, 35 V Tantalum Electrolytic Capacitor  
1.8 pF Chip Capacitor, ACCU–P (0805)  
1 pF Chip Capacitor, ACCU–P (0805)  
10 Chip Resistor (0805)  
1 kChip Resistors (0805)  
1.2 kChip Resistor (0805)  
R4  
2.2 kChip Resistor (0805)  
Substrate = 0.5 mm Teflon Glass, ε = 2.55  
r
R5  
5 k, SMD Potentiometer  
Figure 3. 1800 – 2000 MHz Demo Board Schematic  
V
b i a s  
G
ro  
u
nd  
V
s upp l y  
C4  
R1  
C
1
R
R
2
3
T
1
R
4
R5  
T
2
C
2
C
3
C
5
R
6
C
8
C
7
C
6
MRF18060  
Figure 4. 1800 – 2000 MHz Demo Board Component Layout  
MRF18060A MRF18060AR3 MRF18060AS MRF18060ASR3  
5.2–216  
MOTOROLA WIRELESS  
RF PRODUCT DEVICE DATA  
TYPICAL CHARACTERISTICS (DATA TAKEN USING WIDEBAND DEMONSTRATION BOARD)  
1
6
1
0
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
1
5
I
=
75  
0
m
A
D
Q
P
i n  
=
5
W
1 4  
1 3  
1 2  
5
0
0
mA  
2
.5  
W
3
0
0
mA  
1
1
1
W
1
0
1
0
0
m
A
V
f
=
1
2
6
V dc  
MH z  
D D  
=
V
D D  
=
2
6
V
d
c
9
8
0
0
8
8
0
I
=
5
0
0
mA  
D Q  
1
1
0
1
00  
1
8
2
0
2
2
2
4
2
6
2
8
3
0
P
o ut  
,
O
UT  
P
UT  
P
OW  
E
R
(
W
A
T
T
S
)
V
D D  
,
S
UP  
P
L
Y
V
O
L
T
A
G
E
(V O LTS)  
Figure 5. Power Gain versus  
Output Power  
Figure 6. Output Power versus Supply Voltage  
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
6
5
5
4
4
3
3
2
0
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
P
i n  
=
6
W
5
0
5
0
5
0
5
3
W
h
P
ou t  
V
=
=
2
6
0
V dc  
mA  
D D  
I
5
0
D Q  
1
W
V
I
f
=
=
1
2
6
0
Vd c  
mA  
D
D
5
0
0
.
5
W
D Q  
0
0
2
1
0
5
0
0
=
8
8
0
MH  
z
1
8
0
0
18  
20  
1
8
4
0
1
8
6
0
1
8
8
0
1
90  
0
0
1
2
3
T
4
5
6
f
,
F
R
E
Q
UE  
NC  
Y
(
M
H
z
)
P
,
i n  
I
N
P
U
P
O
W
E
R
(
W
A
T
T
S
)
Figure 7. Output Power versus Frequency  
Figure 8. Output Power and Efficiency  
versus Input Power  
1
5
.
0
0
-
-
-
-
-
-
-
-
2
4
6
8
1
1
1
1
1
1
1
1
1
1
4
4
3
3
2
2
.
.
.
.
.
.
.
.
5
0
5
0
5
0
5
0
G
p
s
0
2
4
6
1
1
1
1
I
R
L
V
I
=
=
2
6
0
V dc  
mA  
D
D
-
-
1
2
8
0
5
0
1
1
0
0
.5  
0
D
Q
.
1
7
0
0
1
8
0
0
1
9
0
0
2
0
0
0
2
1
0
0
f
,
F
R
E
Q
U
E
N
C
Y
(
M
H
z
)
Figure 9. Wideband Gain and IRL  
(at Small Signal)  
MOTOROLA WIRELESS  
RF PRODUCT DEVICE DATA  
MRF18060A MRF18060AR3 MRF18060AS MRF18060ASR3  
5.2–217  
Z
0
i n  
f
=
2
10  
0
MH z  
f
=
17  
0
0
M Hz  
f
=
2
1
0
MH z  
f
=
1
70  
0
MH z  
Z
*
O L  
Z
=
5
o
V
D D  
=
2
6
D Q  
V,  
=
I
5
00  
mA ,  
ou t  
=
P
6
0
Wa  
t
ts  
(C W)  
f
Z
in  
Z
OL  
*
MHz  
1700  
1800  
1900  
2000  
2100  
0.60 + j2.53  
0.80 + j3.20  
0.92 + j3.42  
1.07 + j3.59  
1.31 + j4.00  
2.27 + j3.44  
2.05 + j3.05  
1.90 + j2.90  
1.64 + j2.88  
1.29 + j2.99  
Z
in  
= Complex conjugate of the source impedance.  
Z
OL  
* = Complex conjugate of the optimum load at a  
given voltage, P1dB, gain, efficiency, bias  
current and frequency.  
Note: Z * was chosen based on tradeoffs between gain,  
OL  
output power, and drain efficiency.  
O
u
a
t
p
u
i
t
n
I
n
a
p
t
u
c
t
h
D
U
e
n
vi ce  
d
M t  
Ne t wo rk  
ch  
g
M
Ne t wor k  
i
n
g
e
r
Te st  
Z
Z
*
in  
OL  
Figure 10. Series Equivalent Input and Output Impedance  
MRF18060A MRF18060AR3 MRF18060AS MRF18060ASR3  
5.2–218  
MOTOROLA WIRELESS  
RF PRODUCT DEVICE DATA  

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