N-HFA15PB60 [NELLSEMI]

FRED Ultrafast Soft Recovery Diode, 15 A; FRED超快软恢复二极管, 15 A
N-HFA15PB60
型号: N-HFA15PB60
厂家: NELL SEMICONDUCTOR CO., LTD    NELL SEMICONDUCTOR CO., LTD
描述:

FRED Ultrafast Soft Recovery Diode, 15 A
FRED超快软恢复二极管, 15 A

二极管 超快软恢复二极管
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RoHS  
RoHS  
N-HFA15PB60  
SEMICONDUCTOR  
Nell High Power Products  
FRED  
Ultrafast Soft Recovery Diode, 15 A  
FEATURES  
Ultrafast and ultrasoft recovery  
Very low I and Q  
RRM  
rr  
Compliant to RoHS  
Designed and qualified for industrial level  
BENEFITS  
TO-247AC modified  
Reduced RFI and EMI  
Reduced power loss in diode and switching transistor  
Higher frequency operation  
Reduced snubbing  
common  
cathode  
Reduced parts count  
2
DESCRIPTION  
HFA15PB60 is a state of the art ultrafast recovery  
diode. Employing the latest in epitaxial construction  
and advanced processing techniques it features a  
superb combination of characteristics which result in  
performance which is unsurpassed by any rectifier  
previously available. With basic ratings of 600V and  
15 A continuous current, the HFA15PB60 is especially  
well suited for use as the companion diode for IGBTs  
and MOSFETs. In addition to ultrafast recovery time,  
the FRED product line features extremely low values  
1
3
Cathode  
Anode  
of peak recovery current (I  
) and does not exhibit  
RRM  
PRODUCT SUMMARY  
any tendency to “snap-off” during the t portion of  
b
Package  
lF(AV)  
TO-247AC modified (2 pins)  
recovery. The FRED features combine to offer  
designers a rectifier with lower noise and significantly  
lower switching losses in both the diode and the  
switching transistor. These FRED advantages can  
help to significantly reduce snubbing, component  
count and heatsink sizes. The FRED HFA15PB60 is  
ideally suited for applications in power supplies and  
power conversion systems (such as inverters), motor  
drives, and many other similar applications where high  
speed, high efficiency is needed.  
15A  
VR  
600 V  
VF at lF  
trr (typ.)  
1.7 V  
19 ns  
TJ max.  
150ºC  
Single die  
Diode variation  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
VALUES  
UNITS  
Cathode to anode voltage  
Maximum continuous forward current  
Single pulse forward current  
Maximum repetitive forward current  
VR  
IF  
600  
15  
V
T
= 100 ºC  
c
lFSM  
lFRM  
150  
60  
A
T
T
= 25 ºC  
74  
c
c
Maximum power dissipation  
PD  
W
= 100 ºC  
29  
TJ, TStg  
Operating junction and storage temperature range  
- 55 to + 150  
ºC  
Page 1 of 6  
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RoHS  
RoHS  
N-HFA15PB60  
SEMICONDUCTOR  
Nell High Power Products  
ELECTRICAL SPECIFICATIONS  
(T = 25 ºC unless otherwise specified)  
J
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MAX.  
TYP.  
UNITS  
MIN.  
Cathode to anode  
breakdown voltage  
-
-
VBR  
IR = 100 µA  
600  
IF = 15 A  
IF = 30 A  
-
-
1.55  
1.80  
1.40  
1.7  
2.0  
1.6  
V
VFM  
Maximum forward voltage  
IF = 15 A, TJ = 125 ºC  
-
VR = VR rated  
TJ = 125°C, VR = VR rated  
VR = 200V  
-
-
1.0  
400  
25  
10  
1000  
Maximum reverse  
leakage current  
IRM  
µA  
Junction capacitance  
Series inductance  
pF  
nH  
CT  
LS  
50  
-
-
12  
Measured lead to lead 5 mm from package body  
-
DYNAMIC RECOVERY CHARACTERISTICS PERLEG (T = 25 ºC unless otherwise specified)  
J
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
MAX. UNITS  
TYP.  
IF = 0.5A, IR = 1.0A, IRR = 250mA (RG#1 CKT)  
IF = 1.0 A, dIF/dt = -200 A/µs, VR =30 V, TJ = 25°C  
-
-
30  
22  
trr  
-
19  
ns  
Reverse recovery time  
trr1  
trr2  
-
-
TJ = 25 ºC  
42  
74  
60  
TJ = 125 ºC  
120  
IF= 15A  
dIF/dt = -200 A/µs  
VR = 200 V  
IRRM1  
TJ = 25 ºC  
-
-
6.0  
4.0  
Peak recovery current  
A
IRRM2  
Qrr1  
TJ = 125 ºC  
10  
6.5  
80  
-
-
TJ = 25 ºC  
TJ = 125 ºC  
TJ = 25 ºC  
TJ = 125 ºC  
180  
Reverse recovery charge  
nC  
Qrr2  
220  
188  
160  
600  
-
dl(rec)M/dt1  
dl(rec)M/dt2  
-
Peak rate of fall of recovery  
current during tb  
A/µs  
-
-
THERMAL - MECHANICAL SPECIFICATIONS PER LEG  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNITS  
Lead temperature  
Tlead  
0.063'' from case (1.6 mm) for 10 s  
300  
°C  
Junction to case,  
single leg conduction  
Junction to case,  
both legs conducting  
Thermal resistance,  
junction to ambient  
Thermal resistance,  
case to heatsink  
-
-
-
1.7  
RthJC  
-
40  
40  
-
K/W  
RthJA  
RthCS  
Typical socket mount  
-
Mounting surface, flat, smooth and greased  
0.25  
-
-
6.0  
-
-
g
Weight  
0.21  
oz.  
6.0  
(5.0)  
12  
(10)  
kgf . cm  
(lbf . in)  
Mounting torque  
Marking device  
-
Case style TO-247AC (JEDEC)  
HFA15PA60  
Page 2 of 6  
www.nellsemi.com  
RoHS  
RoHS  
N-HFA15PB60  
SEMICONDUCTOR  
Nell High Power Products  
Fig.1 Maximum forward voltage drop vs.  
Instantaneous forward current  
Fig.2 Typical reverse current vs. reverse voltage  
10000  
100  
10  
T
= 150 °С  
J
1000  
100  
10  
T
= 125 °C  
J
1
T
= 25 ºC  
J
T
T
T
= 150 °С  
= 125 °С  
= 25 °С  
J
J
J
0.1  
0.01  
1
1.0  
0
100  
200  
300  
400  
500  
600  
1.2  
1.4  
1.6  
1.8  
2.0  
2.2  
2.4  
Forward voltage drop (V), VFM  
Reverse voltage (V), VR  
Fig.3 Typical junction capacitance vs. reverse voltage  
100  
T
= 25 °С  
J
10  
10  
100  
1000  
Reverse voltage (V), VR  
Fig.4 Maximum thermal Impedance ZthJC characteristics  
10  
1
0.1  
P
DM  
t
1
D = 0.50  
D = 0.20  
D = 0.10  
D = 0.05  
D = 0.02  
D = 0.01  
t
2
Notes:  
1. Duty factor D = t1/ t 2  
Single pulse  
(thermal response)  
2. Peak T = Pdm x ZthJC + Tc  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
Rectangular pulse duration (sec), t1  
Page 3 of 6  
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RoHS  
RoHS  
N-HFA15PB60  
SEMICONDUCTOR  
Nell High Power Products  
Fig.5 Typical reverse recovery time vs. dI /dt  
Fig.6 Typical recovery current vs. dI /dt  
F
F
100  
80  
25  
20  
15  
I
I
I
= 30 A  
= 15 A  
= 5 A  
V
T
= 200 V  
= 125 °С  
= 25 °С  
F
F
F
R
J
J
T
60  
40  
20  
I
I
I
= 30 A  
= 15 A  
= 5 A  
F
F
F
10  
5
0
V
T
= 200 V  
= 125 °С  
= 25 °С  
R
J
J
T
0
100  
1000  
100  
1000  
dIF/dt (A/µs)  
dIF/dt (A/µs)  
Fig.8 Typical dI  
/dt vs. dI /dt  
(rec)M  
Fig.7 Typical Stored Charge vs. dI /dtI  
F
F
10000  
800  
600  
400  
V
T
= 200 V  
= 125 °С  
= 25 °С  
R
I
I
I
= 30 A  
J
J
F
T
= 15 A  
F
= 5 A  
F
I
= 30 A  
= 15 A  
= 5 A  
F
F
F
I
I
1000  
200  
0
V
T
= 200 V  
R
= 125 °С  
= 25 °С  
J
J
T
100  
1000  
100  
1000  
100  
dI /dt (A/µs)  
F
dIF/dt (A/µs)  
Fig.9 Reverse recovery parameter test circuit  
VR = 200 V  
Ω
0.01  
L = 70 µH  
D.U.T.  
D
dI /dt  
F
adjust  
IRFP250  
G
S
Page 4 of 6  
www.nellsemi.com  
RoHS  
RoHS  
N-HFA15PB60  
SEMICONDUCTOR  
Nell High Power Products  
Fig.10 Reverse recovery waveform and definitions  
(3)  
trr  
IF  
ta  
tb  
0
(4)  
Qrr  
(2)  
IRRM  
0.5 IRRM  
(5)  
dI(rec)M/dt  
0.75 I  
RRM  
dIF/dt  
(1)  
(4) Qrr - area under curve defined by trr  
and IRRM  
(1) dIF/dt - rate of change of current  
through zero crossing  
x l  
2
trr  
RRM  
(2) IRRM - peak reverse recovery current  
Q
rr  
=
(3) trr - reverse recovery time measured  
/dt - peak rate of change of  
(5) dI(rec)M  
current during tb portion of trr  
from zero crossing point of negative  
going I to point where a line passing  
F
through 0.75 IRRM and 0.50 IRRM  
extrapolated to zero current.  
ORDERING INFORMATION TABLE  
Device code  
-
HFA 15 PB  
N
60  
1
2
3
4
5
-
-
-
-
-
Nell Semiconductors product  
FRED family  
1
2
3
4
Current rating (15 =15A)  
PB = TO-247AC modified  
Voltage rating: (60 = 600 V)  
5
Page 5 of 6  
www.nellsemi.com  
RoHS  
RoHS  
N-HFA15PB60  
SEMICONDUCTOR  
Nell High Power Products  
Outine Table  
N-HFA15PB60  
Page 6 of 6  
www.nellsemi.com  

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