PSMN0R9-30ULD [NEXPERIA]
N-channel 30 V, 0.87 mOhm, 300 A level Application Specific MOSFET in SOT1023A enhanced package for UL2595Production;型号: | PSMN0R9-30ULD |
厂家: | Nexperia |
描述: | N-channel 30 V, 0.87 mOhm, 300 A level Application Specific MOSFET in SOT1023A enhanced package for UL2595Production |
文件: | 总13页 (文件大小:263K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PSMN0R9-30ULD
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET
in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
23 May 2018
Product data sheet
1. General description
SOT1023A with improved creepage and clearance to meet UL2595 requirements. 300 Amp logic
level gate drive N-channel enhancement mode MOSFET in LFPAK56 package. NextPowerS3
portfolio utilising Nexperia’s unique “SchottkyPlus” technology delivers high efficiency, low spiking
performance usually associated with MOSFETs with an integrated Schottky or Schottky-like diode
but without problematic high leakage current. NextPowerS3 is particularly suited to high efficiency
applications at high switching frequencies.
2. Features and benefits
•
•
Improved creepage and clearance – meets the requirements of UL2595
300 A capability
•
•
Avalanche rated, 100% tested at IAS = 190 A
Ultra low QG, QGD and QOSS for high system efficiency, especially at higher switching
frequencies
•
•
•
•
•
•
Superfast switching with soft-recovery; s-factor > 1
Low spiking and ringing for low EMI designs
Unique “SchottkyPlus” technology; Schottky-like performance with < 1 μA leakage at 25 °C
Optimised for 4.5 V gate drive
Low parasitic inductance and resistance
High reliability clip bonded and solder die attach Power SO8 package; no glue, no wire bonds,
qualified to 150 °C
•
Wave solderable; exposed leads for optimal visual solder inspection
3. Applications
•
•
Brushed and brushless motor control
Battery powered appliances where enhanced creepage and clearance is required to meet
UL2595
•
For non-UL2595 applications please use PSMN0R9-30YLD
4. Quick reference data
Table 1. Quick reference data
Symbol
VDS
ID
Parameter
Conditions
Min
Typ
Max
30
Unit
V
drain-source voltage
drain current
25 °C ≤ Tj ≤ 150 °C
VGS = 10 V; Tmb = 25 °C; Fig. 2
-
-
-
-
-
[1]
-
300
227
150
A
Ptot
total power dissipation Tmb = 25 °C; Fig. 1
junction temperature
-
W
Tj
-55
°C
Nexperia
PSMN0R9-30ULD
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
Symbol
Static characteristics
RDSon drain-source on-state
resistance
Parameter
Conditions
Min
Typ
Max
Unit
VGS = 4.5 V; ID = 25 A; Tj = 25 °C;
Fig. 10
-
-
0.79
0.65
1.09
0.87
mΩ
mΩ
VGS = 10 V; ID = 25 A; Tj = 25 °C;
Fig. 10
Dynamic characteristics
QGD
gate-drain charge
ID = 25 A; VDS = 15 V; VGS = 4.5 V;
Fig. 12; Fig. 13
-
-
13.5
109
-
-
nC
nC
QG(tot)
total gate charge
ID = 25 A; VDS = 15 V; VGS = 10 V;
Fig. 12; Fig. 13
Source-drain diode
softness factor
S
IS = 25 A; dIS/dt = -100 A/µs; VGS = 0 V;
VDS = 15 V; Fig. 16
-
0.9
-
[1] 300A Continuous current has been successfully demonstrated during application tests. Practically the current will be limited by PCB,
thermal design and operating temperature.
5. Pinning information
Table 2. Pinning information
Pin
1
Symbol Description
Simplified outline
Graphic symbol
S
S
S
G
D
source
source
source
gate
D
S
2
G
3
4
mbb076
mb
mounting base; connected to
drain
1
2
3
4
sot1023a_sv
LFPAK56-UL2595
(SOT1023A)
6. Ordering information
Table 3. Ordering information
Type number
Package
Name
Description
Version
PSMN0R9-30ULD
LFPAK56-UL plastic, single-ended surface-mounted package (LFPAK56); 4
SOT1023A
2595
leads; 1.27 mm pitch
©
PSMN0R9-30ULD
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2018. All rights reserved
Product data sheet
23 May 2018
2 / 13
Nexperia
PSMN0R9-30ULD
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
7. Marking
Table 4. Marking codes
Type number
Marking code
PSMN0R9-30ULD
0D93UL
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDS
Parameter
Conditions
Min
Max
30
Unit
V
drain-source voltage
drain-gate voltage
gate-source voltage
total power dissipation
drain current
25 °C ≤ Tj ≤ 150 °C
25 °C ≤ Tj ≤ 150 °C; RGS = 20 kΩ
-
VDGR
VGS
-
30
V
-20
20
V
Ptot
Tmb = 25 °C; Fig. 1
-
227
300
284
1592
150
150
260
W
A
ID
VGS = 10 V; Tmb = 25 °C; Fig. 2
VGS = 10 V; Tmb = 100 °C; Fig. 2
pulsed; tp ≤ 10 µs; Tmb = 25 °C; Fig. 3
[1]
-
-
A
IDM
peak drain current
storage temperature
junction temperature
-
A
Tstg
Tj
-55
-55
-
°C
°C
°C
Tsld(M)
peak soldering
temperature
VESD
electrostatic discharge
voltage
HBM
2
-
kV
Source-drain diode
IS
source current
peak source current
Tmb = 25 °C
-
-
242
A
A
ISM
pulsed; tp ≤ 10 µs; Tmb = 25 °C
1800
Avalanche ruggedness
EDS(AL)S non-repetitive drain-
ID = 25 A; Vsup ≤ 30 V; RGS = 50 Ω;
VGS = 10 V; Tj(init) = 25 °C; unclamped;
tp = 6.1 ms
[2]
[2]
-
-
2575
190
mJ
A
source avalanche
energy
IAS
non-repetitive avalanche Vsup ≤ 30 V; VGS = 10 V; Tj(init) = 25 °C;
current RGS = 50 Ω
[1] 300A Continuous current has been successfully demonstrated during application tests. Practically the current will be limited by PCB,
thermal design and operating temperature.
[2] Protected by 100% test
©
PSMN0R9-30ULD
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2018. All rights reserved
Product data sheet
23 May 2018
3 / 13
Nexperia
PSMN0R9-30ULD
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
aaa-020460
03ne36
500
400
300
200
100
0
120
I
D
(A)
Pder
(%)
80
(1)
40
0
0
50
100
150
200
0
25
50
75 100 125 150 175 200
(°C)
T
mb
°
Tmb ( C)
(1) 300A continuous current has been successfully
demonstrated during application tests. Practically
the current will be limited by PCB, thermal design
and operating temperature
Fig. 1. Normalized total power dissipation as a
function of mounting base temperature
Fig. 2. Continuous drain current as a function of
mounting base temperature
aaa-027871
4
10
I
D
(A)
3
2
Limit R
= V / I
DS
10
DSon
D
t
= 10 µs
p
100 µs
10
DC
10
1
1 ms
10 ms
100 ms
-1
2
10
1
10
10
V
DS
(V)
Tmb = 25 °C; IDM is a single pulse
Fig. 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage
©
PSMN0R9-30ULD
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2018. All rights reserved
Product data sheet
23 May 2018
4 / 13
Nexperia
PSMN0R9-30ULD
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-mb)
thermal resistance
from junction to
mounting base
Fig. 4
-
0.45
0.55
K/W
Rth(j-a)
thermal resistance
from junction to
ambient
Fig. 5
Fig. 6
-
-
50
-
-
K/W
K/W
125
aaa-027870
1
Z
th(j-mb)
(K/W)
δ = 0.5
0.2
-1
-2
-3
10
0.1
0.05
0.02
t
p
single shot
P
10
10
δ =
T
t
t
p
T
-6
-5
-4
-3
-2
-1
10
10
10
10
10
10
1
t
p
(s)
Fig. 4. Transient thermal impedance from junction to mounting base as a function of pulse duration
aaa-005750
aaa-005751
Fig. 5. PCB layout for thermal resistance junction to
ambient 1” square pad; FR4 Board; 2oz copper
Fig. 6. PCB layout for thermal resistance junction to
ambient minimum footprint;FR4 board; 2oz
copper
©
PSMN0R9-30ULD
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2018. All rights reserved
Product data sheet
23 May 2018
5 / 13
Nexperia
PSMN0R9-30ULD
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
10. Characteristics
Table 7. Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
V(BR)DSS
drain-source
breakdown voltage
ID = 250 µA; VGS = 0 V; Tj = 25 °C
ID = 250 µA; VGS = 0 V; Tj = -55 °C
30
27
1.2
-
-
V
V
V
-
-
VGS(th)
gate-source threshold ID = 1 mA; VDS=VGS; Tj = 25 °C
voltage
1.5
2.2
ΔVGS(th)/ΔT
gate-source threshold 25 °C ≤ Tj ≤ 150 °C
voltage variation with
-
-4.5
-
mV/K
temperature
IDSS
drain leakage current
gate leakage current
VDS = 24 V; VGS = 0 V; Tj = 25 °C
VDS = 24 V; VGS = 0 V; Tj = 125 °C
VGS = 16 V; VDS = 0 V; Tj = 25 °C
VGS = -16 V; VDS = 0 V; Tj = 25 °C
-
-
-
-
-
-
1
µA
µA
nA
nA
mΩ
3.7
-
IGSS
-
100
100
1.09
-
RDSon
drain-source on-state
resistance
VGS = 4.5 V; ID = 25 A; Tj = 25 °C;
Fig. 10
0.79
VGS = 4.5 V; ID = 25 A; Tj = 150 °C;
Fig. 10; Fig. 11
-
-
-
-
-
1.8
0.87
1.44
-
mΩ
mΩ
mΩ
Ω
VGS = 10 V; ID = 25 A; Tj = 25 °C;
Fig. 10
0.65
-
VGS = 10 V; ID = 25 A; Tj = 150 °C;
Fig. 10; Fig. 11
RG
gate resistance
f = 1 MHz
1.4
Dynamic characteristics
QG(tot)
total gate charge
ID = 25 A; VDS = 15 V; VGS = 10 V;
Fig. 12; Fig. 13
-
-
109
51
-
-
nC
nC
ID = 25 A; VDS = 15 V; VGS = 4.5 V;
Fig. 12; Fig. 13
ID = 0 A; VDS = 0 V; VGS = 0 V
-
-
-
99
-
-
-
nC
nC
nC
QGS
gate-source charge
ID = 25 A; VDS = 15 V; VGS = 4.5 V;
Fig. 12; Fig. 13
15.3
10.5
QGS(th)
pre-threshold gate-
source charge
QGS(th-pl)
post-threshold gate-
source charge
-
4.8
-
nC
QGD
gate-drain charge
-
-
13.5
2.4
-
-
nC
V
VGS(pl)
gate-source plateau
voltage
ID = 25 A; VDS = 15 V; Fig. 12; Fig. 13
Ciss
Coss
Crss
input capacitance
output capacitance
VDS = 15 V; VGS = 0 V; f = 1 MHz;
Tj = 25 °C; Fig. 14
-
-
-
7668
2914
445
-
-
-
pF
pF
pF
reverse transfer
capacitance
©
PSMN0R9-30ULD
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2018. All rights reserved
Product data sheet
23 May 2018
6 / 13
Nexperia
PSMN0R9-30ULD
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
Symbol
td(on)
tr
Parameter
Conditions
Min
Typ
38.1
49.8
63
Max
Unit
ns
turn-on delay time
rise time
VDS = 15 V; RL = 0.6 Ω; VGS = 4.5 V;
RG(ext) = 5 Ω
-
-
-
-
-
-
-
-
-
-
ns
td(off)
tf
turn-off delay time
fall time
ns
42.6
83.11
ns
Qoss
output charge
VGS = 0 V; VDS = 15 V; f = 1 MHz;
Tj = 25 °C
nC
Source-drain diode
VSD
trr
source-drain voltage
IS = 25 A; VGS = 0 V; Tj = 25 °C; Fig. 15
-
-
-
-
0.76
52
1.2
V
reverse recovery time IS = 25 A; dIS/dt = -100 A/µs; VGS = 0 V;
-
-
-
ns
nC
ns
VDS = 15 V; Fig. 16
Qr
ta
recovered charge
[1]
67
reverse recovery rise
time
27.4
tb
S
reverse recovery fall
time
-
-
24.7
0.9
-
-
ns
softness factor
[1] includes capacitive recovery
aaa-011698
aaa-011700
180
6
5
4
3
2
1
0
I
D
R
DSon
(mΩ)
10 V
V
= 3 V
2.8 V
GS
(A)
135
90
45
0
2.6 V
2.4 V
2.2 V
0
0.5
1
1.5
2
DS
2.5
0
2
4
6
8
10
12
14
(V)
16
V
(V)
V
GS
Fig. 7. Output characteristics; drain current as a
function of drain-source voltage; typical values
Fig. 8. Drain-source on-state resistance as a function
of gate-source voltage; typical values
©
PSMN0R9-30ULD
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2018. All rights reserved
Product data sheet
23 May 2018
7 / 13
Nexperia
PSMN0R9-30ULD
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
aaa-011701
aaa-011702
200
160
120
80
12
I
D
R
(mΩ)
DSon
(A)
2.4 V
2.6 V
2.8 V
9
6
3
0
3 V
40
150°C
T = 25°C
j
4.5 V
V
GS
= 10 V
0
0
0.5
1
1.5
2
2.5
V
3
(V)
3.5
0
25
50
75 100 125 150 175 200
(A)
I
D
GS
Fig. 9. Transfer characteristics; drain current as a
function of gate-source voltage; typical values
Fig. 10. Drain-source on-state resistance as a function
of drain current; typical values
003aal037
2
V
a
DS
I
D
10 V
1.6
V
V
GS(pl)
1.2
GS(th)
V
= 4.5 V
GS
V
GS
0.8
0.4
0
Q
GS2
Q
GS1
Q
GS
Q
GD
G(tot)
Q
003aaa508
Fig. 12. Gate charge waveform definitions
-60 -30
0
30
60
90 120 150 180
T (°C)
j
Fig. 11. Normalized drain-source on-state resistance
factor as a function of junction temperature
©
PSMN0R9-30ULD
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2018. All rights reserved
Product data sheet
23 May 2018
8 / 13
Nexperia
PSMN0R9-30ULD
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
aaa-011703
aaa-011705
5
4
3
10
8
10
V
GS
C
(V)
(pF)
10
C
C
iss
6
24 V
oss
15 V
4
10
V
= 6 V
DS
C
rss
2
2
0
10
-1
2
0
20
40
60
80
100
(nC)
120
10
1
10
10
Q
G
V
DS
(V)
Fig. 14. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values
Fig. 13. Gate-source voltage as a function of gate
charge; typical values
003aal160
aaa-011706
3
10
I
S
I
D
(A)
(A)
2
10
t
rr
t
t
b
a
0
10
0.25 I
RM
1
150°C
T = 25°C
j
I
RM
-1
10
t (s)
0
0.2
0.4
0.6
0.8
V
1
(V)
1.2
SD
Fig. 16. Reverse recovery timing definition
Fig. 15. Source current as a function of source-drain
voltage; typical values
©
PSMN0R9-30ULD
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2018. All rights reserved
Product data sheet
23 May 2018
9 / 13
Nexperia
PSMN0R9-30ULD
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
11. Package outline
Plastic single-ended surface-mounted package (LFPAK56); 4 leads
SOT1023A
E
E
A
A
1
b
(3x)
2
b
c
1
1
mounting
base
D
1
D
H
L (4x)
1
2
3
4
X
e
c
b
w
A
(4x)
(3x)
C
A
1
A
2
θ
L
p
y
C
detail X
0
2.5
5 mm
scale
Dimensions
Unit
(1)
(1)
(1)
(1)
A
A
A
b
b
b
c
c
1
D
D
1
E
E
e
H
L
L
p
w
y
θ
1
2
1
2
1
°
max 1.10 0.15
nom
min 0.95 0.00
0.50 4.41
0.35 3.62
0.25 0.30 4.70 3.8 5.30 3.7
0.19 0.24 4.45 3.6 4.95 3.5
6.2 1.3 0.85
5.9 0.8 0.40
8
0
0.25
mm
0.85
1.27
0.25 0.1
°
Note
1. Plastic or metal protrusions of 0.15 mm per side are not included.
sot1023a_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
- - -
JEITA
17-05-29
17-06-02
SOT1023A
Fig. 17. Package outline LFPAK56-UL2595 (SOT1023A)
©
PSMN0R9-30ULD
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2018. All rights reserved
Product data sheet
23 May 2018
10 / 13
Nexperia
PSMN0R9-30ULD
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
Suitability for use — Nexperia products are not designed, authorized or
warranted to be suitable for use in life support, life-critical or safety-critical
systems or equipment, nor in applications where failure or malfunction
12. Legal information
of an Nexperia product can reasonably be expected to result in personal
injury, death or severe property or environmental damage. Nexperia and its
suppliers accept no liability for inclusion and/or use of Nexperia products in
such equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Data sheet status
Document status Product
Definition
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
[1][2]
status [3]
Objective [short]
data sheet
Development
This document contains data from
the objective specification for
product development.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.
Preliminary [short]
data sheet
Qualification
Production
This document contains data from
the preliminary specification.
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and products using Nexperia products, and Nexperia accepts no liability for
any assistance with applications or customer product design. It is customer’s
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and fit for the customer’s applications and products planned, as well as
for the planned application and use of customer’s third party customer(s).
Customers should provide appropriate design and operating safeguards to
minimize the risks associated with their applications and products.
Product [short]
data sheet
This document contains the product
specification.
[1] Please consult the most recently issued document before initiating or
completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the internet at https://www.nexperia.com.
Nexperia does not accept any liability related to any default, damage, costs
or problem which is based on any weakness or default in the customer’s
applications or products, or the application or use by customer’s third party
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customer’s applications and products using Nexperia products in order to
avoid a default of the applications and the products or of the application or
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liability in this respect.
Definitions
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internal review and subject to formal approval, which may result in
modifications or additions. Nexperia does not give any representations or
warranties as to the accuracy or completeness of information included herein
and shall have no liability for the consequences of use of such information.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the relevant
full data sheet, which is available on request via the local Nexperia sales
office. In case of any inconsistency or conflict with the short data sheet, the
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©
PSMN0R9-30ULD
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2018. All rights reserved
Product data sheet
23 May 2018
11 / 13
Nexperia
PSMN0R9-30ULD
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
Translations — A non-English (translated) version of a document is for
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Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
©
PSMN0R9-30ULD
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2018. All rights reserved
Product data sheet
23 May 2018
12 / 13
Nexperia
PSMN0R9-30ULD
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
Contents
1. General description......................................................1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Marking..........................................................................3
8. Limiting values............................................................. 3
9. Thermal characteristics............................................... 5
10. Characteristics............................................................6
11. Package outline........................................................ 10
12. Legal information.......................................................11
© Nexperia B.V. 2018. All rights reserved
For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 23 May 2018
©
PSMN0R9-30ULD
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2018. All rights reserved
Product data sheet
23 May 2018
13 / 13
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