935286429118 [NXP]
Multiplexer And Demux/Decoder;
| 型号： | 935286429118 |
| 厂家： | 
NXP |
| 描述： | Multiplexer And Demux/Decoder 逻辑集成电路 |
| 文件： | 总15页 (文件大小：98K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NX5DV330
Quad 1-of-2 video multiplexer/demultiplexer
Rev. 03 — 5 August 2009
Product data sheet
1. General description
The NX5DV330 is a quad 1-of-2 high-speed TTL-compatible video
multiplexer/demultiplexer. The low ON resistance of the switch allows inputs to be
connected to outputs without adding propagation delay or generating additional ground
bounce noise
It has a digital select input (S), four independent inputs/outputs (nY0, nY1), a common
input/output (nZ) and an active LOW enable input (E). When pin E is HIGH, the switch is
turned off.
Schmitt-trigger action at the enable input (E) and select input (S) makes the circuit tolerant
to slower input rise and fall times across the entire VCC range from 4.0 V to 5.5 V.
The NX5DV330 is characterized for operation from −40 °C to +85 °C.
2. Features
I 5 Ω switch connection between two ports
I TTL-compatible input levels
I Minimal propagation delay through the switch
I ESD protection:
N HBM JESD22-A114E Class 2A exceeds 2000 V
N MM JESD22-A115-A exceeds 200 V
N CDM JESD22-C101C exceeds 1000 V
I Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA
NX5DV330
NXP Semiconductors
Quad 1-of-2 video multiplexer/demultiplexer
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
NX5DV330D
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
SO16
plastic small outline package; 16 leads;
body width 3.9 mm
SOT109-1
SOT519-1
SOT403-1
SOT763-1
NX5DV330DS
NX5DV330PW
NX5DV330BQ
SSOP16[1] plastic shrink small outline package; 16 leads;
body width 3.9 mm; lead pitch 0.635 mm
TSSOP16
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
DHVQFN16 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 16 terminals;
body 2.5 × 3.5 × 0.85 mm
[1] Also known as QSOP16.
4. Functional diagram
4
2
3
1Z
2Z
3Z
4Z
1Y0
1Y1
2Y0
2Y1
3Y0
3Y1
4Y0
4Y1
7
5
6
9
11
10
14
13
12
1
S
E
15
001aai498
Fig 1. Logic diagram
NX5DV330_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
2 of 15
NX5DV330
NXP Semiconductors
Quad 1-of-2 video multiplexer/demultiplexer
5. Pinning information
5.1 Pinning
NX5DV330
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
S
1Y0
1Y1
1Z
V
E
CC
NX5DV330
4Y0
4Y1
4Z
1
2
3
4
5
6
7
8
16
15
14
13
S
1Y0
1Y1
1Z
V
E
CC
4Y0
4Y1
2Y0
2Y1
2Z
12 4Z
3Y0
3Y1
3Z
2Y0
2Y1
2Z
11
10
9
3Y0
3Y1
3Z
GND
GND
001aai499
001aai500
Fig 2. Pin configuration for SOT109-1 (SO16)
Fig 3. Pin configuration for SOT519-1 (SSOP16)
NX5DV330
terminal 1
index area
NX5DV330
2
3
4
5
6
7
15
14
13
12
11
10
1Y0
1Y1
1Z
E
4Y0
4Y1
4Z
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
S
1Y0
1Y1
1Z
V
E
CC
4Y0
4Y1
4Z
2Y0
2Y1
2Z
(1)
3Y0
3Y1
GND
2Y0
2Y1
2Z
3Y0
3Y1
3Z
001aak330
GND
Transparent top view
001aai501
Fig 4. Pin configuration for SOT403-1 (TSSOP16)
Fig 5. Pin configuration for SOT763-1 (DHVQFN16)
5.2 Pin description
Table 2.
Symbol
S
Pin description
Pin
Description
1
select control input
1Y0, 1Y1, 2Y0, 2Y1, 3Y1, 3Y0, 4Y1, 4Y0 2, 3, 5, 6, 10, 11, 13, 14
independent input or output
independent input or output
ground (0 V)
1Z, 2Z, 3Z, 4Z
4, 7, 9, 12
GND
E
8
15
16
enable input (active LOW)
positive supply voltage
VCC
NX5DV330_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
3 of 15
NX5DV330
NXP Semiconductors
Quad 1-of-2 video multiplexer/demultiplexer
6. Functional description
Table 3.
Function selection
H = HIGH voltage level; L = LOW voltage level; X = Don’t care.
Input
Switch
E
L
S
L
Y0 to Z or Z to Y0
Y1 to Z or Z to Y1
switch off
L
H
X
H
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCC
Parameter
Conditions
Min
−0.5
−0.5
-
Max
+7.0
+7.0
128
Unit
V
supply voltage
input voltage
switch current
[1]
VI
V
ISW
continuous current
through each switch
mA
IIK
input clamping current
storage temperature
total power dissipation
VI < 0 V
-
−50
mA
°C
Tstg
Ptot
−65
+150
500
[2][3][4]
-
mW
[1] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
[2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 °C.
[3] For SSOP16 (QSOP16) and TSSOP16 packages: Ptot derates linearly with 5.5 mW/K above 60 °C.
[4] For DHVQFN16 packages: above 60 °C derate linearly with 4.5 mW/K.
8. Recommended operating conditions
Table 5.
Operating conditions
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation.
Symbol
VCC
VIH
Parameter
Conditions
Min
4.0
2.0
-
Typ
5.0
-
Max
5.5
-
Unit
V
supply voltage
HIGH-level input voltage
LOW-level input voltage
hysteresis voltage
ambient temperature
V
VIL
-
0.8
-
V
VH
pin S, E
-
45
+25
mV
°C
Tamb
operating in free-air
−40
+85
NX5DV330_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
4 of 15
NX5DV330
NXP Semiconductors
Quad 1-of-2 video multiplexer/demultiplexer
9. Static characteristics
Table 6.
Static characteristics
Tamb = −40 °C to +85 °C.
Symbol Parameter
Conditions
Min
Typ[1] Max
Unit
V
VIK
input clamping voltage
VCC = 4.5 V; II = −18 mA
-
-
-
-
-
-
-
-
-
-
-
-
−1.2
±1
±1
±1
3
II
input leakage current
OFF-state leakage current
power-off leakage current
supply current
pin S, E; VCC = 5.5 V; VI = GND or 5.5 V
VCC = 5.5 V; VI = GND; VO = 0 V to 5.5 V
VCC = 0 V; VI = VO = 0 V to 5.5 V
VCC = 5.5 V; IO = 0 mA; VI = VCC or GND
µA
µA
µA
µA
mA
IS(OFF)
IOFF
ICC
[2]
∆ICC
additional supply current
pin S, E; VCC = 5.5 V; one input at 3.4 V,
other inputs at VCC or GND
2.5
CI
input capacitance
pin S, E; VI = 5 V or 0 V
-
-
-
-
3.5
6.0
4.0
14
-
-
-
-
pF
pF
pF
pF
Cio(off)
off-state input/output
capacitance
Z port; VCC = 5 V; VO = 5 V or 0 V; E = VCC
Y port; VCC = 5 V; VO = 5 V or 0 V; E = VCC
Z port; VCC = 5 V; VO = 5 V or 0 V; E = GND
Cio(on)
RON
on-state input/output
capacitance
[3]
ON resistance
VCC = 4.5 V
VI = 1.0 V; II = 13 mA
VI = 2.0 V; II = 26 mA
-
-
3
7
7
Ω
Ω
10
[1] All typical values are measured at VCC = 5 V; Tamb = 25 °C.
[2] This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
[3] Measured by the voltage drop between the Z and the Y terminals at the indicated current through the switch. ON-state resistance is
determined by the lowest voltage of the two (Z or Y) terminals.
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Tamb = −40 °C to +85 °C; for test circuit see Figure 7.
Symbol
Parameter
Conditions
Min
Typ
4.0
2.3
Max
6.0
Unit
ns
ton
turn-on time
S to nZ; see Figure 6
VCC = 4.5 V to 5.5 V
S to nZ; see Figure 6
VCC = 4.5 V to 5.5 V
-
-
toff
turn-off time
6.0
ns
NX5DV330_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
5 of 15
NX5DV330
NXP Semiconductors
Quad 1-of-2 video multiplexer/demultiplexer
11. Waveforms
V
I
S input
GND
V
V
M
M
t
t
on
off
V
OH
nZ output
GND
V
V
Y
Y
001aai502
Measurement points are given in Table 8.
VOH is the typical voltage output level that occurs with the output load.
Fig 6. Input (S) to output (nZ) turn-on and turn-off time
Table 8.
Measurement points
Supply voltage
VCC
Input
Output
VY
VI
VM
4.5 V to 5.5 V
GND to 3.0 V
1.5 V
0.9VOH
V
CC
S
Y0
Y1
V
V
Y0
Z
Y1
E
G
V
50 Ω
V
V
R
L
C
L
i
O
GND
001aai503
Test data is given in Table 9.
Definitions test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
Fig 7. Test circuit for measuring turn-on and turn-off times
Table 9.
Input
VI
Test data
Load
fi
tr, tf
VY0
VY1
3.0 V to GND
RL
CL
GND to 3.0 V
≤ 10 MHz
≤ 2.5 ns
GND to 3.0 V
75 Ω
20 pF
NX5DV330_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
6 of 15
NX5DV330
NXP Semiconductors
Quad 1-of-2 video multiplexer/demultiplexer
12. Additional dynamic characteristics
Table 10. Additional dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); VI = GND or VCC (unless otherwise
specified); Tamb = 25 °C; VCC = 4.5 V to 5.5 V.
Symbol Parameter
Conditions
Min
Typ
0.64
0.1
-
Max Unit
Gdif
differential gain
fi = 3.58 MHz; RL = 150 Ω
fi = 3.58 MHz; RL = 150 Ω
RL = 150 Ω; see Figure 8
fi = 10 MHz; RL = 150 Ω; see Figure 9
-
-
-
-
-
-
%
deg
MHz
dB
ϕdif
differential phase
−3 dB frequency response
isolation (OFF-state)
crosstalk
-
f(−3dB)
αiso
300
-
-
−60
−63
[1]
Xtalk
between switches; see Figure 10;
dB
fi = 10 MHz; RL = 150 Ω; Ri = 10 Ω
[1] All unused analog input pins (nZ) and outputs pins (nYn) are connected through 10 Ω and 50 Ω pull-down resistors, respectively.
13. Test circuits
V
CC
switch
S
1
2
V
IL
S
Z
V
or V
IH
IL
V
Y0 1 switch
Y1
IH
2
f
R
L
dB
i
GND
001aai505
Adjust fi voltage to obtain 0 dBm level at output. Increase fi frequency until dB meter reads −3 dB.
Fig 8. Test circuit for measuring the frequency response when channel is in ON-state
V
CC
switch
S
1
2
V
IH
S
Z
V
or V
IH
IL
V
Y0 1 switch
Y1
IL
2
f
R
L
R
L
dB
i
GND
001aai506
Adjust fi voltage to obtain 0 dBm level at input.
Fig 9. Test circuit for measuring isolation (OFF-state)
NX5DV330_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
7 of 15
NX5DV330
NXP Semiconductors
Quad 1-of-2 video multiplexer/demultiplexer
1E
1Z
V
or V
IL
IH
1Y
f
R
L
50 Ω
i
2Z
2Y
R
i
R
L
dB
001aai507
Adjust fi voltage to obtain 0 dBm level at input.
Fig 10. Test circuit for measuring crosstalk voltage between digital inputs and switch
NX5DV330_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
8 of 15
NX5DV330
NXP Semiconductors
Quad 1-of-2 video multiplexer/demultiplexer
14. Package outline
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
v
c
y
H
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT109-1
076E07
MS-012
Fig 11. Package outline SOT109-1 (SO16)
NX5DV330_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
9 of 15
NX5DV330
NXP Semiconductors
Quad 1-of-2 video multiplexer/demultiplexer
SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm
SOT519-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
A
2
A
(A )
3
A
1
θ
L
p
L
8
1
detail X
w
M
e
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
v
w
y
Z
θ
p
p
1
2
3
E
max.
8o
0o
0.25
0.10
1.55
1.40
0.31
0.20
0.25
0.18
5.0
4.8
4.0
3.8
6.2
5.8
0.89
0.41
0.18
0.05
mm
1.73
0.25
0.635
1
0.2
0.18
0.09
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-05-04
03-02-18
SOT519-1
Fig 12. Package outline SOT519-1 (SSOP16)
NX5DV330_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
10 of 15
NX5DV330
NXP Semiconductors
Quad 1-of-2 video multiplexer/demultiplexer
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
8
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.40
0.06
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT403-1
MO-153
Fig 13. Package outline SOT403-1 (TSSOP16)
NX5DV330_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
11 of 15
NX5DV330
NXP Semiconductors
Quad 1-of-2 video multiplexer/demultiplexer
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
16 terminals; body 2.5 x 3.5 x 0.85 mm
SOT763-1
B
A
D
A
A
1
E
c
detail X
terminal 1
index area
C
terminal 1
index area
e
1
y
y
e
b
v
M
C
C
A
B
C
1
w
M
2
7
L
1
8
9
E
h
e
16
15
10
D
h
X
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
b
c
E
e
e
1
y
D
D
E
L
v
w
y
1
1
h
h
max.
0.05 0.30
0.00 0.18
3.6
3.4
2.15
1.85
2.6
2.4
1.15
0.85
0.5
0.3
mm
0.05
0.1
1
0.2
0.5
2.5
0.1
0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-10-17
03-01-27
SOT763-1
- - -
MO-241
- - -
Fig 14. Package outline SOT763-1 (DHVQFN16)
NX5DV330_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
12 of 15
NX5DV330
NXP Semiconductors
Quad 1-of-2 video multiplexer/demultiplexer
15. Abbreviations
Table 11. Abbreviations
Acronym
CDM
ESD
Description
Charged Device Model
ElectroStatic Discharge
Human Body Model
Machine Model
HBM
MM
TTL
Transistor-Transistor Logic
16. Revision history
Table 12. Revision history
Document ID
NX5DV330_3
Modifications:
NX5DV330_2
NX5DV330_1
Release date
20090805
Data sheet status
Change notice
Supersedes
Product data sheet
-
NX5DV330_2
• Added type number NX5DV330BQ (DHVQFN16 package)
20080825
Product data sheet
-
NX5DV330_1
-
20080815
Product data sheet
-
NX5DV330_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
13 of 15
NX5DV330
NXP Semiconductors
Quad 1-of-2 video multiplexer/demultiplexer
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
17.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NX5DV330_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
14 of 15
NX5DV330
NXP Semiconductors
Quad 1-of-2 video multiplexer/demultiplexer
19. Contents
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Additional dynamic characteristics . . . . . . . . . 7
Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13
7
8
9
10
11
12
13
14
15
16
17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
17.1
17.2
17.3
17.4
18
19
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 5 August 2009
Document identifier: NX5DV330_3
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