935321126557 [NXP]
Microprocessor;型号: | 935321126557 |
厂家: | NXP |
描述: | Microprocessor 外围集成电路 |
文件: | 总99页 (文件大小:1086K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Document Number: MPC8347EAEC
Rev. 12, 09/2011
Freescale Semiconductor
Technical Data
MPC8347EA PowerQUICC II Pro
Integrated Host Processor Hardware
Specifications
Contents
The MPC8347EA PowerQUICC II Pro is a next generation
PowerQUICC II integrated host processor. The
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 6
MPC8347EA contains a processor core built on Power
3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 10
4. Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Architecture® technology with system logic for networking,
storage, and general-purpose embedded applications. For
functional characteristics of the processor, refer to the
5. RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 14
6. DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 16
7. DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
MPC8349EA PowerQUICC II Pro Integrated Host
Processor Family Reference Manual.
8. Ethernet: Three-Speed Ethernet, MII Management . 23
9. USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
10. Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
To locate published errata or updates for this document, refer
to the MPC8347EA product summary page on our website,
as listed on the back cover of this document, or contact your
11. JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
12. I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
13. PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
14. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
local Freescale sales office.
15. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
16. IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
17. SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
18. Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 54
19. Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
20. Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
21. System Design Information . . . . . . . . . . . . . . . . . . . 91
22. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 94
23. Document Revision History . . . . . . . . . . . . . . . . . . . 96
© 2006–2011 Freescale Semiconductor, Inc. All rights reserved.
Overview
NOTE
The information in this document is accurate for revision 3.x silicon and
later (in other words, for orderable part numbers ending in A or B). For
information on revision 1.1 silicon and earlier versions, see the MPC8347E
PowerQUICC II Pro Integrated Host Processor Hardware Specifications.
See Section 22.1, “Part Numbers Fully Addressed by This Document,” for
silicon revision level determination.
1 Overview
This section provides a high-level overview of the device features. Figure 1 shows the major functional
units within the MPC8347EA.
e300 Core
DUART
Dual I2C
DDR
Timers
GPIO
Interrupt
Controller
32KB
32KB
I-Cache
SDRAM
Security
Local Bus
D-Cache
Controller
High-Speed
USB 2.0
10/100/1000
Ethernet
10/100/1000
Ethernet
SEQ
PCI
DMA
Dual
Role
Host
Figure 1. MPC8347EA Block Diagram
Major features of the device are as follows:
• Embedded PowerPC e300 processor core; operates at up to 667 MHz
— High-performance, superscalar processor core
— Floating-point, integer, load/store, system register, and branch processing units
— 32-Kbyte instruction cache, 32-Kbyte data cache
— Lockable portion of L1 cache
— Dynamic power management
— Software-compatible with the other Freescale processor families that implement Power
Architecture technology
•
Double data rate, DDR1/DDR2 SDRAM memory controller
— Programmable timing supporting DDR1 and DDR2 SDRAM
— 32- or 64-bit data interface, up to 400 MHz data rate for TBGA, 266 MHz for PBGA
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
2
Freescale Semiconductor
Overview
— Up to four physical banks (chip selects), each bank up to 1 Gbyte independently addressable
— DRAM chip configurations from 64 Mbits to 1 Gbit with ×8/×16 data ports
— Full error checking and correction (ECC) support
— Support for up to 16 simultaneous open pages (up to 32 pages for DDR2)
— Contiguous or discontiguous memory mapping
— Read-modify-write support
— Sleep-mode support for SDRAM self refresh
— Auto refresh
— On-the-fly power management using CKE
— Registered DIMM support
— 2.5-V SSTL2 compatible I/O for DDR1, 1.8-V SSTL2 compatible I/O for DDR2
Dual three-speed (10/100/1000) Ethernet controllers (TSECs)
•
— Dual controllers designed to comply with IEEE 802.3™, 802.3u™, 820.3x™, 802.3z™,
802.3ac™ standards
— Ethernet physical interfaces:
– 1000 Mbps IEEE Std. 802.3 GMII/RGMII, IEEE Std. 802.3z TBI/RTBI, full-duplex
– 10/100 Mbps IEEE Std. 802.3 MII full- and half-duplex
— Buffer descriptors are backward-compatible with MPC8260 and MPC860T 10/100
programming models
— 9.6-Kbyte jumbo frame support
— RMON statistics support
— Internal 2-Kbyte transmit and 2-Kbyte receive FIFOs per TSEC module
— MII management interface for control and status
— Programmable CRC generation and checking
PCI interface
•
— Designed to comply with PCI Specification Revision 2.3
— Data bus width:
– 32-bit data PCI interface operating at up to 66 MHz
— PCI 3.3-V compatible
— PCI host bridge capabilities
— PCI agent mode on PCI interface
— PCI-to-memory and memory-to-PCI streaming
— Memory prefetching of PCI read accesses and support for delayed read transactions
— Posting of processor-to-PCI and PCI-to-memory writes
— On-chip arbitration supporting five masters on PCI
— Accesses to all PCI address spaces
— Parity supported
— Selectable hardware-enforced coherency
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
3
Overview
— Address translation units for address mapping between host and peripheral
— Dual address cycle for target
— Internal configuration registers accessible from PCI
•
Security engine is optimized to handle all the algorithms associated with IPSec, SSL/TLS, SRTP,
IEEE Std. 802.11i®, iSCSI, and IKE processing. The security engine contains four
crypto-channels, a controller, and a set of crypto execution units (EUs):
— Public key execution unit (PKEU) :
– RSA and Diffie-Hellman algorithms
– Programmable field size up to 2048 bits
– Elliptic curve cryptography
– F2m and F(p) modes
– Programmable field size up to 511 bits
— Data encryption standard (DES) execution unit (DEU)
– DES and 3DES algorithms
– Two key (K1, K2) or three key (K1, K2, K3) for 3DES
– ECB and CBC modes for both DES and 3DES
— Advanced encryption standard unit (AESU)
– Implements the Rijndael symmetric-key cipher
– Key lengths of 128, 192, and 256 bits
– ECB, CBC, CCM, and counter (CTR) modes
— XOR parity generation accelerator for RAID applications
— ARC four execution unit (AFEU)
– Stream cipher compatible with the RC4 algorithm
– 40- to 128-bit programmable key
— Message digest execution unit (MDEU)
– SHA with 160-, 224-, or 256-bit message digest
– MD5 with 128-bit message digest
– HMAC with either algorithm
— Random number generator (RNG)
— Four crypto-channels, each supporting multi-command descriptor chains
– Static and/or dynamic assignment of crypto-execution units through an integrated controller
– Buffer size of 256 bytes for each execution unit, with flow control for large data sizes
Universal serial bus (USB) dual role controller
— USB on-the-go mode with both device and host functionality
— Complies with USB specification Rev. 2.0
— Can operate as a stand-alone USB device
– One upstream facing port
•
– Six programmable USB endpoints
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
4
Freescale Semiconductor
Overview
— Can operate as a stand-alone USB host controller
– USB root hub with one downstream-facing port
– Enhanced host controller interface (EHCI) compatible
– High-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) operations
— External PHY with UTMI, serial and UTMI+ low-pin interface (ULPI)
Universal serial bus (USB) multi-port host controller
•
— Can operate as a stand-alone USB host controller
– USB root hub with one or two downstream-facing ports
– Enhanced host controller interface (EHCI) compatible
– Complies with USB Specification Rev. 2.0
— High-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) operations
— Direct connection to a high-speed device without an external hub
— External PHY with serial and low-pin count (ULPI) interfaces
Local bus controller (LBC)
•
— Multiplexed 32-bit address and data operating at up to 133 MHz
— Eight chip selects for eight external slaves
— Up to eight-beat burst transfers
— 32-, 16-, and 8-bit port sizes controlled by an on-chip memory controller
— Three protocol engines on a per chip select basis:
– General-purpose chip select machine (GPCM)
– Three user-programmable machines (UPMs)
– Dedicated single data rate SDRAM controller
— Parity support
— Default boot ROM chip select with configurable bus width (8-, 16-, or 32-bit)
Programmable interrupt controller (PIC)
•
— Functional and programming compatibility with the MPC8260 interrupt controller
— Support for 8 external and 35 internal discrete interrupt sources
— Support for 1 external (optional) and 7 internal machine checkstop interrupt sources
— Programmable highest priority request
— Four groups of interrupts with programmable priority
— External and internal interrupts directed to host processor
— Redirects interrupts to external INTA pin in core disable mode.
— Unique vector number for each interrupt source
2
•
Dual industry-standard I C interfaces
— Two-wire interface
— Multiple master support
2
— Master or slave I C mode support
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
5
Electrical Characteristics
— On-chip digital filtering rejects spikes on the bus
2
— System initialization data optionally loaded from I C-1 EPROM by boot sequencer embedded
hardware
•
DMA controller
— Four independent virtual channels
— Concurrent execution across multiple channels with programmable bandwidth control
— Handshaking (external control) signals for all channels: DMA_DREQ[0:3],
DMA_DACK[0:3], DMA_DDONE[0:3]
— All channels accessible to local core and remote PCI masters
— Misaligned transfer capability
— Data chaining and direct mode
— Interrupt on completed segment and chain
DUART
•
— Two 4-wire interfaces (RxD, TxD, RTS, CTS)
— Programming model compatible with the original 16450 UART and the PC16550D
Serial peripheral interface (SPI) for master or slave
General-purpose parallel I/O (GPIO)
•
•
— 52 parallel I/O pins multiplexed on various chip interfaces
System timers
•
— Periodic interrupt timer
— Real-time clock
— Software watchdog timer
— Eight general-purpose timers
•
•
Designed to comply with IEEE Std. 1149.1™, JTAG boundary scan
Integrated PCI bus and SDRAM clock generation
2 Electrical Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the
MPC8347EA. The device is currently targeted to these specifications. Some of these specifications are
independent of the I/O cell, but are included for a more complete reference. These are not purely I/O buffer
design specifications.
2.1
Overall DC Electrical Characteristics
This section covers the ratings, conditions, and other characteristics.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
6
Freescale Semiconductor
Electrical Characteristics
2.1.1
Absolute Maximum Ratings
Table 1 provides the absolute maximum ratings.
1
Table 1. Absolute Maximum Ratings
Parameter
Symbol
Max Value
Unit
Notes
Core supply voltage
PLL supply voltage
VDD
–0.3 to 1.32 (1.36 max
for 667-MHz core
frequency)
V
—
AVDD
GVDD
–0.3 to 1.32 (1.36 max
for 667-MHz core
frequency)
V
V
—
—
DDR and DDR2 DRAM I/O voltage
–0.3 to 2.75
–0.3 to 1.98
Three-speed Ethernet I/O, MII management voltage
LVDD
–0.3 to 3.63
–0.3 to 3.63
V
V
—
—
PCI, local bus, DUART, system control and power management, I2C,
and JTAG I/O voltage
OVDD
Input voltage
DDR DRAM signals
MVIN
MVREF
LVIN
–0.3 to (GVDD + 0.3)
–0.3 to (GVDD + 0.3)
–0.3 to (LVDD + 0.3)
–0.3 to (OVDD + 0.3)
V
V
V
V
2, 5
2, 5
4, 5
3, 5
DDR DRAM reference
Three-speed Ethernet signals
Local bus, DUART, CLKIN, system control and
power management, I2C, and JTAG signals
OVIN
PCI
OVIN
TSTG
–0.3 to (OVDD + 0.3)
–55 to 150
V
6
Storage temperature range
°C
—
Notes:
1
Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and
functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause
permanent damage to the device.
2
3
4
5
Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
Caution: OVIN must not exceed OVDD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
Caution: LVIN must not exceed LVDD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during power-on
reset and power-down sequences.
(M,L,O)VIN and MVREF may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2.
6 OVIN on the PCI interface can overshoot/undershoot according to the PCI Electrical Specification for 3.3-V operation, as
shown in Figure 3.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
7
Electrical Characteristics
2.1.2
Power Supply Voltage Specification
Table 2 provides the recommended operating conditions for the MPC8347EA. Note that the values in
Table 2 are the recommended and tested operating conditions. Proper device operation outside these
conditions is not guaranteed.
Table 2. Recommended Operating Conditions
Recommended
Parameter
Symbol
Unit
Notes
Value
Core supply voltage for 667-MHz core frequency
Core supply voltage
VDD
VDD
1.3 V 60 mV
1.2 V 60 mV
1.3 V 60 mV
1.2 V 60 mV
V
V
V
V
V
1
1
PLL supply voltage for 667-MHz core frequency
PLL supply voltage
AVDD
AVDD
GVDD
1
1
DDR and DDR2 DRAM I/O voltage
2.5 V 125 mV
1.8 V 90 mV
—
Three-speed Ethernet I/O supply voltage
Three-speed Ethernet I/O supply voltage
LVDD1
LVDD2
OVDD
3.3 V 330 mV
2.5 V 125 mV
V
V
V
—
—
—
3.3 V 330 mV
2.5 V 125 mV
PCI, local bus, DUART, system control and power
management, I2C, and JTAG I/O voltage
3.3 V 330 mV
Note:
1
GVDD, LVDD, OVDD, AVDD, and VDD must track each other and must vary in the same direction—either in the positive or
negative direction.
Figure 2 shows the undershoot and overshoot voltages at the interfaces of the MPC8347EA.
G/L/OVDD + 20%
G/L/OVDD + 5%
G/L/OVDD
VIH
GND
GND – 0.3 V
VIL
GND – 0.7 V
Not to Exceed 10%
1
of tinterface
Note:
1. tinterface refers to the clock period associated with the bus clock interface.
Figure 2. Overshoot/Undershoot Voltage for GV /OV /LV
DD
DD
DD
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
8
Electrical Characteristics
Figure 3 shows the undershoot and overshoot voltage of the PCI interface of the MPC8347EA for the
3.3-V signals, respectively.
11 ns
(Min)
+7.1 V
Overvoltage
Waveform
7.1 V p-to-p
(Min)
0 V
4 ns
(Max)
4 ns
(Max)
62.5 ns
+3.6 V
Undervoltage
Waveform
7.1 V p-to-p
(Min)
–3.5 V
Figure 3. Maximum AC Waveforms on PCI Interface for 3.3-V Signaling
2.1.3
Output Driver Characteristics
Table 3 provides information on the characteristics of the output driver strengths. The values are
preliminary estimates.
Table 3. Output Drive Capability
Output Impedance
Supply
Voltage
Driver Type
(Ω)
Local bus interface utilities signals
PCI signals (not including PCI output clocks)
PCI output clocks (including PCI_SYNC_OUT)
DDR signal
40
25
40
18
OVDD = 3.3 V
GVDD = 2.5 V
GVDD = 1.8 V
DDR2 signal
18
36 (half-strength mode)
TSEC/10/100 signals
DUART, system control, I2C, JTAG, USB
40
40
40
LVDD = 2.5/3.3 V
OVDD = 3.3 V
GPIO signals
OVDD = 3.3 V,
LVDD = 2.5/3.3 V
2.2
Power Sequencing
This section details the power sequencing considerations for the MPC8347EA.
2.2.1
Power-Up Sequencing
MPC8347EAdoes not require the core supply voltage (V and AV ) and I/O supply voltages (GV ,
DD
DD
DD
LV , and OV ) to be applied in any particular order. During the power ramp up, before the power
DD
DD
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
9
Power Characteristics
supplies are stable and if the I/O voltages are supplied before the core voltage, there may be a period of
time that all input and output pins will actively be driven and cause contention and excessive current from
3A to 5A. In order to avoid actively driving the I/O pins and to eliminate excessive current draw, apply the
core voltage (V ) before the I/O voltage (GV , LV , and OV ) and assert PORESET before the
DD
DD
DD
DD
power supplies fully ramp up. In the case where the core voltage is applied first, the core voltage supply
must rise to 90% of its nominal value before the I/O supplies reach 0.7 V, see Figure 4.
Voltage
I/O Voltage (GVDD, LVDD, OVDD
)
Core Voltage (VDD, AVDD
)
0.7 V
90%
Time
Figure 4. Power Sequencing Example
I/O voltage supplies (GV , LV , and OV ) do not have any ordering requirements with respect to one
DD
DD
DD
another.
3 Power Characteristics
The estimated typical power dissipation for the MPC8347EA device is shown in Table 4.
1
Table 4. MPC8347EA Power Dissipation
Core
Frequency
(MHz)
CSB
Frequency
(MHz)
,
Typical at TJ = 65
Typical2 3
Maximum4
Unit
PBGA
266
400
400
266
133
266
133
200
100
1.3
1.1
1.5
1.4
1.5
1.3
1.6
1.4
1.9
1.7
1.8
1.7
1.8
1.6
2.1
1.9
2.0
1.9
W
W
W
W
W
W
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
10
Power Characteristics
1
Table 4. MPC8347EA Power Dissipation (continued)
Core
Frequency
(MHz)
CSB
Frequency
(MHz)
,
Typical at TJ = 65
Typical2 3
Maximum4
Unit
TBGA
333
333
166
266
133
300
150
333
166
266
133
333
2.0
1.8
2.1
1.9
2.3
2.1
2.4
2.2
2.4
2.2
3.5
3.0
2.8
3.0
2.9
3.2
3.0
3.3
3.1
3.3
3.1
4.6
3.2
2.9
3.3
3.1
3.5
3.2
3.6
3.4
3.6
3.4
5
W
W
W
W
W
W
W
W
W
W
W
400
450
500
533
6675,6
1
2
The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. For I/O power values, see Table 5.
Typical power is based on a voltage of VDD = 1.2 V, a junction temperature of TJ = 105°C, and a Dhrystone benchmark
application.
3
4
5
6
Thermal solutions may need to design to a value higher than typical power based on the end application, TA target, and I/O
power.
Maximum power is based on a voltage of VDD = 1.2 V, worst case process, a junction temperature of TJ = 105°C, and an
artificial smoke test.
Typical power is based on a voltage of VDD = 1.3 V, a junction temperature of TJ = 105°C, and a Dhrystone benchmark
application.
Maximum power is based on a voltage of VDD = 1.3 V, worst case process, a junction temperature of TJ = 105°C, and an
artificial smoke test.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
11
Power Characteristics
Table 5 shows the estimated typical I/O power dissipation for MPC8347EA.
Table 5. MPC8347EA Typical I/O Power Dissipation
DDR2
GVDD
(1.8 V)
DDR1
GVDD
(2.5 V)
OVDD
LVDD
LVDD
Interface
Parameter
Unit
Comments
(3.3 V) (3.3 V) (2.5 V)
DDR I/O
65% utilization
2.5 V
Rs = 20 Ω
Rt = 50 Ω
2 pair of clocks
200 MHz, 32 bits
200 MHz, 64 bits
266 MHz, 32 bits
266 MHz, 64 bits
300 MHz,1 32 bits
300 MHz,1 64 bits
333 MHz,1 32 bits
333 MHz,1 64 bits
400 MHz,1 32 bits
400 MHz,1 64 bits
33 MHz, 32 bits
66 MHz, 32 bits
167 MHz, 32 bits
133 MHz, 32 bits
83 MHz, 32 bits
66 MHz, 32 bits
50 MHz, 32 bits
MII
0.31
0.42
0.35
0.47
0.37
0.50
0.39
0.53
0.44
0.59
—
0.42
0.55
0.5
0.66
0.54
0.7
0.58
0.76
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0.04
—
—
—
W
W
W
W
W
W
W
W
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
PCI I/O
load = 30 pF
—
0.04
0.07
0.34
0.27
0.17
0.14
0.11
—
—
W
W
W
W
W
W
W
W
W
W
W
W
W
—
—
—
Local bus I/O
load = 25 pF
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
TSEC I/O
load = 25 pF
—
—
0.01
0.06
—
Multiply by number of
interfaces used.
GMII or TBI
—
—
—
RGMII or RTBI
12 MHz
—
—
—
USB
—
—
0.01
0.2
0.01
—
Multiply by 2 if using
2 ports.
480 MHz
—
—
—
Other I/O
—
—
—
—
1
TBGA package only.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
12
Clock Input Timing
4 Clock Input Timing
This section provides the clock input DC and AC electrical characteristics for the device.
4.1
DC Electrical Characteristics
Table 6 provides the clock input (CLKIN/PCI_SYNC_IN) DC timing specifications for the MPC8347EA.
Table 6. CLKIN DC Timing Specifications
Parameter
Input high voltage
Condition
Symbol
Min
Max
Unit
—
—
VIH
VIL
IIN
2.7
–0.3
—
OVDD + 0.3
V
V
Input low voltage
0.4
10
10
CLKIN input current
PCI_SYNC_IN input current
0 V ≤ VIN ≤ OVDD
μA
μA
0 V ≤ VIN ≤ 0.5 V or
IIN
—
OVDD – 0.5 V ≤ VIN ≤ OVDD
PCI_SYNC_IN input current
0.5 V ≤VIN ≤ OVDD – 0.5 V
IIN
—
50
μA
4.2
AC Electrical Characteristics
The primary clock source for the MPC8347EA can be one of two inputs, CLKIN or PCI_CLK, depending
on whether the device is configured in PCI host or PCI agent mode. Table 7 provides the clock input
(CLKIN/PCI_CLK) AC timing specifications for the device.
Table 7. CLKIN AC Timing Specifications
Parameter/Condition
CLKIN/PCI_CLK frequency
Symbol
Min
Typical
Max
Unit
Notes
fCLKIN
tCLKIN
—
15
0.6
40
—
—
—
66
—
MHz
ns
1, 6
—
2
CLKIN/PCI_CLK cycle time
CLKIN/PCI_CLK rise and fall time
CLKIN/PCI_CLK duty cycle
CLKIN/PCI_CLK jitter
Notes:
tKH, tKL
tKHK/tCLKIN
—
1.0
—
2.3
60
ns
%
3
—
150
ps
4, 5
1. Caution: The system, core, USB, security, and TSEC must not exceed their respective maximum or minimum operating
frequencies.
2. Rise and fall times for CLKIN/PCI_CLK are measured at 0.4 and 2.7 V.
3. Timing is guaranteed by design and characterization.
4. This represents the total input jitter—short term and long term—and is guaranteed by design.
5. The CLKIN/PCI_CLK driver’s closed loop jitter bandwidth should be < 500 kHz at –20 dB. The bandwidth must be set low to
allow cascade-connected PLL-based devices to track CLKIN drivers with the specified jitter.
6. Spread spectrum clocking is allowed with 1% input frequency down-spread at maximum 50 KHz modulation rate regardless
of input frequency.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
13
RESET Initialization
4.3
TSEC Gigabit Reference Clock Timing
Table 8 provides the TSEC gigabit reference clocks (EC_GTX_CLK125) AC timing specifications.
Table 8. EC_GTX_CLK125 AC Timing Specifications
At recommended operating conditions with LVDD = 2.5 0.125 mV/ 3.3 V 165 mV
Parameter
Symbol
Min
Typical
Max
Unit
Notes
EC_GTX_CLK125 frequency
EC_GTX_CLK125 cycle time
EC_GTX_CLK125 rise and fall time
tG125
tG125
—
—
—
125
8
—
—
MHz
ns
—
—
1
t
G125R/tG125F
—
ns
LVDD = 2.5 V
LVDD = 3.3 V
0.75
1.0
EC_GTX_CLK125 duty cycle
tG125H/tG125
—
—
%
2
2
GMII, TBI
45
47
55
53
1000Base-T for RGMII, RTBI
EC_GTX_CLK125 jitter
Notes:
—
—
150
ps
1. Rise and fall times for EC_GTX_CLK125 are measured from 0.5 and 2.0 V for LVDD = 2.5 V and from 0.6 and 2.7 V for
LVDD = 3.3 V.
2. EC_GTX_CLK125 is used to generate the GTX clock for the eTSEC transmitter with 2% degradation. The EC_GTX_CLK125
duty cycle can be loosened from 47%/53% as long as the PHY device can tolerate the duty cycle generated by the eTSEC
GTX_CLK. See Section 8.2.4, “RGMII and RTBI AC Timing Specifications for the duty cycle for 10Base-T and 100Base-T
reference clock.
5 RESET Initialization
This section describes the DC and AC electrical specifications for the reset initialization timing and
electrical requirements of the MPC8347EA.
5.1
RESET DC Electrical Characteristics
Table 9 provides the DC electrical characteristics for the RESET pins of the MPC8347EA.
1
Table 9. RESET Pins DC Electrical Characteristics
Parameter
Symbol
Condition
Min
Max
Unit
Input high voltage
Input low voltage
Input current
VIH
VIL
—
—
2.0
–0.3
—
OVDD + 0.3
V
V
0.8
5
IIN
—
μA
V
Output high voltage2
Output low voltage
VOH
VOL
IOH = –8.0 mA
IOL = 8.0 mA
2.4
—
—
0.5
V
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
14
RESET Initialization
1
Table 9. RESET Pins DC Electrical Characteristics (continued)
Parameter
Symbol
Condition
Min
Max
0.4
Unit
Output low voltage
V
IOL = 3.2 mA
—
V
OL
Notes:
1. This table applies for pins PORESET, HRESET, SRESET, and QUIESCE.
2. HRESET and SRESET are open drain pins, thus VOH is not relevant for those pins.
5.2
RESET AC Electrical Characteristics
Table 10 provides the reset initialization AC timing specifications of the MPC8347EA.
Table 10. RESET Initialization Timing Specifications
Parameter
Min
Max
Unit
Notes
Required assertion time of HRESET or SRESET (input) to activate reset flow
32
32
—
—
tPCI_SYNC_IN
tCLKIN
1
2
Required assertion time of PORESET with stable clock applied to CLKIN when the
MPC8347EA is in PCI host mode
Required assertion time of PORESET with stable clock applied to PCI_SYNC_IN
when the MPC8347EA is in PCI agent mode
32
—
tPCI_SYNC_IN
1
HRESET/SRESET assertion (output)
512
16
4
—
—
—
tPCI_SYNC_IN
tPCI_SYNC_IN
tCLKIN
1
1
2
HRESET negation to SRESET negation (output)
Input setup time for POR configuration signals (CFG_RESET_SOURCE[0:2] and
CFG_CLKIN_DIV) with respect to negation of PORESET when the MPC8347EA is
in PCI host mode
Input setup time for POR configuration signals (CFG_RESET_SOURCE[0:2] and
CFG_CLKIN_DIV) with respect to negation of PORESET when the MPC8347EA is
in PCI agent mode
4
—
tPCI_SYNC_IN
1
Input hold time for POR configuration signals with respect to negation of HRESET
0
—
4
ns
ns
—
3
Time for the MPC8347EA to turn off POR configuration signals with respect to the
assertion of HRESET
—
Time for the MPC8347EA to turn on POR configuration signals with respect to the
negation of HRESET
1
—
tPCI_SYNC_IN 1, 3
Notes:
1. tPCI_SYNC_IN is the clock period of the input clock applied to PCI_SYNC_IN. In PCI host mode, the primary clock is applied
to the CLKIN input, and PCI_SYNC_IN period depends on the value of CFG_CLKIN_DIV. See the MPC8349EA
PowerQUICC II Pro Integrated Host Processor Family Reference Manual.
2. tCLKIN is the clock period of the input clock applied to CLKIN. It is valid only in PCI host mode. See the MPC8349EA
PowerQUICC II Pro Integrated Host Processor Family Reference Manual.
3. POR configuration signals consist of CFG_RESET_SOURCE[0:2] and CFG_CLKIN_DIV.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
15
DDR and DDR2 SDRAM
Table 11 lists the PLL and DLL lock times.
Table 11. PLL and DLL Lock Times
Parameter/Condition
Min
Max
Unit
Notes
PLL lock times
DLL lock times
Notes:
—
100
μs
—
7680
122,880
csb_clk cycles
1, 2
1. DLL lock times are a function of the ratio between the output clock and the coherency system bus clock (csb_clk). A 2:1 ratio
results in the minimum and an 8:1 ratio results in the maximum.
2. The csb_clk is determined by the CLKIN and system PLL ratio. See Section 19, “Clocking.”
6 DDR and DDR2 SDRAM
This section describes the DC and AC electrical specifications for the DDR SDRAM interface of the
MPC8347EA. Note that DDR SDRAM is GV (typ) = 2.5 V and DDR2 SDRAM is GV (typ) = 1.8 V.
DD
DD
The AC electrical specifications are the same for DDR and DRR2 SDRAM.
NOTE
The information in this document is accurate for revision 3.0 silicon and
later. For information on revision 1.1 silicon and earlier versions see the
MPC8347E PowerQUICC II Pro Integrated Host Processor Hardware
Specifications. See Section 22.1, “Part Numbers Fully Addressed by This
Document,” for silicon revision level determination.
6.1
DDR and DDR2 SDRAM DC Electrical Characteristics
Table 12 provides the recommended operating conditions for the DDR2 SDRAM component(s) of the
MPC8347EA when GV (typ) = 1.8 V.
DD
Table 12. DDR2 SDRAM DC Electrical Characteristics for GV (typ) = 1.8 V
DD
Parameter/Condition
I/O supply voltage
Symbol
Min
Max
Unit
Notes
GVDD
MVREF
VTT
1.71
0.49 × GVDD
MVREF – 0.04
MVREF + 0.125
–0.3
1.89
0.51 × GVDD
MVREF + 0.04
GVDD + 0.3
MVREF – 0.125
9.9
V
V
1
2
I/O reference voltage
I/O termination voltage
Input high voltage
V
3
VIH
V
—
—
4
Input low voltage
VIL
V
Output leakage current
Output high current (VOUT = 1.420 V)
IOZ
–9.9
μA
mA
IOH
–13.4
—
—
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
16
DDR and DDR2 SDRAM
Table 12. DDR2 SDRAM DC Electrical Characteristics for GV (typ) = 1.8 V (continued)
DD
Output low current (VOUT = 0.280 V)
IOL
13.4
—
mA
—
Notes:
1. GVDD is expected to be within 50 mV of the DRAM GVDD at all times.
2. MVREF is expected to equal 0.5 × GVDD, and to track GVDD DC variations as measured at the receiver. Peak-to-peak noise
on MVREF cannot exceed 2% of the DC value.
3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to equal
MVREF. This rail should track variations in the DC level of MVREF
.
4. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ GVDD
.
Table 13 provides the DDR2 capacitance when GVDD(typ) = 1.8 V.
Table 13. DDR2 SDRAM Capacitance for GV (typ) = 1.8 V
DD
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Input/output capacitance: DQ, DQS, DQS
Delta input/output capacitance: DQ, DQS, DQS
Note:
CIO
6
8
pF
pF
1
1
CDIO
—
0.5
1. This parameter is sampled. GVDD = 1.8 V 0.090 V, f = 1 MHz, TA = 25°C, VOUT = GVDD/2, VOUT (peak-to-peak) = 0.2 V.
Table 14 provides the recommended operating conditions for the DDR SDRAM component(s) when
GV (typ) = 2.5 V.
DD
Table 14. DDR SDRAM DC Electrical Characteristics for GV (typ) = 2.5 V
DD
Parameter/Condition
I/O supply voltage
Symbol
Min
Max
Unit
Notes
GVDD
MVREF
VTT
2.375
0.49 × GVDD
MVREF – 0.04
MVREF + 0.18
–0.3
2.625
0.51 × GVDD
MVREF + 0.04
GVDD + 0.3
MVREF – 0.18
–9.9
V
V
1
2
I/O reference voltage
I/O termination voltage
Input high voltage
V
3
VIH
V
—
—
4
Input low voltage
VIL
V
Output leakage current
Output high current (VOUT = 1.95 V)
Output low current (VOUT = 0.35 V)
Notes:
IOZ
–9.9
μA
mA
mA
IOH
–15.2
—
—
—
IOL
15.2
—
1. GVDD is expected to be within 50 mV of the DRAM GVDD at all times.
2. MVREF is expected to be equal to 0.5 × GVDD, and to track GVDD DC variations as measured at the receiver. Peak-to-peak
noise on MVREF may not exceed 2% of the DC value.
3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be
equal to MVREF. This rail should track variations in the DC level of MVREF
.
4. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ GVDD
.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
17
DDR and DDR2 SDRAM
Table 15 provides the DDR capacitance when GVDD(typ) = 2.5 V.
Table 15. DDR SDRAM Capacitance for GV (typ) = 2.5 V
DD
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Input/output capacitance: DQ, DQS
Delta input/output capacitance: DQ, DQS
Note:
CIO
6
8
pF
pF
1
1
CDIO
—
0.5
1. This parameter is sampled. GVDD = 2.5 V 0.125 V, f = 1 MHz, TA = 25°C, VOUT = GVDD/2, VOUT (peak-to-peak) = 0.2 V.
Table 16 provides the current draw characteristics for MV
.
REF
Table 16. Current Draw Characteristics for MV
REF
Parameter/Condition
Symbol
Min
Max
Unit
Note
Current draw for MVREF
Note:
1. The voltage regulator for MVREF must supply up to 500 μA current.
IMVREF
—
500
μA
1
6.2
DDR and DDR2 SDRAM AC Electrical Characteristics
This section provides the AC electrical characteristics for the DDR and DDR2 SDRAM interface.
6.2.1
DDR and DDR2 SDRAM Input AC Timing Specifications
Table 17 provides the input AC timing specifications for the DDR2 SDRAM when GV (typ) = 1.8 V.
DD
Table 17. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface
At recommended operating conditions with GVDD of 1.8 5%.
Parameter
Symbol
Min
Max
Unit
Notes
AC input low voltage
AC input high voltage
VIL
—
MVREF – 0.25
—
V
V
—
—
VIH
MVREF + 0.25
Table 18 provides the input AC timing specifications for the DDR SDRAM when GV (typ) = 2.5 V.
DD
Table 18. DDR SDRAM Input AC Timing Specifications for 2.5-V Interface
At recommended operating conditions with GVDD of 2.5 5%.
Parameter
Symbol
Min
Max
Unit
Notes
AC input low voltage
AC input high voltage
VIL
—
MVREF – 0.31
—
V
V
—
—
VIH
MVREF + 0.31
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
18
DDR and DDR2 SDRAM
Table 19 provides the input AC timing specifications for the DDR SDRAM interface.
Table 19. DDR and DDR2 SDRAM Input AC Timing Specifications
At recommended operating conditions with GVDD of (1.8 or 2.5 V) 5%.
Parameter
Symbol
Min
Max
Unit
Notes
Controller Skew for MDQS—MDQ/MECC/MDM
tCISKEW
ps
1, 2
3
400 MHz
–600
–750
–750
–750
600
750
750
750
333 MHz
266 MHz
200 MHz
—
—
—
Notes:
1. tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding bit that
will be captured with MDQS[n]. This should be subtracted from the total timing budget.
2. The amount of skew that can be tolerated from MDQS to a corresponding MDQ signal is called tDISKEW. This can be
determined by the equation: tDISKEW
value of tCISKEW
=
(T/4 – abs (tCISKEW)); where T is the clock period and abs (tCISKEW) is the absolute
.
3. This specification applies only to the DDR interface.
Figure 5 illustrates the DDR input timing diagram showing the t
timing parameter.
DISKEW
MCK[n]
MCK[n]
tMCK
MDQS[n]
MDQ[x]
D0
D1
tDISKEW
tDISKEW
Figure 5. DDR Input Timing Diagram
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
19
DDR and DDR2 SDRAM
6.2.2
DDR and DDR2 SDRAM Output AC Timing Specifications
Table 20 shows the DDR and DDR2 output AC timing specifications.
Table 20. DDR and DDR2 SDRAM Output AC Timing Specifications
At recommended operating conditions with GVDD of (1.8 or 2.5 V) 5%.
Parameter
Symbol 1
Min
Max
Unit
Notes
MCK[n] cycle time, (MCK[n]/MCK[n] crossing) (PBGA
package)
tMCK
5
—
ns
2
MCK[n] cycle time, (MCK[n]/MCK[n] crossing) (TBGA
package)
tMCK
7.5
—
ns
ns
2
3
ADDR/CMD/MODT output setup with respect to MCK
tDDKHAS
400 MHz
1.95
2.40
3.15
4.20
—
—
—
—
333 MHz
266 MHz
200 MHz
ADDR/CMD/MODT output hold with respect to MCK
tDDKHAX
tDDKHCS
tDDKHCX
tDDKHMH
ns
ns
ns
3
3
3
400 MHz
1.95
2.40
3.15
4.20
—
—
—
—
333 MHz
266 MHz
200 MHz
MCS(n) output setup with respect to MCK
400 MHz
1.95
2.40
3.15
4.20
—
—
—
—
333 MHz
266 MHz
200 MHz
MCS(n) output hold with respect to MCK
400 MHz
1.95
2.40
3.15
4.20
–0.6
—
—
333 MHz
266 MHz
—
200 MHz
—
MCK to MDQS Skew
0.6
ns
ps
4
5
MDQ/MECC/MDM output setup with respect to
MDQS
tDDKHDS,
tDDKLDS
400 MHz
700
775
—
—
—
—
333 MHz
266 MHz
1100
1200
200 MHz
MDQ/MECC/MDM output hold with respect to MDQS
tDDKHDX,
tDDKLDX
ps
5
400 MHz
333 MHz
700
900
—
—
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
20
DDR and DDR2 SDRAM
Table 20. DDR and DDR2 SDRAM Output AC Timing Specifications (continued)
At recommended operating conditions with GVDD of (1.8 or 2.5 V) 5%.
Parameter
Symbol 1
Min
Max
Unit
Notes
266 MHz
1100
1200
—
—
200 MHz
MDQS preamble start
MDQS epilogue end
Notes:
tDDKHMP
tDDKHME
–0.5 × tMCK – 0.6 –0.5 × tMCK + 0.6
–0.6 0.6
ns
ns
6
6
1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can be read as DDR timing (DD) from
the rising or falling edge of the reference clock (KH or KL) until the output goes invalid (AX or DX). For example, tDDKHAS
symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes from the high (H) state until outputs (A) are
set up (S) or output valid time. Also, tDDKLDX symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes
low (L) until data outputs (D) are invalid (X) or data output hold time.
2. All MCK/MCK referenced measurements are made from the crossing of the two signals 0.1 V.
3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS. For the
ADDR/CMD setup and hold specifications, it is assumed that the clock control register is set to adjust the memory clocks by
1/2 applied cycle.
4. tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR timing (DD) from the
rising edge of the MCK(n) clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be modified through control of the
DQSS override bits in the TIMING_CFG_2 register and is typically set to the same delay as the clock adjust in the CLK_CNTL
register. The timing parameters listed in the table assume that these two parameters are set to the same adjustment value.
See the MPC8349EA PowerQUICC II Pro Integrated Host Processor Family Reference Manual for the timing modifications
enabled by use of these bits.
5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), ECC
(MECC), or data mask (MDM). The data strobe should be centered inside the data eye at the pins of the microprocessor.
6. All outputs are referenced to the rising edge of MCK(n) at the pins of the microprocessor. Note that tDDKHMP follows the
symbol conventions described in note 1.
Figure 6 shows the DDR SDRAM output timing for the MCK to MDQS skew measurement (t
).
DDKHMH
MCK[n]
MCK[n]
tMCK
tDDKHMHmax) = 0.6 ns
MDQS
tDDKHMH(min) = –0.6 ns
MDQS
Figure 6. Timing Diagram for t
DDKHMH
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
21
DUART
Figure 7 shows the DDR SDRAM output timing diagram.
MCK[n]
MCK[n]
tMCK
tDDKHAS,tDDKHCS
tDDKHAX,tDDKHCX
ADDR/CMD/MODT
Write A0
tDDKHMP
NOOP
tDDKHMH
MDQS[n]
MDQ[x]
tDDKHME
tDDKHDS
tDDKLDS
D0
D1
tDDKLDX
tDDKHDX
Figure 7. DDR SDRAM Output Timing Diagram
Figure 8 provides the AC test load for the DDR bus.
GVDD/2
Output
Z0 = 50 Ω
RL = 50 Ω
Figure 8. DDR AC Test Load
7 DUART
This section describes the DC and AC electrical specifications for the DUART interface of the
MPC8347EA.
7.1
DUART DC Electrical Characteristics
Table 21 provides the DC electrical characteristics for the DUART interface of the MPC8347EA.
Table 21. DUART DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
High-level input voltage
Low-level input voltage
VIH
VIL
IIN
2
OVDD + 0.3
V
V
–0.3
—
0.8
5
Input current (0.8 V ≤ VIN ≤ 2 V)
μA
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
22
Ethernet: Three-Speed Ethernet, MII Management
Table 21. DUART DC Electrical Characteristics (continued)
Parameter
Symbol
Min
Max
Unit
High-level output voltage, IOH = –100 μA
Low-level output voltage, IOL = 100 μA
VOH
VOL
OVDD – 0.2
—
—
V
V
0.2
7.2
DUART AC Electrical Specifications
Table 22 provides the AC timing parameters for the DUART interface of the MPC8347EA.
Table 22. DUART AC Timing Specifications
Parameter
Value
Unit
Notes
Minimum baud rate
Maximum baud rate
Oversample rate
Notes:
256
> 1,000,000
16
baud
baud
—
—
1
2
1. Actual attainable baud rate will be limited by the latency of interrupt processing.
2. The middle of a start bit is detected as the 8th sampled 0 after the 1-to-0 transition of the start bit. Subsequent bit values are
sampled each 16th sample.
8 Ethernet: Three-Speed Ethernet, MII Management
This section provides the AC and DC electrical characteristics for three-speeds (10/100/1000 Mbps) and
MII management.
8.1
Three-Speed Ethernet Controller
(TSEC)—GMII/MII/TBI/RGMII/RTBI Electrical Characteristics
The electrical characteristics specified here apply to gigabit media independent interface (GMII), the
media independent interface (MII), ten-bit interface (TBI), reduced gigabit media independent
interface (RGMII), and reduced ten-bit interface (RTBI) signals except management data input/output
(MDIO) and management data clock (MDC). The MII, GMII, and TBI interfaces are defined for 3.3 V,
and the RGMII and RTBI interfaces are defined for 2.5 V. The RGMII and RTBI interfaces follow the
Hewlett-Packard Reduced Pin-Count Interface for Gigabit Ethernet Physical Layer Device Specification,
Version 1.2a (9/22/2000). The electrical characteristics for MDIO and MDC are specified in Section 8.3,
“Ethernet Management Interface Electrical Characteristics.”
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
23
Ethernet: Three-Speed Ethernet, MII Management
8.1.1
TSEC DC Electrical Characteristics
GMII, MII, TBI, RGMII, and RTBI drivers and receivers comply with the DC parametric attributes
specified in Table 23 and Table 24. The RGMII and RTBI signals in Table 24 are based on a 2.5-V CMOS
interface voltage as defined by JEDEC EIA/JESD8-5.
Table 23. GMII/TBI and MII DC Electrical Characteristics
Parameter
Symbol
Conditions
Min
Max
Unit
2
Supply voltage 3.3 V
Output high voltage
Output low voltage
Input high voltage
Input low voltage
Input high current
Input low current
Notes:
LVDD
—
2.97
2.40
GND
2.0
3.63
LVDD + 0.3
0.50
V
V
VOH
VOL
VIH
VIL
IIH
IOH = –4.0 mA
LVDD = Min
IOL = 4.0 mA
LVDD = Min
V
—
—
—
—
LVDD + 0.3
0.90
V
–0.3
—
V
VIN1 = LVDD
VIN1 = GND
40
μA
μA
IIL
–600
—
1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.
2. GMII/MII pins not needed for RGMII or RTBI operation are powered by the OVDD supply.
Table 24. RGMII/RTBI (When Operating at 2.5 V) DC Electrical Characteristics
Parameters
Supply voltage 2.5 V
Symbol
Conditions
Min
Max
Unit
LVDD
VOH
VOL
VIH
VIL
—
2.37
2.00
2.63
LVDD + 0.3
0.40
V
V
Output high voltage
Output low voltage
Input high voltage
Input low voltage
Input high current
Input low current
Note:
IOH = –1.0 mA
LVDD = Min
LVDD = Min
LVDD = Min
LVDD = Min
IOL = 1.0 mA
GND – 0.3
1.7
V
—
—
LVDD + 0.3
0.70
V
–0.3
V
IIH
VIN1 = LVDD
VIN1 = GND
—
10
μA
μA
IIL
–15
—
1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.
8.2
GMII, MII, TBI, RGMII, and RTBI AC Timing Specifications
The AC timing specifications for GMII, MII, TBI, RGMII, and RTBI are presented in this section.
8.2.1
GMII Timing Specifications
This section describes the GMII transmit and receive AC timing specifications.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
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Freescale Semiconductor
Ethernet: Three-Speed Ethernet, MII Management
8.2.1.1
GMII Transmit AC Timing Specifications
Table 25 provides the GMII transmit AC timing specifications.
Table 25. GMII Transmit AC Timing Specifications
At recommended operating conditions with LVDD/OVDD of 3.3 V 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
GTX_CLK clock period
tGTX
GTXH/tGTX
tGTKHDX
tGTXR
—
43.75
0.5
8.0
—
—
—
—
—
56.25
5.0
ns
%
GTX_CLK duty cycle
t
GTX_CLK to GMII data TXD[7:0], TX_ER, TX_EN delay
GTX_CLK clock rise time (20%–80%)
GTX_CLK clock fall time (80%–20%)
Notes:
ns
ns
ns
—
1.0
tGTXF
—
1.0
1. The symbols for timing specifications follow the pattern t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and
(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGTKHDV symbolizes GMII transmit timing (GT)
t
with respect to the tGTX clock reference (K) going to the high state (H) relative to the time date input signals (D) reaching the
valid state (V) to state or setup time. Also, tGTKHDX symbolizes GMII transmit timing (GT) with respect to the tGTX clock
reference (K) going to the high state (H) relative to the time date input signals (D) going invalid (X) or hold time. In general,
the clock reference symbol is based on three letters representing the clock of a particular function. For example, the subscript
of tGTX represents the GMII(G) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate
letter: R (rise) or F (fall).
Figure 9 shows the GMII transmit AC timing diagram.
t
t
GTXR
GTX
GTX_CLK
t
t
GTXF
GTXH
TXD[7:0]
TX_EN
TX_ER
t
GTKHDX
Figure 9. GMII Transmit AC Timing Diagram
8.2.1.2
GMII Receive AC Timing Specifications
Table 26 provides the GMII receive AC timing specifications.
Table 26. GMII Receive AC Timing Specifications
At recommended operating conditions with LVDD/OVDD of 3.3 V 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
RX_CLK clock period
tGRX
—
40
8.0
—
—
—
—
60
—
—
ns
%
RX_CLK duty cycle
tGRXH/tGRX
tGRDVKH
tGRDXKH
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
2.0
0.5
ns
ns
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
25
Ethernet: Three-Speed Ethernet, MII Management
Table 26. GMII Receive AC Timing Specifications (continued)
At recommended operating conditions with LVDD/OVDD of 3.3 V 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
RX_CLK clock rise (20%–80%)
RX_CLK clock fall time (80%–20%)
Note:
tGRXR
tGRXF
—
—
—
—
1.0
1.0
ns
ns
1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGRDVKH symbolizes GMII receive timing
(GR) with respect to the time data input signals (D) reaching the valid state (V) relative to the tRX clock reference (K) going
to the high state (H) or setup time. Also, tGRDXKL symbolizes GMII receive timing (GR) with respect to the time data input
signals (D) went invalid (X) relative to the tGRX clock reference (K) going to the low (L) state or hold time. In general, the clock
reference symbol is based on three letters representing the clock of a particular function. For example, the subscript of tGRX
represents the GMII (G) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter:
R (rise) or F (fall).
Figure 10 shows the GMII receive AC timing diagram.
G
tGRX
tGRXR
RX_CLK
tGRXF
tGRXH
RXD[7:0]
RX_DV
RX_ER
tGRDXKH
tGRDVKH
Figure 10. GMII Receive AC Timing Diagram
8.2.2
MII AC Timing Specifications
This section describes the MII transmit and receive AC timing specifications.
8.2.2.1
MII Transmit AC Timing Specifications
Table 27 provides the MII transmit AC timing specifications.
Table 27. MII Transmit AC Timing Specifications
At recommended operating conditions with LVDD/OVDD of 3.3 V 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
TX_CLK clock period 10 Mbps
TX_CLK clock period 100 Mbps
TX_CLK duty cycle
tMTX
tMTX
tMTXH/ MTX
tMTKHDX
—
—
35
1
400
40
—
5
—
—
65
15
ns
ns
%
t
TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay
ns
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
26
Ethernet: Three-Speed Ethernet, MII Management
Table 27. MII Transmit AC Timing Specifications (continued)
At recommended operating conditions with LVDD/OVDD of 3.3 V 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
TX_CLK data clock rise (20%–80%)
TX_CLK data clock fall (80%–20%)
Note:
tMTXR
tMTXF
1.0
1.0
—
—
4.0
4.0
ns
ns
1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII transmit timing
(MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). In general, the clock reference
symbol is based on two to three letters representing the clock of a particular function. For example, the subscript of tMTX
represents the MII(M) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate letter:
R (rise) or F (fall).
Figure 11 shows the MII transmit AC timing diagram.
tMTXR
tMTX
TX_CLK
tMTXF
tMTXH
TXD[3:0]
TX_EN
TX_ER
tMTKHDX
Figure 11. MII Transmit AC Timing Diagram
8.2.2.2
MII Receive AC Timing Specifications
Table 28 provides the MII receive AC timing specifications.
Table 28. MII Receive AC Timing Specifications
At recommended operating conditions with LVDD/OVDD of 3.3 V 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
RX_CLK clock period 10 Mbps
tMRX
tMRX
—
—
400
40
—
—
—
65
—
—
ns
ns
%
RX_CLK clock period 100 Mbps
RX_CLK duty cycle
t
MRXH/tMRX
tMRDVKH
tMRDXKH
35
RXD[3:0], RX_DV, RX_ER setup time to RX_CLK
RXD[3:0], RX_DV, RX_ER hold time to RX_CLK
10.0
10.0
—
ns
ns
—
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
27
Ethernet: Three-Speed Ethernet, MII Management
Table 28. MII Receive AC Timing Specifications (continued)
At recommended operating conditions with LVDD/OVDD of 3.3 V 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
RX_CLK clock rise (20%–80%)
RX_CLK clock fall time (80%–20%)
Note:
tMRXR
tMRXF
1.0
1.0
—
—
4.0
4.0
ns
ns
1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive timing
(MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K) going to
the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input signals
(D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. In general, the clock
reference symbol is based on three letters representing the clock of a particular function. For example, the subscript of tMRX
represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter:
R (rise) or F (fall).
Figure 12 provides the AC test load for TSEC.
OVDD/2
Output
Z0 = 50 Ω
RL = 50 Ω
Figure 12. TSEC AC Test Load
Figure 13 shows the MII receive AC timing diagram.
tMRXR
tMRX
RX_CLK
tMRXF
Valid Data
tMRXH
RXD[3:0]
RX_DV
RX_ER
tMRDVKH
tMRDXKH
Figure 13. MII Receive AC Timing Diagram
8.2.3
TBI AC Timing Specifications
This section describes the TBI transmit and receive AC timing specifications.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
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Freescale Semiconductor
Ethernet: Three-Speed Ethernet, MII Management
8.2.3.1
TBI Transmit AC Timing Specifications
Table 29 provides the TBI transmit AC timing specifications.
Table 29. TBI Transmit AC Timing Specifications
At recommended operating conditions with LVDD/OVDD of 3.3 V 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
GTX_CLK clock period
tTTX
tTTXH/tTTX
tTTKHDX
tTTXR
—
40
1.0
—
8.0
—
—
—
—
—
60
ns
%
GTX_CLK duty cycle
GTX_CLK to TBI data TXD[7:0], TX_ER, TX_EN delay
GTX_CLK clock rise (20%–80%)
GTX_CLK clock fall time (80%–20%)
Notes:
5.0
1.0
1.0
ns
ns
ns
tTTXF
—
1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tTTKHDV symbolizes the TBI transmit
timing (TT) with respect to the time from tTTX (K) going high (H) until the referenced data signals (D) reach the valid state (V)
or setup time. Also, tTTKHDX symbolizes the TBI transmit timing (TT) with respect to the time from tTTX (K) going high (H) until
the referenced data signals (D) reach the invalid state (X) or hold time. In general, the clock reference symbol is based on
three letters representing the clock of a particular function. For example, the subscript of tTTX represents the TBI (T) transmit
(TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
Figure 14 shows the TBI transmit AC timing diagram.
tTTXR
tTTX
GTX_CLK
tTTXH
tTTXF
TXD[7:0]
TX_EN
TX_ER
tTTKHDX
Figure 14. TBI Transmit AC Timing Diagram
8.2.3.2
TBI Receive AC Timing Specifications
Table 30 provides the TBI receive AC timing specifications.
Table 30. TBI Receive AC Timing Specifications
At recommended operating conditions with LVDD/OVDD of 3.3 V 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
PMA_RX_CLK clock period
PMA_RX_CLK skew
RX_CLK duty cycle
tTRX
16.0
—
ns
ns
%
tSKTRX
7.5
40
8.5
60
tTRXH/tTRX
—
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
29
Ethernet: Three-Speed Ethernet, MII Management
Table 30. TBI Receive AC Timing Specifications (continued)
At recommended operating conditions with LVDD/OVDD of 3.3 V 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
RXD[7:0], RX_DV, RX_ER (RCG[9:0]) setup time to rising
PMA_RX_CLK
2.5
—
—
ns
2
tTRDVKH
2
RXD[7:0], RX_DV, RX_ER (RCG[9:0]) hold time to rising
PMA_RX_CLK
tTRDXKH
1.5
—
—
ns
RX_CLK clock rise time (20%–80%)
RX_CLK clock fall time (80%–20%)
Notes:
tTRXR
tTRXF
0.7
0.7
—
—
2.4
2.4
ns
ns
1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tTRDVKH symbolizes TBI receive timing
(TR) with respect to the time data input signals (D) reach the valid state (V) relative to the tTRX clock reference (K) going to
the high (H) state or setup time. Also, tTRDXKH symbolizes TBI receive timing (TR) with respect to the time data input signals
(D) went invalid (X) relative to the tTRX clock reference (K) going to the high (H) state. In general, the clock reference symbol
is based on three letters representing the clock of a particular function. For example, the subscript of tTRX represents the TBI
(T) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). For
symbols representing skews, the subscript SK followed by the clock that is being skewed (TRX).
2. Setup and hold time of even numbered RCG are measured from the riding edge of PMA_RX_CLK1. Setup and hold times
of odd-numbered RCG are measured from the riding edge of PMA_RX_CLK0.
Figure 15 shows the TBI receive AC timing diagram.
tTRXR
tTRX
PMA_RX_CLK1
RCG[9:0]
tTRXH
tTRXF
Even RCG
Odd RCG
tTRDVKH
tSKTRX
tTRDXKH
PMA_RX_CLK0
tTRXH
tTRDXKH
tTRDVKH
Figure 15. TBI Receive AC Timing Diagram
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
30
Ethernet: Three-Speed Ethernet, MII Management
8.2.4
RGMII and RTBI AC Timing Specifications
Table 31 presents the RGMII and RTBI AC timing specifications.
Table 31. RGMII and RTBI AC Timing Specifications
At recommended operating conditions with LVDD of 2.5 V 5%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
Data to clock output skew (at transmitter)
Data to clock input skew (at receiver)2
Clock cycle duration3
Duty cycle for 1000Base-T4, 5
Duty cycle for 10BASE-T and 100BASE-TX3, 5
Rise time (20%–80%)
tSKRGT
tSKRGT
–0.5
1.0
7.2
45
—
—
0.5
2.8
8.8
55
ns
ns
ns
%
tRGT
8.0
50
50
—
tRGTH/tRGT
tRGTH/tRGT
tRGTR
40
60
%
—
0.75
0.75
ns
ns
Fall time (80%–20%)
tRGTF
—
—
Notes:
1. In general, the clock reference symbol for this section is based on the symbols RGT to represent RGMII and RTBI timing. For
example, the subscript of tRGT represents the TBI (T) receive (RX) clock. Also, the notation for rise (R) and fall (F) times
follows the clock symbol. For symbols representing skews, the subscript is SK followed by the clock being skewed (RGT).
2. This implies that PC board design requires clocks to be routed so that an additional trace delay of greater than 1.5 ns is added
to the associated clock signal.
3. For 10 and 100 Mbps, tRGT scales to 400 ns 40 ns and 40 ns 4 ns, respectively.
4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet clock domains as long
as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed transitioned.
5. Duty cycle reference is LVDD/2.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
31
Ethernet: Three-Speed Ethernet, MII Management
Figure 16 shows the RBMII and RTBI AC timing and multiplexing diagrams.
tRGT
tRGTH
GTX_CLK
(At Transmitter)
tSKRGT
TXD[8:5][3:0]
TXD[8:5]
TXD[7:4][3:0]
TXD[3:0]
TXD[7:4]
TXD[9]
TXERR
TXD[4]
TXEN
TX_CTL
tSKRGT
TX_CLK
(At PHY)
RXD[8:5][3:0]
RXD[7:4][3:0]
RXD[8:5]
RXD[7:4]
RXD[3:0]
tSKRGT
RXD[9]
RXERR
RXD[4]
RXDV
RX_CTL
tSKRGT
RX_CLK
(At PHY)
Figure 16. RGMII and RTBI AC Timing and Multiplexing Diagrams
8.3
Ethernet Management Interface Electrical Characteristics
The electrical characteristics specified here apply to the MII management interface signals management
data input/output (MDIO) and management data clock (MDC). The electrical characteristics for GMII,
RGMII, TBI and RTBI are specified in Section 8.1, “Three-Speed Ethernet Controller
(TSEC)—GMII/MII/TBI/RGMII/RTBI Electrical Characteristics.”
8.3.1
MII Management DC Electrical Characteristics
The MDC and MDIO are defined to operate at a supply voltage of 2.5 or 3.3 V. The DC electrical
characteristics for MDIO and MDC are provided in Table 32 and Table 33.
Table 32. MII Management DC Electrical Characteristics Powered at 2.5 V
Parameter
Symbol
Conditions
Min
Max
Unit
Supply voltage (2.5 V)
Output high voltage
Output low voltage
Input high voltage
Input low voltage
LVDD
VOH
VOL
VIH
—
2.37
2.00
2.63
LVDD + 0.3
0.40
V
V
V
V
V
IOH = –1.0 mA
LVDD = Min
LVDD = Min
LVDD = Min
LVDD = Min
IOL = 1.0 mA
GND – 0.3
1.7
—
—
—
VIL
–0.3
0.70
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
32
Ethernet: Three-Speed Ethernet, MII Management
Table 32. MII Management DC Electrical Characteristics Powered at 2.5 V (continued)
Parameter
Input high current
Symbol
Conditions
Min
Max
Unit
IIH
IIL
VIN1 = LVDD
VIN = LVDD
—
10
—
μA
μA
Input low current
–15
Note:
1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.
Table 33. MII Management DC Electrical Characteristics Powered at 3.3 V
Parameter
Symbol
Conditions
Min
Max
Unit
Supply voltage (3.3 V)
Output high voltage
Output low voltage
Input high voltage
Input low voltage
Input high current
Input low current
Note:
LVDD
VOH
VOL
VIH
VIL
—
2.97
2.10
GND
2.00
—
3.63
LVDD + 0.3
0.50
V
V
IOH = –1.0 mA
LVDD = Min
LVDD = Min
IOL = 1.0 mA
V
—
—
—
V
0.80
V
IIH
LVDD = Max
LVDD = Max
VIN1 = 2.1 V
VIN = 0.5 V
—
40
μA
μA
IIL
–600
—
1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.
8.3.2
MII Management AC Electrical Specifications
Table 34 provides the MII management AC timing specifications.
Table 34. MII Management AC Timing Specifications
At recommended operating conditions with LVDD is 3.3 V 10% or 2.5 V 5%.
Parameter/Condition
MDC frequency
Symbol1
Min
Typ
Max
Unit
Notes
fMDC
tMDC
—
—
32
10
5
2.5
400
—
—
—
—
70
—
—
10
MHz
ns
2
MDC period
—
—
3
MDC clock pulse width high
MDC to MDIO delay
MDIO to MDC setup time
MDIO to MDC hold time
MDC rise time
tMDCH
ns
tMDKHDX
tMDDVKH
tMDDXKH
tMDCR
—
ns
—
ns
—
—
—
0
—
ns
—
—
ns
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
33
Ethernet: Three-Speed Ethernet, MII Management
Table 34. MII Management AC Timing Specifications (continued)
At recommended operating conditions with LVDD is 3.3 V 10% or 2.5 V 5%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
Notes
MDC fall time
Notes:
tMDHF
—
—
10
ns
—
1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMDKHDX symbolizes management data
timing (MD) for the time tMDC from clock reference (K) high (H) until data outputs (D) are invalid (X) or data hold time. Also,
tMDDVKH symbolizes management data timing (MD) with respect to the time data input signals (D) reach the valid state (V)
relative to the tMDC clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention
is used with the appropriate letter: R (rise) or F (fall).
2. This parameter is dependent on the csb_clk speed (that is, for a csb_clk of 267 MHz, the maximum frequency is 8.3 MHz
and the minimum frequency is 1.2 MHz; for a csb_clk of 375 MHz, the maximum frequency is 11.7 MHz and the minimum
frequency is 1.7 MHz).
3. This parameter is dependent on the csb_clk speed (that is, for a csb_clk of 267 MHz, the delay is 70 ns and for a csb_clk of
333 MHz, the delay is 58 ns).
Figure 17 shows the MII management AC timing diagram.
tMDCR
tMDC
MDC
tMDCF
tMDCH
MDIO
(Input)
tMDDVKH
tMDDXKH
MDIO
(Output)
tMDKHDX
Figure 17. MII Management Interface Timing Diagram
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
34
USB
9 USB
This section provides the AC and DC electrical specifications for the USB interface of the MPC8347EA.
9.1
USB DC Electrical Characteristics
Table 35 provides the DC electrical characteristics for the USB interface.
Table 35. USB DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
High-level input voltage
Low-level input voltage
Input current
VIH
VIL
2
–0.3
OVDD + 0.3
V
V
0.8
5
IIN
—
μA
V
High-level output voltage, IOH = –100 μA
Low-level output voltage, IOL = 100 μA
VOH
VOL
OVDD – 0.2
—
—
0.2
V
9.2
USB AC Electrical Specifications
Table 36 describes the general timing parameters of the USB interface of the MPC8347EA.
Table 36. USB General Timing Parameters (ULPI Mode Only)
Parameter
Symbol1
Min
Max
Unit
Notes
USB clock cycle time
tUSCK
tUSIVKH
tUSIXKH
tUSKHOV
tUSKHOX
15
4
—
—
—
7
ns
ns
ns
ns
ns
2–5
2–5
2–5
2–5
2–5
Input setup to USB clock—all inputs
Input hold to USB clock—all inputs
USB clock to output valid—all outputs
Output hold from USB clock—all outputs
Notes:
1
—
2
—
1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tUSIXKH symbolizes USB timing (US) for
the input (I) to go invalid (X) with respect to the time the USB clock reference (K) goes high (H). Also, tUSKHOX symbolizes
USB timing (US) for the USB clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or output hold
time.
2. All timings are in reference to USB clock.
3. All signals are measured from OVDD/2 of the rising edge of the USB clock to 0.4 × OVDD of the signal in question for 3.3 V
signaling levels.
4. Input timings are measured at the pin.
5. For active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered through the
component pin is less than or equal to that of the leakage current specification.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
35
Local Bus
Figure 18 and Figure 19 provide the AC test load and signals for the USB, respectively.
OVDD/2
Output
Z0 = 50 Ω
RL = 50 Ω
Figure 18. USB AC Test Load
USB0_CLK/USB1_CLK/DR_CLK
Input Signals
tUSIXKH
tUSIVKH
tUSKHOX
tUSKHOV
Output Signals:
Figure 19. USB Signals
10 Local Bus
This section describes the DC and AC electrical specifications for the local bus interface of the
MPC8347EA.
10.1 Local Bus DC Electrical Characteristics
Table 37 provides the DC electrical characteristics for the local bus interface.
Table 37. Local Bus DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
High-level input voltage
Low-level input voltage
Input current
VIH
VIL
2
–0.3
OVDD + 0.3
V
V
0.8
5
IIN
—
μA
V
High-level output voltage, IOH = –100 μA
Low-level output voltage, IOL = 100 μA
VOH
VOL
OVDD – 0.2
—
—
0.2
V
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
36
Local Bus
10.2 Local Bus AC Electrical Specification
Table 38 and Table 39 describe the general timing parameters of the local bus interface of the
MPC8347EA.
Table 38. Local Bus General Timing Parameters—DLL On
Parameter
Symbol1
Min
Max
Unit
Notes
Local bus cycle time
tLBK
7.5
1.5
2.2
1.0
1.0
1.5
3
—
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
2
3, 4
3, 4
3, 4
3, 4
5
Input setup to local bus clock (except LUPWAIT)
LUPWAIT input setup to local bus clock
tLBIVKH1
tLBIVKH2
tLBIXKH1
tLBIXKH2
tLBOTOT1
tLBOTOT2
tLBOTOT3
tLBKHLR
tLBKHOV1
tLBKHOV2
tLBKHOV3
tLBKHOX1
tLBKHOX2
tLBKHOZ
—
Input hold from local bus clock (except LUPWAIT)
LUPWAIT Input hold from local bus clock
—
—
LALE output fall to LAD output transition (LATCH hold time)
LALE output fall to LAD output transition (LATCH hold time)
LALE output fall to LAD output transition (LATCH hold time)
Local bus clock to LALE rise
—
—
6
2.5
—
—
—
—
1
—
7
4.5
4.5
4.5
4.5
—
—
—
3
Local bus clock to output valid (except LAD/LDP and LALE)
Local bus clock to data valid for LAD/LDP
Local bus clock to address valid for LAD
3
Output hold from local bus clock (except LAD/LDP and LALE)
Output hold from local bus clock for LAD/LDP
Local bus clock to output high impedance for LAD/LDP
Notes:
3
1
—
3
—
3.8
8
1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus timing (LB)
for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case for clock one
(1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect to the output
(O) going invalid (X) or output hold time.
2. All timings are in reference to the rising edge of LSYNC_IN.
3. All signals are measured from OVDD/2 of the rising edge of LSYNC_IN to 0.4 × OVDD of the signal in question for 3.3 V
signaling levels.
4. Input timings are measured at the pin.
5. tLBOTOT1 should be used when RCWH[LALE] is not set and when the load on the LALE output pin is at least 10 pF less than
the load on the LAD output pins.
6. tLBOTOT2 should be used when RCWH[LALE] is set and when the load on the LALE output pin is at least 10 pF less than the
load on the LAD output pins.
7. tLBOTOT3 should be used when RCWH[LALE] is set and when the load on the LALE output pin equals the load on the LAD
output pins.
8. For active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered through the
component pin is less than or equal to that of the leakage current specification.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
37
Local Bus
9
Table 39. Local Bus General Timing Parameters—DLL Bypass
Parameter
Symbol1
Min
Max
Unit
Notes
Local bus cycle time
tLBK
15
7
—
—
—
—
—
—
3
ns
ns
ns
ns
ns
ns
ns
ns
2
3, 4
3, 4
5
Input setup to local bus clock
tLBIVKH
tLBIXKH
Input hold from local bus clock
1.0
1.5
3
LALE output fall to LAD output transition (LATCH hold time)
LALE output fall to LAD output transition (LATCH hold time)
LALE output fall to LAD output transition (LATCH hold time)
Local bus clock to output valid
tLBOTOT1
tLBOTOT2
tLBOTOT3
tLBKLOV
tLBKHOZ
6
2.5
—
—
7
3
Local bus clock to output high impedance for LAD/LDP
4
8
Notes:
1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus timing (LB)
for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case for clock one
(1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect to the output
(O) going invalid (X) or output hold time.
2. All timings are in reference to the falling edge of LCLK0 (for all outputs and for LGTA and LUPWAIT inputs) or the rising edge
of LCLK0 (for all other inputs).
3. All signals are measured from OVDD/2 of the rising/falling edge of LCLK0 to 0.4 × OVDD of the signal in question for 3.3 V
signaling levels.
4. Input timings are measured at the pin.
5. tLBOTOT1 should be used when RCWH[LALE] is set and when the load on the LALE output pin is at least 10 pF less than the
load on the LAD output pins.
6. tLBOTOT2 should be used when RCWH[LALE] is not set and when the load on the LALE output pin is at least 10 pF less than
the load on the LAD output pins.the
7. tLBOTOT3 should be used when RCWH[LALE] is not set and when the load on the LALE output pin equals to the load on the
LAD output pins.
8. For purposes of active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
9. DLL bypass mode is not recommended for use at frequencies above 66 MHz.
Figure 20 provides the AC test load for the local bus.
OVDD/2
Output
Z0 = 50 Ω
RL = 50 Ω
Figure 20. Local Bus C Test Load
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
38
Local Bus
Figure 21 through Figure 26 show the local bus signals.
LSYNC_IN
tLBIXKH
tLBIVKH
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH
Output Signals:
tLBKHOV
tLBKHOV
tLBKHOV
tLBKHLR
LSDA10/LSDWE/LSDRAS/
LSDCAS/LSDDQM[0:3]
LA[27:31]/LBCTL/LBCKE/LOE
tLBKHOZ
tLBKHOX
Output (Data) Signals:
LAD[0:31]/LDP[0:3]
tLBKHOZ
tLBKHOX
Output (Address) Signal:
LAD[0:31]
tLBOTOT
LALE
Figure 21. Local Bus Signals, Nonspecial Signals Only (DLL Enabled)
LCLK[n]
tLBIXKH
tLBIVKH
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH
tLBIVKH
Input Signal:
LGTA
tLBKLOV
Output Signals:
LSDA10/LSDWE/LSDRAS/
LSDCAS/LSDDQM[0:3]
LA[27:31]/LBCTL/LBCKE/LOE
Output Signals:
tLBKHOZ
tLBKLOV
LAD[0:31]/LDP[0:3]
tLBKLOV
tLBOTOT
LALE
Figure 22. Local Bus Signals, Nonspecial Signals Only (DLL Bypass Mode)
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
39
Local Bus
LSYNC_IN
T1
T3
tLBKHOZ1
tLBKHOV1
GPCM Mode Output Signals:
LCS[0:7]/LWE
tLBIXKH2
tLBIVKH2
UPM Mode Input Signal:
LUPWAIT
tLBIXKH1
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBKHOZ1
tLBKHOV1
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 23. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 2 (DLL Enabled)
LCLK
T1
T3
tLBKHOZ
tLBKLOV
GPCM Mode Output Signals:
LCS[0:7]/LWE
tLBIXKH
tLBIVKH
UPM Mode Input Signal:
LUPWAIT
tLBIXKH
tLBIVKH
Input Signals:
LAD[0:31]/LDP[0:3]
(DLL Bypass Mode)
tLBKHOZ
tLBKLOV
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 24. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 2 (DLL Bypass Mode)
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
40
Freescale Semiconductor
Local Bus
LCLK
T1
T2
T3
T4
tLBKHOZ
tLBKLOV
GPCM Mode Output Signals:
LCS[0:7]/LWE
tLBIXKH
tLBIVKH
UPM Mode Input Signal:
LUPWAIT
tLBIXKH
tLBIVKH
Input Signals:
LAD[0:31]/LDP[0:3]
(DLL Bypass Mode)
tLBKHOZ
tLBKLOV
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 25. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 (DLL Bypass Mode)
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
41
JTAG
LSYNC_IN
T1
T2
T3
T4
tLBKHOZ1
tLBKHOV1
GPCM Mode Output Signals:
LCS[0:3]/LWE
tLBIXKH2
tLBIVKH2
UPM Mode Input Signal:
LUPWAIT
tLBIXKH1
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBKHOZ1
tLBKHOV1
UPM Mode Output Signals:
LCS[0:3]/LBS[0:3]/LGPL[0:5]
Figure 26. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 (DLL Enabled)
11 JTAG
This section describes the DC and AC electrical specifications for the IEEE Std. 1149.1 (JTAG) interface
of the MPC8347EA.
11.1 JTAG DC Electrical Characteristics
Table 40 provides the DC electrical characteristics for the IEEE Std. 1149.1 (JTAG) interface of the
MPC8347EA.
Table 40. JTAG Interface DC Electrical Characteristics
Parameter
Symbol
Condition
Min
Max
Unit
Input high voltage
Input low voltage
Input current
VIH
VIL
—
OVDD – 0.3 OVDD + 0.3
V
V
—
—
–0.3
—
0.8
5
IIN
μA
V
Output high voltage
VOH
IOH = –8.0 mA
2.4
—
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
42
JTAG
Table 40. JTAG Interface DC Electrical Characteristics (continued)
Parameter
Symbol
Condition
Min
Max
Unit
Output low voltage
Output low voltage
VOL
IOL = 8.0 mA
IOL = 3.2 mA
—
—
0.5
0.4
V
V
V
OL
11.2 JTAG AC Timing Specifications
This section describes the AC electrical specifications for the IEEE Std. 1149.1 (JTAG) interface of the
MPC8347EA. Table 41 provides the JTAG AC timing specifications as defined in Figure 28 through
Figure 31.
1
Table 41. JTAG AC Timing Specifications (Independent of CLKIN)
At recommended operating conditions (see Table 2).
Parameter
Symbol2
Min
Max
Unit
Notes
JTAG external clock frequency of operation
JTAG external clock cycle time
JTAG external clock pulse width measured at 1.4 V
JTAG external clock rise and fall times
TRST assert time
fJTG
t JTG
0
33.3
—
—
2
MHz
ns
—
—
—
—
3
30
15
0
tJTKHKL
tJTGR, tJTGF
tTRST
ns
ns
25
—
ns
Input setup times:
ns
Boundary-scan data
tJTDVKH
tJTIVKH
4
4
—
—
4
4
5
5
TMS, TDI
Input hold times:
Valid times:
ns
ns
ns
Boundary-scan data
TMS, TDI
tJTDXKH
tJTIXKH
10
10
—
—
Boundary-scan data
TDO
tJTKLDV
tJTKLOV
2
2
11
11
Output hold times:
Boundary-scan data
TDO
tJTKLDX
tJTKLOX
2
2
—
—
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
43
JTAG
1
Table 41. JTAG AC Timing Specifications (Independent of CLKIN) (continued)
At recommended operating conditions (see Table 2).
Parameter
Symbol2
Min
Max
Unit
Notes
JTAG external clock to output high impedance:
ns
Boundary-scan data
TDO
tJTKLDZ
tJTKLOZ
2
2
19
9
5, 6
Notes:
1. All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal in question.
The output timings are measured at the pins. All output timings assume a purely resistive 50 Ω load (see Figure 18).
Time-of-flight delays must be added for trace lengths, vias, and connectors in the system.
2. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tJTDVKH symbolizes JTAG device timing
(JT) with respect to the time data input signals (D) reaching the valid state (V) relative to the tJTG clock reference (K) going
to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG timing (JT) with respect to the time data input signals (D)
went invalid (X) relative to the tJTG clock reference (K) going to the high (H) state. In general, the clock reference symbol is
based on three letters representing the clock of a particular function. For rise and fall times, the latter convention is used with
the appropriate letter: R (rise) or F (fall).
3. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only.
4. Non-JTAG signal input timing with respect to tTCLK
.
5. Non-JTAG signal output timing with respect to tTCLK
.
6. Guaranteed by design and characterization.
Figure 27 provides the AC test load for TDO and the boundary-scan outputs of the MPC8347EA.
OVDD/2
Output
Z0 = 50 Ω
RL = 50 Ω
Figure 27. AC Test Load for the JTAG Interface
Figure 28 provides the JTAG clock input timing diagram.
JTAG
External Clock
VM
VM
VM
tJTKHKL
tJTGR
tJTG
VM = Midpoint Voltage (OV /2)
tJTGF
DD
Figure 28. JTAG Clock Input Timing Diagram
Figure 29 provides the TRST timing diagram.
TRST
VM
VM
tTRST
VM = Midpoint Voltage (OV /2)
DD
Figure 29. TRST Timing Diagram
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
44
JTAG
Figure 30 provides the boundary-scan timing diagram.
JTAG
VM
VM
External Clock
tJTDVKH
tJTDXKH
Boundary
Data Inputs
Input
Data Valid
tJTKLDV
tJTKLDX
Boundary
Data Outputs
Output Data Valid
tJTKLDZ
Boundary
Output Data Valid
Data Outputs
VM = Midpoint Voltage (OV /2)
DD
Figure 30. Boundary-Scan Timing Diagram
Figure 31 provides the test access port timing diagram.
JTAG
External Clock
VM
VM
tJTIVKH
tJTIXKH
Input
TDI, TMS
TDO
Data Valid
tJTKLOV
tJTKLOX
Output Data Valid
tJTKLOZ
Output Data Valid
TDO
VM = Midpoint Voltage (OV /2)
DD
Figure 31. Test Access Port Timing Diagram
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
45
I2C
12 I2C
2
This section describes the DC and AC electrical characteristics for the I C interface of the MPC8347EA.
2
12.1 I C DC Electrical Characteristics
2
Table 42 provides the DC electrical characteristics for the I C interface of the MPC8347EA.
2
Table 42. I C DC Electrical Characteristics
At recommended operating conditions with OVDD of 3.3 V 10%.
Parameter
Symbol
Min
Max
Unit
Notes
Input high voltage level
Input low voltage level
Low level output voltage
VIH
VIL
0.7 × OVDD
OVDD + 0.3
0.3 × OVDD
0.2 × OVDD
250
V
V
—
—
1
–0.3
0
VOL
V
Output fall time from VIH(min) to VIL(max) with a bus
capacitance from 10 to 400 pF
tI2KLKV
20 + 0.1 × CB
ns
2
Pulse width of spikes which must be suppressed by the
input filter
tI2KHKL
0
50
10
10
ns
μA
pF
3
4
Input current each I/O pin (input voltage is between
0.1 × OVDD and 0.9 × OVDD(max)
II
–10
—
Capacitance for each I/O pin
CI
—
Notes:
1. Output voltage (open drain or open collector) condition = 3 mA sink current.
2. CB = capacitance of one bus line in pF.
3. Refer to the MPC8349EA Integrated Host Processor Family Reference Manual, for information on the digital filter used.
4. I/O pins obstruct the SDA and SCL lines if OVDD is switched off.
2
12.2 I C AC Electrical Specifications
2
Table 43 provides the AC timing parameters for the I C interface of the MPC8347EA. Note that all values
refer to V (min) and V (max) levels (see Table 42).
IH
IL
2
Table 43. I C AC Electrical Specifications
Parameter
Symbol1
Min
Max
Unit
SCL clock frequency
fI2C
tI2CL
0
400
—
kHz
μs
Low period of the SCL clock
1.3
0.6
0.6
0.6
High period of the SCL clock
tI2CH
—
μs
Setup time for a repeated START condition
tI2SVKH
tI2SXKL
—
μs
Hold time (repeated) START condition (after this period, the first clock
pulse is generated)
—
μs
Data setup time
tI2DVKH
tI2DXKL
100
—
ns
Data hold time:CBUS compatible masters
I2C bus devices
—
02
—
μs
0.93
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
46
I2C
2
Table 43. I C AC Electrical Specifications (continued)
Parameter
Symbol1
Min
Max
Unit
__
Fall time of both SDA and SCL signals5
Setup time for STOP condition
tI2CF
tI2PVKH
tI2KHDX
VNL
300
—
ns
μs
μs
V
0.6
1.3
Bus free time between a STOP and START condition
—
Noise margin at the LOW level for each connected device (including
hysteresis)
0.1 × OVDD
—
Noise margin at the HIGH level for each connected device (including
hysteresis)
VNH
0.2 × OVDD
—
V
Notes:
1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tI2DVKH symbolizes I2C timing (I2) with
respect to the time data input signals (D) reach the valid state (V) relative to the tI2C clock reference (K) going to the high (H)
state or setup time. Also, tI2SXKL symbolizes I2C timing (I2) for the time that the data with respect to the start condition (S)
goes invalid (X) relative to the tI2C clock reference (K) going to the low (L) state or hold time. Also, tI2PVKH symbolizes I2C
timing (I2) for the time that the data with respect to the stop condition (P) reaches the valid state (V) relative to the tI2C clock
reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate
letter: R (rise) or F (fall).
2. The device provides a hold time of at least 300 ns for the SDA signal (referred to the VIH(min) of the SCL signal) to bridge
the undefined region of the falling edge of SCL.
3. The maximum tI2DVKH must be met only if the device does not stretch the LOW period (tI2CL) of the SCL signal.
4. CB = capacitance of one bus line in pF.
5.)The device does not follow the “I2C-BUS Specifications” version 2.1 regarding the tI2CF AC parameter.
2
Figure 32 provides the AC test load for the I C.
OVDD/2
Output
Z0 = 50 Ω
RL = 50 Ω
2
Figure 32. I C AC Test Load
2
Figure 33 shows the AC timing diagram for the I C bus.
SDA
tI2CF
tI2CL
tI2DVKH
tI2KHKL
tI2CF
tI2SXKL
tI2CR
SCL
tI2SXKL
tI2CH
tI2SVKH
tI2PVKH
tI2DXKL
S
Sr
Figure 33. I C Bus AC Timing Diagram
P
S
2
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
47
PCI
13 PCI
This section describes the DC and AC electrical specifications for the PCI bus of the MPC8347EA.
13.1 PCI DC Electrical Characteristics
Table 44 provides the DC electrical characteristics for the PCI interface of the MPC8347EA.
Table 44. PCI DC Electrical Characteristics
Parameter
Symbol
Test Condition
Min
Max
Unit
High-level input voltage
Low-level input voltage
Input current
VIH
VIL
VOUT ≥ VOH (min) or
VOUT ≤ VOL (max)
2
–0.3
OVDD + 0.3
V
V
0.8
5
IIN
VIN1= 0 V or VIN = OVDD
—
μA
V
High-level output voltage
VOH
OVDD = min,
OVDD – 0.2
—
IOH = –100 μA
Low-level output voltage
VOL
OVDD = min,
—
0.2
V
IOL = 100 μA
Note:
1. The symbol VIN, in this case, represents the OVIN symbol referenced in Table 1.
13.2 PCI AC Electrical Specifications
This section describes the general AC timing parameters of the PCI bus of the MPC8347EA. Note that the
PCI_CLK or PCI_SYNC_IN signal is used as the PCI input clock depending on whether the device is
configured as a host or agent device. Table 45 provides the PCI AC timing specifications at 66 MHz.
1
Table 45. PCI AC Timing Specifications at 66 MHz
Parameter
Symbol2
Min
Max
Unit
Notes
Clock to output valid
t
—
1
6.0
—
ns
ns
ns
ns
3
PCKHOV
Output hold from clock
Clock to output high impedance
Input setup to clock
tPCKHOX
tPCKHOZ
tPCIVKH
3
—
3.0
14
—
3, 4
3, 5
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
48
PCI
1
Table 45. PCI AC Timing Specifications at 66 MHz (continued)
Parameter
Symbol2
Min
Max
Unit
Notes
3, 5
Input hold from clock
tPCIXKH
0
—
ns
Notes:
1. PCI timing depends on M66EN and the ratio between PCI1/PCI2. Refer to the PCI chapter of the reference manual for a
description of M66EN.
2. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI timing (PC) with
respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, tSYS, reference (K) going
to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC) with respect to the time hard reset (R) went
high (H) relative to the frame signal (F) going to the valid (V) state.
3. See the timing measurement conditions in the PCI 2.3 Local Bus Specifications.
4. For active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered through the
component pin is less than or equal to the leakage current specification.
5. Input timings are measured at the pin.
Table 46 provides the PCI AC timing specifications at 33 MHz.
Table 46. PCI AC Timing Specifications at 33 MHz
Parameter
Symbol1
Min
Max
Unit
Notes
Clock to output valid
t
—
2
11
—
14
—
—
ns
ns
ns
ns
ns
2
PCKHOV
Output hold from clock
Clock to output high impedance
Input setup to clock
Input hold from clock
Notes:
tPCKHOX
tPCKHOZ
tPCIVKH
tPCIXKH
2
—
3.0
0
2, 3
2, 4
2, 4
1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI timing (PC) with
respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, tSYS, reference (K) going
to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC) with respect to the time hard reset (R) went
high (H) relative to the frame signal (F) going to the valid (V) state.
2. See the timing measurement conditions in the PCI 2.3 Local Bus Specifications.
3. For active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered through the
component pin is less than or equal to the leakage current specification.
4. Input timings are measured at the pin.
Figure 34 provides the AC test load for PCI.
OVDD/2
Output
Z0 = 50 Ω
RL = 50 Ω
Figure 34. PCI AC Test Load
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
49
Timers
Figure 35 shows the PCI input AC timing diagram.
CLK
tPCIVKH
tPCIXKH
Input
Figure 35. PCI Input AC Timing Diagram
Figure 36 shows the PCI output AC timing diagram.
CLK
tPCKHOV
tPCKHOX
Output Delay
tPCKHOZ
High-Impedance
Output
Figure 36. PCI Output AC Timing Diagram
14 Timers
This section describes the DC and AC electrical specifications for the timers.
14.1 Timer DC Electrical Characteristics
Table 47 provides the DC electrical characteristics for the MPC8347EA timer pins, including TIN, TOUT,
TGATE, and RTC_CLK.
Table 47. Timer DC Electrical Characteristics
Parameter
Input high voltage
Symbol
Condition
Min
Max
Unit
VIH
VIL
—
—
2.0
–0.3
—
OVDD + 0.3
V
V
Input low voltage
Input current
0.8
5
IIN
—
μA
V
Output high voltage
Output low voltage
Output low voltage
VOH
VOL
IOH = –8.0 mA
IOL = 8.0 mA
IOL = 3.2 mA
2.4
—
—
0.5
0.4
V
V
—
V
OL
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
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GPIO
14.2 Timer AC Timing Specifications
Table 48 provides the timer input and output AC timing specifications.
1
Table 48. Timers Input AC Timing Specifications
Parameter
Symbol2
Min
Unit
ns
Timers inputs—minimum pulse width
Notes:
tTIWID
20
1. Input specifications are measured from the 50 percent level of the signal to the 50 percent level of the rising edge of CLKIN.
Timings are measured at the pin.
2. Timer inputs and outputs are asynchronous to any visible clock. Timer outputs should be synchronized before use by external
synchronous logic. Timer inputs are required to be valid for at least tTIWID ns to ensure proper operation.
15 GPIO
This section describes the DC and AC electrical specifications for the GPIO.
15.1 GPIO DC Electrical Characteristics
Table 49 provides the DC electrical characteristics for the MPC8347EA GPIO.
Table 49. GPIO DC Electrical Characteristics
PArameter
Symbol
Condition
Min
Max
Unit
Input high voltage
Input low voltage
Input current
VIH
VIL
—
—
2.0
–0.3
—
OVDD + 0.3
V
V
0.8
5
IIN
—
μA
V
Output high voltage
Output low voltage
Output low voltage
VOH
VOL
IOH = –8.0 mA
IOL = 8.0 mA
IOL = 3.2 mA
2.4
—
—
0.5
0.4
V
V
—
V
OL
15.2 GPIO AC Timing Specifications
Table 50 provides the GPIO input and output AC timing specifications.
1
Table 50. GPIO Input AC Timing Specifications
Parameter
Symbol2
Min
Unit
GPIO inputs—minimum pulse width
tPIWID
20
ns
Notes:
1. Input specifications are measured from the 50 percent level of the signal to the 50 percent level of the rising edge of CLKIN.
Timings are measured at the pin.
2. GPIO inputs and outputs are asynchronous to any visible clock. GPIO outputs should be synchronized before use by external
synchronous logic. GPIO inputs must be valid for at least tPIWID ns to ensure proper operation.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
51
IPIC
16 IPIC
This section describes the DC and AC electrical specifications for the external interrupt pins.
16.1 IPIC DC Electrical Characteristics
Table 51 provides the DC electrical characteristics for the external interrupt pins.
1
Table 51. IPIC DC Electrical Characteristics
Parameter
Input high voltage
Symbol
Condition
Min
Max
Unit
Notes
VIH
VIL
IIN
—
—
2.0
–0.3
—
OVDD + 0.3
V
V
—
—
—
2
Input low voltage
Input current
0.8
5
—
μA
V
Output low voltage
Output low voltage
Notes:
VOL
IOL = 8.0 mA
IOL = 3.2 mA
—
0.5
0.4
V
—
V
2
OL
1. This table applies for pins IRQ[0:7], IRQ_OUT, and MCP_OUT.
2. IRQ_OUT and MCP_OUT are open-drain pins; thus VOH is not relevant for those pins.
16.2 IPIC AC Timing Specifications
Table 52 provides the IPIC input and output AC timing specifications.
1
Table 52. IPIC Input AC Timing Specifications
Parameter
Symbol2
Min
20
Unit
IPIC inputs—minimum pulse width
tPICWID
ns
Notes:
1. Input specifications are measured at the 50 percent level of the IPIC input signals. Timings are measured at the pin.
2. IPIC inputs and outputs are asynchronous to any visible clock. IPIC outputs should be synchronized before use by external
synchronous logic. IPIC inputs must be valid for at least tPICWID ns to ensure proper operation in edge triggered mode.
17 SPI
This section describes the SPI DC and AC electrical specifications.
17.1 SPI DC Electrical Characteristics
Table 53 provides the SPI DC electrical characteristics.
Table 53. SPI DC Electrical Characteristics
Parameter
Symbol
Condition
Min
Max
Unit
Input high voltage
Input low voltage
VIH
VIL
—
—
2.0
OVDD + 0.3
0.8
V
V
–0.3
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
52
SPI
Table 53. SPI DC Electrical Characteristics (continued)
Parameter
Symbol
Condition
Min
Max
Unit
Input current
IIN
—
—
2.4
—
5
—
μA
V
Output high voltage
Output low voltage
Output low voltage
VOH
VOL
IOH = –8.0 mA
IOL = 8.0 mA
IOL = 3.2 mA
0.5
0.4
V
V
—
V
OL
17.2 SPI AC Timing Specifications
Table 54 provides the SPI input and output AC timing specifications.
1
Table 54. SPI AC Timing Specifications
Parameter
Symbol2
Min
Max
Unit
SPI outputs valid—Master mode (internal clock) delay
SPI outputs hold—Master mode (internal clock) delay
SPI outputs valid—Slave mode (external clock) delay
SPI outputs hold—Slave mode (external clock) delay
SPI inputs—Master mode (internal clock input setup time
SPI inputs—Master mode (internal clock input hold time
SPI inputs—Slave mode (external clock) input setup time
SPI inputs—Slave mode (external clock) input hold time
Notes:
tNIKHOV
tNIKHOX
tNEKHOV
tNEKHOX
tNIIVKH
—
0.5
—
2
6
ns
ns
ns
ns
ns
ns
ns
ns
—
8
—
—
—
—
—
4
tNIIXKH
0
tNEIVKH
tNEIXKH
4
2
1. Output specifications are measured from the 50 percent level of the rising edge of CLKIN to the 50 percent level of the signal.
Timings are measured at the pin.
2. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tNIKHOX symbolizes the internal timing
(NI) for the time SPICLK clock reference (K) goes to the high state (H) until outputs (O) are invalid (X).
Figure 37 provides the AC test load for the SPI.
OVDD/2
Output
Z0 = 50 Ω
RL = 50 Ω
Figure 37. SPI AC Test Load
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
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Package and Pin Listings
Figure 38 and Figure 39 represent the AC timings from Table 54. Note that although the specifications
generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge
is the active edge.
Figure 38 shows the SPI timings in slave mode (external clock).
SPICLK (Input)
tNEIXKH
tNEIVKH
Input Signals:
SPIMOSI
(See Note)
tNEKHOX
Output Signals:
SPIMISO
(See Note)
Note: The clock edge is selectable on SPI.
Figure 38. SPI AC Timing in Slave Mode (External Clock) Diagram
Figure 39 shows the SPI timings in master mode (internal clock).
SPICLK (Output)
tNIIXKH
tNIIVKH
Input Signals:
SPIMISO
(See Note)
tNIKHOX
Output Signals:
SPIMOSI
(See Note)
Note: The clock edge is selectable on SPI.
Figure 39. SPI AC Timing in Master Mode (Internal Clock) Diagram
18 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8347EA is available
in two packages—a tape ball grid array (TBGA) and a plastic ball grid array (PBGA). See Section 18.1,
“Package Parameters for the MPC8347EA TBGA,” Section 18.2, “Mechanical Dimensions for the
MPC8347EA TBGA,” Section 18.3, “Package Parameters for the MPC8347EA PBGA,” and
Section 18.4, “Mechanical Dimensions for the MPC8347EA PBGA.”
18.1 Package Parameters for the MPC8347EA TBGA
The package parameters are provided in the following list. The package type is 35 mm × 35 mm, 672 tape
ball grid array (TBGA).
Package outline
Interconnects
35 mm × 35 mm
672
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
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Package and Pin Listings
Pitch
1.00 mm
1.46 mm
Module height (typical)
Solder balls
62 Sn/36 Pb/2 Ag (ZU package)
96.5 Sn/3.5Ag (VV package)
Ball diameter (typical)
0.64 mm
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
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Package and Pin Listings
18.2 Mechanical Dimensions for the MPC8347EA TBGA
Figure 40 shows the mechanical dimensions and bottom surface nomenclature for the MPC8347EA,
672-TBGA package.
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Parallelism measurement must exclude any effect of mark on top surface of package.
Figure 40. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8347EA TBGA
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
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Freescale Semiconductor
Package and Pin Listings
18.3 Package Parameters for the MPC8347EA PBGA
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm,
620 plastic ball grid array (PBGA).
Package outline
29 mm × 29 mm
620
Interconnects
Pitch
1.00 mm
2.46 mm
2.23 mm
2.00 mm
Module height (maximum)
Module height (typical)
Module height (minimum)
Solder balls
62 Sn/36 Pb/2 Ag (ZQ package)
96.5 Sn/3.5Ag (VR package)
Ball diameter (typical)
0.60 mm
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
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Package and Pin Listings
18.4 Mechanical Dimensions for the MPC8347EA PBGA
Figure 41 shows the mechanical dimensions and bottom surface nomenclature for the MPC8347EA,
620-PBGA package.
Notes:
1. All dimensions are in millimeters.
2. Dimensioning and tolerancing per ASME Y14. 5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
Figure 41. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8347EA PBGA
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
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Freescale Semiconductor
Package and Pin Listings
18.5 Pinout Listings
Table 55 provides the pinout listing for the MPC8347EA, 672 TBGA package.
Table 55. MPC8347EA (TBGA) Pinout Listing
Power
Notes
Signal
Package Pin Number
Pin Type
Supply
PCI
B34
C33
PCI_INTA/IRQ_OUT
O
O
OVDD
OVDD
OVDD
2
PCI_RESET_OUT
PCI_AD[31:0]
—
—
G30, G32, G34, H31, H32, H33, H34,
J29, J32, J33, L30, K31, K33, K34,
L33, L34, P34, R29, R30, R33, R34,
T31, T32, T33, U31, U34, V31, V32,
V33, V34, W33, W34
I/O
PCI_C/BE[3:0]
PCI_PAR
J30, M31, P33, T34
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
—
—
5
P32
PCI_FRAME
M32
PCI_TRDY
N29
5
PCI_IRDY
M34
5
PCI_STOP
N31
5
PCI_DEVSEL
PCI_IDSEL
N30
5
J31
—
5
PCI_SERR
N34
I/O
I/O
I/O
I
PCI_PERR
N33
5
PCI_REQ[0]
D32
—
—
—
—
—
—
—
—
PCI_REQ[1]/CPCI1_HS_ES
PCI_REQ[2:4]
PCI_GNT0
D34
E34, F32, G29
I
C34
I/O
O
PCI_GNT1/CPCI1_HS_LED
PCI_GNT2/CPCI1_HS_ENUM
PCI_GNT[3:4]
M66EN
D33
E33
O
F31, F33
A19
O
I
DDR SDRAM Memory Interface
MDQ[0:63]
D5, A3, C3, D3, C4, B3, C2, D4, D2,
E5, G2, H6, E4, F3, G4, G3, H1, J2,
L6, M6, H2, K6, L2, M4, N2, P4, R2,
T4, P6, P3, R1, T2, AB5, AA3, AD6,
AE4, AB4, AC2, AD3, AE6, AE3, AG4,
AK5, AK4, AE2, AG6, AK3, AK2, AL2,
AL1, AM5, AP5, AM2, AN1, AP4, AN5,
AJ7, AN7, AM8, AJ9, AP6, AL7, AL9,
AN8
I/O
GVDD
—
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
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Package and Pin Listings
Table 55. MPC8347EA (TBGA) Pinout Listing (continued)
Power
Supply
Signal
Package Pin Number
Pin Type
Notes
MECC[0:4]/MSRCID[0:4]
MECC[5]/MDVAL
MECC[6:7]
W4, W3, Y3, AA6, T1
I/O
I/O
I/O
O
GVDD
GVDD
GVDD
GVDD
—
—
—
—
U1
Y1, Y6
MDM[0:8]
B1, F1, K1, R4, AD4, AJ1, AP3, AP7,
Y4
MDQS[0:8]
B2, F5, J1, P2, AC1, AJ2, AN4, AL8,
W2
I/O
GVDD
—
MBA[0:1]
MA[0:14]
AD1, AA5
O
O
GVDD
GVDD
—
—
W1, U4, T3, R3, P1, M1, N1, L3, L1,
K2, Y2, K3, J3, AP2, AN6
MWE
AF1
O
O
GVDD
GVDD
GVDD
GVDD
GVDD
GVDD
GVDD
GVDD
GVDD
—
—
—
—
—
3
MRAS
AF4
MCAS
AG3
AG2, AG1, AK1, AL4
H3, G1
O
MCS[0:3]
MCKE[0:1]
MCK[0:5]
MCK[0:5]
MODT[0:3]
MBA[2]
O
O
U2, F4, AM3, V3, F2, AN3
U3, E3, AN2, V4, E1, AM4
AH3, AJ5, AH1, AJ4
H4
O
—
—
—
—
10
10
O
O
O
MDIC0
AB1
I/O
I/O
MDIC1
AA1
—
Local Bus Controller Interface
LAD[0:31]
AM13, AP13, AL14, AM14, AN14,
AP14, AK15, AJ15, AM15, AN15,
AP15, AM16, AL16, AN16, AP16,
AL17, AM17, AP17, AK17, AP18,
AL18, AM18, AN18, AP19, AN19,
AM19, AP20, AK19, AN20, AL20,
AP21, AN21
I/O
OVDD
—
LDP[0]/CKSTOP_OUT
LDP[1]/CKSTOP_IN
LDP[2]/LCS[4]
AM21
I/O
I/O
I/O
I/O
O
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
—
—
—
—
—
—
—
—
AP22
AN22
LDP[3]/LCS[5]
AM22
LA[27:31]
AK21, AP23, AN23, AP24, AK22
AN24, AL23, AP25, AN25
AK23, AP26, AL24, AM25
AN26
LCS[0:3]
O
LWE[0:3]/LSDDQM[0:3]/LBS[0:3]
LBCTL
O
O
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
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Package and Pin Listings
Table 55. MPC8347EA (TBGA) Pinout Listing (continued)
Power
Notes
Signal
Package Pin Number
Pin Type
Supply
LALE
AK24
O
I/O
I/O
O
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
—
—
—
—
—
13
—
—
—
—
—
LGPL0/LSDA10/cfg_reset_source0
LGPL1/LSDWE/cfg_reset_source1
LGPL2/LSDRAS/LOE
LGPL3/LSDCAS/cfg_reset_source2
LGPL4/LGTA/LUPWAIT/LPBSE
LGPL5/cfg_clkin_div
LCKE
AP27
AL25
AJ24
AN27
I/O
I/O
I/O
O
AP28
AL26
AM27
LCLK[0:2]
AN28, AK26, AP29
O
LSYNC_OUT
AM12
O
LSYNC_IN
AJ10
General Purpose I/O Timers
F24
I
GPIO1[0]/DMA_DREQ0/GTM1_TIN1/
GTM2_TIN2
I/O
I/O
OVDD
OVDD
—
—
GPIO1[1]/DMA_DACK0/GTM1_TGATE1/
GTM2_TGATE2
E24
GPIO1[2]/DMA_DDONE0/GTM1_TOUT1
B25
D24
I/O
I/O
OVDD
OVDD
—
—
GPIO1[3]/DMA_DREQ1/GTM1_TIN2/
GTM2_TIN1
GPIO1[4]/DMA_DACK1/GTM1_TGATE2/
GTM2_TGATE1
A25
B24
A24
D23
I/O
I/O
I/O
I/O
OVDD
OVDD
OVDD
OVDD
—
—
—
—
GPIO1[5]/DMA_DDONE1/GTM1_TOUT2/
GTM2_TOUT1
GPIO1[6]/DMA_DREQ2/GTM1_TIN3/
GTM2_TIN4
GPIO1[7]/DMA_DACK2/GTM1_TGATE3/
GTM2_TGATE4
GPIO1[8]/DMA_DDONE2/GTM1_TOUT3
B23
A23
I/O
I/O
OVDD
OVDD
—
—
GPIO1[9]/DMA_DREQ3/GTM1_TIN4/
GTM2_TIN3
GPIO1[10]/DMA_DACK3/GTM1_TGATE4/
GTM2_TGATE3
F22
E22
I/O
I/O
OVDD
OVDD
—
—
GPIO1[11]/DMA_DDONE3/GTM1_TOUT4/
GTM2_TOUT3
USB Port 1
A26
MPH1_D0_ENABLEN/DR_D0_ENABLEN
MPH1_D1_SER_TXD/DR_D1_SER_TXD
MPH1_D2_VMO_SE0/DR_D2_VMO_SE0
I/O
I/O
I/O
OVDD
OVDD
OVDD
—
—
—
B26
D25
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
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Package and Pin Listings
Table 55. MPC8347EA (TBGA) Pinout Listing (continued)
Power
Supply
Signal
Package Pin Number
Pin Type
Notes
MPH1_D3_SPEED/DR_D3_SPEED
MPH1_D4_DP/DR_D4_DP
A27
B27
C27
D26
E26
D27
A28
I/O
I/O
I/O
I/O
I/O
I
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
—
—
—
—
—
—
—
MPH1_D5_DM/DR_D5_DM
MPH1_D6_SER_RCV/DR_D6_SER_RCV
MPH1_D7_DRVVBUS/DR_D7_DRVVBUS
MPH1_NXT/DR_SESS_VLD_NXT
MPH1_DIR_DPPULLUP/
I/O
DR_XCVR_SEL_DPPULLUP
MPH1_STP_SUSPEND/
DR_STP_SUSPEND
F26
E27
O
I
OVDD
OVDD
—
—
MPH1_PWRFAULT/
DR_RX_ERROR_PWRFAULT
MPH1_PCTL0/DR_TX_VALID_PCTL0
MPH1_PCTL1/DR_TX_VALIDH_PCTL1
MPH1_CLK/DR_CLK
A29
O
O
I
OVDD
OVDD
OVDD
—
—
—
D28
B29
USB Port 0
MPH0_D0_ENABLEN/DR_D8_CHGVBUS
MPH0_D1_SER_TXD/DR_D9_DCHGVBUS
MPH0_D2_VMO_SE0/DR_D10_DPPD
MPH0_D3_SPEED/DR_D11_DMMD
MPH0_D4_DP/DR_D12_VBUS_VLD
MPH0_D5_DM/DR_D13_SESS_END
MPH0_D6_SER_RCV/DR_D14
C29
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
A30
E28
B30
C30
A31
B31
MPH0_D7_DRVVBUS/DR_D15_IDPULLUP
MPH0_NXT/DR_RX_ACTIVE_ID
C31
B32
MPH0_DIR_DPPULLUP/DR_RESET
MPH0_STP_SUSPEND/DR_TX_READY
MPH0_PWRFAULT/DR_RX_VALIDH
MPH0_PCTL0/DR_LINE_STATE0
MPH0_PCTL1/DR_LINE_STATE1
MPH0_CLK/DR_RX_VALID
A32
I/O
I/O
I
A33
C32
D31
I/O
I/O
I
E30
B33
Programmable Interrupt Controller
MCP_OUT
AN33
C19
O
OVDD
OVDD
OVDD
2
IRQ0/MCP_IN/GPIO2[12]
IRQ[1:5]/GPIO2[13:17]
I/O
I/O
—
—
C22, A22, D21, C21, B21
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
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Package and Pin Listings
Table 55. MPC8347EA (TBGA) Pinout Listing (continued)
Power
Notes
Signal
Package Pin Number
Pin Type
Supply
IRQ[6]/GPIO2[18]/CKSTOP_OUT
IRQ[7]/GPIO2[19]/CKSTOP_IN
A21
I/O
I/O
OVDD
OVDD
—
—
C20
Ethernet Management Interface
EC_MDC
EC_MDIO
A7
O
LVDD1
LVDD1
—
E9
I/O
12
Gigabit Reference Clock
EC_GTX_CLK125
C8
I
LVDD1
—
Three-Speed Ethernet Controller (Gigabit Ethernet 1)
TSEC1_COL/GPIO2[20]
TSEC1_CRS/GPIO2[21]
TSEC1_GTX_CLK
A17
I/O
I/O
O
OVDD
LVDD1
LVDD1
LVDD1
LVDD1
OVDD
OVDD
LVDD1
OVDD
OVDD
LVDD1
LVDD1
OVDD
—
—
3
F12
D10
TSEC1_RX_CLK
A11
I
—
—
—
—
—
—
—
11
—
—
TSEC1_RX_DV
B11
I
TSEC1_RX_ER/GPIO2[26]
TSEC1_RXD[7:4]/GPIO2[22:25]
TSEC1_RXD[3:0]
B17
I/O
I/O
I
B16, D16, E16, F16
E10, A8, F10, B8
TSEC1_TX_CLK
D17
I
TSEC1_TXD[7:4]/GPIO2[27:30]
TSEC1_TXD[3:0]
A15, B15, A14, B14
I/O
O
A10, E11, B10, A9
TSEC1_TX_EN
B9
O
TSEC1_TX_ER/GPIO2[31]
A16
I/O
Three-Speed Ethernet Controller (Gigabit Ethernet 2)
TSEC2_COL/GPIO1[21]
TSEC2_CRS/GPIO1[22]
TSEC2_GTX_CLK
C14
I/O
I/O
O
OVDD
LVDD2
LVDD2
LVDD2
LVDD2
OVDD
LVDD2
OVDD
OVDD
OVDD
OVDD
OVDD
—
—
—
—
—
—
—
—
—
—
—
—
D6
A4
TSEC2_RX_CLK
B4
I
TSEC2_RX_DV/GPIO1[23]
TSEC2_RXD[7:4]/GPIO1[26:29]
TSEC2_RXD[3:0]/GPIO1[13:16]
TSEC2_RX_ER/GPIO1[25]
TSEC2_TXD[7]/GPIO1[31]
E6
A13, B13, C13, A12
D7, A6, E8, B7
D14
I/O
I/O
I/O
I/O
I/O
O
B12
TSEC2_TXD[6]/DR_XCVR_TERM_SEL
TSEC2_TXD[5]/DR_UTMI_OPMODE1
TSEC2_TXD[4]/DR_UTMI_OPMODE0
C12
D12
E12
O
O
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
63
Package and Pin Listings
Table 55. MPC8347EA (TBGA) Pinout Listing (continued)
Power
Supply
Signal
Package Pin Number
Pin Type
Notes
TSEC2_TXD[3:0]/GPIO1[17:20]
TSEC2_TX_ER/GPIO1[24]
TSEC2_TX_EN/GPIO1[12]
TSEC2_TX_CLK/GPIO1[30]
B5, A5, F8, B6
F14
I/O
I/O
I/O
I/O
LVDD2
OVDD
LVDD2
OVDD
—
—
3
C5
E14
—
DUART
AK27, AN29
AL28, AM29
AP30
UART_SOUT[1:2]/MSRCID[0:1]/LSRCID[0:1]
UART_SIN[1:2]/MSRCID[2:3]/LSRCID[2:3]
UART_CTS[1]/MSRCID4/LSRCID4
UART_CTS[2]/MDVAL/ LDVAL
O
OVDD
OVDD
OVDD
OVDD
OVDD
—
—
—
—
—
I/O
I/O
I/O
O
AN30
UART_RTS[1:2]
AP31, AM30
I2C interface
AK29
IIC1_SDA
IIC1_SCL
IIC2_SDA
IIC2_SCL
I/O
I/O
I/O
I/O
OVDD
OVDD
OVDD
OVDD
2
2
2
2
AP32
AN31
AM31
SPI
SPIMOSI/LCS[6]
SPIMISO/LCS[7]
SPICLK
AN32
I/O
I/O
I/O
I
OVDD
OVDD
OVDD
OVDD
—
—
—
—
AP33
AK30
SPISEL
AL31
Clocks
AN9, AP9, AM10
AN10
PCI_CLK_OUT[0:2]
PCI_CLK_OUT[3]/LCS[6]
PCI_CLK_OUT[4]/LCS[7]
PCI_SYNC_IN/PCI_CLOCK
PCI_SYNC_OUT
O
O
O
I
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
—
—
—
—
3
AJ11
AK12
AP11
O
I
RTC/PIT_CLOCK
AM32
—
—
CLKIN
AM9
I
JTAG
TCK
TDI
E20
I
I
OVDD
OVDD
OVDD
OVDD
OVDD
—
4
F20
TDO
TMS
TRST
B20
O
I
3
A20
4
B19
I
4
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
64
Package and Pin Listings
Table 55. MPC8347EA (TBGA) Pinout Listing (continued)
Power
Notes
Signal
Package Pin Number
Pin Type
Supply
Test
TEST
D22
I
I
OVDD
OVDD
6
7
TEST_SEL
AL13
PMC
QUIESCE
A18
O
OVDD
—
System Control
PORESET
HRESET
SRESET
C18
I
OVDD
OVDD
OVDD
—
1
B18
I/O
I/O
D18
Thermal Management
K32
2
THERM0
I
—
9
Power and Ground Signals
L31
AVDD
1
Powerfore300
PLL (1.2 V)
AVDD
1
—
nominal, 1.3 V
for 667 MHz)
AVDD2
AP12
Power for
system PLL
(1.2 V)
AVDD
2
—
nominal, 1.3 V
for 667 MHz)
AVDD3
AVDD4
GND
AE1
PowerforDDR
DLL (1.2 V)
nominal, 1.3 V
for 667 MHz)
—
AVDD
—
—
—
—
AJ13
PowerforLBIU
DLL (1.2 V)
nominal, 1.3 V
for 667 MHz)
4
A1, A34, C1, C7, C10, C11, C15, C23,
C25, C28, D1, D8, D20, D30, E7, E13,
E15, E17, E18, E21, E23, E25, E32,
F6, F19, F27, F30, F34, G31, H5, J4,
J34, K30, L5, M2, M5, M30, M33, N3,
N5, P30, R5, R32, T5, T30, U6, U29,
U33, V2, V5, V30, W6, W30, Y30,
AA2, AA30, AB2, AB6, AB30, AC3,
AC6, AD31, AE5, AF2, AF5, AF31,
AG30, AG31, AH4, AJ3, AJ19, AJ22,
AK7, AK13, AK14, AK16, AK18, AK20,
AK25, AK28, AL3, AL5, AL10, AL12,
AL22, AL27, AM1, AM6, AM7, AN12,
AN17, AN34, AP1, AP8, AP34
—
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
65
Package and Pin Listings
Table 55. MPC8347EA (TBGA) Pinout Listing (continued)
Power
Supply
Signal
Package Pin Number
Pin Type
Notes
GVDD
A2, E2, G5, G6, J5, K4, K5, L4, N4, P5, PowerforDDR
GVDD
—
R6, T6, U5, V1, W5, Y5, AA4, AB3,
AC4, AD5, AF3, AG5, AH2, AH5, AH6,
AJ6, AK6, AK8, AK9, AL6
DRAM I/O
voltage
(2.5 V)
LVDD1
C9, D11
Power for
three-speed
Ethernet #1
and for
LVDD
1
—
Ethernet
management
interface I/O
(2.5 V, 3.3 V)
LVDD
2
C6, D9
Power for
three-speed
Ethernet #2
I/O (2.5 V,
3.3 V)
LVDD
2
—
—
VDD
E19, E29, F7, F9, F11,F13, F15, F17, Power for core
VDD
F18, F21, F23, F25, F29, H29, J6,
K29, M29, N6, P29, T29, U30, V6,
V29, W29, AB29, AC5, AD29, AF6,
AF29, AH29, AJ8, AJ12, AJ14, AJ16,
AJ18, AJ20, AJ21, AJ23, AJ25, AJ26,
AJ27, AJ28, AJ29, AK10
(1.2 V
nominal, 1.3 V
for 667 MHz)
OVDD
B22, B28, C16, C17, C24, C26, D13,
PCI, 10/100
OVDD
—
D15, D19, D29, E31, F28, G33, H30, Ethernet, and
L29, L32, N32, P31, R31, U32, W31, other standard
Y29, AA29, AC30, AE31, AF30, AG29,
AJ17, AJ30, AK11, AL15, AL19, AL21,
AL29, AL30, AM20, AM23, AM24,
AM26, AM28, AN11, AN13
(3.3 V)
MVREF1
MVREF2
M3
I
I
DDR
reference
voltage
—
—
AD2
DDR
reference
voltage
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
66
Package and Pin Listings
Table 55. MPC8347EA (TBGA) Pinout Listing (continued)
Power
Notes
Signal
Package Pin Number
No Connection
Pin Type
Supply
NC
W32, AA31, AA32, AA33, AA34,
AB31, AB32, AB33, AB34, AC29,
AC31, AC33, AC34, AD30, AD32,
AD33, AD34, AE29, AE30, AH32,
AH33, AH34, AM33, AJ31, AJ32,
AJ33, AJ34, AK32, AK33, AK34,
AM34, AL33, AL34, AK31, AH30,
AC32, AE32, AH31, AL32, AG34,
AE33, AF32, AE34, AF34, AF33,
AG33, AG32, AL11, AM11, AP10, Y32,
Y34, Y31, Y33
—
—
—
Notes:
1. This pin is an open-drain signal. A weak pull-up resistor (1 kΩ) should be placed on this pin to OVDD
.
2. This pin is an open-drain signal. A weak pull-up resistor (2–10 kΩ) should be placed on this pin to OVDD
.
3. During reset, this output is actively driven rather than three-stated.
4. These JTAG pins have weak internal pull-up P-FETs that are always enabled.
5. This pin should have a weak pull-up if the chip is in PCI host mode. Follow the PCI specifications.
6. This pin must always be tied to GND.
7. This pin must always be pulled up to OVDD
.
8. This pin must always be left not connected.
9. Thermal sensitive resistor.
10.It is recommended that MDIC0 be tied to GRD using an 18 Ω resistor and MDIC1 be tied to DDR power using an 18 Ω
resistor.
11.TSEC1_TXD[3] is required an external pull-up resistor. For proper functionality of the device, this pin must be pulled up or
actively driven high during a hard reset. No external pull-down resistors are allowed to be attached to this net.
12. A weak pull-up resistor (2–10 kΩ) should be placed on this pin to LVDD1
.
13. For systems that boot from local bus (GPCM)-controlled NOR flash, a pullup on LGPL4 is required.
Table 56 provides the pinout listing for the MPC8347EA, 620 PBGA package.
Table 56. MPC8347EA (PBGA) Pinout Listing
Power
Supply
Signal
Package Pin Number
Pin Type
Notes
PCI
D20
B21
PCI1_INTA/IRQ_OUT
O
O
OVDD
OVDD
OVDD
2
PCI1_RESET_OUT
PCI1_AD[31:0]
—
—
E19, D17, A16, A18, B17, B16, D16,
B18, E17, E16, A15, C16, D15, D14,
C14, A12, D12, B11, C11, E12, A10,
C10, A9, E11, E10, B9, B8, D9, A8,
C9, D8, C8
I/O
PCI1_C/BE[3:0]
PCI1_PAR
A17, A14, A11, B10
I/O
I/O
I/O
OVDD
OVDD
OVDD
—
—
5
D13
B14
PCI1_FRAME
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
67
Package and Pin Listings
Table 56. MPC8347EA (PBGA) Pinout Listing (continued)
Power
Supply
Signal
Package Pin Number
Pin Type
Notes
PCI1_TRDY
A13
I/O
I/O
I/O
I/O
I
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
5
5
PCI1_IRDY
E13
PCI1_STOP
C13
5
PCI1_DEVSEL
PCI1_IDSEL
B13
5
C17
—
5
PCI1_SERR
C12
I/O
I/O
I/O
I
PCI1_PERR
B12
5
PCI1_REQ[0]
A21
PCI1_REQ[1]/CPCI1_HS_ES
PCI1_REQ[2:4]
PCI1_GNT0
C19
—
—
—
—
—
—
—
C18, A19, E20
I
B20
I/O
O
PCI1_GNT1/CPCI1_HS_LED
PCI1_GNT2/CPCI1_HS_ENUM
PCI1_GNT[3:4]
M66EN
C20
B19
O
A20, E18
L26
O
I
DDR SDRAM Memory Interface
MDQ[0:63]
AC25, AD27, AD25, AH27, AE28,
AD26, AD24, AF27, AF25, AF28,
AH24, AG26, AE25, AG25, AH26,
AH25, AG22, AH22, AE21, AD19,
AE22, AF23, AE19, AG20, AG19,
AD17, AE16, AF16, AF18, AG18,
AH17, AH16, AG9, AD12, AG7, AE8,
AD11, AH9, AH8, AF6, AF8, AE6,
AF1, AE4, AG8, AH3, AG3, AG4, AH2,
AD7, AB4, AB3, AG1, AD5, AC2, AC1,
AC4, AA3, Y4, AA4, AB1, AB2, Y5, Y3
I/O
GVDD
—
MECC[0:4]/MSRCID[0:4]
MECC[5]/MDVAL
MECC[6:7]
AG13, AE14, AH12, AH10, AE15
I/O
I/O
I/O
O
GVDD
GVDD
GVDD
GVDD
—
—
—
—
AH14
AE13, AH11
MDM[0:8]
AG28, AG24, AF20, AG17, AE9, AH5,
AD1, AA2, AG12
MDQS[0:8]
AE27, AE26, AE20, AH18, AG10, AF5,
AC3, AA1, AH13
I/O
GVDD
—
MBA[0:1]
MA[0:14]
AF10, AF11
O
O
GVDD
GVDD
—
—
AF13, AF15, AG16, AD16, AF17,
AH20, AH19, AH21, AD18, AG21,
AD13, AF21, AF22, AE1, AA5
MWE
AD10
O
GVDD
—
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
68
Package and Pin Listings
Table 56. MPC8347EA (PBGA) Pinout Listing (continued)
Power
Notes
Signal
Package Pin Number
Pin Type
Supply
MRAS
AF7
O
O
GVDD
GVDD
GVDD
GVDD
GVDD
GVDD
GVDD
GVDD
—
—
—
—
3
MCAS
AG6
AE7, AH7, AH4, AF2
AG23, AH23
MCS[0:3]
MCKE[0:1]
MCK[0:5]
MCK[0:5]
MODT[0:3]
MBA[2]
O
O
AH15, AE24, AE2, AF14, AE23, AD3
AG15, AD23, AE3, AG14, AF24, AD2
AG5, AD4, AH6, AF4
AD22
O
—
—
—
—
9
O
O
O
MDIC0
AG11
I/O
I/O
MDIC1
AF12
—
9
Local Bus Controller Interface
LAD[0:31]
T4, T5, T1, R2, R3, T2, R1, R4, P1, P2,
P3, P4, N1, N4, N2, N3, M1, M2, M3,
N5, M4, L1, L2, L3, K1, M5, K2, K3, J1,
J2, L5, J3
I/O
OVDD
—
LDP[0]/CKSTOP_OUT
LDP[1]/CKSTOP_IN
LDP[2]/LCS[4]
H1
I/O
I/O
I/O
I/O
O
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
—
—
—
—
—
—
—
—
—
—
—
—
—
12
—
—
—
—
—
K5
H2
LDP[3]/LCS[5]
G1
LA[27:31]
J4, H3, G2, F1, G3
LCS[0:3]
J5, H4, F2, E1
O
LWE[0:3]/LSDDQM[0:3]/LBS[0:3]
LBCTL
F3, G4, D1, E2
O
H5
E3
O
LALE
O
LGPL0/LSDA10/cfg_reset_source0
LGPL1/LSDWE/cfg_reset_source1
LGPL2/LSDRAS/LOE
LGPL3/LSDCAS/cfg_reset_source2
LGPL4/LGTA/LUPWAIT/LPBSE
LGPL5/cfg_clkin_div
LCKE
F4
I/O
I/O
O
D2
C1
C2
I/O
I/O
I/O
O
C3
B3
E4
LCLK[0:2]
D4, A3, C4
U3
O
LSYNC_OUT
O
LSYNC_IN
Y2
I
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
69
Package and Pin Listings
Table 56. MPC8347EA (PBGA) Pinout Listing (continued)
Power
Supply
Signal
Package Pin Number
Pin Type
Notes
General Purpose I/O Timers
GPIO1[0]/DMA_DREQ0/GTM1_TIN1/
GTM2_TIN2
D27
I/O
I/O
OVDD
OVDD
—
—
GPIO1[1]/DMA_DACK0/GTM1_TGATE1/
GTM2_TGATE2
E26
GPIO1[2]/DMA_DDONE0/GTM1_TOUT1
D28
G25
I/O
I/O
OVDD
OVDD
—
—
GPIO1[3]/DMA_DREQ1/GTM1_TIN2/
GTM2_TIN1
GPIO1[4]/DMA_DACK1/GTM1_TGATE2/
GTM2_TGATE1
J24
F26
E27
E28
I/O
I/O
I/O
I/O
OVDD
OVDD
OVDD
OVDD
—
—
—
—
GPIO1[5]/DMA_DDONE1/GTM1_TOUT2/
GTM2_TOUT1
GPIO1[6]/DMA_DREQ2/GTM1_TIN3/
GTM2_TIN4
GPIO1[7]/DMA_DACK2/GTM1_TGATE3/
GTM2_TGATE4
GPIO1[8]/DMA_DDONE2/GTM1_TOUT3
H25
F27
I/O
I/O
OVDD
OVDD
—
—
GPIO1[9]/DMA_DREQ3/GTM1_TIN4/
GTM2_TIN3
GPIO1[10]/DMA_DACK3/
GTM1_TGATE4/GTM2_TGATE3
K24
G26
I/O
I/O
OVDD
OVDD
—
—
GPIO1[11]/DMA_DDONE3/
GTM1_TOUT4/GTM2_TOUT3
USB Port 1
C28
MPH1_D0_ENABLEN/DR_D0_ENABLEN
MPH1_D1_SER_TXD/DR_D1_SER_TXD
MPH1_D2_VMO_SE0/DR_D2_VMO_SE0
MPH1_D3_SPEED/DR_D3_SPEED
MPH1_D4_DP/DR_D4_DP
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
—
—
—
—
—
—
—
—
—
—
F25
B28
C27
D26
MPH1_D5_DM/DR_D5_DM
E25
MPH1_D6_SER_RCV/DR_D6_SER_RCV
MPH1_D7_DRVVBUS/DR_D7_DRVVBUS
MPH1_NXT/DR_SESS_VLD_NXT
C26
D25
B26
MPH1_DIR_DPPULLUP/
E24
I/O
DR_XCVR_SEL_DPPULLUP
MPH1_STP_SUSPEND/
DR_STP_SUSPEND
A27
C25
O
I
OVDD
OVDD
—
—
MPH1_PWRFAULT/
DR_RX_ERROR_PWRFAULT
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
70
Package and Pin Listings
Table 56. MPC8347EA (PBGA) Pinout Listing (continued)
Power
Notes
Signal
Package Pin Number
Pin Type
Supply
MPH1_PCTL0/DR_TX_VALID_PCTL0
MPH1_PCTL1/DR_TX_VALIDH_PCTL1
MPH1_CLK/DR_CLK
A26
O
O
I
OVDD
OVDD
OVDD
—
—
—
B25
A25
USB Port 0
MPH0_D0_ENABLEN/DR_D8_CHGVBUS
MPH0_D1_SER_TXD/DR_D9_DCHGVBUS
MPH0_D2_VMO_SE0/DR_D10_DPPD
MPH0_D3_SPEED/DR_D11_DMMD
MPH0_D4_DP/DR_D12_VBUS_VLD
MPH0_D5_DM/DR_D13_SESS_END
MPH0_D6_SER_RCV/DR_D14
D24
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
C24
B24
A24
D23
C23
B23
MPH0_D7_DRVVBUS/DR_D15_IDPULLUP
MPH0_NXT/DR_RX_ACTIVE_ID
A23
D22
MPH0_DIR_DPPULLUP/DR_RESET
MPH0_STP_SUSPEND/DR_TX_READY
MPH0_PWRFAULT/DR_RX_VALIDH
MPH0_PCTL0/DR_LINE_STATE0
MPH0_PCTL1/DR_LINE_STATE1
MPH0_CLK/DR_RX_VALID
C22
I/O
I/O
I
B22
A22
E21
I/O
I/O
I
D21
C21
Programmable Interrupt Controller
MCP_OUT
E8
O
OVDD
OVDD
OVDD
OVDD
OVDD
2
IRQ0/MCP_IN/GPIO2[12]
IRQ[1:5]/GPIO2[13:17]
IRQ[6]/GPIO2[18]/CKSTOP_OUT
IRQ[7]/GPIO2[19]/CKSTOP_IN
J28
I/O
I/O
I/O
I/O
—
—
—
—
K25, J25, H26, L24, G27
G28
J26
Ethernet Management Interface
EC_MDC
EC_MDIO
Y24
O
LVDD1
LVDD1
—
Y25
Gigabit Reference Clock
Y26
I/O
11
EC_GTX_CLK125
I
LVDD1
—
Three-Speed Ethernet Controller (Gigabit Ethernet 1)
TSEC1_COL/GPIO2[20]
TSEC1_CRS/GPIO2[21]
TSEC1_GTX_CLK
M26
U25
V24
I/O
I/O
O
OVDD
LVDD1
LVDD1
—
—
3
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
71
Package and Pin Listings
Table 56. MPC8347EA (PBGA) Pinout Listing (continued)
Power
Supply
Signal
Package Pin Number
Pin Type
Notes
TSEC1_RX_CLK
U26
I
I
LVDD1
LVDD1
OVDD
OVDD
LVDD1
OVDD
OVDD
LVDD1
LVDD1
OVDD
—
—
—
—
—
—
—
10
—
—
TSEC1_RX_DV
U24
TSEC1_RX_ER/GPIO2[26]
TSEC1_RXD[7:4]/GPIO2[22:25]
TSEC1_RXD[3:0]
L28
I/O
I/O
I
M27, M28, N26, N27
W26, W24, Y28, Y27
TSEC1_TX_CLK
N25
I
TSEC1_TXD[7:4]/GPIO2[27:30]
TSEC1_TXD[3:0]
N28, P25, P26, P27
I/O
O
O
I/O
V28, V27, V26, W28
TSEC1_TX_EN
W27
TSEC1_TX_ER/GPIO2[31]
N24
Three-Speed Ethernet Controller (Gigabit Ethernet 2)
TSEC2_COL/GPIO1[21]
TSEC2_CRS/GPIO1[22]
TSEC2_GTX_CLK
P28
I/O
I/O
O
OVDD
LVDD2
LVDD2
LVDD2
LVDD2
OVDD
LVDD2
OVDD
OVDD
OVDD
OVDD
OVDD
LVDD2
OVDD
LVDD2
OVDD
—
—
—
—
—
—
—
—
—
—
—
—
—
—
3
AC28
AC27
TSEC2_RX_CLK
AB25
I
TSEC2_RX_DV/GPIO1[23]
TSEC2_RXD[7:4]/GPIO1[26:29]
TSEC2_RXD[3:0]/GPIO1[13:16]
TSEC2_RX_ER/GPIO1[25]
TSEC2_TXD[7]/GPIO1[31]
AC26
R28, T24, T25, T26
AA25, AA26, AA27, AA28
R25
I/O
I/O
I/O
I/O
I/O
O
T27
TSEC2_TXD[6]/DR_XCVR_TERM_SEL
TSEC2_TXD[5]/DR_UTMI_OPMODE1
TSEC2_TXD[4]/DR_UTMI_OPMODE0
TSEC2_TXD[3:0]/GPIO1[17:20]
TSEC2_TX_ER/GPIO1[24]
T28
U28
O
U27
O
AB26, AB27, AA24, AB28
I/O
I/O
I/O
I/O
R27
AD28
R26
TSEC2_TX_EN/GPIO1[12]
TSEC2_TX_CLK/GPIO1[30]
—
DUART
B4, A4
D5, C5
B5
UART_SOUT[1:2]/MSRCID[0:1]/LSRCID[0:1]
UART_SIN[1:2]/MSRCID[2:3]/LSRCID[2:3]
UART_CTS[1]/MSRCID4/LSRCID4
UART_CTS[2]/MDVAL/LDVAL
O
OVDD
OVDD
OVDD
OVDD
OVDD
—
—
—
—
—
I/O
I/O
I/O
O
A5
UART_RTS[1:2]
D6, C6
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
72
Package and Pin Listings
Table 56. MPC8347EA (PBGA) Pinout Listing (continued)
Power
Notes
Signal
Package Pin Number
Pin Type
Supply
I2C interface
IIC1_SDA
IIC1_SCL
IIC2_SDA
IIC2_SCL
E5
I/O
I/O
I/O
I/O
OVDD
OVDD
OVDD
OVDD
2
2
2
2
A6
B6
E7
SPI
SPIMOSI/LCS[6]
SPIMISO/LCS[7]
SPICLK
D7
I/O
I/O
I/O
I
OVDD
OVDD
OVDD
OVDD
—
—
—
—
C7
B7
SPISEL
A7
Clocks
PCI_CLK_OUT[0:2]
PCI_CLK_OUT[3]/LCS[6]
PCI_CLK_OUT[4]/LCS[7]
PCI_SYNC_IN/PCI_CLOCK
PCI_SYNC_OUT
Y1, W3, W2
O
O
O
I
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
OVDD
—
—
—
—
3
W1
V3
U4
U5
O
I
RTC/PIT_CLOCK
E9
—
—
CLKIN
W5
I
JTAG
TCK
TDI
H27
I
I
OVDD
OVDD
OVDD
OVDD
OVDD
—
4
H28
TDO
TMS
TRST
M24
O
I
3
J27
4
K26
I
4
Test
TEST
F28
I
I
OVDD
OVDD
6
6
TEST_SEL
T3
PMC
QUIESCE
K27
O
OVDD
—
System Control
PORESET
HRESET
SRESET
K28
M25
L27
I
OVDD
OVDD
OVDD
—
1
I/O
I/O
2
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
73
Package and Pin Listings
Table 56. MPC8347EA (PBGA) Pinout Listing (continued)
Power
Supply
Signal
Package Pin Number
Pin Type
Notes
Thermal Management
THERM0
B15
Power and Ground Signals
C15
I
—
8
AVDD
1
Powerfore300
PLL (1.2 V)
AVDD1
—
nominal, 1.3 V
for 667 MHz)
AVDD2
U1
Power for
system PLL
(1.2 V)
AVDD
2
—
nominal, 1.3 V
for 667 MHz)
AVDD
3
AF9
U2
PowerforDDR
DLL (1.2 V
nominal, 1.3 V
for 667 MHz)
—
—
—
AVDD4
GND
PowerforLBIU
DLL (1.2 V
nominal, 1.3 V
for 667 MHz)
AVDD4
A2, B1, B2, D10, D18, E6, E14, E22,
F9, F12, F15, F18, F21, F24, G5, H6,
J23, L4, L6, L12, L13, L14, L15, L16,
L17, M11, M12, M13, M14, M15, M16,
M17, M18, M23, N11, N12, N13, N14,
N15, N16, N17, N18, P6, P11, P12,
P13, P14, P15, P16, P17, P18, P24,
R5, R11, R12, R13, R14, R15, R16,
R17, R18, R23, T11, T12, T13, T14,
T15, T16, T17, T18, U6, U11, U12,
U13, U14, U15, U16, U17, U18, V12,
V13, V14, V15, V16, V17, V23, V25,
W4, Y6, AA23, AB24, AC5, AC8,
—
—
AC11, AC14, AC17, AC20, AD9,
AD15, AD21, AE12, AE18, AF3, AF26
GVDD
U9, V9, W10, W19, Y11, Y12, Y14, PowerforDDR
GVDD
—
Y15, Y17, Y18, AA6, AB5, AC9, AC12,
AC15, AC18, AC21, AC24, AD6, AD8,
AD14, AD20, AE5, AE11, AE17, AG2,
AG27
DRAM I/O
voltage
(2.5 V)
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
74
Package and Pin Listings
Table 56. MPC8347EA (PBGA) Pinout Listing (continued)
Power
Notes
Signal
Package Pin Number
Pin Type
Supply
LVDD
1
U20, W25
Power for
three-speed
Ethernet #1
and for
LVDD
1
—
Ethernet
management
interface I/O
(2.5 V, 3.3 V)
LVDD
2
V20, Y23
Power for
three-speed
Ethernet #2
I/O (2.5 V,
3.3 V)
LVDD2
—
—
VDD
J11, J12, J15, K10, K11, K12, K13, Power for core
VDD
K14, K15, K16, K17, K18, K19, L10,
L11, L18, L19, M10, M19, N10, N19,
P9, P10, P19, R10, R19, R20, T10,
T19, U10, U19, V10, V11, V18, V19,
W11, W12, W13, W14, W15, W16,
W17, W18
(1.2 V)
OVDD
B27, D3, D11, D19, E15, E23, F5, F8,
PCI, 10/100
OVDD
—
F11, F14, F17, F20, G24, H23, H24, Ethernet, and
J6, J14, J17, J18, K4, L9, L20, L23, other standard
L25, M6, M9, M20, P5, P20, P23, R6,
R9, R24, U23, V4, V6
(3.3 V)
MVREF1
MVREF2
AF19
AE10
I
DDR
reference
voltage
—
—
I
DDR
reference
voltage
No Connection
NC
V1, V2, V5
—
—
—
Notes:
1. This pin is an open-drain signal. A weak pull-up resistor (1 kΩ) should be placed on this pin to OVDD
.
2. This pin is an open-drain signal. A weak pull-up resistor (2–10 kΩ) should be placed on this pin to OVDD
.
3. During reset, this output is actively driven rather than three-stated.
4. These JTAG pins have weak internal pull-up P-FETs that are always enabled.
5. This pin should have a weak pull-up if the chip is in PCI host mode. Follow the PCI specifications.
6. This pin must always be tied to GND.
7. This pin must always be left not connected.
8. Thermal sensitive resistor.
9. It is recommended that MDIC0 be tied to GRD using an 18 Ω resistor and MDIC1 be tied to DDR power using an 18 Ω resistor.
10.TSEC1_TXD[3] is required an external pull-up resistor. For proper functionality of the device, this pin must be pulled up or
actively driven high during a hard reset. No external pull-down resistors are allowed to be attached to this net.
11. A weak pull-up resistor (2–10 kΩ) should be placed on this pin to LVDD1
.
12. For systems that boot from local bus (GPCM)-controlled NOR flash, a pullup on LGPL4 is required.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
75
Clocking
19 Clocking
Figure 42 shows the internal distribution of the clocks.
e300 Core
Core PLL
core_clk
csb_clk
To DDR
Memory
6
6
DDR
Controller
DDR
Memory
Device
MCK[0:5]
MCK[0:5]
Clock
Div
/2
ddr_clk
Clock
Unit
System PLL
lbiu_clk
/n
LCLK[0:2]
To Local Bus
Memory
Local Bus
Memory
Device
LBIU
DLL
LSYNC_OUT
LSYNC_IN
Controller
csb_clk to Rest
of the Device
PCI_CLK/
PCI_SYNC_IN
CFG_CLKIN_DIV
CLKIN
PCI_SYNC_OUT
PCI Clock
Divider
5
PCI_CLK_OUT[0:4]
Figure 42. MPC8347EA Clock Subsystem
The primary clock source can be one of two inputs, CLKIN or PCI_CLK, depending on whether the device
is configured in PCI host or PCI agent mode. When the MPC8347EA is configured as a PCI host device,
CLKIN is its primary input clock. CLKIN feeds the PCI clock divider (÷2) and the multiplexors for
PCI_SYNC_OUT and PCI_CLK_OUT. The CFG_CLKIN_DIV configuration input selects whether
CLKIN or CLKIN/2 is driven out on the PCI_SYNC_OUT signal. The OCCR[PCICDn] parameters select
whether CLKIN or CLKIN/2 is driven out on the PCI_CLK_OUTn signals.
PCI_SYNC_OUT is connected externally to PCI_SYNC_IN to allow the internal clock subsystem to
synchronize to the system PCI clocks. PCI_SYNC_OUT must be connected properly to PCI_SYNC_IN,
with equal delay to all PCI agent devices in the system, to allow the MPC8347EA to function. When the
device is configured as a PCI agent device, PCI_CLK is the primary input clock and the CLKIN signal
should be tied to GND.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
76
Freescale Semiconductor
Clocking
As shown in Figure 42, the primary clock input (frequency) is multiplied up by the system phase-locked
loop (PLL) and the clock unit to create the coherent system bus clock (csb_clk), the internal clock for the
DDR controller (ddr_clk), and the internal clock for the local bus interface unit (lbiu_clk).
The csb_clk frequency is derived from a complex set of factors that can be simplified into the following
equation:
csb_clk = {PCI_SYNC_IN × (1 + CFG_CLKIN_DIV)} × SPMF
In PCI host mode, PCI_SYNC_IN × (1 + CFG_CLKIN_DIV) is the CLKIN frequency.
The csb_clk serves as the clock input to the e300 core. A second PLL inside the e300 core multiplies the
csb_clk frequency to create the internal clock for the e300 core (core_clk). The system and core PLL
multipliers are selected by the SPMF and COREPLL fields in the reset configuration word low (RCWL),
which is loaded at power-on reset or by one of the hard-coded reset options. See the chapter on reset,
clocking, and initialization in the MPC8349EA Reference Manual for more information on the clock
subsystem.
The internal ddr_clk frequency is determined by the following equation:
ddr_clk = csb_clk × (1 + RCWL[DDRCM])
ddr_clk is not the external memory bus frequency; ddr_clk passes through the DDR clock divider (÷2) to
create the differential DDR memory bus clock outputs (MCK and MCK). However, the data rate is the
same frequency as ddr_clk.
The internal lbiu_clk frequency is determined by the following equation:
lbiu_clk = csb_clk × (1 + RCWL[LBIUCM])
lbiu_clk is not the external local bus frequency; lbiu_clk passes through the LBIU clock divider to create
the external local bus clock outputs (LSYNC_OUT and LCLK[0:2]). The LBIU clock divider ratio is
controlled by LCCR[CLKDIV].
In addition, some of the internal units may have to be shut off or operate at lower frequency than the
csb_clk frequency. Those units have a default clock ratio that can be configured by a memory-mapped
register after the device exits reset. Table 57 specifies which units have a configurable clock frequency.
Table 57. Configurable Clock Units
Unit
Default Frequency
Options
TSEC1
csb_clk/3
csb_clk/3
csb_clk/3
csb_clk/3
csb_clk
Off, csb_clk, csb_clk/2, csb_clk/3
Off, csb_clk, csb_clk/2, csb_clk/3
Off, csb_clk, csb_clk/2, csb_clk/3
Off, csb_clk, csb_clk/2, csb_clk/3
Off, csb_clk
TSEC2, I2C1
Security core
USB DR, USB MPH
PCI and DMA complex
Table 58 provides the operating frequencies for the MPC8347EA TBGA under recommended operating
conditions (see Table 2). All frequency combinations shown in the table below may not be available.
Maximum operating frequencies depend on the part ordered, see Section 22.1, “Part Numbers Fully
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
77
Clocking
Addressed by This Document,” for part ordering details and contact your Freescale Sales Representative
or authorized distributor for more information.
Table 58. Operating Frequencies for TBGA
Characteristic1
e300 core frequency (core_clk)
400 MHz
266–400
533 MHz
266–533
667 MHz
266–667
Unit
MHz
Coherent system bus frequency (csb_clk)
DDR1 memory bus frequency (MCK)2
DDR2 memory bus frequency (MCK)3
Local bus frequency (LCLKn)4
100–266
100–133
100–133
16.67–133
25–66
100–333
100–133
100–200
16.67–133
25–66
100–333
100–166.67
100–200
16.67–133
25–66
MHz
MHz
MHz
MHz
MHz
MHz
MHz
PCI input frequency (CLKIN or PCI_CLK)
Security core maximum internal operating frequency
133
133
166
USB_DR, USB_MPH maximum internal operating
frequency
133
133
166
1
The CLKIN frequency, RCWL[SPMF], and RCWL[COREPLL] settings must be chosen so that the resulting csb_clk, MCLK,
LCLK[0:2], and core_clk frequencies do not exceed their respective maximum or minimum operating frequencies. The value
of SCCR[ENCCM], SCCR[USBDRCM], and SCCR[USBMPHCM] must be programmed so that the maximum internal
operating frequency of the Security core and USB modules does not exceed the respective values listed in this table.
The DDR data rate is 2x the DDR memory bus frequency.
The DDR data rate is 2x the DDR memory bus frequency.
The local bus frequency is 1/2, 1/4, or 1/8 of the lbiu_clk frequency (depending on LCCR[CLKDIV]) which is in turn 1x or 2x
the csb_clk frequency (depending on RCWL[LBIUCM]).
2
3
4
Table 59 provides the operating frequencies for the MPC8347EA PBGA under recommended operating
conditions.
Table 59. Operating Frequencies for PBGA
Parameter1
266 MHz
333 MHz
400 MHz
Unit
MHz
e300 core frequency (core_clk)
200–266
200–333
100–266
100–133
100–133
16.67–133
25–66
200–400
Coherent system bus frequency (csb_clk)
DDR1 memory bus frequency (MCK)2
DDR2 memory bus frequency (MCK)3
Local bus frequency (LCLKn)4
MHz
MHz
MHz
MHz
MHz
MHz
MHz
PCI input frequency (CLKIN or PCI_CLK)
Security core maximum internal operating frequency
133
USB_DR, USB_MPH maximum internal operating
frequency
133
1
The CLKIN frequency, RCWL[SPMF], and RCWL[COREPLL] settings must be chosen so that the resulting csb_clk, MCLK,
LCLK[0:2], and core_clk frequencies do not exceed their respective maximum or minimum operating frequencies. The value
of SCCR[ENCCM], SCCR[USBDRCM], and SCCR[USBMPHCM] must be programmed so that the maximum internal
operating frequency of the Security core and USB modules does not exceed the respective values listed in this table.
The DDR data rate is 2× the DDR memory bus frequency.
2
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
78
Freescale Semiconductor
Clocking
3
4
The DDR data rate is 2× the DDR memory bus frequency.
The local bus frequency is ½, ¼, or 1/8 of the lbiu_clk frequency (depending on LCCR[CLKDIV]) which is in turn 1× or 2× the
csb_clk frequency (depending on RCWL[LBIUCM]).
19.1 System PLL Configuration
The system PLL is controlled by the RCWL[SPMF] parameter. Table 60 shows the multiplication factor
encodings for the system PLL.
Table 60. System PLL Multiplication Factors
RCWL[SPMF]
System PLL Multiplication Factor
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
× 16
Reserved
× 2
× 3
× 4
× 5
× 6
× 7
× 8
× 9
× 10
× 11
× 12
× 13
× 14
× 15
As described in Section 19, “Clocking,” the LBIUCM, DDRCM, and SPMF parameters in the reset
configuration word low and the CFG_CLKIN_DIV configuration input signal select the ratio between the
primary clock input (CLKIN or PCI_CLK) and the internal coherent system bus clock (csb_clk). Table 61
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
79
Clocking
and Table 62 show the expected frequency values for the CSB frequency for select csb_clk to
CLKIN/PCI_SYNC_IN ratios.
Table 61. CSB Frequency Options for Host Mode
Input Clock Frequency (MHz)2
CFG_CLKIN_DIV
at Reset1
csb_clk :
SPMF
16.67
25
33.33
66.67
Input Clock Ratio2
csb_clk Frequency (MHz)
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
High
High
High
High
High
High
High
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
0000
0010
0011
0100
0101
0110
0111
1000
2 : 1
3 : 1
4 : 1
5 : 1
6 : 1
7 : 1
8 : 1
9 : 1
10 : 1
11 : 1
12 : 1
13 : 1
14 : 1
15 : 1
16 : 1
2 : 1
3 : 1
4 : 1
5 : 1
6 : 1
7 : 1
8 : 1
133
200
266
333
100
100
125
150
175
200
225
250
275
300
325
133
166
200
233
266
300
333
100
116
133
150
166
183
200
216
233
250
266
133
200
266
333
100
133
166
200
233
1
2
CFG_CLKIN_DIV selects the ratio between CLKIN and PCI_SYNC_OUT.
CLKIN is the input clock in host mode; PCI_CLK is the input clock in agent mode.
DDR2 memory may be used at 133 MHz provided that the memory components are specified for operation at this frequency.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
80
Freescale Semiconductor
Clocking
Table 62. CSB Frequency Options for Agent Mode
Input Clock Frequency (MHz)2
CFG_CLKIN_DIV
at Reset1
csb_clk :
SPMF
16.67
25
33.33
66.67
Input Clock Ratio2
csb_clk Frequency (MHz)
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
High
High
High
High
High
High
High
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
0000
0010
0011
0100
0101
0110
0111
1000
2 : 1
3 : 1
133
200
266
333
100
4 : 1
100
125
150
175
200
225
250
275
300
325
133
166
200
233
266
300
333
5 : 1
6 : 1
100
7 : 1
116
133
150
166
183
200
216
8 : 1
9 : 1
10 : 1
11 : 1
12 : 1
13 : 1
14 : 1
15 : 1
16 : 1
4 : 1
233
250
266
100
150
200
250
300
133
200
266
333
266
6 : 1
100
133
166
200
233
266
8 : 1
10 : 1
12 : 1
14 : 1
16 : 1
1
2
CFG_CLKIN_DIV doubles csb_clk if set high.
CLKIN is the input clock in host mode; PCI_CLK is the input clock in agent mode.
DDR2 memory may be used at 133 MHz provided that the memory components are specified for operation at this frequency.
19.2 Core PLL Configuration
RCWL[COREPLL] selects the ratio between the internal coherent system bus clock (csb_clk) and the e300
core clock (core_clk). Table 63 shows the encodings for RCWL[COREPLL]. COREPLL values that are
not listed in Table 63 should be considered as reserved.
NOTE
Core VCO frequency = core frequency × VCO divider
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
81
Clocking
VCO divider must be set properly so that the core VCO frequency is in the
range of 800–1800 MHz.
Table 63. e300 Core PLL Configuration
RCWL[COREPLL]
core_clk : csb_clk Ratio
VCO Divider1
0–1
2–5
6
nn
0000
n
PLL bypassed
PLL bypassed
(PLL off, csb_clk clocks core directly) (PLL off, csb_clk clocks core directly)
00
01
10
11
00
01
10
11
00
01
10
11
00
01
10
11
00
01
10
11
0001
0001
0001
0001
0001
0001
0001
0001
0010
0010
0010
0010
0010
0010
0010
0010
0011
0011
0011
0011
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1:1
1:1
2
4
8
8
2
4
8
8
2
4
8
8
2
4
8
8
2
4
8
8
1:1
1:1
1.5:1
1.5:1
1.5:1
1.5:1
2:1
2:1
2:1
2:1
2.5:1
2.5:1
2.5:1
2.5:1
3:1
3:1
3:1
3:1
1
Core VCO frequency = core frequency × VCO divider. The VCO divider must be set properly so that the core VCO frequency
is in the range of 800–1800 MHz.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
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Freescale Semiconductor
Clocking
19.3 Suggested PLL Configurations
Table 64 shows suggested PLL configurations for 33 and 66 MHz input clocks.
Table 64. Suggested PLL Configurations
RCWL
400 MHz Device
533 MHz Device
667 MHz Device
Input
Input
Input
Clock
Freq
Ref
CSB
Freq
(MHz)
Core
Freq
(MHz)
CSB
Freq
(MHz)
Core
Freq
(MHz)
CSB
Freq
(MHz)
Core
Freq
(MHz)
No.1
CORE
PLL
Clock
Freq
Clock
Freq
SPMF
(MHz)2
(MHz)2
(MHz)2
33 MHz CLKIN/PCI_CLK Options
922
723
604
624
803
823
903
923
704
724
A03
804
705
606
904
805
A04
1001
0111
0110
0110
1000
1000
1001
1001
0111
0111
1010
1000
0111
0110
1001
1000
1010
0100010
0100011
0000100
0100100
0000011
0100011
0000011
0100011
0000011
0100011
0000011
0000100
0000101
0000110
0000100
0000101
0000100
—
33
33
33
33
33
—
233
200
200
266
266
—
—
—
33
33
33
33
33
33
33
33
33
33
33
—
233
200
200
266
266
300
300
233
233
333
266
—
f300
350
400
400
400
400
450
450
466
466
500
533
33
33
33
33
33
33
33
33
33
33
33
33
33
33
33
33
33
300
233
200
200
266
266
300
300
233
233
333
266
233
200
300
266
333
300
350
400
400
400
400
450
450
466
466
500
533
583
600
600
667
667
350
400
400
400
400
—
—
—
—
—
—
—
—
—
—
—
—
—
—
66 MHz CLKIN/PCI_CLK Options
304
324
403
423
305
503
404
0011
0011
0100
0100
0011
0101
0100
0000100
0100100
0000011
0100011
0000101
0000011
0000100
66
66
66
66
200
200
266
266
—
400
400
400
400
66
66
66
66
66
66
66
200
200
266
266
200
333
266
400
400
400
400
500
500
533
66
66
66
66
66
66
66
200
200
266
266
200
333
266
400
400
400
400
500
500
533
—
—
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
83
Thermal
Table 64. Suggested PLL Configurations (continued)
400 MHz Device 533 MHz Device
RCWL
667 MHz Device
Input
Input
Input
Ref
CSB
Freq
(MHz)
Core
Freq
(MHz)
CSB
Freq
(MHz)
Core
Freq
(MHz)
CSB
Freq
(MHz)
Core
Freq
(MHz)
No.1
CORE
PLL
Clock
Freq
Clock
Freq
Clock
Freq
SPMF
(MHz)2
(MHz)2
(MHz)2
306
405
0011
0100
0101
0000110
0000101
0000100
—
—
—
—
—
—
66
66
66
200
266
333
600
667
667
504
1
The PLL configuration reference number is the hexadecimal representation of RCWL, bits 4–15 associated with the SPMF and
COREPLL settings given in the table.
The input clock is CLKIN for PCI host mode or PCI_CLK for PCI agent mode.
2
20 Thermal
This section describes the thermal specifications of the MPC8347EA.
20.1 Thermal Characteristics
Table 65 provides the package thermal characteristics for the 672 35 × 35 mm TBGA of the MPC8347EA.
Table 65. Package Thermal Characteristics for TBGA
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection on single-layer board (1s)
Junction-to-ambient natural convection on four-layer board (2s2p)
Junction-to-ambient (at 200 ft/min) on single-layer board (1s)
Junction-to-ambient (at 200 ft/min) on four-layer board (2s2p)
Junction-to-ambient (at 2 m/s) on single-layer board (1s)
Junction-to-ambient (at 2 m/s) on four-layer board (2s2p)
Junction-to-board thermal
RθJA
RθJMA
RθJMA
RθJMA
RθJMA
RθJMA
RθJB
14
11
11
8
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
1, 2
1, 3
1, 3
1, 3
1, 3
1, 3
4
9
7
3.8
1.7
Junction-to-case thermal
RθJC
5
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
84
Thermal
Table 65. Package Thermal Characteristics for TBGA (continued)
Characteristic
Symbol
Value
Unit
Notes
Junction-to-package natural convection on top
ψJT
1
°C/W
6
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal, 1 m/s is approximately equal to 200 linear feet per minute (LFM).
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Table 66 provides the package thermal characteristics for the 620 29 × 29 mm PBGA of the MPC8347EA.
Table 66. Package Thermal Characteristics for PBGA
Parameter
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection on single-layer board (1s)
Junction-to-ambient natural convection on four-layer board (2s2p)
Junction-to-ambient (at 200 ft/min) on single-layer board (1s)
Junction-to-ambient (at 200 ft/min) on four-layer board (2s2p)
Junction-to-board thermal
RθJA
RθJMA
RθJMA
RθJMA
RθJB
21
15
17
12
6
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
1, 2
1, 3
1, 3
1, 3
4
Junction-to-case thermal
RθJC
5
5
Junction-to-package natural convection on top
Notes
ψJT
5
6
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
20.2 Thermal Management Information
For the following sections, P = (V × I ) + P where P is the power dissipation of the I/O drivers.
D
DD
DD
I/O
I/O
See Table 5 for I/O power dissipation values.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
85
Thermal
20.2.1 Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
An estimation of the chip junction temperature, T , can be obtained from the equation:
J
T = T + (R
× P )
D
J
A
θJA
where:
T = junction temperature (°C)
J
T = ambient temperature for the package (°C)
A
R
= junction-to-ambient thermal resistance (°C/W)
θJA
P = power dissipation in the package (W)
D
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Generally, the value obtained on a single-layer board is appropriate for
a tightly packed printed-circuit board. The value obtained on the board with the internal planes is usually
appropriate if the board has low power dissipation and the components are well separated. Test cases have
demonstrated that errors of a factor of two (in the quantity T – T ) are possible.
J
A
20.2.2 Estimation of Junction Temperature with Junction-to-Board
Thermal Resistance
The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal
resistance. The thermal performance of any component is strongly dependent on the power dissipation of
surrounding components. In addition, the ambient temperature varies widely within the application. For
many natural convection and especially closed box applications, the board temperature at the perimeter
(edge) of the package is approximately the same as the local air temperature near the device. Specifying
the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
T = T + (R
× P )
D
J
A
θJA
where:
T = junction temperature (°C)
J
T = ambient temperature for the package (°C)
A
R
= junction-to-ambient thermal resistance (°C/W)
θJA
P = power dissipation in the package (W)
D
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
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Freescale Semiconductor
Thermal
20.2.3 Experimental Determination of Junction Temperature
To determine the junction temperature of the device in the application after prototypes are available, use
the thermal characterization parameter (Ψ ) to determine the junction temperature and a measure of the
JT
temperature at the top center of the package case using the following equation:
T = T + (Ψ × P )
J
T
JT
D
where:
T = junction temperature (°C)
J
T = thermocouple temperature on top of package (°C)
T
Ψ
= junction-to-ambient thermal resistance (°C/W)
JT
P = power dissipation in the package (W)
D
The thermal characterization parameter is measured per the JESD51-2 specification using a 40 gauge type
T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
20.2.4 Heat Sinks and Junction-to-Case Thermal Resistance
Some application environments require a heat sink to provide the necessary thermal management of the
device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case
thermal resistance and a case-to-ambient thermal resistance:
R
= R
+ R
θJA
θJC θCA
where:
R
R
R
= junction-to-ambient thermal resistance (°C/W)
= junction-to-case thermal resistance (°C/W)
= case-to-ambient thermal resistance (°C/W)
θJA
θJC
θCA
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
The thermal performance of devices with heat sinks has been simulated with a few commercially available
heat sinks. The heat sink choice is determined by the application environment (temperature, air flow,
adjacent component power dissipation) and the physical space available. Because there is not a standard
application environment, a standard heat sink is not required.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
87
Thermal
Table 67 and Table 68 show heat sink thermal resistance for TBGA and PBGA of the MPC8347EA.
Table 67. Heat Sink and Thermal Resistance of MPC8347EA (TBGA)
35 × 35 mm TBGA
Heat Sink Assuming Thermal Grease
Air Flow
Thermal Resistance
AAVID 30 × 30 × 9.4 mm pin fin
Natural convection
1 m/s
10
6.5
5.6
8.4
4.7
4
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 30 × 30 × 9.4 mm pin fin
2 m/s
AAVID 31 × 35 × 23 mm pin fin
Natural convection
1 m/s
AAVID 31 × 35 × 23 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
2 m/s
Wakefield, 53 × 53 × 25 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 mm, adjacent board, 40 mm side bypass
f
Natural convection
1 m/s
5.7
3.5
2.7
6.7
4.1
2.8
3.1
2 m/s
Natural convection
1 m/s
2 m/s
1 m/s
Table 68. Heat Sink and Thermal Resistance of MPC8347EA (PBGA)
29 × 29 mm PBGA
Heat Sink Assuming Thermal Grease
Air Flow
Thermal Resistance
AAVID 30 × 30 × 9.4 mm pin fin
Natural convection
1 m/s
13.5
9.6
8.8
11.3
8.1
7.5
9.1
7.1
6.5
10.1
7.7
6.6
6.9
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 30 × 30 × 9.4 mm pin fin
2 m/s
AAVID 31 × 35 × 23 mm pin fin
Natural convection
1 m/s
AAVID 31 × 35 × 23 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
2 m/s
Wakefield, 53 × 53 × 25 mm pin fin
Natural convection
1 m/s
Wakefield, 53 × 53 × 25 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
2 m/s
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 mm, adjacent board, 40 mm side bypass
Natural convection
1 m/s
2 m/s
1 m/s
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
88
Thermal
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
Heat sink vendors include the following list:
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
603-224-9988
408-567-8082
Alpha Novatech
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
408-436-8770
800-522-2800
603-635-5102
Internet: www.mei-thermal.com
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Interface material vendors include the following:
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
781-935-4850
800-248-2481
Dow-Corning Corporation
Dow-Corning Electronic Materials
P.O. Box 994
Midland, MI 48686-0997
Internet: www.dowcorning.com
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
89
Thermal
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
888-642-7674
800-347-4572
Internet: www.microsi.com
The Bergquist Company
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
20.3 Heat Sink Attachment
When heat sinks are attached, an interface material is required, preferably thermal grease and a spring clip.
The spring clip should connect to the printed-circuit board, either to the board itself, to hooks soldered to
the board, or to a plastic stiffener. Avoid attachment forces that can lift the edge of the package or peel the
package from the board. Such peeling forces reduce the solder joint lifetime of the package. The
recommended maximum force on the top of the package is 10 lb force (4.5 kg force). Any adhesive
attachment should attach to painted or plastic surfaces, and its performance should be verified under the
application requirements.
20.3.1 Experimental Determination of the Junction Temperature with a
Heat Sink
When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimize the size of the clearance to minimize the change in thermal
performance caused by removing part of the thermal interface to the heat sink. Because of the experimental
difficulties with this technique, many engineers measure the heat sink temperature and then back calculate
the case temperature using a separate measurement of the thermal resistance of the interface. From this
case temperature, the junction temperature is determined from the junction-to-case thermal resistance.
T = T + (R
× P )
D
J
C
θJC
where:
T = junction temperature (°C)
J
T = case temperature of the package (°C)
C
R
= junction-to-case thermal resistance (°C/W)
θJC
P = power dissipation (W)
D
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
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Freescale Semiconductor
System Design Information
21 System Design Information
This section provides electrical and thermal design recommendations for successful application of the
MPC8347EA.
21.1 System Clocking
The MPC8347EA includes two PLLs:
1. The platform PLL generates the platform clock from the externally supplied CLKIN input. The
frequency ratio between the platform and CLKIN is selected using the platform PLL ratio
configuration bits as described in Section 19.1, “System PLL Configuration.”
2. The e300 core PLL generates the core clock as a slave to the platform clock. The frequency ratio
between the e300 core clock and the platform clock is selected using the e300 PLL ratio
configuration bits as described in Section 19.2, “Core PLL Configuration.”
21.2 PLL Power Supply Filtering
Each PLL gets power through independent power supply pins (AV 1, AV 2, respectively). The AV
DD
DD
DD
level should always equal to V , and preferably these voltages are derived directly from V through a
DD
DD
low frequency filter scheme.
There are a number of ways to provide power reliably to the PLLs, but the recommended solution is to
provide four independent filter circuits as illustrated in Figure 43, one to each of the four AV pins.
DD
Independent filters to each PLL reduce the opportunity to cause noise injection from one PLL to the other.
The circuit filters noise in the PLL resonant frequency range from 500 kHz to 10 MHz. It should be built
with surface mount capacitors with minimum effective series inductance (ESL). Consistent with the
recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook of Black Magic
(Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a single large value
capacitor.
To minimize noise coupled from nearby circuits, each circuit should be placed as closely as possible to the
specific AV pin being supplied. It should be possible to route directly from the capacitors to the AV
DD
DD
pin, which is on the periphery of package, without the inductance of vias.
Figure 43 shows the PLL power supply filter circuit.
10 Ω
VDD
AVDD (or L2AVDD)
2.2 µF
2.2 µF
Low ESL Surface Mount Capacitors
GND
Figure 43. PLL Power Supply Filter Circuit
21.3 Decoupling Recommendations
Due to large address and data buses and high operating frequencies, the MPC8347EA can generate
transient power surges and high frequency noise in its power supply, especially while driving large
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
91
System Design Information
capacitive loads. This noise must be prevented from reaching other components in the MPC8347EA
system, and the device itself requires a clean, tightly regulated source of power. Therefore, the system
designer should place at least one decoupling capacitor at each V , OV , GV , and LV pin of the
DD
DD
DD
DD
device. These capacitors should receive their power from separate V , OV , GV , LV , and GND
DD
DD
DD
DD
power planes in the PCB, with short traces to minimize inductance. Capacitors can be placed directly under
the device using a standard escape pattern. Others can surround the part.
These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, distribute several bulk storage capacitors around the PCB, feeding the V , OV , GV ,
DD
DD
DD
and LV planes, to enable quick recharging of the smaller chip capacitors. These bulk capacitors should
DD
have a low ESR (equivalent series resistance) rating to ensure the quick response time. They should also
be connected to the power and ground planes through two vias to minimize inductance. Suggested bulk
capacitors are 100–330 µF (AVX TPS tantalum or Sanyo OSCON).
21.4 Connection Recommendations
To ensure reliable operation, connect unused inputs to an appropriate signal level. Unused active low
inputs should be tied to OV , GV , or LV as required. Unused active high inputs should be
DD
DD
DD
connected to GND. All NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external V , GV , LV , OV , and GND pins of
DD
DD
DD
DD
the MPC8347EA.
21.5 Output Buffer DC Impedance
The MPC8347EA drivers are characterized over process, voltage, and temperature. For all buses, the
2
driver is a push-pull single-ended driver type (open drain for I C).
To measure Z for the single-ended drivers, an external resistor is connected from the chip pad to OV
0
DD
or GND. Then the value of each resistor is varied until the pad voltage is OV /2 (see Figure 44). The
DD
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open) and R is trimmed until the voltage at the pad equals
P
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
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Freescale Semiconductor
System Design Information
OV /2. R then becomes the resistance of the pull-up devices. R and R are designed to be close to each
DD
P
P
N
other in value. Then, Z = (R + R ) ÷ 2.
0
P
N
OVDD
RN
SW2
SW1
Pad
RP
Data
OGND
Figure 44. Driver Impedance Measurement
Two measurements give the value of this resistance and the strength of the driver current source. First, the
output voltage is measured while driving logic 1 without an external differential termination resistor. The
measured voltage is V = R
× I
. Second, the output voltage is measured while driving logic 1
1
source
source
with an external precision differential termination resistor of value R . The measured voltage is
term
V = (1 ÷ (1/R + 1/R )) × I
. Solving for the output impedance gives R
= R
× (V ÷ V – 1).
2
1
2
source
source
term 1 2
The drive current is then I
= V ÷ R
.
source
1
source
Table 69 summarizes the signal impedance targets. The driver impedance are targeted at minimum V
,
DD
nominal OV , 105°C.
DD
Table 69. Impedance Characteristics
Local Bus, Ethernet,
PCI Signals
(Not Including PCI
Output Clocks)
PCI Output Clocks
(Including
PCI_SYNC_OUT)
DUART, Control,
Configuration, Power
Management
Impedance
DDR DRAM Symbol
Unit
R
R
42 Target
42 Target
NA
25 Target
25 Target
NA
42 Target
42 Target
NA
20 Target
20 Target
NA
Z0
Z0
W
W
W
N
P
Differential
ZDIFF
Note: Nominal supply voltages. See Table 1, Tj = 105°C.
21.6 Configuration Pin Multiplexing
The MPC8347EA power-on configuration options can be set through external pull-up or pull-down
resistors of 4.7 kΩ on certain output pins (see the customer-visible configuration pins). These pins are used
as output only pins in normal operation.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
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Ordering Information
However, while HRESET is asserted, these pins are treated as inputs, and the value on these pins is latched
when PORESET deasserts. Then the input receiver is disabled and the I/O circuit takes on its normal
function. Careful board layout with stubless connections to these pull-up/pull-down resistors coupled with
the large value of the pull-up/pull-down resistor should minimize the disruption of signal quality or speed
for the output pins.
21.7 Pull-Up Resistor Requirements
The MPC8347EA requires high resistance pull-up resistors (10 kΩ is recommended) on open-drain pins,
2
including I C pins, and IPIC interrupt pins.
For more information on required pull-up resistors and the connections required for the JTAG interface,
refer to application note AN2931, “PowerQUICC Design Checklist.”
22 Ordering Information
This section presents ordering information for the device discussed in this document, and it shows an
example of how the parts are marked.
NOTE
The information in this document is accurate for revision 3.x silicon and
later (in other words, for orderable part numbers ending in A or B). For
information on revision 1.1 silicon and earlier versions, see the MPC8347E
PowerQUICC II Pro Integrated Host Processor Hardware Specifications
(Document Order No. MPC8347EEC).
22.1 Part Numbers Fully Addressed by This Document
Table 70 shows an analysis of the Freescale part numbering nomenclature for the MPC8347EA. The
individual part numbers correspond to a maximum processor core frequency. Each part number also
contains a revision code that refers to the die mask revision number. For available frequency configuration
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
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Freescale Semiconductor
Ordering Information
parts including extended temperatures, refer to the device product summary page on our website listed on
the back cover of this document or, contact your local Freescale sales office.
Table 70. Part Numbering Nomenclature
MPC
nnnn
Part
e
t
pp
aa
a
r
Product
Encryption
Temperature1
Range
Processor
Platform
Frequency
Revision
Level
Package2
Code Identifier Acceleration
Frequency3
MPC
8347
Blank = Not Blank = 0 to 105°C ZU =TBGA
e300 core
speed
D = 266
F = 3334
B = 3.1
included
C = –40 to 105°C VV = PB free TBGA
E = included
ZQ = PBGA
VR = PB Free PBGA
AD = 266
AG = 400
AJ = 533
AL = 667
Notes:
1. For temperature range = C, processor frequency is limited to 400 (PBGA) with a platform frequency of 266 and up to 533
(TBGA) with a platform frequency of 333
2. See Section 18, “Package and Pin Listings,” for more information on available package types.
3. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. Additionally, parts addressed by Part Number Specifications may support other
maximum core frequencies.
4. ALF marked parts support DDR1 data rate up to 333 MHz (at 333 MHz CSB as the 'F' marking implies) and DDR2 data rate
up to 400 MHz (at 200 MHz CSB). AJF marked parts support DDR1 and DDR2 data rate up to 333 MHz (at a CSB of 333
MHz).
Table 71 shows the SVR settings by device and package type.
Table 71. SVR Settings
Device
Package
SVR (Rev. 3.0)
MPC8347EA
MPC8347A
MPC8347EA
MPC8347A
TBGA
TBGA
PBGA
PBGA
8052_0030
8053_0030
8054_0030
8055_0030
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Document Revision History
22.2 Part Marking
Parts are marked as in the example shown in Figure 45.
MPCnnnnetppaaar
core/platform MHZ
ATWLYYWW
CCCCC
*MMMMM
YWWLAZ
TBGA/
PBGA
Notes:
ATWLYYWW is the traceability code.
CCCCC is the country code.
MMMMM is the mask number.
YWWLAZ is the assembly traceability code.
Figure 45. Freescale Part Marking for TBGA or PBGA Devices
23 Document Revision History
This table provides a revision history of this document.
Table 72. Document Revision History
Rev.
Number
Date
Substantive Change(s)
12
09/2011
• In Section 2.2, “Power Sequencing,” added Section 2.2.1, “Power-Up Sequencing” and Figure 4.
• In Table 25, Table 29 and Table 31, removed the GTX_CLK125.
• In Table 34, updated tMDKHDX Max value from 170ns to 70ns.
11
11/2010
• In Table 56, added overbar to LCS[4] and LCS[5] signals. In Table 55 and Table 56, added note
for pin LGPL4.
• In Section 21.7, “Pull-Up Resistor Requirements, updated the list of open drain type pins.
10
9
05/2010
5/2009
• In Table 25 through Table 30, changed VIL(min) to VIH(max) to (20%–80%).
• Added Table 8, “EC_GTX_CLK125 AC Timing Specifications.”
• In Section 18.3, “Package Parameters for the MPC8347EA PBGA, changed solder ball for TBGA
and PBGA from 95.5 Sn/0.5 Cu/4 Ag to 96.5 Sn/3.5 Ag.
• In Table 58, updated frequency for DDR2, from 100-200 to 100-133 at core frequency = 533MHz.
• In Table 59, added two columns for the DDR1 and DDR2 memory bus frequency.
• In Table 70, footnote 1, changed 667(TBGA) to 533(TBGA). footnote 4, added data rate for DDR1
and DDR2.
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Document Revision History
Table 72. Document Revision History (continued)
Rev.
Number
Date
Substantive Change(s)
8
2/2009
• Added footnote 6 to Table 7.
• In Section 9.2, “USB AC Electrical Specifications,” clarified that AC table is for ULPI only.
• In Table 39, corrected tLBKHOV parameter to tLBKLOV (output data is driven on falling edge of clock
in DLL bypass mode). Similarly, made the same correction to Figure 22, Figure 24, and Figure 25
for output signals.
• Added footnote 10 and 11 to Table 55 and Table 56.
• In Section 21.1, “System Clocking,” removed “(AVDD1)” and “(AVDD2”) from bulleted list.
• In Section 21.2, “PLL Power Supply Filtering,” in the second paragraph, changed “provide five
independent filter circuits,” and “the five AVDD pins” to provide four independent filter circuits,” and
“the four AVDD pins.”
• In Table 58, corrected the max csb_clk to 266 MHz.
• In Table 64, added PLL configurations 903, 923, A03, A23, and 503 for 533 MHz
• Added footnote 4 to Table 70.
• In Table 70, updated note 1 to say the following: “For temperature range = C, processor frequency
is limited to 533 (TBGA) and 400 (PBGA) with a platform frequency of 266.”
7
6
4/2007
3/2007
• In Table 3, “Output Drive Capability,” changed the values in the Output Impedance column and
added USB to the seventh row.
• In Table 4, “Operating Frequencies for TBGA,” added column for 400 MHz.
• In Section 21.7, “Pull-Up Resistor Requirements,“deleted last two paragraphs and after first
paragraph, added a new paragraph.
• Deleted Section 21.8, “JTAG Configuration Signals,” and Figure 43, “JTAG Interface Connection.”
• Page 1, updated first paragraph to reflect PowerQUICC II Pro information.
• In Table 18, “DDR and DDR2 SDRAM Input AC Timing Specifications,” added note 2 to tCISKEW
and deleted original note 3; renumbered the remaining notes.
• In Figure 43, “JTAG Interface Connection,” updated with new figure.
• In Table 57, “Operating Frequencies for TBGA,” in the ‘Coherent system bus frequency (csb_clk)’
row, changed the value in the 533 MHz column to 100-333.
• In Table 63, “Suggested PLL Configurations,” under the subhead, ‘33 MHz CLKIN/PCI_CLK
Options,’ added row A03 between Ref. No. 724 and 804. Under the subhead ‘66 MHz
CLKIN/PCI_CLK Options,’ added row 503 between Ref. No. 305 and 404. For Ref. No. 306,
changed the CORE PLL value to 0000110.
• In Section 23, “Ordering Information,” replaced first paragraph and added a note.
• In Section 23.1, “Part Numbers Fully Addressed by this Document,” replaced first paragraph.
5
1/2007
• In Table 1, “Absolute Maximum Ratings,” added (1.36 max for 667-MHz core frequency).
• In Table 2, “Recommended Operating Conditions,” added a row showing nominal core supply
voltage of 1.3 V for 667-MHz parts.
• In Table 4, “MPC8347EA Power Dissipation,” added two footnotes to 667-MHz row showing
nominal core supply voltage of 1.3 V for 667-MHz parts.
• In Table 54, “MPC8347EA (TBGA) Pinout Listing,” updated VDD row to show nominal core supply
voltage of 1.3 V for 667-MHz parts.
4
3
12/2006
11/2006
Table 19, “DDR and DDR2 SDRAM Output AC Timing Specifications,” modified Tddkhds for 333 MHz
from 900 ps to 775 ps.
• Updated note in introduction.
• In the features list in Section 1, “Overview,” updated DDR data rate to show 266 MHz for PBGA
parts for all silicon revisions, and 400 MHz for DDR2 for TBGA parts for silicon Rev. 2 and 3.
• In Table 5, “MPC8347EA Typical I/O Power Dissipation,” added GVDD 1.8-V values for DDR2;
added table footnote to designate rates that apply only to the TBGA package.
• In Section 23, “Ordering Information,” replicated note from document introduction.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
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Document Revision History
Table 72. Document Revision History (continued)
Substantive Change(s)
Rev.
Date
Number
2
8/2006
• Changed all references to revision 2.0 silicon to revision 3.0 silicon.
• Changed VIH minimum value in Table 39, “JTAG Interface DC Electrical Characteristics,” to
OVDD – 0.3.
• In Table 40, “PCI DC Electrical Characteristics,” changed high-level input voltage values to min
= 2 and max = OVDD + 0.3; changed low-level input voltage values to min = (–0.3) and max = 0.8.
• In Table 44, “PCI DC Electrical Characteristics,” changed high-level input voltage values to min
= 2 and max = OVDD + 0.3; changed low-level input voltage values to min = (–0.3) and max = 0.8.
• Updated DDR2 I/O power values in Table 5, “MPC8347EA Typical I/O Power Dissipation.”
• In Table 63, “Suggested PLL Configurations,” deleted reference-number rows 902 and 703.
1
4/2006
• Removed Table 20, “Timing Parameters for DDR2-400.”
• Changed ADDR/CMD to ADDR/CMD/MODT in Table 9, “DDR and DDR2 SDRAM Output AC
Timing Specifications,” rows 2 and 3, and in Figure 2, “DDR SDRAM Output Timing Diagram.
• Changed Min and Max values for VIH and VIL in Table 40,“PCI DC Electrical Characteristics.”
• In Table 51, “MPC8347EA (TBGA) Pinout Listing,” and Table 52, “MPC8347EA (PBGA) Pinout
Listing,” modified rows for MDICO and MDIC1 signals and added note ‘It is recommended that
MDICO be tied to GRD using an 18 Ω resistor and MCIC1 be tied to DDR power using an 18 Ω
resistor.’
• In Table 51, “MPC8347EA (TBGA) Pinout Listing,” and Table 52, “MPC8347EA (PBGA) Pinout
Listing,” in row AVDD3 changed power supply from “AVDD3” to ‘—.’
0
3/2006
Initial public release
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
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98
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Document Number: MPC8347EAEC
Rev. 12
09/2011
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