BGA2003 [NXP]

Silicon MMIC amplifier; 硅MMIC放大器
BGA2003
型号: BGA2003
厂家: NXP    NXP
描述:

Silicon MMIC amplifier
硅MMIC放大器

放大器
文件: 总12页 (文件大小:104K)
中文:  中文翻译
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DISCRETE SEMICONDUCTORS  
DATA SHEET  
BGA2003  
Silicon MMIC amplifier  
Product specification  
1999 Jul 23  
Supersedes data of 1999 Feb 25  
Philips Semiconductors  
Product specification  
Silicon MMIC amplifier  
BGA2003  
FEATURES  
PINNING  
PIN  
Low current  
DESCRIPTION  
Very high power gain  
1
2
3
4
GND  
RF in  
Low noise figure  
Integrated temperature compensated biasing  
Control pin for adjustment bias current  
Supply and RF output pin combined.  
CTRL (bias current control)  
VS + RF out  
APPLICATIONS  
V +RFout  
S
handbook, halfpage  
CTRL  
3
4
RF front end  
Wideband applications, e.g. analog and digital cellular  
BIAS  
telephones, cordless telephones (PHS, DECT, etc.)  
CIRCUIT  
Low noise amplifiers  
2
1
Satellite television tuners (SATV)  
High frequency oscillators.  
RFin  
GND  
Top view  
MAM427  
DESCRIPTION  
Marking code: A3.  
Silicon MMIC amplifier consisting of an NPN double  
polysilicon transistor with integrated biasing for low voltage  
applications in a plastic, 4-pin SOT343R package.  
Fig.1 Simplified outline (SOT343R) and symbol.  
QUICK REFERENCE DATA  
SYMBOL  
VS  
PARAMETER  
CONDITIONS  
RF input AC coupled  
TYP.  
MAX.  
4.5  
UNIT  
DC supply voltage  
DC supply current  
V
IS  
VVS-OUT = 2.5 V; ICTRL = 1 mA;  
RF input AC coupled  
11  
mA  
dB  
dB  
MSG  
NF  
maximum stable gain  
noise figure  
VVS-OUT = 2.5 V; f = 1800 MHz;  
Tamb = 25 °C  
16  
VVS-OUT = 2.5 V; f = 1800 MHz; ΓS = Γopt  
1.8  
1999 Jul 23  
2
Philips Semiconductors  
Product specification  
Silicon MMIC amplifier  
BGA2003  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
VS  
VCTRL  
IS  
PARAMETER  
supply voltage  
CONDITIONS  
RF input AC coupled  
MIN.  
MAX.  
4.5  
UNIT  
V
V
voltage on control pin  
supply current (DC)  
2
forced by DC voltage on RF input  
or ICTRL  
30  
mA  
ICTRL  
Ptot  
Tstg  
Tj  
control current  
3
mA  
mW  
°C  
total power dissipation  
storage temperature  
operating junction temperature  
Ts 100 °C  
135  
+150  
150  
65  
°C  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
VALUE  
UNIT  
Rth j-s  
thermal resistance from junction to soldering point  
350  
K/W  
CHARACTERISTICS  
RF input AC coupled; Tj = 25 °C; unless otherwise specified.  
SYMBOL  
IS  
PARAMETER  
supply current  
CONDITIONS  
MIN.  
TYP. MAX. UNIT  
VVS-OUT = 2.5 V; ICTRL = 0.4 mA  
3
8
4.5  
11  
24  
6
mA  
mA  
dB  
V
VS-OUT = 2.5 V; ICTRL = 1.0 mA  
VS-OUT = 2.5 V; IVS-OUT = 10 mA;  
f = 900 MHz  
15  
MSG  
maximum stable gain  
insertion power gain  
isolation  
V
V
VS-OUT = 2.5 V; IVS-OUT = 10 mA;  
f = 1800 MHz  
16  
2
2
dB  
2
VVS-OUT = 2.5 V; IVS-OUT = 10 mA;  
f = 900 MHz  
18  
13  
19  
dB  
|s21  
s12  
NF  
|
V
VS-OUT = 2.5 V; IVS-OUT = 10 mA;  
f = 1800 MHz  
14  
dB  
VVS-OUT = 2.5 V; IVS-OUT = 0;  
f = 900 MHz  
26  
dB  
VVS-OUT = 2.5 V; IVS-OUT = 0;  
f = 1800 MHz  
20  
dB  
noise figure  
VVS-OUT = 2.5 V; IVS-OUT = 10 mA;  
f = 900 MHz; ΓS = Γopt  
1.8  
1.8  
6.5  
4.8  
dB  
V
VS-OUT = 2.5 V; IVS-OUT = 10 mA;  
f = 1800 MHz; ΓS = Γopt  
dB  
IP3(in)  
input intercept point; note 1  
VVS-OUT = 2.3 V; IVS-OUT = 3.6 mA;  
f = 900 MHz  
dBm  
dBm  
VVS-OUT = 2.3 V; IVS-OUT = 3.5 mA;  
f = 1800 MHz  
Note  
1. See application note RNR-T45-99-B-0514.  
1999 Jul 23  
3
Philips Semiconductors  
Product specification  
Silicon MMIC amplifier  
BGA2003  
MGS537  
200  
handbook, halfpage  
P
tot  
(mW)  
100 pF  
handbook, halfpage  
R1  
C
V
S
150  
L1  
4
RF out  
R
CTRL  
100  
50  
V
3
CTRL  
BGA2003  
2
1
C
0
0
50  
100  
150  
200  
RF in  
T
(°C)  
MGS536  
s
Fig.2 Typical application circuit.  
Fig.3 Power derating.  
MGS538  
MGS539  
2.5  
30  
handbook, halfpage  
handbook, halfpage  
I
CTRL  
(mA)  
I
VS-OUT  
(mA)  
2
20  
1.5  
1
10  
0.5  
0
0
0
0
0.5  
1
1.5  
2
0.5  
1
1.5  
2
2.5  
I
(mA)  
V
(V)  
CTRL  
CTRL  
ICTRL = (VCTRL 0.83)/296.  
VS-OUT = 2.5 V.  
Fig.4 Control current as a function of the control  
voltage on pin 3; typical values.  
Fig.5 Bias current as a function of the control  
current; typical values.  
1999 Jul 23  
4
Philips Semiconductors  
Product specification  
Silicon MMIC amplifier  
BGA2003  
MGS540  
(6)  
MGS541  
30  
20  
handbook, halfpage  
handbook, halfpage  
I
VS-OUT  
(mA)  
25  
I
VS-OUT  
(mA)  
(5)  
(4)  
(3)  
15  
20  
15  
10  
5
10  
5
(2)  
(1)  
0
0
0
40  
0
40  
80  
120  
(°C)  
1
2
3
4
5
T
V
(V)  
amb  
VS-OUT  
VS-OUT = 2.5 V.  
(1) ICTRL = 0.2 mA.  
(4) ICTRL = 1.5 mA.  
(2)  
ICTRL = 0.4 mA.  
(5)  
ICTRL = 2.0 mA.  
(3) ICTRL = 1.0 mA.  
(6) ICTRL = 2.5 mA.  
ICTRL = 1 mA.  
Fig.6 Bias current (IVS-OUT) as a function of the  
ambient temperature with ICTRL as  
parameter; typical values.  
Fig.7 Bias current (IVS-OUT) as a function of the  
voltage at the output pin (VVS-OUT); typical  
values.  
MGS543  
MGS542  
30  
handbook, halfpage  
gain  
25  
handbook, halfpage  
f
T
(dB)  
(GHz)  
25  
20  
15  
10  
5
MSG  
G
max  
20  
G
UM  
15  
10  
5
0
0
0
5
10  
15  
20  
25  
0
10  
20  
I
30  
(mA)  
I
(mA)  
VS-OUT  
VS-OUT  
VVS-OUT = 2.5 V; f = 1000 MHz.  
VVS-OUT = 2.5 V; f = 900 MHz.  
Fig.8 Transition frequency as a function of the  
bias current (IVS-OUT); typical values.  
Fig.9 Gain as a function of the bias current  
(IVS-OUT); typical values.  
1999 Jul 23  
5
Philips Semiconductors  
Product specification  
Silicon MMIC amplifier  
BGA2003  
MGS545  
MGS544  
40  
25  
handbook, halfpage  
handbook, halfpage  
gain  
(dB)  
gain  
(dB)  
MSG  
20  
30  
20  
10  
0
G
max  
15  
G
UM  
G
UM  
G
max  
10  
5
0
2
3
4
10  
10  
10  
0
5
10  
15  
20  
25  
f (MHz)  
I
(mA)  
VS-OUT  
VVS-OUT = 2.5 V; f = 1800 MHz.  
VVS-OUT = 2.5 V; IVS-OUT = 10 mA.  
Fig.10 Gain as a function of the bias current  
(IVS-OUT); typical values.  
Fig.11 Gain as a function of frequency; typical  
values.  
MGS546  
3
min  
handbook, halfpage  
NF  
(dB)  
2.5  
2
(1)  
(3)  
(2)  
1.5  
(4)  
1
0.5  
0
2
1
10  
10  
I
(mA)  
VS-OUT  
(1) f = 2400 MHz.  
(2) f = 1800 MHz.  
(3) f = 1000 MHz.  
(4) f = 900 MHz.  
Fig.12 Minimum noise figure as a function of the  
bias current (IVS-OUT); typical values.  
1999 Jul 23  
6
Philips Semiconductors  
Product specification  
Silicon MMIC amplifier  
BGA2003  
90°  
+1  
unstable region  
1.0  
0.8  
0.6  
0.4  
0.2  
0
source  
135°  
45°  
+2  
unstable  
region load  
+0.5  
(1)  
(2)  
+0.2  
+5  
(3)  
Γopt  
0.2  
0.5  
1
2
5
180°  
0°  
0
(4)  
5  
0.2  
(5)  
(6)  
f = 900 MHz; VVS-OUT = 2.5 V;  
IVS-OUT = 10 mA; Zo = 50 .  
(1) G = 23 dB.  
(2) G = 22 dB.  
(3) G =21 dB.  
(4) NF = 1.8 dB.  
(5) NF = 2 dB.  
(6) NF = 2.2 dB.  
0.5  
2  
45°  
135°  
1  
1.0  
90°  
MGS547  
Fig.13 Noise, stability and gain circles; typical values.  
90°  
unstable region  
source  
1.0  
unstable  
region load  
+1  
0.8  
0.6  
0.4  
0.2  
0
135°  
45°  
+2  
+0.5  
(4)  
(3)  
(2)  
(1)  
+0.2  
+5  
0.2  
0.5  
1
2
5
180°  
0°  
0
Γopt  
f = 1800 MHz; VVS-OUT = 2.5 V;  
IVS-OUT = 10 mA; Zo = 50 .  
(5)  
5  
0.2  
(6)  
(7)  
(1)  
Gmax = 16.1 dB.  
(2) G = 16 dB.  
(3) G = 15 dB.  
(4) G = 14 dB.  
(5) NF = 1.9 dB.  
(6) NF = 2.1 dB.  
(7) NF = 2.3 dB.  
0.5  
2  
45°  
135°  
1  
1.0  
90°  
MGS548  
Fig.14 Noise, stability and gain circles; typical values.  
1999 Jul 23  
7
Philips Semiconductors  
Product specification  
Silicon MMIC amplifier  
BGA2003  
90°  
+1  
1.0  
0.8  
0.6  
0.4  
0.2  
0
135°  
+0.2  
45°  
+2  
+0.5  
+5  
0.2  
0.5  
1
2
5
180°  
0°  
0
1 GHz  
100 MHz  
2 GHz  
3 GHz  
200 MHz  
500 MHz  
5  
0.2  
0.5  
2  
45°  
135°  
1  
90°  
1.0  
MGS549  
VVS-OUT = 2.5 V; IVS-OUT = 10 mA; Zo = 50 .  
Fig.15 Common emitter input reflection coefficient (s11); typical values.  
90°  
135°  
45°  
500 MHz  
900 MHz  
1 GHz  
200 MHz  
1.8 GHz  
3 GHz  
100 MHz  
20  
16  
12  
8
4
180°  
0°  
135°  
45°  
MGS550  
90°  
VVS-OUT = 2.5 V; IVS-OUT = 10 mA; Zo = 50 .  
Fig.16 Common emitter forward transmission coefficient (s21); typical values.  
8
1999 Jul 23  
Philips Semiconductors  
Product specification  
Silicon MMIC amplifier  
BGA2003  
90°  
135°  
45°  
3 GHz  
0.5  
0.4  
0.3  
0.2  
0.1  
180°  
0°  
100 MHz  
135°  
45°  
MGS551  
90°  
VVS-OUT = 2.5 V; IVS-OUT = 10 mA; Zo = 50 .  
Fig.17 Common emitter reverse transmission coefficient (s12); typical values.  
90°  
1.0  
+1  
0.8  
0.6  
0.4  
0.2  
0
135°  
+0.2  
45°  
+2  
+0.5  
+5  
0.2  
0.5  
1
2
5
180°  
0°  
0
100 MHz  
900 MHz  
200 MHz  
1 GHz  
5  
0.2  
500 MHz  
3 GHz  
1.8 GHz  
0.5  
2  
45°  
135°  
1  
1.0  
90°  
MGS552  
VVS-OUT = 2.5 V; IVS-OUT = 10 mA; Zo = 50 .  
Fig.18 Common emitter output reflection coefficient (s22); typical values.  
9
1999 Jul 23  
Philips Semiconductors  
Product specification  
Silicon MMIC amplifier  
BGA2003  
PACKAGE OUTLINE  
Plastic surface mounted package; reverse pinning; 4 leads  
SOT343R  
D
B
E
A
X
H
v
M
A
y
E
e
3
4
Q
A
A
1
c
2
1
L
p
w
M
B
b
p
b
1
e
1
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
max  
A
UNIT  
b
b
c
D
E
e
e
H
E
L
Q
v
w
y
p
p
1
1
0.4  
0.3  
1.1  
0.8  
0.7  
0.5  
0.25  
0.10  
2.2  
1.8  
1.35  
1.15  
2.2  
2.0  
0.45  
0.15  
0.23  
0.13  
mm  
0.1  
1.15  
0.2  
0.2  
0.1  
1.3  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
SOT343R  
97-05-21  
1999 Jul 23  
10  
Philips Semiconductors  
Product specification  
Silicon MMIC amplifier  
BGA2003  
DEFINITIONS  
Data Sheet Status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1999 Jul 23  
11  
Philips Semiconductors – a worldwide company  
Argentina: see South America  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
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Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210  
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220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773  
Pakistan: see Singapore  
Belgium: see The Netherlands  
Brazil: see South America  
Philippines: Philips Semiconductors Philippines Inc.,  
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Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
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Slovenia: see Italy  
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Tel. +49 40 2353 60, Fax. +49 40 2353 6300  
Spain: Balmes 22, 08007 BARCELONA,  
Tel. +34 93 301 6312, Fax. +34 93 301 4107  
Hungary: see Austria  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745  
India: Philips INDIA Ltd, Band Box Building, 2nd floor,  
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,  
Tel. +91 22 493 8541, Fax. +91 22 493 0966  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2741 Fax. +41 1 488 3263  
Indonesia: PT Philips Development Corporation, Semiconductors Division,  
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,  
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080  
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TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874  
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Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
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Uruguay: see South America  
Vietnam: see Singapore  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Middle East: see Italy  
Tel. +381 11 62 5344, Fax.+381 11 63 5777  
For all other countries apply to: Philips Semiconductors,  
Internet: http://www.semiconductors.philips.com  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1999  
SCA67  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
125006/04/pp12  
Date of release: 1999 Jul 23  
Document order number: 9397 750 06134  

相关型号:

BGA2003,115

BGA2003 - Silicon MMIC amplifier
NXP

BGA2003T/R

RF/Microwave Amplifier, 900 MHz - 1800 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER, PLASTIC, SOT-343R, 4 PIN
NXP

BGA2011

900 MHz high linear low noise amplifier
NXP

BGA2011T/R

RF/Microwave Amplifier, RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER, PLASTIC, SOT363, SC-88, 6 PIN
NXP

BGA2012

1900 MHz high linear low noise amplifier
NXP

BGA2012,115

BGA2012 - 1900 MHz high linear low noise amplifier TSSOP 6-Pin
NXP

BGA2021

RF/Microwave Mixer, 500 MHz - 2500 MHz RF/MICROWAVE DOUBLE BALANCED MIXER
NXP

BGA2022

MMIC mixer
NXP

BGA2022,115

BGA2022 - MMIC mixer TSSOP 6-Pin
NXP

BGA2022T/R

RF/Microwave Mixer, 880 MHz - 2450 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, PLASTIC, SC-88, SOT-363, 6 PIN
NXP

BGA2031

MMIC variable gain amplifier
NXP

BGA2031-1

RF Manual 16th edition
NXP