BGA2716 [NXP]

MMIC wideband amplifier; MMIC宽带放大器器
BGA2716
型号: BGA2716
厂家: NXP    NXP
描述:

MMIC wideband amplifier
MMIC宽带放大器器

放大器
文件: 总14页 (文件大小:83K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BGA2716  
MMIC wideband amplifier  
Rev. 02 — 24 September 2004  
Product data sheet  
1. Product profile  
1.1 General description  
Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal  
matching circuit in a 6-pin SOT363 SMD plastic package.  
CAUTION  
This device is sensitive to electrostatic discharge (ESD). Therefore care should be taken  
during transport and handling.  
MSC895  
1.2 Features  
Internally matched to 50  
Wide frequency range (3.2 GHz at 3 dB bandwidth)  
Flat 23 dB gain (±1 dB up to 2.7 GHz)  
9 dBm output power at 1 dB compression point  
Good linearity for low current (IP3out = 22 dBm)  
Low second harmonic; 38 dBc at PL = 5 dBm  
Unconditionally stable (K 1.2).  
1.3 Applications  
LNB IF amplifiers  
Cable systems  
ISM  
General purpose.  
1.4 Quick reference data  
Table 1:  
Symbol  
VS  
Quick reference data  
Parameter  
Conditions  
Min  
Typ  
5
Max  
Unit  
V
DC supply voltage  
supply current  
-
-
-
-
-
6
-
IS  
15.9  
22.9  
5.3  
mA  
dB  
2
s21  
insertion power gain  
noise figure  
f = 1 GHz  
f = 1 GHz  
f = 1 GHz  
-
NF  
-
dB  
PL(sat)  
saturated load power  
11.6  
-
dBm  
BGA2716  
Philips Semiconductors  
MMIC wideband amplifier  
2. Pinning information  
Table 2:  
Pinning  
Pin  
1
Description  
VS  
Simplified outline  
Symbol  
1
6
5
4
2, 5  
3
GND2  
RF_OUT  
GND1  
6
3
4
4
2, 5  
6
RF_IN  
sym052  
1
2
3
SOT363  
3. Ordering information  
Table 3:  
Ordering information  
Type number Package  
Name  
Description  
Version  
BGA2716  
-
plastic surface mounted package; 6 leads  
SOT363  
4. Marking  
Table 4:  
Marking  
Type number  
Marking code  
BGA2716  
B7-  
5. Limiting values  
Table 5:  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
VS  
DC supply voltage  
RF input AC  
coupled  
-
6
V
IS  
supply current  
-
30  
mA  
mW  
°C  
Ptot  
Tstg  
Tj  
total power dissipation  
storage temperature  
junction temperature  
maximum drive power  
Tsp 90 °C  
-
200  
+150  
150  
10  
65  
-
-
°C  
PD  
dBm  
9397 750 13292  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
2 of 14  
BGA2716  
Philips Semiconductors  
MMIC wideband amplifier  
6. Thermal characteristics  
Table 6:  
Symbol  
Rth(j-sp)  
Thermal characteristics  
Parameter  
thermal resistance from junction Ptot = 200 mW;  
Conditions  
Typ  
Unit  
300  
K/W  
to solder point  
Tsp 90 °C  
7. Characteristics  
Table 7:  
Characteristics  
VS = 5 V; IS = 15.9 mA; Tj = 25 °C; measured on demo board; unless otherwise specified.  
Symbol Parameter  
IS supply current  
s21  
Conditions  
Min  
13  
21  
22  
22  
21  
20  
19  
15  
10  
10  
9
Typ  
15.9  
22.1  
22.9  
23.1  
22.8  
22.1  
20.8  
17  
Max  
21  
23  
24  
25  
24  
24  
22  
-
Unit  
mA  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
GHz  
2
insertion power f = 100 MHz  
gain  
f = 1 GHz  
f = 1.8 GHz  
f = 2.2 GHz  
f = 2.6 GHz  
f = 3 GHz  
2
2
2
s11  
s22  
s12  
input return  
losses  
f = 1 GHz  
f = 2.2 GHz  
f = 1 GHz  
12  
-
output return  
losses  
12  
-
f = 2.2 GHz  
f = 1.6 GHz  
f = 2.2 GHz  
f = 1 GHz  
11  
-
isolation  
30  
33  
-
31  
-
35  
-
NF  
noise figure  
5.3  
5.4  
5.6  
-
f = 2.2 GHz  
at s21 2 3 dB below flat  
gain at 1 GHz  
-
5.5  
B
K
bandwidth  
3
3.2  
stability factor  
f = 1 GHz  
-
1.4  
1.9  
11.6  
7.5  
8.9  
-
-
-
-
-
f = 2.2 GHz  
-
PL(sat)  
saturated load f = 1 GHz  
10  
6
8
dBm  
dBm  
dBm  
power  
f = 2.2 GHz  
PL(1dB)  
load power  
at 1 dB gain compression;  
f = 1 GHz  
at 1 dB gain compression;  
f = 2.2 GHz  
5
6.1  
38  
-
-
dBm  
dBc  
IM2  
second order  
at PL = 5 dBm;  
36  
intermodulation f0 = 1 GHz  
product  
IP3in  
IP3out  
input, third  
order intercept  
point  
f = 1 GHz  
2  
8  
0.7  
6.9  
-
-
dBm  
dBm  
f = 2.2 GHz  
output, third  
order intercept  
point  
f = 1 GHz  
21  
15  
22.2  
15.9  
-
-
dBm  
dBm  
f = 2.2 GHz  
9397 750 13292  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
3 of 14  
BGA2716  
Philips Semiconductors  
MMIC wideband amplifier  
8. Application information  
Figure 1 shows a typical application circuit for the BGA2716 MMIC. The device is  
internally matched to 50 , and therefore does not need any external matching. The value  
of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF  
for applications above 100 MHz. However, when the device is operated below 100 MHz,  
the capacitor value should be increased.  
The nominal value of the RF choke L1 is 100 nH. At the frequencies below 100 MHz this  
value should be increased. At frequencies above 1 GHz, a lower value can be used to  
tune the output return loss. For optimal results, a good quality chip inductor or a  
wire-wound SMD type should be chosen.  
Both the RF choke and the 22 nF supply decoupling capacitor C1 should be located as  
close as possible to the MMIC.  
The printed-circuit board (PCB) top ground plane, connected to pins 2, 4 and 5 must be as  
close as possible to the MMIC, and ideally directly beneath it. When using via holes, use  
multiple via holes, located as close as possible to the MMIC.  
V
S
C1  
C2  
L1  
C3  
V
S
RF_OUT  
RF_IN  
RF input  
RF output  
mgu436  
GND1  
GND2  
Fig 1. Typical application circuit.  
Figure 2 shows the PCB layout, used for the standard demonstration board.  
9397 750 13292  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
4 of 14  
BGA2716  
Philips Semiconductors  
MMIC wideband amplifier  
30 mm  
PHILIPS  
PH  
30 mm  
IN  
OUT  
V+  
PHILIPS  
PH  
DUT  
C1  
C3  
C2  
L1  
IN  
OUT  
V+  
001aab256  
Material = FR4; thickness = 0.6 mm, εr = 4.6.  
Fig 2. PCB layout and demonstration board showing components.  
8.1 Application examples  
The excellent wideband characteristics of the MMIC make it an ideal building block in IF  
amplifier such as LNBs (see Figure 3).  
9397 750 13292  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
5 of 14  
BGA2716  
Philips Semiconductors  
MMIC wideband amplifier  
As second amplifier after an LNA, the MMIC offers an easy matching, low noise solution  
(see Figure 4).  
As driver amplifier in the TX path, the good linear performance and matched input/output  
offer quick design solutions (see Figure 5).  
mixer  
to IF circuit  
from  
or demodulator  
RF circuit  
wideband  
amplifier  
oscillator  
mgu438  
Fig 3. Application as IF amplifier.  
mixer  
to IF circuit  
or demodulator  
antenna  
LNA  
wideband  
amplifier  
oscillator  
mgu439  
Fig 4. Application as RF amplifier.  
mixer  
from modulation  
or IF circuit  
to power  
amplifier  
wideband  
amplifier  
oscillator  
mgu440  
Fig 5. Application as driver amplifier.  
9397 750 13292  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
6 of 14  
BGA2716  
Philips Semiconductors  
MMIC wideband amplifier  
90°  
+1  
1.0  
0.8  
135°  
+0.2  
45°  
+0.5  
+2  
0.6  
0.4  
+5  
100 MHz  
0.5  
0.2  
4 GHz  
0
0.2  
1
2
5
10  
0°  
0
180°  
5  
0.2  
2  
0.5  
135°  
45°  
1  
1.0  
001aab257  
90°  
IS = 15.9 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .  
Fig 6. Input reflection coefficient (s11); typical values.  
90°  
+1  
1.0  
0.8  
0.6  
0.4  
0.2  
0
135°  
+0.5  
45°  
+2  
100 MHz  
+0.2  
+5  
4 GHz  
0
0.2  
0.5  
2
5
10  
0°  
180°  
5  
0.2  
2  
0.5  
135°  
45°  
1  
1.0  
001aab258  
90°  
IS = 15.9 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .  
Fig 7. Output reflection coefficient (s22); typical values.  
9397 750 13292  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
7 of 14  
BGA2716  
Philips Semiconductors  
MMIC wideband amplifier  
001aab259  
001aab260  
0
2
30  
2
|s  
21  
|
|s  
|
12  
(dB)  
(dB)  
(2)  
(1)  
20  
20  
(3)  
40  
60  
10  
0
0
1000  
2000  
3000  
4000  
0
1000  
2000  
3000  
4000  
f (MHz)  
f (MHz)  
IS = 15.9 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .  
PD = 35 dBm; Zo = 50 .  
(1) IS = 19.5 mA; VS = 5.5 V.  
(2) IS = 15.9 mA; VS = 5 V.  
(3) IS = 12.4 mA; VS = 4.5 V.  
Fig 8. Isolation ( s12 2) as a function of frequency;  
typical values.  
Fig 9. Insertion gain ( s21 2) as a function of  
frequency; typical values.  
001aab261  
001aab262  
20  
20  
P
P
L
L
(dBm)  
(dBm)  
(1)  
(2)  
(3)  
10  
10  
(1)  
(2)  
(3)  
0
10  
20  
0
10  
20  
40  
30  
20  
10  
0
40  
30  
20  
10  
0
P
(dBm)  
P (dBm)  
D
D
f = 1 GHz; Zo = 50 .  
(1) VS = 5.5 V.  
f = 2.2 GHz; Zo = 50 .  
(1) VS = 5.5 V.  
(2) VS = 5 V.  
(2) VS = 5 V.  
(3) VS = 4.5 V.  
(3) VS = 4.5 V.  
Fig 10. Load power as a function of drive power at  
1 GHz; typical values.  
Fig 11. Load power as a function of drive power at  
2.2 GHz; typical values.  
9397 750 13292  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
8 of 14  
BGA2716  
Philips Semiconductors  
MMIC wideband amplifier  
001aab263  
001aab264  
8
5
4
3
2
1
0
K
NF  
(dB)  
7
6
5
4
(1)  
(2)  
(3)  
0
500  
1000  
1500  
2000  
2500  
0
1000  
2000  
3000  
4000  
f (MHz)  
f (MHz)  
Zo = 50 .  
IS = 15.9 mA; VS = 5 V; Zo = 50 .  
(1) IS = 19.5 mA; VS = 5.5 V.  
(2) IS = 15.9 mA; VS = 5 V.  
(3) IS = 12.4 mA; VS = 4.5 V.  
Fig 12. Noise figure as a function of frequency; typical  
values.  
Fig 13. Stability factor as a function of frequency;  
typical values.  
9397 750 13292  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
9 of 14  
BGA2716  
Philips Semiconductors  
MMIC wideband amplifier  
Table 8:  
Scattering parameters  
VS = 5 V; IS = 15.9 mA; PD = 35 dBm; Zo = 50 ; Tamb = 25 °C.  
f (MHz) s11  
Magnitude Angle  
s21  
s12  
s22  
Magnitude Angle  
K-factor  
Magnitude Angle  
Magnitude Angle  
(ratio)  
(deg)  
(ratio)  
(deg)  
(ratio)  
(deg)  
(ratio)  
(deg)  
100  
0.182562  
0.123465  
0.107855  
0.114731  
0.130176  
0.144984  
0.160922  
0.179351  
0.20199  
102.7794  
87.55274  
58.58513  
40.14071  
24.28555  
9.657616  
12.69581  
13.13419  
13.47149  
13.57901  
13.67457  
13.91705  
13.48682  
0.029472  
28.74955  
0.39239  
91.48628  
62.37296  
24.6455  
1.3  
1.2  
1.2  
200  
5.272917 0.035438  
31.7377 0.035299  
2.202361 0.267851  
22.54301 0.227252  
43.06353 0.227993  
59.63503 0.234967  
76.09972 0.239818  
88.34045 0.242141  
101.2729 0.243087  
110.3342 0.24499  
121.0192 0.255598  
127.6765 0.269829  
137.8213 0.283613  
138.8717 0.29058  
147.6622 0.281505  
152.1988 0.25135  
163.8718 0.211425  
170.5637 0.165534  
176.5407 0.118726  
400  
600  
53.09631 0.033167  
73.60665 0.033194  
94.01973 0.029047  
3.493572 1.3  
31.11084 1.3  
60.54722 1.4  
91.56898 1.4  
124.5484 1.4  
158.6224 1.5  
800  
1000  
1200  
1400  
1600  
1800  
2000  
2200  
2400  
2600  
2800  
3000  
3200  
3400  
3600  
3800  
4000  
7.518892 14.10949  
23.35989 14.2808  
41.01349 14.3825  
60.71294 14.26935  
81.48254 14.0667  
103.1109 13.83968  
114.55  
0.028188  
135.3117 0.025188  
156.7041 0.022257  
178.3843 0.019611  
0.218268  
0.233965  
0.242904  
0.246576  
0.249069  
0.243665  
0.233266  
0.222055  
0.207486  
0.191654  
0.175783  
0.163768  
167.5983  
136.117  
1.7  
1.8  
1.9  
2.0  
2.2  
2.5  
160.1504  
138.2379  
115.7594  
93.38644  
71.02792  
50.42722  
30.75908  
11.98315  
0.018087  
0.017203  
0.016318  
0.015514  
0.014954  
0.015522  
0.016261  
0.016664  
106.0987  
77.95189  
50.68612  
24.40624  
125.52  
13.46447  
148.8707 12.74638  
172.646  
163.9035  
140.7754  
117.0531  
94.64431  
71.9551  
11.87558  
10.94049  
10.05626  
9.576357  
9.199166  
8.912598  
8.618058  
0.674037 2.7  
23.9944 2.9  
46.28101 3.0  
72.36691 3.2  
109.9804 3.3  
163.7132 3.3  
7.677643 0.016982  
27.73098 0.017094  
48.90874 0.017414  
176.9385  
165.8227  
157.6095  
0.083354  
0.058549  
0.055225  
49.89436  
9397 750 13292  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
10 of 14  
BGA2716  
Philips Semiconductors  
MMIC wideband amplifier  
9. Package outline  
Plastic surface mounted package; 6 leads  
SOT363  
D
B
E
A
X
y
H
v
M
A
E
6
5
4
Q
pin 1  
index  
A
A
1
1
2
3
c
e
1
b
p
L
p
w
M B  
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max  
0.30  
0.20  
1.1  
0.8  
0.25  
0.10  
2.2  
1.8  
1.35  
1.15  
2.2  
2.0  
0.45  
0.15  
0.25  
0.15  
mm  
0.1  
1.3  
0.65  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
97-02-28  
SOT363  
SC-88  
Fig 14. Package outline; SOT363 (SC-88).  
9397 750 13292  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
11 of 14  
BGA2716  
Philips Semiconductors  
MMIC wideband amplifier  
10. Revision history  
Table 9:  
Revision history  
Release date Data sheet status  
20040924 Product data sheet  
Document ID  
BGA2716_2  
Modifications:  
Change notice Doc. number  
Supersedes  
-
9397 750 13292 BGA2716_N_1  
The format of this data sheet has been redesigned to comply with the new presentation and  
information standard of Philips Semiconductors  
BGA2716_N_1  
20040202  
Preliminary data sheet  
-
9397 750 12827  
-
9397 750 13292  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
12 of 14  
BGA2716  
Philips Semiconductors  
MMIC wideband amplifier  
11. Data sheet status  
Level Data sheet status[1] Product status[2] [3]  
Definition  
I
Objective data  
Development  
This data sheet contains data from the objective specification for product development. Philips  
Semiconductors reserves the right to change the specification in any manner without notice.  
II  
Preliminary data  
Qualification  
This data sheet contains data from the preliminary specification. Supplementary data will be published  
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in  
order to improve the design and supply the best possible product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips Semiconductors reserves the  
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant  
changes will be communicated via a Customer Product/Process Change Notification (CPCN).  
[1]  
[2]  
Please consult the most recently issued data sheet before initiating or completing a design.  
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at  
URL http://www.semiconductors.philips.com.  
[3]  
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
12. Definitions  
13. Disclaimers  
Short-form specification The data in a short-form specification is  
extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
Life support — These products are not designed for use in life support  
appliances, devices, or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors  
customers using or selling these products for use in such applications do so  
at their own risk and agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in accordance with  
the Absolute Maximum Rating System (IEC 60134). Stress above one or  
more of the limiting values may cause permanent damage to the device.  
These are stress ratings only and operation of the device at these or at any  
other conditions above those given in the Characteristics sections of the  
specification is not implied. Exposure to limiting values for extended periods  
may affect device reliability.  
Right to make changes — Philips Semiconductors reserves the right to  
make changes in the products - including circuits, standard cells, and/or  
software - described or contained herein in order to improve design and/or  
performance. When the product is in full production (status ‘Production’),  
relevant changes will be communicated via a Customer Product/Process  
Change Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no  
license or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are  
free from patent, copyright, or mask work right infringement, unless otherwise  
specified.  
Application information Applications that are described herein for any  
of these products are for illustrative purposes only. Philips Semiconductors  
make no representation or warranty that such applications will be suitable for  
the specified use without further testing or modification.  
14. Contact information  
For additional information, please visit: http://www.semiconductors.philips.com  
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com  
9397 750 13292  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
13 of 14  
BGA2716  
Philips Semiconductors  
MMIC wideband amplifier  
15. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
1.4  
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Application information. . . . . . . . . . . . . . . . . . . 4  
Application examples . . . . . . . . . . . . . . . . . . . . 5  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 13  
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Contact information . . . . . . . . . . . . . . . . . . . . 13  
3
4
5
6
7
8
8.1  
9
10  
11  
12  
13  
14  
© Koninklijke Philips Electronics N.V. 2004  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior  
written consent of the copyright owner. The information presented in this document does  
not form part of any quotation or contract, is believed to be accurate and reliable and may  
be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under  
patent- or other industrial or intellectual property rights.  
Date of release: 24 September 2004  
Document number: 9397 750 13292  
Published in The Netherlands  

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