TDA8008HL [NXP]
Dual multiprotocol smart card coupler; 多协议双智能卡连接器
| 型号： | TDA8008HL |
| 厂家： | 
NXP |
| 描述： | Dual multiprotocol smart card coupler |
| 文件： | 总12页 (文件大小：72K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8008
Dual multiprotocol smart card
coupler
Objective specification
1999 Dec 14
File under Integrated Circuits, IC02
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
FEATURES
• Chip select input allowing use of several devices in
parallel and memory space paging
• 8xC51 core with 16 kbytes or EPROM (TDA8008),
256 bytes RAM, 512 bytes AUXRAM, Timer 0, 1, 2 and
• Enhanced ESD protections on card contacts (6 kV min.)
enhanced UART
• Software library for easy integration within the
application
• Specific ISO 7816 UART, accessible with MOVX
instructions for automatic convention processing,
variable baud rate through frequency or division ratio
programming, error management at character level for
T = 0 protocol, extra guard time register
• Development tool with a TDA8007B and a regular
emulator.
APPLICATIONS
• Dual VCC generation (5 V ±5% or 3 V ±5%), maximum
• Multiple smart card readers for multiprotocol
applications (EMV banking, digital pay TV, access
control, etc.).
current of 60 mA with controlled rise and fall times
• Dual cards clock generation (up to 10 MHz) with two
times synchronous frequency doubling
• Cards clock STOP HIGH or LOW or 1.25 MHz (from an
integrated oscillator) for cards power reduction mode
GENERAL DESCRIPTION
The TDA8008 is a complete, one-chip, low cost dual smart
card coupler.
• Automatic activation and deactivation sequences
through an independent sequencer
• Supports the asynchronous protocols T = 0 and T = 1 in
accordance with ISO 7816 and EMV
It can be used as the kernel of a multiple card reader. It can
handle all ISO 7816, EMV and GSM11-11 requirements.
The integrated ISO 7816 UART and the time-out counters
allow easy use even at high baud rates with no real time
constraints. Due to its chip select and external I/O and
interrupt features, it simplifies the realization of any
number of cards reader. It gives the cards and the set a
very high level of security, due to its special hardware
against ESD, short-circuiting, power failure and
overheating. Its integrated step-up converter allows
operation within a supply voltage range of 2.7 to 5.5 V at
16 MHz.
• Versatile 24-bit time-out counter for Answer To Reset
(ATR) and waiting times processing
• 22 ETU counter for block guard time
• Supports synchronous cards
• Current limitations on cards contacts
• Special circuitry for killing spikes during power-on or off
• Supply supervisor for Power-on reset
• Step-up converter (supply voltage from 2.7 to 5.5 V at
16 MHz), doubler, tripler or follower according to VCC
and VDD
The OTP version of the TDA8008 allows fast and reliable
software development and fast product introduction.
• Speed up to 25 MHz at VDD = 5 V
A software library has been developed, that can handle all
actions required for T = 0, T = 1 and synchronous
protocols.
• Additional I/O pin allowing the use of the ISO 7816
UART for an external card interface (pin IOAUX)
• Additional interrupt pin allowing detection of level
toggling on an external signal (pin INTAUX)
• Fast and efficient swapping between the 3 cards due to
separate buffering of parameters for each card
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
TDA8008HL
1999 Dec 14
LQFP80
plastic low profile quad flat package; 80 leads; body 12 × 12 × 1.4 mm
SOT315-1
2
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
QUICK REFERENCE DATA
SYMBOL
VDD
PARAMETER
supply voltage
CONDITIONS
MIN.
2.7
TYP. MAX. UNIT
VDDD = VDDA = VDDP
−
−
5.5
tbf
V
IDD(pd)
IDD(sm)
IDD(om)
VCC
supply current in Power-down mode VDD = 3.3 V; cards inactive;
8xC51 controller in power-down
−
−
−
µA
mode; note 1
supply current in sleep mode
supply current in operating mode
card output supply voltage
VDD = 3.3 V; cards active at
VCC = 5V; clock stopped; 8xC51
controller in Idle mode; note 1
−
−
tbf
tbf
mA
mA
VDD = 3.3 V; fXTAL1 = 20 MHz
V
CC1 = VCC2 = 5 V;
ICC1 + ICC2 = 80 mA; note 1
including static loads (5 V card) 4.75
5.0
5.0
5.25
5.4
V
V
with 40 nAs dynamic loads on
200 nF capacitor (5 V card)
4.6
including static loads (3 V card) 2.80
3.0
3.0
3.20
3.25
V
V
with 40 nAs dynamic loads on
200 nF capacitor (3 V card)
2.75
ICC
card output supply current
operating
−
−
65
mA
mA
mA
V/µs
µs
overload detection
−
80
−
−
ICC1 + ICC2 sum of both cards currents
−
80
SR
tde
tact
fXTAL
fop
slew rate on VCC (rise and fall)
deactivation cycle duration
activation cycle duration
crystal frequency
CL = 300 nF (max.)
0.10
−
0.16
−
0.22
100
225
25
−
−
µs
3.5
0
−
MHz
MHz
operating frequency
external frequency applied to
pin XTAL1
−
25
Tamb
ambient temperature
−25
−
+85
°C
Note
1. IDD in all configurations includes the current at pins VDDD, VDDA and VDDP
.
1999 Dec 14
3
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
BLOCK DIAGRAM
200 nF
23
200 nF
51
52
24
6
25 16
18
3
SUPPLY
V
RESET
DDP
39
SUPERVISOR
RSTOUT
STEP-UP
CONVERTER
17
26
GNDP
VUP
8xC51 CONTROLLER
65
63
EA/VPP
PSEN
200 nF
V
TIME-OUT
COUNTER
16 KBYTES ROM or OTP
256 BYTES RAM
4
DDA
64
ALE/PROG
34
33
I/01
75 to 80,
1, 2
C81
TIMER 0, 1 and 2
ENHANCED UART
ISO 7816
UART
32
31
P10 to P17
P30 to P37
PRES1
8
8
C41
RST1
41 to 48
30
29
ANALOG
DRIVERS
V
CC1
CLK1
28
27
CLOCK
GNDC1
TDA8008
CIRCUITRY
15
14
GNDC2
CLK2
AND
P20 to P27
53 to 62
67 to 74
SEQUENCER
13
V
CC2
RST2
12
11
10
9
C42
C82
I/02
PRES2
P00 to P07
512 BYTES AUXRAM
BY MOVX
8
5
GNDA
50
49
ALE
XTAL1
XTAL2
XTAL
OSCILLATOR
47
P36/WR
48
P37/RD
INTERNAL
35
37
38
OSCILLATOR
INTAUX
IOAUX
CS
36
7
TEST
INHIB
19 to 22, 40,
58, 59, 66
n.c.
FCE568
Fig.1 Block diagram.
4
1999 Dec 14
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
PINNING
SYMBOL
P16
PIN
DESCRIPTION
1
2
3
8xC51 general purpose I/O port
8xC51 general purpose I/O port
P17
RESET
reset input: a HIGH on this pin for 2 machine cycles while the oscillator is running, resets the
device. An internal diffused resistor connected to GNDD permits a Power-on reset using an
external capacitor connected to VDDD
.
VDDA
4
5
analog supply voltage
GNDA
CDELAY
INHIB
PRES2
IO2
analog ground
6
pin for an external delay capacitor
7
test pin (must be left open-circuit in the application)
card 2 presence contact input (active HIGH or LOW by mask option)
data line to/from card 2 (ISO C7 contact)
8
9
C82
10
11
12
13
14
15
16
auxiliary I/O for ISO C8 contact for card 2 (i.e. synchronous cards)
auxiliary I/O for ISO C4 contact for card 2 (i.e. synchronous cards)
card 2 reset output (ISO C2 contact)
C42
RST2
VCC2
card 2 output supply voltage (ISO C1 contact)
clock output of card 2 (ISO C3 contact)
CLK2
GNDC2
SAM
ground for card 2
contact 2 for the step-up converter (connect a low ESR 220 nF capacitor between pins SAP
and SAM)
GNDP
SBM
17
18
ground for the step-up converter
contact 4 for the step-up converter (connect a low ESR 220 nF capacitor between pins SBP
and SBM)
n.c.
19
20
21
22
23
24
not connected
n.c.
not connected
n.c.
not connected
n.c.
not connected
VDDP
SBP
supply voltage for the step-up converter
contact 3 for the step-up converter (connect a low ESR 220 nF capacitor between pins SBP
and SBM)
SAP
25
contact 1 for the step-up converter (connect a low ESR 220 nF capacitor between pins SAP
and SAM)
VUP
26
27
28
29
30
31
32
33
34
35
output of the step-up converter
GNDC1
CLK1
VCC1
ground for card 1
clock output of card 1 (ISO C3 contact)
card 1 output supply voltage (ISO C1 contact)
card 1 reset output (ISO C2 contact)
RST1
C41
auxiliary I/O for ISO C4 contact for card 1 (i.e. synchronous cards)
card 1 presence contact input (active HIGH or LOW by mask option)
auxiliary I/O for ISO C8 contact for card 1 (i.e. synchronous cards)
data line to and from card 1 (ISO C7 contact)
auxiliary interrupt input
PRES1
C81
IO1
INTAUX
1999 Dec 14
5
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
SYMBOL
PIN
DESCRIPTION
TEST
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
test pin (must be left open-circuit in the application)
input or output for an I/O line issued on an auxiliary smart card interface
chip select input (active LOW)
IOAUX
CS
RSTOUT
n.c.
open-drain output for resetting external chips
not connected
P30/RXD
P31/TXD
P32/INT0
P33/INT1
P34/T0
P35/T1
P36/WR
P37/RD
XTAL2
8xC51 general purpose I/O port/serial input port
8xC51 general purpose I/O port/serial output port
8xC51 general purpose I/O port/external interrupt 0
8xC51 general purpose I/O port/external interrupt 1
8xC51 general purpose I/O port/Timer 0 external input
8xC51 general purpose I/O port/Timer 1 external input
8xC51 general purpose I/O port/external data memory write strobe
8xC51 general purpose I/O port/external data memory read strobe
connection pin for an external crystal (output from the inverting oscillator amplifier)
XTAL1
connection pin for an external crystal, or input for an external clock signal (input to the
inverting oscillator amplifier and input to the internal clock generator circuits)
VDDD
51
52
53
54
55
56
57
58
59
60
61
62
63
digital supply voltage
GNDD
P20/A8
P21/A9
P22/A10
P23/A11
P24/A12
n.c.
digital ground
8xC51 general purpose I/O port/address 8
8xC51 general purpose I/O port/address 9
8xC51 general purpose I/O port/address 10
8xC51 general purpose I/O port/address 11
8xC51 general purpose I/O port/address 12
not connected
n.c.
not connected
P25/A13
P26/A14
P27/A15
PSEN
8xC51 general purpose I/O port/address 13
8xC51 general purpose I/O port/address 14
8xC51 general purpose I/O port/address 15
Program store enable output: this is the read strobe to the external program memory. When
executing code from the external program memory, PSEN is activated twice each machine
cycle, except that two PSEN activations are skipped during each access to external data
memory. PSEN is not activated during fetches from internal program memory.
ALE/PROG
64
Address latch enable/program pulse: this is the output pulse for latching the low byte of the
address during an access to external memory. In normal operation, ALE pulses are emitted at
a constant rate of 1⁄6 of the oscillator frequency and can be used for external timing or
clocking. It should be noted that one ALE pulse is skipped during each access to external data
memory. This pin is also the program pulse input (PROG) during EPROM programming. ALE
can be disabled by setting bit SFR Auxiliary 0. With this bit set, ALE will be active only during
a MOVX instruction.
1999 Dec 14
6
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
SYMBOL
PIN
DESCRIPTION
EA/VPP
65
External access enable/programming supply voltage: EA must be externally held LOW to
enable the device to fetch code from external program memory locations starting with 0000H.
If EA is held HIGH, the device executes from the internal program memory unless the program
counter contains an address greater than 3FFFH (16 kbytes boundary). This pin also receives
the 12.75 V programming supply voltage (VPP) during EPROM programming. If security bit 1
is programmed, EA will be internally latched on reset.
n.c.
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
not connected
P07/AD7
P06/AD6
P05/AD5
P04/AD4
P03/AD3
P02/AD2
P01/AD1
P00/AD0
P10/T2
P11/T2EX
P12
8xC51 general purpose I/O port/address/data 7
8xC51 general purpose I/O port/address/data 6
8xC51 general purpose I/O port/address/data 5
8xC51 general purpose I/O port/address/data 4
8xC51 general purpose I/O port/address/data 3
8xC51 general purpose I/O port/address/data 2
8xC51 general purpose I/O port/address/data 1
8xC51 general purpose I/O port/address/data 0
8xC51 general purpose I/O port/timer, counter 2 external count input and clock output
8xC51 general purpose I/O port/timer, counter 2 reload, capture and direction control
8xC51 general purpose I/O port
P13
8xC51 general purpose I/O port
P14
8xC51 general purpose I/O port
P15
8xC51 general purpose I/O port
1999 Dec 14
7
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
61
P26/A14
40 n.c.
P27/A15 62
RSTOUT
CS
39
63
38
37
PSEN
64
ALE/PROG
IOAUX
TEST
INTAUX
IO1
65
36
35
34
EA/VPP
n.c.
P07/AD7
P06/AD6
P05/AD5
P04/AD4
66
67
68
69
70
33 C81
32
31
30
29
28
27
PRES1
C41
TDA8008HL
P03/AD3 71
RST1
72
P02/AD2
P01/AD1
P00/AD0
V
CC1
73
74
CLK1
GNDC1
75
76
26 VUP
P10/T2
P11/T2EX
25
24
SAP
SBP
P12 77
78
79
80
P13
P14
P15
23 V
22
DDP
n.c.
21
n.c.
FCE569
Fig.2 Pin configuration.
8
1999 Dec 14
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
PACKAGE OUTLINE
LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm
SOT315-1
y
X
A
60
41
Z
61
40
E
e
H
A
E
2
E
A
(A )
3
A
1
w M
p
θ
b
L
p
L
pin 1 index
80
21
detail X
1
20
Z
D
v
M
A
e
w M
b
p
D
B
H
v
M
B
D
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
θ
1
2
3
p
E
p
D
E
max.
7o
0o
0.16 1.5
0.04 1.3
0.27 0.18 12.1 12.1
0.13 0.12 11.9 11.9
14.15 14.15
13.85 13.85
0.75
0.30
1.45 1.45
1.05 1.05
mm
1.6
0.25
0.5
1.0
0.2 0.15 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-12-19
97-07-15
SOT315-1
1999 Dec 14
9
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
SOLDERING
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Manual soldering
Wave soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
1999 Dec 14
10
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
BGA, LFBGA, SQFP, TFBGA
WAVE
not suitable
REFLOW(1)
suitable
suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC(3), SO, SOJ
not suitable(2)
suitable
LQFP, QFP, TQFP
not recommended(3)(4) suitable
not recommended(5)
suitable
SSOP, TSSOP, VSO
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Dec 14
11
Philips Semiconductors – a worldwide company
Argentina: see South America
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Pakistan: see Singapore
Belgium: see The Netherlands
Brazil: see South America
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Colombia: see South America
Czech Republic: see Austria
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Hungary: see Austria
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Middle East: see Italy
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
68
SCA
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545004/01/pp12
Date of release: 1999 Dec 14
Document order number: 9397 750 06532
相关型号：
©2020 ICPDF网 联系我们和版权申明