TDA8501TD-T [NXP]
IC COLOR SIGNAL ENCODER, PDSO24, PLASTIC, SOT-137AH1, 24 PIN, Color Signal Converter;
| 型号： | TDA8501TD-T |
| 厂家： | 
NXP |
| 描述： | IC COLOR SIGNAL ENCODER, PDSO24, PLASTIC, SOT-137AH1, 24 PIN, Color Signal Converter 转换器 色度信号转换器 消费电路 商用集成电路 光电二极管 输入元件 编码器 |
| 文件： | 总30页 (文件大小：241K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8501
PAL/NTSC encoder
April 1993
Preliminary specification
File under Integrated Circuits, IC02
Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
FEATURES
GENERAL DESCRIPTION
• Two input stages: R, G, B and −(R−Y), −(B−Y), Y with
multiplexing
The TDA8501 is a highly integrated PAL/NTSC encoder IC
which is designed for use in all applications where R, G
and B or Y, U and V signals require transformation to PAL
or NTSC values.The specification of the input signals are
fully compatible with the specification of those of the
TDA8505 SECAM-encoder.
• Chrominance processing, highly integrated, includes
low frequency filters for the colour difference signals,
and after the modulator a bandpass filter
• Fully controlled modulator produces a signal according
to the PAL or NTSC standard without adjustments
• A free running oscillator. Can be tuned by crystal or by
an external frequency source
• Output stages with separated Y + SYNC and
chrominance (Y + C, SVHS), and a CVBS output. Signal
amplitudes are correct for 75 Ω driving via an external
emitter follower. Internal generation of NTSC setup
• Sync separator circuit and pulse shaper, to generate the
required pulses for the processing, clamping, blanking,
FH/2, and burst pulse
• H/2 control pin. In PAL mode the internally generated
H/2 is connected to this pin and the phase of this signal
can be reset
• Internal bandgap reference.
ORDERING INFORMATION
PACKAGE
EXTENDED TYPE
NUMBER
PINS
PIN POSITION
MATERIAL
CODE
TDA8501
24
24
DIL
SO
plastic
plastic
SOT234AH2(1)
SOT137AH1(2)
TDA8501T
Note
1. SOT234-1; 1996 December 2.
2. SOT137-1; 1996 December 2.
April 1993
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Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
April 1993
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Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
Fig.2 Pin configuration.
PINNING
U and V respectively, are the terms used to describe the colour difference signals at the output of the matrix.
SYMBOL
−(R−Y)
PIN
DESCRIPTION
1
2
3
4
colour difference input signal, for EBU bar (75%) 1.05 V (p-p)
multiplexer switch control input; HIGH = RGB, LOW = −(R−Y), −(B−Y), Y
colour difference input signal, for EBU bar (75%) 1.33 V (p-p)
MCONTROL
−(B−Y)
H/2
line pulse input/output divided-by-2 for synchronizing the internal H/2, if not used, this pin
dependent on mode selected, is either left open-circuit, or connected to VCC or to ground
(note 1)
Y
5
6
luminance input signal 1 V nominal without sync
U modulator offset control capacitor
RED input signal for EBU bar of 75% 0.7 V (p-p)
supply voltage; 5 V nominal
U OFFSET
R
7
VCC
8
G
9
GREEN input signal for EBU bar of 75% 0.7 V (p-p)
ground (0 V)
VSS
10
11
12
13
14
15
16
B
BLUE input signal for EBU bar of 75% 0.7 V (p-p)
V modulator offset control capacitor
2.5 V internal reference voltage output
chrominance output
V OFFSET
VREF
CHROMA
FLT
filter tuning loop capacitor
CVBS
composite PAL or NTSC output, 2 V (p-p) nominal
April 1993
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Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
SYMBOL
PIN
DESCRIPTION
PAL/NTSC and
17
four level control pin (note 2)
Y/Y + SYNC
NOTCH
18
19
20
21
22
23
Y +SYNC output via an internal resistor of 2 kΩ; a notch filter can be connected to this pin
2 V (p-p) nominal Y +SYNC output
Y +SYNC OUT
Y +SYNC IN
BURST ADJ
Y +SYNC OUT
OSC
Y +SYNC input; (from pin 22) connected to the output of the external delay line
burst current adjustment via external resistor
Y +SYNC output 1 V (p-p) nominal, connected to the input of the external delay line
oscillator tuning: connected to either a crystal in series with capacitor to ground, or to an
external frequency source via a resistor in series with a capacitor
CS
24
composite sync input, 0.3 V (p-p) nominal
Notes
1. Pin 4: in PAL mode, if not connected to external H2 pulse, this pin is the output for the internally generated H/2 signal.
Pin 4: in NTSC mode, for internal set-up this pin is connected to ground; when internal set-up is switched off, this pin
is connected to VCC
.
2. The listed voltages connected to pin 17 (if VCC = + 5 V) enable the following Y (via pin 5) input signal states:
0 V = PAL mode; at pin 5, Y without sync and input blanking on
5 V = NTSC mode; at pin 5, Y without sync and input blanking on
1.8 V = PAL mode; at pin 5, Y with sync and input blanking off
3.2 V = NTSC mode; at pin 5, Y with sync and input blanking off
April 1993
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Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
The Y input signal (via pin 5) differs from other signal
inputs, in that the timing of the internal clamp is after the
sync period.
FUNCTIONAL DESCRIPTION
The TDA8501 device comprises:
• encoder circuit
The amplitude and polarity of these colour difference and
luminance input signals are processed to provide suitable
switch inputs of U, V and Y signal values.
• oscillator and filter control
• sync separator and pulse shaper.
Within this functional description, the term Y is used to
describe the luminance signal and the terms U and V
respectively, are used to describe the colour difference
signals.
The condition for 75% colour bar is:
pin 1
pin 3
pin 5
−(R−Y) = 1.05 V (peak-to-peak)
−(B−Y) = 1.33 V (peak-to-peak)
Y = 1 V (peak-to-peak) without sync
Encoder circuit
INPUT STAGE
The input stage of the device uses two signal paths (see
Fig.1). Fast switching between the two signal paths is
achieved by means of the signal path selection switch
MCONTROL (pin 2).
When selected (via MCONTROL), the U and V signals (via
the switch) are routed to the low pass filters. The Y signal
(via the switch) is routed via the adder and buffer to pin 22
(Y +SYNC OUT to delay line). Dependent on pin 17
conditioning, the Y signal may have external or internal
sync added (see section Four level control pin).
R, B AND G INPUT SIGNALS PATH
One signal path provides the connection for R, G and B
signal inputs (via pins 7, 9 and 11) which are connected to
a matrix via clamping and line blanking circuits. The signal
outputs from the matrix are U, V and Y.
FOUR LEVEL CONTROL PIN
The Y input signal (via pin 5) is conditioned by use of the
4-level control pin (pin 17) to emulate either the PAL or
NTSC modes, with sync and input blanking off or without
sync and input blanking on.
For an EBU colour bar of 75% the amplitude of the signal
must be 0.7 V (peak-to-peak):
Pin 17 may be hard wire connected to either ground (LOW
for PAL mode) or VCC (HIGH for NTSC mode). External
resistors can further modify the voltage level input at pin 17
to condition (pin 5) Y with sync and input blanking off or Y
without sync and input blanking on. (see section
PAL/NTSC and Y/Y +SYNC).
U
V
Y
= 0.493 (B−Y)
= 0.877 (R−Y)
= 0.299 R +0.587 G +0.114 B
When selected (via MCONTROL), the U, V signals from
the matrix are routed through the selection switch to the
low pass filters. The Y signal from the matrix is routed
through the selection switch to the adder and combined
with the sync pulse from the sync separator and then
connected via a buffer internally to pin 22 (Y + SYNC OUT
to delay line).
U AND V SIGNALS
In PAL and NTSC modes the U and V (colour difference)
signals at the output of the switch are configured differently
as follows:
PAL mode:
• after the adding of the burst pulse to U and V, these
signals are connected to the input of the low pass filters.
During the vertical sync period the burst pulse is
suppressed.
−(R−Y), −(B−Y) AND Y INPUT SIGNALS PATH
A second signal path provides the connection for negative
colour difference signal inputs −(R−Y), −(B−Y) i.e. V, U (via
pins 1, 3) and luminance Y (via pin 5), which are routed
directly to the switch inputs via clamping and line blanking
circuits.
NTSC mode:
• the burst pulse is only added to U and the gain of the U
and V signals is 0.95 of the gain in PAL mode. During
the vertical sync period the burst pulse is suppressed.
April 1993
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Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
Low pass filters
The −3dB nominal frequency response level of the low
pass filters are different in PAL and NTSC modes.
PAL mode: bandwidth = 1.35 MHz nominal (see Fig.3).
NTSC mode: bandwidth = 1.1 MHz nominal (see Fig.4).
The signal outputs of the low pass filters are connected to
the signal inputs of the U and V modulators.
U AND V MODULATORS
Two four-quadrant multipliers are used for quadrature
amplitude modulation of the U and V signals. The level of
harmonics produced by the modulated signals are
minimal, because of real multiplication with sinewave
carriers.
The unbalance of the modulators is minimized by means
of a control loop and two external capacitors, pin 6 for the
U modulator and pin 12 for the V modulator. The timing of
the control loop is triggered by the H/2 pulse, so that during
one sync period the U control is active and during the next
sync period the V control is active. In this way, when U and
V are both zero, the suppressed carrier is guaranteed to be
at a low level.
(1) frequency response.
(2) group delay.
Fig.3 Low pass filter response for colour
difference signals (PAL mode).
The internal oscillator circuit generates two sinewave
carriers (0 degree and 90 degree). The '0 degree' (0)
carrier is connected to the U modulator and the '90 degree'
(1) carrier is connected to the V modulator.
PAL mode:
• switched sequentially by the H/2 pulse, the V signal is
modulated alternately with the direct and inverse carrier.
• the internal H/2 pulse can be forced into a specific phase
by means of an external pulse connected to pin 4 (H/2).
Forcing is active at HIGH level. If not used pin 4 can be
left open-circuit or connected to ground. If pin 4 is left
open, the internally generated H/2 pulse (output) is
connected to this pin.
NTSC mode:
• alternation of the V modulation is not allowed. If pin 4 is
not used for set-up control (see Y +SYNC, CVBS and
Chrominance outputs), it can be left open-circuit or
connected to ground.
(1) frequency response.
(2) group delay.
Fig.4 Low pass filter response for colour
difference signals (NTSC mode).
April 1993
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Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
CHROMINANCE BLANKING
BANDPASS FILTER
The signal outputs from the modulators are connected to
the signal input of the chrominance blanking circuit. To
avoid signal distortion that may be caused by the control
loop, the signal outputs of the modulators are blanked
during the sync period. This prevents signal distortion
during the adding of the sync pulse at the CVBS output
circuit.
A wide symmetrical bandpass filter is used so that a
maximum performance of the chrominance for Y +C
(SVHS) is guaranteed. This wide curve is possible
because of the minimal signal level of the harmonics within
the modulators see Figs (PAL mode: 5 and 6);
(NTSC mode: 7 and 8) which illustrate the nominal
response for PAL and NTSC modes.
(1) frequency response.
(2) group delay.
Fig.5 Band pass filter nominal frequency
response (PAL mode).
Fig.6 Band pass filter nominal frequency/group
delay response (PAL mode).
April 1993
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Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
Y +SYNC, CVBS AND CHROMINANCE OUTPUTS
The Y signal from the matrix, or the Y signal from pin 5,
(selected via the switch) is added with the composite sync
signal of the sync separator (dependent on pin 17
conditioning). The output of the adder, nominal 1 V
(peak-to-peak), is connected to pin 22 (see Fig.1). Pin 22
is connected to an external delay line.
The delay line is necessary for correct timing of the
Y + SYNC signal with the chrominance signal. The output
resistor of the delay line is connected to VREF (pin 13). The
output of the external delay line is connected to (input)
pin 20.
The Y +SYNC (delayed) input signal at pin 20 is amplified
via a buffer to a level of 2 V (peak-to-peak) nominal and
connected to pin 19 (Y + SYNC output).
The Y + SYNC (delayed) input signal at pin 20 is also
connected via an internal resistor of 2 kΩ to the input of the
CVBS adder stage. After the internal resistor of 2 kΩ, and
before the input of the CVBS adder, an external notch filter
can be connected via pin 18.
Fig.7 Band pass filter nominal frequency
response (NTSC mode).
The chrominance output of the bandpass filter is added
with Y +SYNC signal via the CVBS adder. The CVBS
(combined video and blanking signal) output of the adder
is connected to pin 16 with a nominal amplitude of 2 V
(peak-to-peak).
The chrominance output of the bandpass filter is amplified
via a buffer and connected to pin 14. The chrominance
amplitude corresponds with the value of Y + SYNC signal
output at pin 19. Together both outputs give the
Y +C (SVHS) signals.
BLACK AND BLANKING LEVELS IN PAL AND NTSC MODES
PAL mode: Fig.9 illustrates the nominal Y + SYNC signal
at pin 22, the difference between black and blanking level
is 0 mV.
NTSC mode: Fig.10 illustrates the nominal Y + SYNC
signal at pin 22, the difference between black and blanking
level is 53 mV.
Because of the difference between the black and blanking
level in the NTSC mode, there are two options for NTSC.
(1) frequency response.
(2) group delay.
Fig.8 Band pass filter nominal frequency/group
delay response (NTSC mode).
April 1993
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Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
NTSC option with internal set-up generation
Pin 4 connected to ground or left open-circuit. The set-up
is generated internally and the input signals have the
values already specified in section Input stage. The set-up
is not suppressed during vertical sync.
NTSC option without internal set-up generation
Pin 4 connected to VCC. This option places some
restrictions on the input signals as follows:
• if the output signal must be according to the NTSC
standard, the input signals must be generated with a
specific set-up level
• for R, G and B inputs a set-up level of 53 mV is required,
therefore the specified amplitude must be 753 mV
(peak-to-peak) instead of 700 mV (peak-to-peak)
• for U, V and Y inputs a set-up level for Y of 76 mV is
required, therefore the specified amplitude must be
1076 mV (peak-to-peak) (without sync) instead of 1 V
(peak-to-peak). This option, combined with U, V and Y
inputs, is not possible if VCC is < 4.75 V.
Fig.9 Nominal Y + SYNC signal level at pin 22
(PAL mode).
Fig.10 Nominal Y +SYNC signal level at pin 22
(NTSC mode).
April 1993
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Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
Oscillator and Filter Control
Sync separator and Pulse shaper
The internal crystal oscillator is connected to pin 23 which
provides for the external connection of a crystal in series
with a trimmer to ground. It is possible to connect an
external signal source to pin 23, via a capacitor in series
with a resistor. The signal shape is not important.
Figure 11 shows the external components connected to
pin 23 and the required conditions. The minimum AC
current of 50 µA must be determined by the resistors
(Rint and Rext) and the voltage of the signal source. For
example, in this way an external sub-carrier, locked to the
sync, can be used.
The composite sync (CS) input at pin 24 (via the sync
separator) together with a sawtooth generator provide the
source for all pulses necessary for the processing.
Pulses are used for:
• clamping
• video blanking
• H/2
• chrominance blanking
• burst pulse generation for adding to U, V
• pulses for the modulator offset control.
The value of the sawtooth generator output (current) is
determined by the value of a fixed resistor to ground which
is connected externally at pin 21 (BURST ADJ). When
finer tolerance of the burst position is required, the fixed
resistor is connected in series with a variable
PAL mode:
frequency of the oscillator is
4.433618 MHz.
NTSC mode: frequency of the oscillator is
3.579545 MHz.
potentiometer to ground. By use of the potentiometer the
burst position at the outputs can be finely adjusted, after
which the pulse width of the burst and the position and
pulse width of all other internal pulses are then
determined. When using a fixed resistor with a tolerance of
2%, a tolerance of 10% of the burst position can be
expected. Timing diagrams of the pulses are provided by
Figs 12 and 13.
The −3 dB of the low pass filters and the centre frequency
of the bandpass filter are controlled by the filter control
loop and directly coupled to the value of the frequency of
the oscillator. The external capacitor of the control loop is
connected to pin 15.
H/2 at pin 4 is only necessary in the PAL mode when the
internal H/2 pulse requires locking with an external H/2
phase (two or more encoders locked in same phase). The
forcing of the internal H/2 to a desired phase is possible by
means of an external pulse. Forcing is active at HIGH
level.
For the functioning of Pin 4 in the NTSC mode see also
section Black and Blanking levels in PAL and NTSC
modes.
Fig.11 Tuning circuit for external signal source.
April 1993
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Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
April 1993
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Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
April 1993
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Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
PAL/NTSC and Y/Y + SYNC
Pin 17 is used as a four level control pin to condition the Y/Y + SYNC input signal (via pin 5). Pin 17 is normally connected
to ground for PAL mode, or to VCC for the NTSC mode. By use of external resistors (potential divider connected to
pin 17), the input blanking at pin 5 can be switched on and off. (see Table 1 and Fig 14).
Table 1 PAL/NTSC Y/Y +SYNC pin 5 options (pin 17 connection configurations).
MODE
PAL
PIN 5 STATUS
PIN 17 CONNECTION REQUIREMENT
Y without sync and input blanking on pin 17 LOW, connected to VSS
Y without sync and input blanking on pin 17 HIGH, connected to VCC
NTSC
PAL
Y with sync and input blanking off
Y with sync and input blanking off
pin 17 with 39 kΩ connected to VCC and 22 kΩ connected to VSS
pin 17 with 22 kΩ connected to VCC and 39 kΩ connected to VSS
NTSC
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC134); all voltages referenced to VSS (pin 10).
SYMBOL PARAMETER MIN. MAX.
positive supply voltage 5.5
UNIT
VCC
Tstg
0
V
storage temperature
−65
−25
+150
+70
°C
°C
Tamb
operating ambient temperature
THERMAL RESISTANCE
SYMBOL
PARAMETER
THERMAL RESISTANCE
Rth j-a
from junction to ambient in free air
SOT234
SOT137
66 K/W
75 K/W
DC CHARACTERISTICS
VCC = 5 V; Tamb = 25 °C; all voltages referenced to ground (pin 10); unless otherwise specified.
SYMBOL
Supply (pin 8)
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VCC
ICC
supply voltage
supply current
4.5
5.0
5.5
V
−
40
−
mA
mW
V
Ptot
total power dissipation
−
200
2.5
−
VREF
reference voltage output (pin 13)
2.425
2.575
April 1993
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Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
AC CHARACTERISTICS
VCC = 5 V; Tamb = 25 °C; composite sync signal connected to pin 24; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Encoder circuit
Input stage (pins 1, 3, 5, 7, 9 and 11); black level = clamping level
maximum signal
Vn(max)
Vn(min)
Ibias
from black level positive
from black level negative
input bias current
−
1.2
−
V
V
only pins 1, 3 and 5
VI = V13
−
0.9
−
−
−
< 1
tbf
µA
VI
input voltage clamped
input capacitor
tbf
V13
V
connected to ground
ZI
input clamping impedance
II = 1 mA
IO = 1 mA
−
−
−
80
80
−
−
Ω
Ω
%
−
matrix and gain tolerance of R, G
and B signals
< 5
G
gain tolerance of Y, −(R−Y) and
−(B−Y)
−
−
< 5
%
MCONTROL (pin 2; note 1)
VIL
LOW level input voltage
Y, −(R−Y) and −(B−Y)
0
1
−
−
0.4
5
V
V
VIH
HIGH level input voltage
R, G and B
II
input current
−
−
−
−3
µA
tsw
switching time
50
−
ns
U modulator offset control (pin 6)
V6
DC voltage control level
input leakage current
−
−
−
−
2.5
−
−
V
ILI
100
−
nA
V
VLL
VHL
limited level voltage LOW
limited level voltage HIGH
1.8
3.2
−
V
V modulator offset control (pin 12)
V12
ILI
DC voltage control level
input leakage current
−
−
−
−
2.5
−
−
V
100
−
nA
V
VLL
VHL
limited level voltage LOW
limited level voltage HIGH
1.8
3.2
−
V
Y + SYNC (pin 22 out to delay circuit)
RO
output resistance
−
−
< 25
Ω
Isink
Isource
VBL
maximum sink current
maximum source current
black level output voltage
350
1000
−
−
−
−
−
µA
µA
V
−
2.5
April 1993
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Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
PAL mode; pin 17 = 0 V
VSYNC
VY
sync voltage amplitude
285
300
315
mV
Y voltage amplitude
665
700
0
735
mV
mV
VDIF
difference between black and
blanking level
−
−
NTSC mode; pin 17 = 5 V and pin 4 open-circuit or ground
VSYNC
VY
sync voltage amplitude
Y voltage amplitude
270
628
−
286
661
53
300
694
−
mV
mV
mV
VDIF
difference between black and
blanking level
BW
frequency response
pin 22 with external
load of R = 10 kΩ and
C = 10 pF
10
−
−
MHz
group delay tolerance
−
−
20
ns
ns
ns
dB
td
td
α
sync delay from pin 24 to pin 22
Y delay from pin 5 to pin 22
Chrominance cross talk
220
−
290
10
−
360
−
0 dB = 1330 mV
(peak-to-peak)
= 75% RED
−
−60
Y + SYNC IN (pin 20 from delay circuit; note 2)
Ibias
VI
input bias current
−
−
−
−
1
1
µA
maximum voltage amplitude
V
Y + SYNC OUT (pin 19 output Y (SVHS); note 2)
RO
output resistance
−
120
−
−
−
−
−
−
Ω
Isink
Isource
VBL
G
maximum sink current
maximum source current
black level output voltage
650
1000
−
µA
µA
V
−
1.65
12
Y + SYNC gain;
−
dB
from pin 20 to pin 19
BW
frequency response
pin 19 with external
load of R = 10 kΩ and
C = 10 pF
10
−
−
MHz
group delay tolerance
Chrominance cross talk
−
−
−
−
20
ns
α
0 dB = 1330 mV
(peak-to-peak)
= 75% RED
−54
dB
April 1993
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Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
NOTCH (pin 18)
RO
output resistance
1750
2000
2500
Ω
VCC
Isink
DC voltage level
−
2.5
−
−
V
maximum sink current
350
−
µA
Chrominance output (pin 14)
Isink
maximum sink current
maximum source current
output resistance
700
1000
−
−
−
−
−
5
µA
µA
Ω
Isource
RO
−
120
−
∆VDC
variation of DC voltage level
when chrominance signal is
blanked and chrominance signal is
not blanked
−
mV
PAL mode; pin 17 = 0 V
VO chrominance output voltage
480
2.1
600
2.2
720
2.3
mV
mV
(peak-to-peak) amplitude burst
ratio: chrominance
(75% RED)/burst
NTSC mode; pin 17 = 5 V
VO
chrominance output voltage
460
2.1
−
570
2.2
37
−
680
2.3
−
(peak-to-peak) amplitude burst
ratio: chrominance
(75% RED)/burst
carrier suppression when
input-signals are 0 V
0 dB = 1330 mV
(peak-to-peak)
dB
phase accuracy (difference
−
2
degrees
between 0 and 90 degree carriers)
LPF
BPF
Vn
Low-pass filters
see Figs 3 and 4
see Figs 5 and 6
Band-pass filters
noise level (RMS value)
−
−
4
mV
BP
burst phase; 0 degrees = phase U carrier
PAL mode
−
−
−
±135
180
−
−
degrees
degrees
dB
NTSC mode
−
α
Y + SYNC cross talk
(0 to 6 MHz)
0 dB = 1400 mV
(peak-to-peak)
−60
April 1993
17
Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
CVBS output (pin 16)
Isink
Isource
VO
maximum sink current
650
−
−
−
µA
maximum source current
DC voltage level
1000
−
−
−
µA
V
Y +SYNC = 0
−
−
1.6
12
G
Y +SYNC gain;
dB
from pin 20 to pin 16
G
chrominance difference;
from pin 14 to pin 16
−
0
−
dB
Gø
GV
RO
differential phase
differential gain
output resistance
note 3
note 4
−
−
−
−
3
3
−
degrees
−
dB
120
Ω
Oscillator output (pin 23)
OSC series-resonance
the resonance resistance of the crystal should be < 60 Ω and the
parallel capacitance of the crystal should be < 10 pF.
Filter tuning loop (pin 15)
VDC
DC control voltage level NTSC
−
−
−
−
0.83
0.88
0.27
1.8
−
−
−
−
V
V
V
V
VDC
DC control voltage level PAL
limited DC-level LOW
VDCL
VDCH
IO = 200 µA
II = 200 µA
limited DC-level HIGH
H2 (pin 4)
VIL
VIH
II
LOW level input voltage
HIGH level input voltage
current for forcing HIGH
current for forcing LOW
voltage out LOW
inactive
active
0
−
−
−
−
−
−
−
−
1
V
4
5
V
220
260
−
−
µA
µA
V
IO
−
VO
VO
Isink
Isource
< 0.5
voltage out HIGH
4
−
−
−
V
maximum sink current
maximum source current
50
50
µA
µA
Composite sync input (pin 24)
VSYNC
SYNC pulse amplitude
slicing level
75
−
300
50
600
−
mV (p-p)
%
II
input current
−
4
−
µA
µA
IO
maximum output current during
SYNC
−
100
−
BURST ADJ (pin 21; note 5)
BP
DC voltage level
−
VREF
−
V
(V13)
April 1993
18
Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Control pin PAL/NTSC and Y/Y + SYNC (pin 17; note 6)
VI
VI
VI
VI
PAL mode and blanking pin 5
active
internal sync added to Y
0
−
−
−
−
−
1
V
V
V
V
PAL mode and blanking pin 5
inactive
internal sync not added to Y
1.6
4
2.0
5
NTSC mode and blanking pin 5
active
internal sync added to Y
NTSC mode and blanking pin 5
inactive
internal sync not added to Y
3
3.4
−10
Ibias
input bias current
−
µA
Notes
1. The threshold level of this pin is 700 mV ±20 mV. The specification of the HIGH and LOW levels is according to the
SCART fast blanking.
2. Pin 20 condition: black level of input signal must be 2.5 V; amplitude 0.5 V (peak-to-peak) nominal.
3. Definition: maximum phase − minimum phase = difference phase
maximum gain – minimum gain
4. Definition:
× 100 = difference gain %
----------------------------------------------------------------------------------
maximum gain
5. The output impedance of this pin is low (< 100 Ω). The nominal value of the external resistor is 196 kΩ (see also
section Sync separator and Pulse shaper).
6. The threshold levels are: 0.25 times VCC, 0.5 times VCC and 0.75 times VCC
.
April 1993
19
Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
Table 2 Internal circuitry.
PIN
NAME
−(R−Y)
CIRCUIT
DESCRIPTION
1
−(R−Y) input; connected via
47 nF capacitor
1.05 V (p-p) for EBU bar of 75%
see also pins 3, 5, 7, 9 and 11
2
MCONTROL
multiplexer switch control input
< 0.4 V Y, U and V
>1 V R, G and B
3
4
−(B−Y)
see pin 1
−(B−Y) input; connected via
47 nF capacitor
1.33 (p-p) for EBU bar of 75%
H/2
H/2 input
IN/OUT
PAL MODE:
pin open, output of internal H/2
Forcing possibility
NTSC mode:
0 V set-up
5 V no set-up
April 1993
20
Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
PIN
NAME
CIRCUIT
DESCRIPTION
5
Y
see pin 1
Y input; connected via 47 nF
capacitor
1 V (p-p) for EBU bar of 75%
6
U OFFSET
220 nF (low-leakage) connected
to ground see also pin 12
7
8
R
see pin 1
RED input; connected via 47 nF
capacitor
0.7 V (p-p) for EBU bar of 75%
VCC
supply voltage
5 V nominal
9
G
see pin 1
GREEN input; connected via
47 nF capacitor
0.7 V (p-p) for EBU bar of 75%
10
VSS
ground
11
B
see pin 1
BLUE input; connected via
47 nF capacitor
0.7 V (p-p) for EBU bar of 75%
April 1993
21
Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
PIN
NAME
CIRCUIT
DESCRIPTION
12
V OFFSET
see pin 6
220 nF (low-leakage) connected
to ground
13
14
15
VREF
2.5 V reference voltage
decoupling with 47 µF and 22 nF
capacitors
CHROMA
chrominance output; together with
pin 19 the Y + C (SVHS) output
FLT
filter control pin
220 nF capacitor to ground
April 1993
22
Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
PIN
NAME
CBVS
CIRCUIT
DESCRIPTION
16
CVBS output
17
PAL/NTSC
Y/Y+SYNC
4-level control pin
Pin 5:
0 V PAL, Y
1.8 V PAL Y+SYNC
3.2 V NTSC Y +SYNC
5 V NTSC Y
18
NOTCH
pin for external notch filter
April 1993
23
Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
PIN
NAME
CIRCUIT
DESCRIPTION
19
Y+SYNC OUT
output of the Y +SYNC signal;
together with pin 14 the Y +C
(SVHS) output
20
Y+SYNC IN
input of the delayed Y+SYNC
signal of the delay line
black level must be 2.5 V
21
BURST ADJ
external resistor to ground for
adjusting the position of the burst
April 1993
24
Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
PIN
NAME
CIRCUIT
DESCRIPTION
22
Y+SYNC OUT
output of the Y+SYNC signal,
connected to the delay line via a
resistor
23
OSC
subcarrier-crystal in series with a
trimmer, or an external
subcarrier signal, via 1 nF in
series with a resistor
24
CS
composite SYNC signal input
amplitude < 600 mV (p-p)
April 1993
25
Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
April 1993
26
Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
PACKAGE OUTLINES
SDIP24: plastic shrink dual in-line package; 24 leads (400 mil)
SOT234-1
D
M
E
A
2
A
A
L
1
c
(e )
w M
e
Z
1
b
1
M
H
b
24
13
pin 1 index
E
1
12
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
max.
A
A
2
max.
1
(1)
(1)
Z
w
UNIT
b
b
c
D
E
e
e
L
M
M
1
1
E
H
min.
max.
1.3
0.8
0.53
0.40
0.32
0.23
22.3
21.4
9.1
8.7
3.2
2.8
10.7
10.2
12.2
10.5
mm
4.7
0.51
3.8
1.778
10.16
0.18
1.6
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-04
SOT234-1
April 1993
27
Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
H
v
M
A
E
y
Z
24
13
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
12
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
0.25
0.01
1.27
0.050
1.4
0.25 0.25
0.01
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.61
0.014 0.009 0.60
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT137-1
075E05
MS-013AD
April 1993
28
Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
Several techniques exist for reflowing; for example,
SOLDERING
Introduction
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
SDIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
April 1993
29
Philips Semiconductors
Preliminary specification
PAL/NTSC encoder
TDA8501
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
April 1993
30
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