UAA3515A_技术文档

INTEGRATED CIRCUITS

DATA SHEET

UAA3515A

900 MHz analog cordless

telephone IC

Product speciﬁcation

2001 Dec 12

File under Integrated Circuits, IC17

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

CONTENTS

8

LIMITING VALUES

HANDLING

9

1

FEATURES

10

11

12

13

13.1

THERMAL CHARACTERISTICS

CHARACTERISTICS

PACKAGE OUTLINE

SOLDERING

1.1

1.2

1.3

1.4

1.5

1.6

1.7

Single frequency conversion FM receiver

Receiver baseband

Synthesizer

Transmitter

Transmitter baseband

Microcontroller interface

Power supplies

Introduction to soldering surface mount

packages

Reflow soldering

Wave soldering

Manual soldering

13.2

13.3

13.4

13.5

2

3

4

5

6

7

APPLICATIONS

GENERAL DESCRIPTION

ORDERING INFORMATION

BLOCK DIAGRAM

Suitability of surface mount IC packages for

wave and reflow soldering methods

14

15

16

DATA SHEET STATUS

DEFINITIONS

PINNING

FUNCTIONAL DESCRIPTION

DISCLAIMERS

7.1

Power supply and power management

Power supply

Power saving

Current consumption

FM receiver

7.1.1

7.1.2

7.1.3

7.2

7.2.1

7.3

Data comparator

Transmitter

7.4

Synthesizer

7.4.1

7.5

7.6

Calculation example

Receiver baseband

TX baseband

7.7

Voltage regulator

7.8

7.9

Low-battery detection

Microcontroller interface

Data registers

7.9.1

7.9.2

7.9.3

7.9.4

7.9.5

7.9.6

7.9.7

7.9.8

7.9.9

7.9.10

7.9.11

7.9.12

7.9.13

Active modes

Clock output divider

FM-PLL centre frequency

TX and RX gain control registers

Carrier detector threshold programming

Low-battery detection

Power amplifier output level

PLL charge pump current

Volume control

Crystal tuning capacitors

Voltage reference adjustment

Test mode

2001 Dec 12

2

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

1

FEATURES

1.4

Transmitter

1.1

Single frequency conversion FM receiver

• Internal buffered Power Amplifier (PA) with

programmable gain

• Integrated Low Noise Amplifier (LNA)

• Image reject mixer

• Data transmission summing amplifier.

• FM detector (10.7 MHz) with:

– IF limiter

1.5

Transmitter baseband

• Programmable transmitter gain

• Microphone amplifier

– wide band PLL demodulator

– output amplifier

• Compressor with Automatic Level Control (ALC) and

– Received Signal Strength Indicator (RSSI) output

• Carrier Detector (CD) with programmable threshold

• Programmable data amplifier (slicer) phase.

hard limiter.

1.6

Microcontroller interface

• Three-wire serial interface.

1.2

Receiver baseband

1.7

Power supplies

• Programmable receiver gain

• Expander

• Voltage regulator for internal PLL supplies

• Selectable voltage doubler

• Earpiece amplifier with volume control feature

• Data amplifier.

• Programmable Low-Battery Detection (LBD)

(time-multiplexed with RSSI carrier detector).

1.3

Synthesizer

2

APPLICATIONS

• Crystal reference oscillator with integrated tuning

capacitor

• Analog cordless telephone sets (900 MHz).

• Reference frequency divider

• Narrow band receiver PLL including VCO with

3

GENERAL DESCRIPTION

integrated variable capacitance diodes

The UAA3515A is a BiCMOS integrated circuit that

performs all functions from antenna to microcontroller in

reception and transmission for both base station and

handset of a 900 MHz cordless telephone set. In addition,

the implemented programming reduces significantly the

amount of external components, board space and external

adjustments required.

• Narrow band transmitter PLL including VCO with

integrated variable capacitance diodes

• Integrated VCO circuits designed to function with

external inductors etched directly as part of the

printed-circuit board (cost-saving feature)

• Programmable clock divider with output buffer to drive

the microcontroller.

4

ORDERING INFORMATION

TYPE

PACKAGE

NUMBER

NAME

DESCRIPTION

VERSION

UAA3515AHL

LQFP64

plastic, low proﬁle quad ﬂat package; 64 leads; body 10 × 10 × 1.4 mm SOT314-2

2001 Dec 12

3

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

6

PINNING

SYMBOL

DESCRIPTION

MIXGND

RFIX

1

2

mixer ground

LNA voltage (X) input

LNA voltage (Y) input

LNA ground

RFIY

3

LNAGND

RXLF

4

5

RX PLL ﬁlter output

RX phase detector voltage output

RSSI output

RXPD

RSSI

6

7

V_REG

8

pin for internal voltage regulator

digital ground

DGND

V_CC(CP)

9

10

internal voltage doubler supply voltage (or positive supply voltage input) for

charge pumps

CPGND

V_CC(PS)

TXPD

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

charge pump ground

prescaler positive supply voltage input

TX phase detector voltage input

TX PLL ﬁlter output

TXLF

PAGND1

PAO

power ampliﬁer ground 1

power ampliﬁer output

PAGND2

MODI

power ampliﬁer ground 2

summing ampliﬁer input

MODO

VTXGND

V_CC(VTX)

TXLOX

TXLOY

V_CC(ATX)

CCAP

TXO

summing ampliﬁer output

transmitter VCO ground

transmitter VCO positive supply voltage input

transmitter VCO voltage (X) to external inductor

transmitter VCO voltage (Y) to external inductor

transmitter audio positive supply voltage input

external capacitor for compressor

audio transmitter output

MICI

microphone ampliﬁer input

microphone ampliﬁer output

compressor input

MICO

CMPI

VB

reference voltage

ATXGND

XTALI

transmitter audio ground

crystal input

XTALO

CDLBD

crystal output

CD or LBD open collector output (out-of-lock synthesizer receiver and/or

transmitter in test mode)

CLKOUT

EN

35

36

37

38

clock output (CMOS levels)

enable input for serial interface

clock input for serial interface

data input for serial interface

CLK

DATA

2001 Dec 12

5

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

SYMBOL

DATO

DESCRIPTION

data ampliﬁer open collector output

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

DATI

data ampliﬁer input

ARXGND

EARO

EARI

audio receiver ground

earpiece ampliﬁer output

earpiece ampliﬁer input

V_CC(ARX)

ECAP

RXAI

audio receiver positive supply voltage input

external capacitor for expander

audio receiver input

LPFD

demodulator loop ﬁlter output

demodulator ampliﬁer output

demodulator ampliﬁer negative input

limiter input

DETO

PLLO

LIMI

IFGND

IFA2O

IFA2I

IF negative supply voltage

IF second ampliﬁer output

IF second ampliﬁer input

V_CC(IF)

IFA1O

IFA1I

IF positive supply voltage input

IF ﬁrst ampliﬁer output

IF ﬁrst ampliﬁer input

V_CC(VRX)

RXLOX

RXLOY

VRXGND

V_CC(BLO)

V_CC(MIX)

MIXO

receiver VCO positive supply voltage input

receiver VCO voltage (X) to external inductor

receiver VCO voltage (Y) to external inductor

receiver VCO ground

receiver LO buffer positive supply voltage input

mixers positive supply voltage input

mixer output

V_CC(LNA)

LNA positive supply voltage input

2001 Dec 12

6

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

handbook, full pagewidth

MIXGND

RFIX

1

2

48 DETO

LPFD

47

RFIY

3

46 RXAI

45 ECAP

V

LNAGND

RXLF

4

5

44

CC(ARX)

RXPD

RSSI

6

43 EARI

7

42 EARO

V

8

ARXGND

41

REG

UAA3515AHL

DGND

9

40 DATI

39 DATO

38 DATA

37 CLK

36 EN

V

10

CC(CP)

CPGND 11

V

12

CC(PS)

TXPD 13

TXLF 14

CLKOUT

35

PAGND1 15

PAO 16

34 CDLBD

33 XTALO

FCA294

Fig.2 Pin configuration.

2001 Dec 12

7

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

7

FUNCTIONAL DESCRIPTION

• Inactive mode: with the exception of the microcontroller

interface, all circuits are powered-down. The crystal

reference oscillator, the output clock buffer, the voltage

regulator and the voltage doubler can be disabled

separately. To reduce microcontroller current

consumption, the crystal frequency to the clock output

can be divided by 128. A low current consumption mode

for the crystal oscillator can be programmed.

7.1

Power supply and power management

7.1.1

POWER SUPPLY

The UAA3515A is used in a cordless telephone handset

and in a base unit. The handset unit is battery powered

and operates on three NiCd cells. The minimum supply

voltage (V_CC) is 2.9 V.

Latch memory is maintained in all modes. Blocks that are

powered are shown in Table 1 per operating mode.

7.1.2

POWER SAVING

When the UAA3515A is used in a handset, it is important

to minimize current consumption. The main operating

modes are:

The crystal oscillator, the clock output buffer, the voltage

reference adjustment, the power amplifier, the voltage

doubler, the earpiece, the hard limiter and the ALC can be

activated separately. Blocks that can be activated in each

mode are shown in Table 2.

• Active mode (talk): all blocks are powered

• RX mode: all circuits in the receiver part are powered

Table 1 Power operating modes

CIRCUIT BLOCK

ACTIVE MODE

RX MODE

INACTIVE MODE

Voltage reference adjustment

RF receiver

power ON

power OFF

RX PLL

RX and TX audio paths

RF TX (and PA, when enabled)

Table 2 Powered circuit blocks

CIRCUIT BLOCK

ACTIVE MODE

RX MODE

INACTIVE MODE

Crystal oscillator; note 1

power ON

power OFF

power ON

power OFF

power ON

power OFF

power ON

power OFF

Clock output buffer

Voltage reference enable; note 2

Power ampliﬁer (PA2 = 1)

Voltage doubler enable; note 3

Hard limiter and ALC not disabled

Earpiece ampliﬁer (earpiece enable = 1); note 4

Notes

1. In RX and active mode, the crystal oscillator is activated automatically. An external frequency can be forced at the

crystal pins XTALI and XTALO.

2. In RX and active mode, the voltage reference is enabled automatically (whether bit V_REGenable is logic 0 or 1).

3. If the voltage doubler is enabled, the crystal oscillator is activated automatically.

4. In inactive mode the amplifier is disabled automatically.

2001 Dec 12

8

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

7.1.3

CURRENT CONSUMPTION

The control bit values for selection of each mode and typical current consumption for the modes are shown in Table 3.

When clock out is activated there is an extra power demand proportional to the programmed output level (see Table 4

for examples). When bit Xtal high = 0 (oscillator is in low current consumption mode), the crystal in use must have losses

less than 20 Ω to ensure oscillator start-up.

Table 3 Typical current consumption

V_CC= 3.3 V; T_amb= 25 °C; f_(i)xtal= 10.24 MHz.

TYPICAL CURRENT

CONSUMPTION

POWER OPERATING MODE

CONDITIONS

Active mode

RX mode

76 mA

58 mA

<10 µA

230 µA

330 µA

550 µA

690 µA

Inactive mode

xtal active = 0; V_REGenable = 0; note 1

xtal active = 1; V_REGenable = 0; Xtal high = 0; note 1

xtal active = 1; V_REGenable = 0; Xtal high = 1; note 1

xtal active = 1; V_REGenable = 1; Xtal high = 1; note 1

xtal active = 1; V_REGenable = 1; Xtal high = 0; note 2

Notes

1. Voltage doubler and clock output buffer disabled.

2. Voltage doubler enabled, clock output buffer disabled.

Table 4 Examples of additional current consumption

V_CC= 3.3 V; T_amb= 25 °C; f_(i)xtal= 10.24 MHz; C_L(CLKOUT)= 14 pF.

CURRENT CONSUMPTION ADDITIONAL TO TYPICAL VALUE

DIVIDER RATIO

CLKO level = 0

CLKO level = 1

1, 2, 2.5, 4 or 128

off

770 µA

530 µA

0

7.2

FM receiver

The FM receiver (see Fig.3) has a single frequency conversion architecture with integrated image rejection mixer that

makes an external RF filter unnecessary. The Side Band Select (SBS) feature allows choice of frequency for RXLO to

be in or out of the ISM band allowing use of the same IC type for both base station and handset. IF channel filtering

(a compromise between price and performance) can be implemented simply using two or three external 10.7 MHz filters.

The integrated FM PLL demodulator with limiter decreases significantly the number of pins and external components

required.

2001 Dec 12

9

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

7.2.1

DATA COMPARATOR

7.3

Transmitter

The data comparator is an inverting hysteresis

comparator. An external bandpass filter is connected

between pins DETO and DATI (AC-coupled). The

open-collector output is current limited to control the output

signal slew rate. An external resistor of 180 kΩ should be

connected between pin DATO and V_CC. An external

capacitor in parallel with this resistor will reduce the slew

rate.

The transmitter architecture is of the direct modulation

type. The transmit VCO can be frequency modulated by

speech or data (see Fig.4). An amplifier sums the

modulating signal with the data TX signal before the VCO.

Frequency control is affected by integrated variable

capacitance diodes. To obtain the correct frequency,

external inductors in series with the bonding wires and

leadframe are required. The power amplifier is capable of

driving a 50 Ω load. The level of the output signal PAO is

programmed with two bits via the serial bus interface.

V

CC

handbook, full pagewidth

L

P

UAA3515A

PAO 16

XTAL

DUAL PLL

C

S

TXPD 13

FREQUENCY

TX VCO

SYNTHESIZER

TXLF

14

SUMMING

AMPLIFIER

VB

mod

TX

VOLTAGE

REGULATOR

VB

18

19

21

V

22

TXLOX

23

26

MODI

MODO

TXLOY TXO

CC(VTX)

FCA296

Data TX

Fig.4 Transmitter block diagram.

2001 Dec 12

11

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

7.4

Synthesizer

7.4.1

CALCULATION EXAMPLE

The crystal local oscillator and reference divider (see

Fig.5) provide the reference frequency for the RX and TX

PLLs. The 10-bit reference divider is programmed with

respect to the crystal frequency and the desired RX and

TX frequencies. The microcontroller operating frequency

of 4.096 MHz is derived from a 16.384 MHz crystal

frequency. The clock divider ratio can be programmed to

1, 2, 2.5, 4 or to 128; ratio 128 is chosen in sleep mode to

save current in the microcontroller section. Clock output

(pin CLKOUT) is an emitter follower output.

Given:

RF input frequency f_i(RF)= 903 MHz

VCO RX f_VCO(RX)= 892.3 MHz

f_IF= 10.7 MHz

VCO TX f_VCO(TX)= 925.6 MHz

Internal comparison frequency = 20 kHz

(f_XTAL= 10.24 MHz)

We have:

Reference divider = 512 (1000000000)

The 16-bit TX counter is programmed for the desired

transmit channel frequency. Similarly, the 16-bit RX

counter is programmed for the desired local oscillator

frequency. The divider counter comprises a 6-bit prescaler

with division ratios (R) from 64 to 127, and a 10-bit CMOS

divider with division ratios (C) from 8 to 1023. The full

counter provides division ratios from 512 to 65535.

Settings of RX and TX counters are calculated as follows:

892.3 × 10⁶

20 × 10³

M RX =

= 44615

------------------------------

C RX = 697 (1010111001) and R RX = 7 (000111)

and

925.6 × 10⁶

20 × 10³

M TX =

= 46280

------------------------------

M

C = int

------

64

C TX = 723 (1011010011) and R TX = 8 (001000)

R = M − C × 64

VCOs and variable capacitance diodes are integrated.

Resonance inductors are shared between bonding wires,

leadframe of the package and external inductors. Costs

can be reduced by etching external inductors directly onto

the printed-circuit board.

(where M is the division ratio between VCO frequency and

the reference frequency).

An on-chip selectable voltage doubler is provided to

enable a larger tuning range of both VCOs. The phase

detectors have current drive type outputs with selection

possibilities between 400 and 800 µA.

2001 Dec 12

12

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

7.5

Receiver baseband

The earpiece amplifier is a rail-to-rail inverting operational

amplifier. The non-inverting input is connected to the

internal reference voltage at pin VB. Software volume

control on the earpiece amplifier is achieved by using an

integrated switched feedback resistor R_int. The volume

control tuning range is 14 dB. Hardware volume control is

achieved by switching externally the earpiece feedback

This section covers the RX audio path from pins RXAI to

EARO (see Fig.6). The RXAI input signal is AC-coupled.

The microcontroller sets the value of the RX gain in

32 linear steps of 0.5 dB. The RX baseband has a mute

function and an expander with characteristics as shown in

Fig.7.

resistor R_ext

.

For audio level adjustment and, potentially for software

volume control, setting the RX gain provides a dynamic

range of 31 dB. This is achieved by the expander slope

that multiplies the RX gain by a factor of two for each gain

step thus giving 1 dB steps measured at the earpiece

amplifier output.

handbook, full pagewidth

RX MUTE

EXPANDER

RX GAIN

46 RXAI

45 ECAP

V

44

CC(ARX)

43 EARI

C

ext

R

ext

R

int

42 EARO

VB

EARPIECE

AMPLIFIER

UAA3515A

FCA298

Fig.6 RX baseband block diagram.

2001 Dec 12

14

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

FCA168

20

handbook, halfpage

V

o(EARO)

(dBV)

0

−20

−40

−60

+

y = 2 × 20

−40

−30

−20

−10

0

V

(dBV)

i(RXAI)

RX gain adjusted to 0 dB.

No external resistor.

VCTL = 00.

EXP_out= −7 dB at THD < 4%.

Fig.7 Expander characteristic.

7.6

TX baseband

The TX baseband has a compressor with the

characteristic shown in Fig.9. The ALC provides a ‘soft’

limit to the output signal swing as the input voltage

increases slowly (i.e. a sine wave is maintained at the

output). A hard limiter clamps the compressor output

voltage at 1.26 V (peak-to-peak). The ALC and the hard

limiter can be disabled via the microcontroller interface.

The hard limiter is followed by a mute circuit. The TX gain

is digitally programmable in 32 steps of 0.5 dB.

This section covers the TX audio path from pins MICI to

TXO (see Fig.8). The input signal at pin MICI is

AC-coupled. There is another AC-coupling at the

microphone amplifier output.

The microphone amplifier is an inverting operational

amplifier whose gain can be set by external resistors. The

non-inverting input is connected to the internal reference

voltage VB. External resistors are used to set the gain and

frequency response.

2001 Dec 12

15

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

handbook, full pagewidth

UAA3515A

COMPRESSOR HARD

LIMITER

MICROPHONE

AMPLIFIER

TX MUTE

TX GAIN

26 TXO

VB

ALC

27

MICI

28

29

25

FCA299

MICO

CMPI

CCAP

Fig.8 TX baseband block diagram.

FCA170

0

handbook, halfpage

(3)

V

TXO

(dBV)

−10

(2)

1

−

/ × 5

2

y =

(1)

−20

−30

(1) Slowly changing ALC signals:

V_CPMI= −16 dBV;

−40

−60

−40

−20

0

V

20

(dBV)

V_TXO= −13 dBV.

CMPI

(2)

V_CPMI= −2.5 dBV;

V_TXO= −11.5 dBV.

(3) Hard limiting signals:

V_CPMI= −4 dBV;

V_TXO= −1.26 V (p-p).

Fig.9 Compressor characteristic showing TXO as a function of CMPI.

16

2001 Dec 12

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

7.7

Voltage regulator

7.9

Microcontroller interface

Pin V_REGprovides the internal supply voltage for the

RX and TX PLLs. It is regulated at 2.7 V nominal voltage.

Two capacitors of 4.7 µF and 100 nF must be connected

to pin V_REGto filter and stabilize this regulated voltage. The

tolerance of the regulated voltage is initially ±8% but is

improved to ±2% after the internal bandgap voltage

reference is adjusted through the microcontroller.

The DATA, CLK and EN pins provide a 3-wire

unidirectional serial interface for programming the

reference counters, the transmit and receive channel

divider-counters and the control functions.

The interface consists of 19-bit shift registers connected to

a matrix of registers organized as 7 words of 16 bits (all

are control registers). The leading 16 bits include the data

D15 to D0. The trailing 3 bits set up the address AD2 to

AD0. The data is entered with the most significant bit D15

first and the last bit is AD0.

7.8

The low-battery detector measures the voltage level of the

_CCusing a resistance divider and a comparator. One

Low-battery detection

V

Pins DATA and CLK are used to load data into the shift

register. Figure 10 shows the timing required on all pins.

Data is clocked into the shift registers on negative clock

transitions.

input of the comparator is connected to VB, the other to the

middle point of the resistance divider. The comparator has

a built-in hysteresis to prevent spurious switching. The

precision of the detection depends on the divider

accuracy, the comparator offset and the accuracy of the

reference voltage VB. The output is multiplexed at pin

CDLBD. When the battery voltage level is under the

threshold voltage the output CDLBD is going LOW.

A new clock divider ratio is enabled using an extra EN

rising edge. Minimum hold time is 50 ns and during this

time no clock cycle is allowed. These extra EN edges can

be applied to all the data programmed but will have no

effect on the serial interface programming.

The pins DATA, CLK and EN are supplied by V_REG. The

ESD protection diodes on these pins are connected to

V_CC

.

2001 Dec 12

17

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

data bits (16)

address bits (3)

handbook, full pagewidth

DATA

D15

D14

D13

AD1

AD0

t

SU;DC

50%

CLK

t

END

HD;EC

(1)

t

SU;CE

w

EN

50%

data bits latched

FCA193

(1) The minimum pulse width should be equal to the period of the comparison frequency. The synthesizer prevents the internal EN signal occurring

during a comparison phase to avoid any phase error jump. The enable pulse width can be reduced to 100 ns for words that do not influence the

synthesizer (words 1, 2 and 3)

Fig.10 Digital signals timing requirement (except clock divider programming).

data bits (16)

address bits (3)

handbook, full pagewidth

DATA

D15

D14

D13

AD1

AD0

t

SU;DC

50%

CLK

t

HD;EC

t

SU;CE

END

EN

50%

data bits latched

FCA194

Fig.11 Digital signals timing requirement for clock divider programming.

18

2001 Dec 12

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

Table 7 Data register content description

DATA REGISTER NAME

SBS⁽¹⁾

BIT

DESCRIPTION

sideband select: (LO + IF) frequency is rejected

sideband select: (LO − IF) frequency is rejected

second ﬁlter select: the second IF ﬁlter is selected

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

SFS

second ﬁlter select: the second IF ﬁlter is deselected; note 2

clock output signal is regulated with respect to V_REG; V_CLKOUT(p-p)= 1 V

clock output signal is regulated with respect to V_CC; V_CLKOUT(p-p)= 1.4 V

crystal oscillator is active

CLKO level⁽³⁾

Xtal active

crystal oscillator is disable

Xtal high⁽⁴⁾

oscillator is in normal operation

oscillator is in low current consumption mode

DATA signal is inverted

DATA phase⁽⁵⁾

ALC disable

Hard limiter enable

RX mute

DATA signal is not inverted (inverter bypassed)

ALC disabled

normal operation

hard limiter enabled

hard limiter disabled

RX channel muted

normal operation

TX mute

TX channel muted

normal operation

V_REGenable

Doubler enable⁽⁶⁾

Earpiece enable

V_REGenabled

V_REGdisabled and tied to V_CC(in inactive mode)

voltage doubler is enabled

voltage doubler is disabled

earpiece enabled (can be used in RX mode for speciﬁc features)

earpiece disabled

Notes

1. Sideband select enables the user to have the RX local oscillator in or out of the ISM band and to use the same IC in

both handset and base.

2. A 4.5 dB insertion loss in the filter is assumed.

3. The clock output signal will be AC-coupled with the XTALI pin of the microcontroller. The external resonator from the

microcontroller can be removed. Caution needs to be taken that no radiation is present on the PCB

4. In inactive mode, the crystal oscillator is a major contributor to the full current consumption. When Xtal high = 0, the

current mode can be programmed to save current and in inactive mode this comes to full current consumption at

230 µA (see Section 7.1.3). When Xtal high = 1, the crystal oscillator current is increased by 100 µA.

5. Depending on the SBS-bit and the protocol chosen, the data may be inverted between the base and handset data

transmission.

6. Minimum supply voltage for the IC is 2.9 V which limits the voltage swing on both charge pumps to approximately

2.3 V. With the voltage doubler or with an external high supply voltage on pin V_CC(CP), the extra voltage availability

can be used to enhance the tuning range of the VCOs variable capacitance diodes. To save current in inactive mode,

XTAL

128

voltage doubler clock is the same as CLKO clock (can be programmed to

clock is XTALI divided by two.

); in other modes the voltage doubler

--------------

2001 Dec 12

20

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

7.9.2

ACTIVE MODES

When the clock output signal is used, an external RC filter

connected to pin CLKOUT can be added to limit clock

waveform edges and therefore clock radiation on the

printed-circuit board.

Table 8 Active mode bit selection; note 1

BIT 1

BIT 0

DESCRIPTION

0

1

X

0

1

inactive mode

RX mode

To supply the clock to the microcontroller and save current

in the handset, an external low power resonator may be

used and the clock output disabled (000) as well as the

crystal oscillator (Xtal active = 0). In power saving mode,

the divider ratio can be programmed down to 128 to

reduce the microcontroller power consumption.

active mode

Note

1. See details on activated blocks in Section 7.1.2.

7.9.3

CLOCK OUTPUT DIVIDER

The crystal oscillator produces a reference frequency that

is divided and buffered to drive a microcontroller. Table 9

gives the division ratios. The buffer is a CMOS output

which can drive up to 20 pF at 10 MHz in both CLKO level

modes.

Table 9 Clock division register

BIT 2

BIT 1

BIT 0

SELECT

CLOCK DIVISION RATIO

0

1

0

1

0

1

0

1

0

1

0

1

2

3

4

5

output disabled

2

2.5

4

1

128

2001 Dec 12

21

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

7.9.4

FM-PLL CENTRE FREQUENCY

This register allows the centre frequency of the VCO to be calibrated within the FM PLL to align the frequency as close

as possible to the nominal 10.7 MHz frequency.

Table 10 FM-PLL VCO tuning register

CENTRE

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

SELECT

FREQUENCY

SHIFT (MHz)

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

3.0

2.8

1

2

2.6

3

2.4

4

2.2

5

2.0

6

1.8

7

1.6

8

1.4

9

1.2

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

1.0

0.8

0.6

0.4

0.2

0

−0.2

−0.4

−0.6

−0.8

−1.0

−1.2

−1.4

−1.6

−1.8

−2.0

−2.2

−2.4

−2.6

−2.8

−3.0

−3.2

2001 Dec 12

22

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

7.9.5

TX AND RX GAIN CONTROL REGISTERS

The TX and RX audio signal paths each have a programmable gain block. If a TX or RX voltage gain other than the

nominal power-up default is desired it can be programmed through the microcontroller interface. The gain blocks can be

used during final telephone testing to adjust electronically gain tolerances in the telephone system. The RX gain and the

TX gain controls have steps of 0.5 dB covering a dynamic range of −7.5 to +8.0 dB. Measured on the earpiece amplifier

output, RX gain steps are multiplied by 2 due to the expander slope. A dynamic range of −15 to +16 dB at the earpiece

amplifier supports a volume control feature that can be implemented in the telephone and compensate for gain

tolerances. Volume control can also be performed externally with hardware switches on various resistor values.

Table 11 RX and TX gain control registers

BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 GAIN CONTROL RX GAIN (dB)

EARO (dB)

TX GAIN (dB)

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

−7.5

−7.0

−6.5

−6.0

−5.5

−5.0

−4.5

−4.0

−3.5

−3.0

−2.5

−2.0

−1.5

−1.0

−0.5

0

−15.0

−14.0

−13.0

−12.0

−11.0

−10.0

−9.0

−8.0

−7.0

−6.0

−5.0

−4.0

−3.0

−2.0

−1.0

0

−7.5

−7.0

−6.5

−6.0

−5.5

−5.0

−4.5

−4.0

−3.5

−3.0

−2.5

−2.0

−1.5

−1.0

−0.5

0

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

0.5

1.0

0.5

1.0

2.0

1.0

1.5

3.0

1.5

2.0

4.0

2.0

2.5

5.0

2.5

3.0

6.0

3.0

3.5

7.0

3.5

4.0

8.0

4.0

4.5

9.0

4.5

5.0

10.0

11.0

12.0

13.0

14.0

15.0

16.0

5.0

5.5

6.0

6.5

7.0

7.5

8.0

2001 Dec 12

23

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

7.9.6

CARRIER DETECTOR THRESHOLD PROGRAMMING

When the LBD active register = 0, the carrier detector is enabled and the signal CDout is sent to the output pin CDLBD.

If RSSI is above the programmed RSSI level, CDLBD = 0; if RSSI is below the programmed level then CDLBD = 1. The

carrier detector gives an indication if a carrier signal is present on the selected channel. The carrier detector has a

nominal value and tolerance, if a different carrier detect threshold value is desired, this can be programmed through the

microcontroller interface. If the carrier detect range is to be scaled, an external resistor should be connected between

pin RSSI and ground. CD control = 10011 which corresponds to RSSI = 0.86 V (typical DC value).

Table 12 CD levels register

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

SELECT

RSSI VOLTAGE THRESHOLD DETECT (V)

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

0.1

0.14

0.18

0.22

0.26

0.3

1

2

3

4

5

6

0.34

0.38

0.42

0.46

0.5

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

0.54

0.58

0.62

0.66

0.7

0.74

0.78

0.82

0.86

0.9

0.94

0.98

1.02

1.06

1.1

1.14

1.18

1.22

1.26

1.3

1.34

2001 Dec 12

24

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

7.9.7

LOW-BATTERY DETECTION

When the LBD active register = 1, the low battery detector is enabled and the signal BDout passes to the output CDLBD.

If V_CCis below the programmed LBD level, CDLBD = 0; if not below the programmed level, CDLBD = 1. The power-up

default value is 110.

Table 13 LBD level register

BIT 2

BIT 1

BIT 0

SELECT

LOW BATTERY VOLTAGE DETECTION; NOMINAL VALUE (V)

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

2

3

4

5

6

7

3.5

3.4

3.3

3.2

3.1

3.0

2.9

2.8

7.9.8

POWER AMPLIFIER OUTPUT LEVEL

The power amplifier output register has two bits to modify the output power and one bit to disable the power amplifier

(PA output bit 2 = 0). Duplexer matching (300 Ω to 50 Ω) is performed using a parallel inductive/series capacitive

network. Output power on 50 Ω is specified in Table 14. To get power on the antenna, duplexer insertion loss should be

removed. At maximum power, 3 mA extra DC current is consumed compared with the current at the minimum power

settings.

Table 14 PA output register

PA OUTPUT

POWER (dBm)

2ndHARMONIC 3rd HARMONIC 4th HARMONIC

BIT 2

BIT 1

BIT 0

SELECT

(dBm)

0

1

X

0

1

X

0

1

0

1

−

0

1

2

3

PA inactive

−

1.0

1.9

2.5

3.1

−17

−19

−23

−327

−29

−33

−36

−34

−36

−40

7.9.9

PLL CHARGE PUMP CURRENT

Performance of the PLLs can be improved by increasing charge pump current. Then a programmable current on both

RX and TX charge pump can be programmed. RX and TX charge pump currents are programmed independently. When

the RX or TX charge pump current register = 0, charge pump current is 400 µA; when it is set to 1, charge pump current

is 800 µA.

2001 Dec 12

25

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

7.9.10 VOLUME CONTROL

The register VCTL enables the volume control of the earpiece amplifier to be set to a predefined gain. This is achieved

by switched feedback resistor R_int. The optional resistor R_ext, connected between pins EARI and EARO provides the

hardware control.

Table 15 Volume control bit selection

BIT 1

BIT 0

R_int(kΩ)

14

R_ext(kΩ)

none

100

G_EAR(dB)

0

1

0

1

0

1

0

24

4.7

9.3

14

41

70.2

9.4

4.1

−1

33

15

7.9.11 CRYSTAL TUNING CAPACITORS

On-chip crystal reference tuning is provided to compensate for frequency spread over process and temperature changes.

An external capacitor should be connected at pin XTALI; the value of the capacitor should be approximately 3 pF less

than the capacitance of pin XTALO. Internally, a programmable capacitance is available in parallel with the XTALI pin.

Tuning capacitance values are in the range 0 to 4.5 pF; see Table 16.

Table 16 Xtal tuning cap register

BIT 3

BIT 2

BIT 1

BIT 0

SELECT

CAPACITANCE (pF)

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0.2

0.5

0.8

1.1

1.4

1.7

2.0

2.3

2.6

2.9

3.2

3.5

3.8

4.1

4.4

4.7

2

3

4

5

6

7

8

9

10

11

12

13

14

15

2001 Dec 12

26

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

7.9.12 VOLTAGE REFERENCE ADJUSTMENT

An internal 1.5 V bandgap voltage reference provides the voltage reference for the low battery detect circuits, the V_REG

voltage regulator, the VB reference and all internal analog references. In inactive mode, the adjustment is disabled.

Table 17 Voltage reference adjust register

BIT 2

BIT 1

BIT 0

SELECT

NOMINAL VOLTAGE REFERENCE

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

2

3

4

5

6

7

−7%

−5%

−3%

−1%

1%

3%

5%

7%

7.9.13 TEST MODE

Test mode bits are used only for test in production and application tuning. The test bits must be set to 0 for normal

operation. Out-of-lock of synthesizers RX or TX can be monitored indirectly on pin CDLBD: the width of the ‘glitch’ that

occurs with out-of-lock gives a direct indication of the phase error on the PLL RX and/or TX. To tune the external

inductors of the RX and TX VCOs, a defined division ratio has to be programmed into the dividers, and then the image

frequency of the VCO can be read on pin CDLBD. Test mode can also be used to check the division ratio: a frequency

can be forced on the VCO or crystal pins and the programmed frequency can be read on pin CDLBD. There is a

divide-by-2 stage before the CDLBD pin, therefore all frequencies are divided-by-2. When both charge pumps are in the

high-impedance state, the VCOs can be measured as stand alone.

Table 18 Test mode register

BIT 2

BIT 1

BIT 0

SELECT

0

1

0

1

0

1

0

1

0

1

0

1

0

1

normal operation

XOR between internal signals ‘up’ and ‘down’ of the RX synthesizer

XOR between internal signals ‘up’ and ‘down’ of the TX synthesizer

XOR between internal signals ‘up’ and ‘down’ of the RX or TX synthesizers

reference divider output divided by 2

prescaler and main divider RX divided by 2

prescaler and main divider TX divided by 2

both synthesizer charge pumps are in high-impedance-state

2001 Dec 12

27

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

8

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER

V_CC

MIN.

−0.3

MAX.

UNIT

supply voltage

+6.0

+125

+80

V

T_stg

storage temperature

ambient temperature

−55

−20

°C

T_amb

9

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is

desirable to take normal precautions appropriate to handling MOS devices. Do not operate or store near strong

electrostatic fields.

Meets Class 1 ESD test requirements (human body model) in accordance with “EIA/JESD22-A114-B (June 2001)” and

class A ESD test requirements (machine model) in accordance with “EIA/JESD22-A115-B (October 1997)”.

10 THERMAL CHARACTERISTICS

SYMBOL

R_th(j-a)

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to ambient

in free air

68

K/W

2001 Dec 12

28

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

11 CHARACTERISTICS

V_CC= V_CC(PS)= V_CC(ATX)= V_CC(ARX)= V_CC(IF)= V_CC(BLO)= V_CC(MIX)= V_CC(LNA)= 3.3 V; T_amb= 25 °C; unless otherwise

speciﬁed.

SYMBOL

Supplies

V_CC

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

positive supply voltage to

2.9

3.3

5.5

V

pins V_CC(PS); V_CC(ATX)

_CC(ARX); V_CC(IF)

V_CC(BLO); V_CC(MIX)

V_CC(LNA)

;

V

;

PLL VOLTAGE REGULATOR

V_o(VREG)

regulated output voltage

V_REGenable = 0

_REGenable = 1

−

V_CC

−

V

inactive mode

2.5

2.65

−

2.7

−

2.9

2.75

3

V

before V_refadjustment

after V_refadjustment

I_o(VREG)

output current

C_VREG= 1 µF

mA

LOW BATTERY DETECTION: LBD active = 1

V_LBD

detection voltage range

2.8

−

3.5

V

∆V_LBD

number of detection

voltage steps

−

8

−

steps

V_hys

comparator hysteresis

−

18

−

mV

%

V_VB

[V_CC(high)– V_CC(low)] ×

---------

V_th

∆V_CC/V_CC

LBD accuracy

measured after V_refadjusted;

LBD = 010

0.5

5

Receiver section

LNA AND IMAGE REJECTION MIXER; f_i(RX)= 903 MHz

R_i(RX)

C_i(RX)

f_i(RX)

RF input resistance

RF input capacitance

RF input frequency

balanced

−

110

0.7

903

−

Ω

−

pF

902

10

928

−

MHz

dB

RL_i(RX)

return loss on match

RF input

note 1

G_conv(p)(RX)

CP1_RX

conversion power gain

balun input to MIXO pin;

matched to 330 Ω

−

22

−

dB

1 dB input compression

point

note 1

−23

dBm

IP3_RX

NF_RX

3^rdorder intercept point

−

−13

−

dBm

dB

overall noise ﬁgure,

RF front end

IF section excluded

4

5

IR

image frequency rejection in band of interest

IF resistive output load on pin MIXO

IF capacitive output load on pin MIXO

26

−

45

330

−

3

dB

Ω

R_L(RX)

C_L(RX)

−

pF

2001 Dec 12

29

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

IF AMPLIFIER SECTION: f₀= 10.7 MHz

G_IFAMP1

voltage or power gain of

ﬁrst IF ampliﬁer

330 Ω matched input and

output; SFS = 1; measured at

ampliﬁer output

−

22.5

−

dB

NF_IFAMP1

G_IFAMP2

noise ﬁgure of ﬁrst

IF ampliﬁer

330 Ω matched input and

output

−

7

−

dB

voltage or power gain of

second IF ampliﬁer

330 Ω matched input and

output; SFS = 1; measured at

ampliﬁer output

25

NF_IFAMP2

G_IFAMP

noise ﬁgure of second

IF ampliﬁer

330 Ω matched input and

output

−

14

43

7.5

−

dB

gain of IF ampliﬁer

section

330 Ω matched input and

output; SFS = 0

NF_IFAMP

noise ﬁgure of IF ampliﬁer

section

PLL DEMODULATOR: f₀= 10.7 MHz; f_dev= ±25 kHz; f_mod= 1 kHz

∆f_VCO/∆V

VCO gain

after calibration

−

760

−

kHz/V

MHz

f_VCO

VCO centre frequency

(free running)

open loop; all conditions

7.0

10.7

15.0

∆f_VCO

VCO frequency

adjustment

see Table 10

−

32

200

−

steps

kHz

kΩ

f_VCO(step)

BW_demod

f_dev(max)

R_L(DETO)

VCO centre frequency

step size

−

demodulator −3 dB

bandwidth

loop ﬁlter: see note 2

10

−

maximum frequency

deviation

−

±75

−

demodulator external

load on pin DETO

5

−

V_o(DETO)(RMS)PLL output voltage on

pin DETO (RMS value)

TX mode; R_L(DETO)= 10 kΩ;

ampliﬁer gain = 10; note 3

−

100

1.4

350

1.6

mV

V

V_o(DETO)(DC)

PLL output DC voltage on microcontroller adjustable DC

pin DETO component

1.2

FM RECEIVER: f₀= 903 MHz; f_dev= ±25 kHz; f_mod= 1 kHz; R_L(EARO)= 150 Ω in series with 10 µF (all with CCITT ﬁlter)

s_RFI

receiver sensitivity

measured at antenna; duplexer

insertion loss = 3 dB;

input level for 12 dB SINAD;

bandwidth = 100 kHz

RX mode

−

−115

−

dBm

TX mode; PA = 10;

−113.5

V_EARO(RMS)= 200 mV;

TX to RX duplexer isolation

is 35 dB minimum

2001 Dec 12

30

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

SYMBOL

S/N_FM

PARAMETER

CONDITIONS

TX mode;

MIN.

40

TYP.

45

MAX.

UNIT

dB

signal-to-noise ratio

−

V_i(RF)= −80 and −40 dBm;

PA = 10; CLKO level = 0;

V_EARO(RMS)= 200 mV

THD_FM

total harmonic distortion

TX mode; f_dev= ±60 kHz;

V_i(RF)= −80 and −40 dBm;

PA = 10; CLKO level = 0;

V_EARO(RMS)= 500 mV;

−

0.6

2

%

measured without CCITT ﬁlter

RSSI AND CARRIER DETECTION: VB = 1.5 V

RSSI

V_OH

V_OL

R_int

output current dynamic

range

−

68

−

dB

V

HIGH-level output voltage V_i(LIM)(RMS)= 0 mV; CD = 10011 0.9V_CC

at pin CDLBD

LOW-level output voltage V_i(LIM)= 0.1 V (RMS);

at pin CDLBD

−

0.1V_CC

V

CD = 10011

internal resistance

between pin RSSI and

V_CC

−

175

−

kΩ

V_det

voltage detection range

voltage detection step

hysteresis

0.05

−

1.6

−

V

∆V_det

V_hys

−

40

45

32

mV

steps

−

V_th(CD)

carrier sense threshold

microcontroller programmable

−

DATA COMPARATOR

V_i(DATC)(p-p)

comparator input signal

100

−

mV

(peak-to-peak value)

V_hys(DATC)

V_th(DATC)

hysteresis

25

40

75

mV

V

pin DATI threshold

voltage

−

V

_CC− 0.9 −

Z_i(DATC)

V_OH

pin DATI input impedance

150

240

−

kΩ

V

HIGH-level output voltage V_i(DATI)= V_CC− 1.4 V

LOW-level output voltage V_i(DATI)= V_CC− 0.4 V

0.9V_CC

−

V_OL

−

0.1V_CC

V

I_OHsink

pin DATO output sink

current

V_i(DATI)= V_CC− 0.4 V;

V_o(DATO)= 0.1V_CC

40

−

µA

Transmitter section

SUMMING AMPLIFIER

V_o(p-p)

pin MODO output voltage

(peak-to-peak value)

external feedback resistor between pins MODI and MODO 10

pin MODI bias voltage

−

94

240

mV

R_fb

−

kΩ

V_bias

−

2.2

V

2001 Dec 12

31

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

TX VOLTAGE-CONTROLLED OSCILLATOR AND POWER AMPLIFIER

f_VCO(TX)

VCO free running

frequency

note 1

−

910

−

MHz

Q_L(VCO)(TX)

quality factor of external

inductor

L = 3.9 nH;

f_VCO= 902 to 928 MHz

30

−

VCO gain

V

_TXLF= 0.5 V

−

50

25

−

MHz/V

∆f_VCO(TX)

-------------------------

V_TXLF= 1.5 V

∆V_TXLF

VCO modulation gain

V_MODO= 2.2V

−

530

−

kHz/V

∆ f _VCO(TX)

-------------------------

∆V_mod

N_VCO(TX)

VCO and power ampliﬁer P_o= 0 dBm;

phase noise

f_carrier= 925.6 MHz;

TX to RX duplexer isolation

is 35 dB minimum;L_ext= 3.9 nH

(both base and handset); loop

ﬁlter: see note 4

f

_offset= 20 MHz

_offset= 10 kHz

_offset= 1 kHz

−139

−150

−85

−60

2

−

dBc/Hz

dB

−

P_o(PA)

PA output power range

R_o= 50 Ω, L_P= 22 nH;

C_S= 1.6 pF (see Fig.4)

∆P_o(PA)

P_o(PA)(max)

PA output power

adjustment

−

4

1

−

steps

dBm

PA maximum output

power

R_o= 50 Ω, L_P= 22 nH,

C_S= 1.6 pF (see Fig.4); remove

duplexer insertion loss to get

power on the antenna

TRANSMIT SYSTEM

THD_TX

total harmonic distortion

after demodulation

f_dev= ±60 kHz;

V_MODO= 225 mV (p-p);

CCITT ﬁlter included

−

1

2

%

α_ct(RX−TX)

RXVCO crosstalk on

PA output with respect to

output power

note 1

−45

−

dBc

Synthesizer

CRYSTAL OSCILLATOR: external capacitor on pin XTALO is 8.2 pF; on pin XTALI is 5.6 pF (indicative)

f_(i)XTAL

C_XTALI

crystal input frequency

4

10.24

4

20

MHz

pF

input capacitance on

pin XTALI

indicative; XTAL tuning cap = 8

(see Table 5)

−

C_XTALO

input capacitance on

pin XTALO

indicative

−

1.5

4.5

−

pF

∆C_TUNE

crystal tuning

on XTALI pin

capacitance range

2001 Dec 12

32

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

SYMBOL

N_TUNE

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

steps

number of capacitance

tuning steps

−

16

−

REFERENCE AND CLOCK DIVIDER

RDR

reference divider ratio

8

1

−

1023

128

20

CDR

clock divider ratio

5 steps (2, 2.5, 4, 1 and 128)

external to pin CLKOUT

C_L(CLKOUT)

clock output load

capacitance

pF

V_CLKOUT(p-p)

CLKOUT voltage swing

(peak-to-peak value)

CLKO level = 0

CLKO level = 1

−

1.4

1

−

V

s

t_sw(f1-f2)

switching time from

frequency f1 to f2

2

----

f2

RF TX AND RX PRESCALER AND MAIN DIVIDERS

f_RF

RF input frequency

prescaler divider ratio

main divider ratio

902

64

8

903

−

928

MHz

R_PDR

R_MDR

127

−

1023

Charge pump current

I_RXCPsink

RX charge pump sink

current

RXCPI = 0

RXCPI = 1

−

400

−

µA

800

I_RXCPsource

RX charge pump source RXCPI = 0

current

−400

−800

400

RXCPI = 1

I_TXCPsink

TX charge pump sink

current

TXCPI = 0

TXCPI = 1

TXCPI = 0

TXCPI = 1

800

I_TXCPsource

TX charge pump source

current

−400

−800

RX VCO

f_VCO

oscillator free running

frequency

note 1

−

910

−

MHz

Q_L(VCO)(RX)

external inductor quality

factor

f = 920 MHz; L = 3.9 nH

30

−

VCO gain

L

_ext= 4.7 nH at 890 MHz

∆ f _VCO(RX)

--------------------------

(3.9 nH for 935 MHz operation)

∆V_RXLF

V

_RXLF= 0.5 V

_RXLF= 1.5 V

−

55

30

−

MHz/V

V

N_VCO(RX)

VCO RX phase noise;

(indicative: cannot be

measured directly)

f_carrier= 892.3 MHz;

L_ext= 4.7 nH

(3.9 nH for 935 MHz operation);

loop ﬁlter: see note 5

f

_offset= 1 kHz

−

−58

−

dBc/Hz

f_offset= 10 kHz

−82

f_offset= 100 kHz

−102

2001 Dec 12

33

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

VOLTAGE DOUBLER (Doubler enable = 1)

V_CC(CP)

charge pump supply

voltage from voltage

doubler

V_CC= 3 V

−

5.2

−

V

I_CC(CP)

voltage doubler current

consumption

PLL locked

RX or TX mode

CDR = 128

−

300

130

−

µA

RX baseband

RX AUDIO PATH (see Fig.6): V_VB= 1.5 V; f_mod= 1 kHz; RX gain set for 0 dB at V_I(RXAI)= −20 dB; earpiece ampliﬁer gain

set by VCTL to 4.7 dB; with no external resistor and C_ext= 560 pF; measured with a CCITT ﬁlter, except THD;

Z_L(EARO)= 150 Ω in series with 10 µF

∆G_RX

RX gain adjustment

range

on RX gain ampliﬁer

on EARO

−7.5

−15

−

+8

+16

−

dB

−

dB

∆G_RX(steps)

RX gain adjustment steps programmable through

microcontroller interface

32

steps

∆G_RX(mute)

RX gain with mute on

expander gain

V_i(RXAI)= −20 dBV

−

−70

0

−60

+1

−18

−26

−

dB

G_EXP

−1

−22

−34

−

dB

V

_i(RXAI)= −30 dBV

_i(RXAI)= −35 dBV

−20

−30

−13

−7

dB

V

dB

V_i(RXAI)(max)

V_o(EXP)(max)

maximum input voltage

THD < 4%

dBV

maximum expander

output voltage (indicative:

cannot be measured

directly)

indicative; THD < 4%

−

N_RX

RX audio path noise

input impedance

BW = 300 Hz to 3.4 kHz

note 3

−

−83

−

dBVp

Z_i(RXAI)

TX mode

−

15

−

kΩ

ms

dB

RX mode

100

−

t_att(EXP)

t_rel(EXP)

α_ct(TX-RX)

expander attack time

expander release time

C_ECAP= 0.47 µF

2.0

5.0

80

−

TX compressor to

RX expander crosstalk

attenuation

measured between pins CMPI

and EARO; V_RXAI= 0;

V_CMPI= −20 dBV

−

V_{EARO(max)(p-p)}maximum output voltage THD < 4%

(peak-peak value)

−

2.2

−

V

R_L(EARO)

load resistance on

pin EARO for stable

earpiece ampliﬁer

in series with 10 µF capacitor

0.15

100

kΩ

G_EAR

earpiece ampliﬁer gain

set by internal resistors

without external

R_int= 14 kΩ

R_int= 24 kΩ

-1

0

+1

dB

3.7

8.3

13

4.7

9.3

14

5.7

10.3

15

R_int= 41 kΩ

components (R_extand

R_int= 70.2 kΩ

C_ext

)

2001 Dec 12

34

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

SYMBOL

G_EAR(dyn)

PARAMETER

CONDITIONS

MIN.

13

TYP.

14

MAX.

15

UNIT

dB

dynamic earpiece

ampliﬁer gain

THD_ARX

audio receiver total

harmonic distortion

V_i(RXAI)= −20 dBV

−

0.2

2

%

TX baseband

MICROPHONE AMPLIFIER: V_VB= 1.5 V; f_mod= 1 kHz

V_MICO(max)

maximum output voltage R_L= 10 kΩ; THD < 4%

−12

−

dBV

dB

∆G_V

voltage gain range

0

34

TX AUDIO PATH (see Fig.8): V_VB= 1.5 V; f_mod= 1 kHz; TX gain set for 10 dB at V_CMPI= −30 dBV

G_COMP

compressor gain level

ALC disable = 1;

9

10

11

dB

hard limiter enable = 0

∆G_COMP

change in compressor

gain referenced to

V_CMPI= −10 dBV

V_CMPI= −50 dBV

8

10

12

dB

−12

−10

−8

V_CMPI= −30 dBV

G_COMP(max)

V_HLIM(p-p)

maximum compressor

gain

V_CMPI= −70 dBV

−

23

−

dB

V

hard limiter output voltage ALC disable = 1;

(peak-to-peak value) hard limiter enable = 1;

V_CMPI= −4 dBV

1.26

V_TXO(max)

maximum output voltage ALC disable = 0

range

V

_CMPI= −12 dBV

_CMPI= −10 dBV

−

−12.5

−12.3

−11.5

0.3

−

1

dBV

%

V

V_CMPI= −2.5 dBV

THD_COMP

Z_CMPI

compressor total

harmonic distortion

ALC disable = 1;

V_CMPI= −10 dBV

input impedance on

pin CMPI

−

15

−

kΩ

t_att(COMP)

t_rel(COMP)

α_ct(RX-TX)

compressor attack time

C_CCAP= 0.47 µF

−

4.0

8.0

65

−

ms

dB

compressor release time C_CCAP= 0.47 µF

RX expander to

measured between pins RXAI

TX compressor crosstalk and TXO; V_CMPI= 0;

attenuation

V_RXAI= −10 dBV

∆G_TX

TX gain adjustment range programmable through

microcontroller interface

−7.5

−

+8

−

dB

∆G_TX(steps)

∆G_TX(mute)

Z_o(TXO)

TX gain adjustment steps programmable through

microcontroller interface

−

32

steps

dB

TX gain with mute on

ALC disable = 1;

−70

500

−60

−

V_CMPI= −10 dBV

output impedance at

pin TXO

Ω

2001 Dec 12

35

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Microcontroller interface

DC CHARACTERISTICS FOR DIGITAL PINS

V_IL

V_IH

LOW-level input voltage

serial interface

−

0.5

V

HIGH-level input voltage serial interface

V_CC

V_VREG

----------------

1.5

I_IL

LOW-level input current

HIGH-level input current

serial interface; V_IL= 0.3 V

−5

−

µA

I_IH

serial interface;

−

5

V_IH= V_REG− 0.3 V

I_OL

V_OL

V_OH

C_i

LOW-level output current pin CDLBD

20

−

µA

V

LOW-level output voltage pin CDLBD; R_L= 470 kΩ

HIGH-level output voltage pin CDLBD; R_L= 470 kΩ

−

0.1V_CC

0.9V_CC

−

8

V

input capacitance

output capacitance

serial bus

−

pF

C_o

pins RXPD and TXPD

SERIAL INTERFACE TIMING; CLK, DATA and EN (see Fig.10)

t_su(CLK-EN)

clock to enable set-up

time

50% signal level

50

−

ns

t_su(DATA-CLK)

input data to clock set-up 50% signal level

time

t_h(EN-CLK)

enable to clock hold time 50% signal level

clock frequency

50

−

ns

f_CLK

t_r

3

MHz

ns

input rise time

input fall time

10% to 90%

−

50

−

t_f

−

ns

t_END

delay from last falling

clock edge

100

ns

t_w

enable pulse width

see Fig.10

−

ns

1

---------------

fcomp

t_strt

microcontroller interface

start-up time

90% of V_VREGto DATA, CLK

and EN present

−

200

µs

Notes

1. Measured and guaranteed only on the Philips UAA3515A test board.

2. Loop filter: C₁= 1.8 nF; R₂= 4.7 kΩ; C₂= 150 nF (see “Report CTT01001”, available on request).

3. RXAI level will be higher in RX mode than in TX mode.

4. Loop filter: C₁= 3.9 nF; R₂= 6.8 kΩ; C₂= 47 nF (see “Report CTT01001”, available on request).

5. Loop filter: C₁= 470 nF; R₂= 1.8 kΩ; C₂= 4.7 µF (see “Report CTT01001”, available on request).

2001 Dec 12

36

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

12 PACKAGE OUTLINE

LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm

SOT314-2

y

X

A

48

33

Z

49

32

E

e

H

A

E

2

E

A

(A )

3

A

1

w M

p

θ

b

L

p

pin 1 index

L

64

17

detail X

1

16

Z

v

M

A

D

e

w M

b

p

D

B

H

v

M

B

D

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

UNIT

A

b

c

D

E

e

H

D

H

L

v

w

y

Z

E

θ

1

2

3

p

E

p

D

max.

7^o

0^o

0.20 1.45

0.05 1.35

0.27 0.18 10.1 10.1

0.17 0.12 9.9 9.9

12.15 12.15

11.85 11.85

0.75

0.45

1.45 1.45

1.05 1.05

1.60

mm

0.25

0.5

1.0

0.2 0.12 0.1

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

99-12-27

00-01-19

SOT314-2

136E10

MS-026

2001 Dec 12

37

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

13 SOLDERING

• Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

13.1 Introduction to soldering surface mount

packages

• For packages with leads on two sides and a pitch (e):

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for

certain surface mount ICs, but it is not suitable for fine pitch

SMDs. In these situations reflow soldering is

recommended.

The footprint must incorporate solder thieves at the

downstream end.

• For packages with leads on four sides, the footprint must

be placed at a 45° angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

13.2 Reﬂow soldering

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Several methods exist for reflowing; for example,

convection or convection/infrared heating in a conveyor

type oven. Throughput times (preheating, soldering and

cooling) vary between 100 and 200 seconds depending

on heating method.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 220 °C for

thick/large packages, and below 235 °C for small/thin

packages.

13.4 Manual soldering

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

13.3 Wave soldering

Conventional single wave soldering is not recommended

for surface mount devices (SMDs) or printed-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

2001 Dec 12

38

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

13.5 Suitability of surface mount IC packages for wave and reﬂow soldering methods

SOLDERING METHOD

PACKAGE

WAVE

not suitable

REFLOW⁽¹⁾

BGA, HBGA, LFBGA, SQFP, TFBGA

HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS

PLCC⁽³⁾, SO, SOJ

suitable

not suitable⁽²⁾

suitable

LQFP, QFP, TQFP

not recommended⁽³⁾⁽⁴⁾suitable

not recommended⁽⁵⁾

suitable

SSOP, TSSOP, VSO

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2001 Dec 12

39

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

14 DATA SHEET STATUS

PRODUCT

DATA SHEET STATUS⁽¹⁾

STATUS⁽²⁾

DEFINITIONS

Objective data

Development This data sheet contains data from the objective specification for product

development. Philips Semiconductors reserves the right to change the

speciﬁcation in any manner without notice.

Preliminary data

Qualiﬁcation

This data sheet contains data from the preliminary specification.

Supplementary data will be published at a later date. Philips

Semiconductors reserves the right to change the speciﬁcation without

notice, in order to improve the design and supply the best possible

product.

Product data

Production

This data sheet contains data from the product specification. Philips

Semiconductors reserves the right to make changes at any time in order

to improve the design, manufacturing and supply. Changes will be

communicated according to the Customer Product/Process Change

Notiﬁcation (CPCN) procedure SNW-SQ-650A.

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

15 DEFINITIONS

16 DISCLAIMERS

Short-form specification

The data in a short-form

Life support applications

These products are not

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductors customers using or selling these products

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

at these or at any other conditions above those given in the

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Right to make changes

Philips Semiconductors

reserves the right to make changes, without notice, in the

products, including circuits, standard cells, and/or

software, described or contained herein in order to

improve design and/or performance. Philips

Semiconductors assumes no responsibility or liability for

the use of any of these products, conveys no licence or title

under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that

these products are free from patent, copyright, or mask

work right infringement, unless otherwise specified.

Application information

Applications that are

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

no representation or warranty that such applications will be

suitable for the specified use without further testing or

modification.

2001 Dec 12

40

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

NOTES

2001 Dec 12

41

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

NOTES

2001 Dec 12

42

Philips Semiconductors

Product speciﬁcation

900 MHz analog cordless telephone IC

UAA3515A

NOTES

2001 Dec 12

43

Philips Semiconductors – a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com.

Fax: +31 40 27 24825

For sales ofﬁces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

SCA73

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

403506/01/pp44

Date of release: 2001 Dec 12

Document order number: 9397 750 08997


型号：	UAA3515A
厂家：	NXP
描述：	900 MHz analog cordless telephone IC 900 MHz模拟无绳电话IC 电话
文件：	总44页 (文件大小：180K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

UAA3515A [NXP]

相关型号：

UAA3515AHL

UAA3522

UAA3522HL

UAA3535

UAA3535HL

UAA3535HL

UAA3540

UAA3540TS

UAA3545

UAA3545HL

UAA3545HL/C1,118

UAA3546