CAV24C512_18 [ONSEMI]
EEPROM Serial 512-Kb I2C;型号: | CAV24C512_18 |
厂家: | ONSEMI |
描述: | EEPROM Serial 512-Kb I2C 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 |
文件: | 总18页 (文件大小:357K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CAV24C512
EEPROM Serial 512-Kb I2C
- Automotive Grade 1
Description
2
The CAV24C512 is a EEPROM Serial 512−Kb I C, internally
organized as 65,536 words of 8 bits each.
It features a 128−byte page write buffer and supports the Standard
(100 kHz), Fast (400 kHz) and Fast−Plus (1 MHz) I C protocol.
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2
Write operations can be inhibited by taking the WP pin High (this
protects the entire memory).
External address pins make it possible to address up to eight
CAV24C512 devices on the same bus.
On−Chip ECC (Error Correction Code) makes the device suitable
for high reliability applications.
SOIC−8
W SUFFIX
CASE 751BD
UDFN−8
HU5 SUFFIX
CASE 517BU
Features
• Automotive Temperature Grade 1 (−40°C to +125°C)
2
TSSOP−8
Y SUFFIX
CASE 948AL
WLCSP−8
C8A SUFFIX
CASE 567JL
• Supports Standard, Fast and Fast−Plus I C Protocol
• 2.5 V to 5.5 V Supply Voltage Range
• 128−Byte Page Write Buffer
• Hardware Write Protection for Entire Memory
PIN CONFIGURATIONS
2
• Schmitt Triggers and Noise Suppression Filters on I C Bus Inputs
Pin A1
Reference
A
A
A
V
CC
0
1
2
(SCL and SDA)
1
WP
• Low Power CMOS Technology
• 1,000,000 Program/Erase Cycles
• 100 Year Data Retention
• 8−lead SOIC, TSSOP, UDFN and 8−ball WLCSP Packages
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
SCL
SDA
SDA
VCC
WP
V
SS
SCL
A
2
SOIC (W, X), TSSOP (Y),
UDFN (HU5)
A
1
(Top View)
A
0
VSS
V
CC
For the location of
Pin 1, please consult
the corresponding
package drawing.
WLCSP (C8A)
(Top View)
SCL
CAV24C512
SDA
PIN FUNCTION
A , A , A
2
1
0
Pin Name
Function
Device Address
WP
A , A , A
0
1
2
SDA
Serial Data
Serial Clock
Write Protect
Power Supply
Ground
V
SS
SCL
WP
Figure 1. Functional Symbol
V
CC
V
SS
This document contains information on some products that are still under development.
ON Semiconductor reserves the right to change or discontinue these products without
notice.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
May, 2018 − Rev. 3
CAV24C512/D
CAV24C512
MARKING DIAGRAMS
C9L
ALL
YM
G
24512A
C12A
AYMXXX
UDFN−8 (HU5)
AYMXXX
G
G
C9L = Specific Device Code
A
= Assembly Location Code
TSSOP−8 (Y)
LL = Assembly Lot
SOIC−8 (W)
Y
M
G
= Year
= Month
= Pb−Free Package
24512A = Specific Device Code
C12A = Specific Device Code
A
Y
M
XXX
= Assembly Location Code
= Production Year (Last Digit)
= Production Month (1−9, O, N, D)
= Last Three Digits of
= Assembly Lot Number
= Pb−Free Microdot
A
Y
M
XXX
= Assembly Location Code
= Production Year (Last Digit)
= Production Month (1−9, O, N, D)
= Last Three Digits of
C9A
AYW
= Assembly Lot Number
= Pb−Free Microdot
G
G
WLCSP−8 (C8A)
C9A = Specific Device Code
A
Y
= Assembly Location
= Year
W
= Work Week
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameters
Ratings
Units
Storage Temperature
–65 to +150
–0.5 to +6.5
°C
Voltage on any Pin with Respect to Ground (Note 1)
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The DC input voltage on any pin should not be lower than −0.5 V or higher than V + 0.5 V. During transitions, the voltage on any pin may
CC
undershoot to no less than −1.5 V or overshoot to no more than V + 1.5 V, for periods of less than 20 ns.
CC
Table 2. RELIABILITY CHARACTERISTICS (Note 2)
Symbol
(Notes 3, 4)
Parameter
Min
1,000,000
100
Units
Program/Erase Cycles
Years
N
Endurance
END
T
DR
Data Retention
2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
and JEDEC test methods.
3. Page Mode, V = 5 V, 25°C.
CC
4. The device uses ECC (Error Correction Code) logic with 6 ECC bits to correct one bit error in 4 data bytes. Therefore, when a single byte
has to be written, 4 bytes (including the ECC bits) are re-programmed. It is recommended to write by multiple of 4 bytes in order to benefit
from the maximum number of write cycles.
Table 3. D.C. OPERATING CHARACTERISTICS V = 2.5 V to 5.5 V, T = −40°C to +125°C, unless otherwise specified.
CC
A
Symbol
Parameter
Read Current
Test Conditions
= 400 kHz/1 MHz
Min
Max
1
Units
mA
mA
mA
mA
V
I
Read, f
SCL
CCR
I
Write Current
V
CC
= 5.5 V
2.5
5
CCW
I
SB
Standby Current
I/O Pin Leakage
Input Low Voltage
Input High Voltage
Output Low Voltage
All I/O Pins at GND or V
T = −40°C to +125°C
A
CC
I
L
Pin at GND or V
T = −40°C to +125°C
A
2
CC
V
−0.5
0.3 V
CC
IL1
IH1
OL1
V
0.7 V
V
+ 0.5
V
CC
CC
V
I
OL
= 3.0 mA
0.4
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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2
CAV24C512
Table 4. PIN IMPEDANCE CHARACTERISTICS V = 2.5 V to 5.5 V, T = −40°C to +125°C, unless otherwise specified.
CC
A
Symbol
Parameter
Conditions
Max
8
Units
pF
C
C
(Note 5)
(Note 5)
SDA I/O Pin Capacitance
Input Capacitance (other pins)
WP Input Current, Address Input
V
IN
V
IN
V
IN
V
IN
V
IN
= 0 V
= 0 V
IN
IN
6
pF
I
, I (Note 6)
< V , V = 5.5 V
75
50
2
mA
WP
A
IH
CC
Current (A , A , A )
0
1
2
< V , V = 3.3 V
IH
IH
CC
> V
5. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
and JEDEC test methods.
6. When not driven, the WP, A , A , A pins are pulled down to GND internally. For improved noise immunity, the internal pull−down is relatively
0
1
2
strong; therefore the external driver must be able to supply the pull−down current when attempting to drive the input HIGH. To conserve power,
as the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x V ), the strong pull−down reverts to a weak current source.
CC
Table 5. A.C. CHARACTERISTICS (Note 7) V = 2.5 V to 5.5 V, T = −40°C to +125°C, unless otherwise specified.
CC
A
Standard
Fast
Fast−Plus
Min
Max
Min
Max
Min
Max
Symbol
Parameter
Clock Frequency
Units
kHz
ms
F
SCL
100
400
1,000
t
START Condition Hold Time
Low Period of SCL Clock
High Period of SCL Clock
START Condition Setup Time
Data In Hold Time
4
4.7
4
0.6
1.3
0.6
0.6
0
0.25
0.45
0.40
0.25
0
HD:STA
t
ms
LOW
t
ms
HIGH
t
4.7
0
ms
SU:STA
HD:DAT
t
ms
t
Data In Setup Time
250
100
50
ns
SU:DAT
t
(Note 8)
SDA and SCL Rise Time
SDA and SCL Fall Time
STOP Condition Setup Time
1,000
300
300
300
100
100
ns
R
t (Note 8)
ns
F
t
4
0.6
1.3
0.25
0.5
ms
SU:STO
t
Bus Free Time Between
STOP and START
4.7
ms
BUF
t
SCL Low to Data Out Valid
Data Out Hold Time
3.5
50
0.9
50
0.40
50
ms
ns
ns
AA
t
50
50
50
DH
T (Note 8)
Noise Pulse Filtered at SCL
and SDA Inputs
i
t
WP Setup Time
0
0
0
1
ms
ms
SU:WP
t
WP Hold Time
2.5
2.5
HD:WP
t
Write Cycle Time
Power-up to Ready Mode
5
1
5
1
5
1
ms
ms
WR
t
(Notes 8, 9)
0.1
PU
7. Test conditions according to “A.C. Test Conditions” table.
8. Tested initially and after a design or process change that affects this parameter.
9. t is the delay between the time V is stable and the device is ready to accept commands.
PU
CC
Table 6. A.C. TEST CONDITIONS
Input Levels
0.2 x V to 0.8 x V
CC
CC
Input Rise and Fall Times
Input Reference Levels
Output Reference Levels
Output Load
≤ 50 ns
0.3 x V , 0.7 x V
CC
CC
0.5 x V
CC
Current Source: I = 3 mA, C = 100 pF
L
L
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3
CAV24C512
Power-On Reset (POR)
device pulls down the SDA line to ‘transmit’ a ‘0’ and
releases it to ‘transmit’ a ‘1’.
Data transfer may be initiated only when the bus is not
busy (see A.C. Characteristics).
The CAV24C512 incorporates Power−On Reset (POR)
circuitry which protects the internal logic against powering
up in the wrong state.
The device will power up into Standby mode after V
exceeds the POR trigger level and will power down into
During data transfer, the SDA line must remain stable
while the SCL line is HIGH. An SDA transition while SCL
is HIGH will be interpreted as a START or STOP condition
(Figure 2).
CC
Reset mode when V drops below the POR trigger level.
CC
This bi−directional POR behavior protects the device
against brown−out failure, following a temporary loss of
power.
START
The START condition precedes all commands. It consists
of a HIGH to LOW transition on SDA while SCL is HIGH.
The START acts as a ‘wake−up’ call to all receivers. Absent
a START, a Slave will not respond to commands.
Pin Description
SCL: The Serial Clock input pin accepts the Serial Clock
signal generated by the Master.
STOP
SDA: The Serial Data I/O pin receives input data and
transmits data stored in EEPROM. In transmit mode, this pin
is open drain. Data is acquired on the positive edge, and is
delivered on the negative edge of SCL.
The STOP condition completes all commands. It consists
of a LOW to HIGH transition on SDA while SCL is HIGH.
The STOP starts the internal Write cycle (when following a
Write command) or sends the Slave into standby mode
(when following a Read command).
A , A and A : The Address pins accept the device address.
0
1
2
These pins have on−chip pull−down resistors.
WP: The Write Protect input pin inhibits all write
operations, when pulled HIGH. This pin has an on−chip
pull−down resistor.
Device Addressing
The Master initiates data transfer by creating a START
condition on the bus. The Master then broadcasts an 8−bit
serial Slave address. The first 4 bits of the Slave address are
set to 1010, for normal Read/Write operations (Figure 3).
Functional Description
The CAV24C512 supports the Inter−Integrated Circuit
The next 3 bits, A , A and A , select one of 8 possible Slave
2
1
0
2
(I C) Bus data transmission protocol, which defines a device
devices. The last bit, R/W, specifies whether a Read (1) or
Write (0) operation is to be performed.
that sends data to the bus as a transmitter and a device
receiving data as a receiver. Data flow is controlled by a
Master device, which generates the serial clock and all
START and STOP conditions. The CAV24C512 acts as a
Slave device. Master and Slave alternate as either
transmitter or receiver. Up to 8 devices may be connected to
Acknowledge
After processing the Slave address, the Slave responds
with an acknowledge (ACK) by pulling down the SDA line
during the 9th clock cycle (Figure 4). The Slave will also
acknowledge the byte address and every data byte presented
in Write mode. In Read mode the Slave shifts out a data byte,
and then releases the SDA line during the 9th clock cycle. If
the Master acknowledges the data, then the Slave continues
transmitting. The Master terminates the session by not
acknowledging the last data byte (NoACK) and by sending
a STOP to the Slave. Bus timing is illustrated in Figure 5.
the bus as determined by the device address inputs A , A ,
0
1
and A .
2
I2C Bus Protocol
2
The I C bus consists of two ‘wires’, SCL and SDA. The
two wires are connected to the V supply via pull−up
CC
resistors. Master and Slave devices connect to the 2−wire
bus via their respective SCL and SDA pins. The transmitting
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4
CAV24C512
SCL
SDA
START
CONDITION
STOP
CONDITION
Figure 2. Start/Stop Timing
1
0
1
0
A
2
A
1
A
0
R/W
DEVICE ADDRESS
Figure 3. Slave Address Bits
BUS RELEASE DELAY (TRANSMITTER)
BUS RELEASE DELAY (RECEIVER)
SCL FROM
MASTER
1
8
9
DATA OUTPUT
FROM TRANSMITTER
DATA OUTPUT
FROM RECEIVER
ACK SETUP (≥ t
)
SU:DAT
START
ACK DELAY (≤ t
)
AA
Figure 4. Acknowledge Timing
t
t
F
t
R
HIGH
t
t
LOW
LOW
SCL
t
t
HD:DAT
SU:STA
t
t
t
SU:DAT
SU:STO
HD:STA
SDA IN
t
BUF
t
AA
t
DH
SDA OUT
Figure 5. Bus Timing
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5
CAV24C512
Acknowledge Polling
WRITE OPERATIONS
Acknowledge polling can be used to determine if the
CAV24C512 is busy writing or is ready to accept
commands. Polling is implemented by interrogating the
device with a ‘Selective Read’ command (see READ
OPERATIONS).
Byte Write
In Byte Write mode the Master sends a START, followed
by Slave address, two byte address and data to be written
(Figure 6). The Slave acknowledges all 4 bytes, and the
Master then follows up with a STOP, which in turn starts the
internal Write operation (Figure 7). During internal Write,
the Slave will not acknowledge any Read or Write request
from the Master.
The CAV24C512 will not acknowledge the Slave address,
as long as internal Write is in progress.
Hardware Write Protection
With the WP pin held HIGH, the entire memory is
protected against Write operations. If the WP pin is left
floating or is grounded, it has no impact on the operation of
the CAV24C512. The state of the WP pin is strobed on the
last falling edge of SCL immediately preceding the first data
byte (Figure 9). If the WP pin is HIGH during the strobe
interval, the CAV24C512 will not acknowledge the data
byte and the Write request will be rejected.
Page Write
The CAV24C512 contains 65,536 bytes of data, arranged
in 512 pages of 128 bytes each. A two byte address word,
following the Slave address, points to the first byte to be
written. The most significant 9 bits (A to A ) identify the
15
7
page and the last 7 bits identify the byte within the page. Up
to 128 bytes can be written in one Write cycle (Figure 8).
The internal byte address counter is automatically
incremented after each data byte is loaded. If the Master
transmits more than 128 data bytes, then earlier bytes will be
overwritten by later bytes in a ‘wrap−around’ fashion
(within the selected page). The internal Write cycle starts
immediately following the STOP.
Delivery State
The CAV24C512 is shipped erased, i.e., all bytes are FFh.
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6
CAV24C512
S
T
A
R
T
S
T
BUS ACTIVITY:
MASTER
SLAVE
BYTE ADDRESS
8
O
P
ADDRESS
DATA
A
15
− A
A − A
7 0
SDA LINE
S
P
A
C
K
A
C
K
A
C
K
A
C
K
Figure 6. Byte Write Timing
SCL
SDA
8th Bit
Byte n
ACK
t
WR
STOP
START
CONDITION
ADDRESS
CONDITION
Figure 7. Write Cycle Timing
S
T
A
R
T
BUS
ACTIVITY:
MASTER
S
T
SLAVE
ADDRESS
BYTE ADDRESS
− A A − A
7 0
O
P
A
15
DATA
DATA n
DATA n+127
8
S
P
SDA LINE
A
C
K
A
C
K
A
C
K
A
C
K
A
A
A
C
K
C
K
C
K
Figure 8. Page Write Timing
ADDRESS
BYTE
DATA
BYTE
1
1
8
9
8
d
SCL
a
a
0
d
7
SDA
WP
7
0
t
SU:WP
t
HD:WP
Figure 9. WP Timing
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7
CAV24C512
READ OPERATIONS
The address counter can be initialized by performing a
‘dummy’ Write operation (Figure 11). Here the START is
followed by the Slave address (with the R/W bit set to ‘0’)
and the desired two byte address. Instead of following up
with data, the Master then issues a 2nd START, followed by
the ‘Immediate Address Read’ sequence, as described
earlier.
Immediate Address Read
In standby mode, the CAV24C512 internal address
counter points to the data byte immediately following the
last byte accessed by a previous operation. If that ‘previous’
byte was the last byte in memory, then the address counter
will point to the 1st memory byte, etc.
When, following a START, the CAV24C512 is presented
with a Slave address containing a ‘1’ in the R/W bit position
(Figure 10), it will acknowledge (ACK) in the 9th clock cycle,
and will then transmit data being pointed at by the internal
address counter. The Master can stop further transmission by
issuing a NoACK, followed by a STOP condition.
Sequential Read
If the Master acknowledges the 1st data byte transmitted
by the CAV24C512, then the device will continue
transmitting as long as each data byte is acknowledged by
the Master (Figure 12). If the end of memory is reached
during sequential Read, then the address counter will
‘wrap−around’ to the beginning of memory, etc. Sequential
Read works with either ‘Immediate Address Read’ or
‘Selective Read’, the only difference being the starting byte
address.
Selective Read
The Read operation can also be started at an address
different from the one stored in the internal address counter.
S
T
S
T
A
R
T
BUS ACTIVITY:
MASTER
SLAVE
ADDRESS
O
P
SDA LINE
S
P
A
C
K
N
O
A
C
K
DATA
SCL
SDA
8
9
8th Bit
DATA OUT
NO ACK
STOP
Figure 10. Immediate Address Read Timing
S
T
A
R
T
S
T
S
T
BUS ACTIVITY:
MASTER
A
R
T
BYTE ADDRESS
− A A − A
7 0
SLAVE
SLAVE
O
P
ADDRESS
ADDRESS
A
15
DATA
8
S
S
P
SDA LINE
N
O
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
Figure 11. Selective Read Timing
S
T
BUS ACTIVITY:
MASTER
SLAVE
ADDRESS
O
P
DATA n
DATA n+1
DATA n+2
DATA n+x
P
SDA LINE
N
O
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
Figure 12. Sequential Read Timing
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8
CAV24C512
ORDERING INFORMATION (Notes 10, 11, 12, 13)
Specific
Device
Lead
Finish
†
Marking
24512A
C12A
C9L
Device Order Number
CAV24C512WE−GT3
CAV24C512YE−GT3
CAV24C512HU5EGT3
CAV24C512C8ATR
Package Type
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Shipping
SOIC−8, JEDEC
TSSOP−8
NiPdAu
NiPdAu
NiPdAu
SnAgCu
Tape & Reel, 3,000 Units / Reel
Tape & Reel, 3,000 Units / Reel
Tape & Reel, 3,000 Units / Reel
Tape & Reel, 5,000 Units / Reel
UDFN−8
C9A
WLCSP−8
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
10.All packages are RoHS-compliant (Lead-free, Halogen-free).
11. The standard lead finish is NiPdAu.
12.For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Device
Nomenclature document, TND310/D, available at www.onsemi.com
13.For additional package and temperature options, please contact your nearest ON Semiconductor Sales office.
2
ON Semiconductor is licensed by the Philips Corporation to carry the I C bus protocol.
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9
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC 8, 150 mils
CASE 751BD−01
ISSUE O
DATE 19 DEC 2008
SYMBOL
MIN
NOM
MAX
1.35
A
1.75
A1
b
0.10
0.33
0.19
4.80
5.80
3.80
0.25
0.51
0.25
5.00
6.20
4.00
c
E1
E
D
E
E1
e
h
L
θ
1.27 BSC
0.25
0.40
0º
0.50
1.27
8º
PIN # 1
IDENTIFICATION
TOP VIEW
D
h
A1
θ
A
c
e
b
L
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MS-012.
98AON34272E
DOCUMENT NUMBER:
STATUS:
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
ON SEMICONDUCTOR STANDARD
REFERENCE:
DESCRIPTION: SOIC 8, 150 MILS
PAGE 1 OF2
DOCUMENT NUMBER:
98AON34272E
PAGE 2 OF 2
ISSUE
REVISION
DATE
19 DEC 2008
O
RELEASED FOR PRODUCTION FROM POD #SOIC8−002−01 TO ON
SEMICONDUCTOR. REQ. BY B. BERGMAN.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2008
Case Outline Number:
December, 2008 − Rev. 01O
751BD
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP8, 4.4x3
CASE 948AL−01
ISSUE O
DATE 19 DEC 2008
b
SYMBOL
MIN
NOM
MAX
A
A1
A2
b
1.20
0.15
1.05
0.30
0.20
3.10
6.50
4.50
0.05
0.80
0.19
0.09
2.90
6.30
4.30
0.90
E
c
E1
D
3.00
6.40
E
E1
e
4.40
0.65 BSC
1.00 REF
0.60
L
L1
0.50
0.75
0º
8º
θ
e
TOP VIEW
D
c
A2
A
q1
A1
L1
L
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-153.
98AON34428E
ON SEMICONDUCTOR STANDARD
DOCUMENT NUMBER:
STATUS:
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
REFERENCE:
DESCRIPTION: TSSOP8, 4.4X3
PAGE 1 OF2
DOCUMENT NUMBER:
98AON34428E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION FROM POD #TSSOP8−004−01 TO ON
SEMICONDUCTOR. REQ. BY B. BERGMAN.
19 DEC 2008
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2008
Case Outline Number:
December, 2008 − Rev. 01O
948AL
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN8 3.0x2.0, 0.5P
CASE 517BU−01
ISSUE O
DATE 06 APR 2011
SCALE 4:1
A
B
E
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
(0.065)
PIN 1
(0.127)
REFERENCE
DETAIL A
MILLIMETERS
0.15
C
DIM MIN
MAX
0.55
0.05
0.30
A
A1
b
0.45
0.00
0.20
0.15
C
TOP VIEW
D
2.00 BSC
D2
E
1.35
1.45
DETAIL A
3.00 BSC
0.05
C
C
E2
e
0.85
0.35
0.95
0.50 BSC
A
L
0.45
0.05
A1
SIDE VIEW
NOTE 4
GENERIC
MARKING DIAGRAM*
SEATING
C
PLANE
M
0.10
C A B
XXX
ALL
YM
G
D2
8X
L
1
4
M
0.10
C A B
XXX = Specific Device Code
A
= Assembly Location Code
LL = Assembly Lot
E2
Y
M
G
= Year
= Month
= Pb−Free Package
5
8
8X
b
e
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
M
C A B
0.10
NOTE 3
C D
M
0.05
BOTTOM VIEW
RECOMMENDED
MOUNTING FOOTPRINT
1.56
1.06
8X
0.63
3.30
PKG
OUTLINE
1
8X
0.32
0.50
PITCH
DIMENSIONS: MILLIMETERS
98AON55336E
DOCUMENT NUMBER:
STATUS:
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
DESCRIPTION: UDFN8 3.0 X 2.0, 0.5P
PAGE 1 OF 2
DOCUMENT NUMBER:
98AON55336E
PAGE 2 OF 2
ISSUE
REVISION
DATE
06 APR 2011
O
RELEASED FOR PRODUCTION. REQ. BY V. CRACIUNOIU.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
©
Semiconductor Components Industries, LLC, 2011
Case Outline Number:
April, 2011 − Rev. 01O
517BU
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP8, 1.39x1.65
CASE 567JL
ISSUE B
SCALE 4:1
DATE 06 MAY 2015
E
A
B
D
NOTES:
PIN A1
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
REFERENCE
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
4. DATUM C, THE SEATING PLANE, IS DEFINED
BY THE SPHERICAL CROWNS OF THE SOL-
DER BALLS.
2X
0.10
C
5. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER PARALLEL TO DA-
TUM C.
2X
0.10
0.10
C
TOP VIEW
MILLIMETERS
DIM
A
A1
A2
b
MIN
−−−
0.16
0.35 REF
0.22
MAX
0.60
0.22
A2
A
C
0.32
D
1.39 BSC
E
e
e1
1.65 BSC
0.50 BSC
0.433 BSC
0.08
C
A1
SIDE VIEW
SEATING
PLANE
NOTE 3
C
GENERIC
MARKING DIAGRAM*
e/2
e
8X
b
XXX
AYW
e1
0.05 C
0.03 C
A B
C
B
A
XXX = Specific Device Code
A
Y
W
= Assembly Location
= Year
= Work Week
1
2 3 4 5
BOTTOM VIEW
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
0.500
PITCH
0.433
PITCH
A1
PACKAGE
OUTLINE
8X
0.27
0.25
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
98AON80360F
ON SEMICONDUCTOR STANDARD
DOCUMENT NUMBER:
STATUS:
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
REFERENCE:
DESCRIPTION: WLCSP8, 1.39X1.65
PAGE 1 OF2
DOCUMENT NUMBER:
98AON80360F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
A
RELEASED FOR PRODUCTION. REQ. BY V. CRACIUNOIU
03 JAN 2014
10 APR 2015
CHANGED PACKAGE DIMENSIONS FROM 1.38X1.64 TO 1.39X1.65X0.60. REQ.
BY E. IONESCU.
B
CORRECTED MARKING DIAGRAM CODE INFORMATION. REQ. BY E. IONESCU.
06 MAY 2015
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2015
Case Outline Number:
May, 2015 − Rev. B
567JL
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
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application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
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