CAV24C64 [ONSEMI]

64-Kb I2C CMOS Serial EEPROM; 64 KB I2C CMOS串行EEPROM
CAV24C64
型号: CAV24C64
厂家: ONSEMI    ONSEMI
描述:

64-Kb I2C CMOS Serial EEPROM
64 KB I2C CMOS串行EEPROM

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器
文件: 总10页 (文件大小:132K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CAV24C64  
64-Kb I2C CMOS Serial  
EEPROM  
Description  
The CAV24C64 is a 64Kb CMOS Serial EEPROM device,  
internally organized as 8192 words of 8 bits each.  
http://onsemi.com  
It features a 32byte page write buffer and supports the Standard  
2
(100 kHz) and Fast (400 kHz) I C protocol.  
External address pins make it possible to address up to eight  
CAV24C64 devices on the same bus.  
SOIC8  
W SUFFIX  
TSSOP8  
Y SUFFIX  
Features  
Automotive Temperature Grade 1 (40°C to +125°C)  
CASE 751BD  
CASE 948AL  
2
Supports Standard and Fast I C Protocol  
2.5 V to 5.5 V Supply Voltage Range  
32Byte Page Write Buffer  
PIN CONFIGURATION  
1
A
A
A
V
0
1
2
CC  
Hardware Write Protection for Entire Memory  
CAV Prefix for Automotive and Other Applications Requiring Site  
and Change Control  
WP  
SCL  
SDA  
2
Schmitt Triggers and Noise Suppression Filters on I C Bus Inputs  
V
SS  
(SCL and SDA)  
SOIC (W), TSSOP (Y)  
Low Power CMOS Technology  
1,000,000 Program/Erase Cycles  
100 Year Data Retention  
For the location of Pin 1, please consult the  
corresponding package drawing.  
SOIC, TSSOP 8lead Packages  
This Device is PbFree, Halogen Free/BFR Free, and RoHS  
Compliant  
PIN FUNCTION  
Pin Name  
Function  
Device Address Input  
Serial Data Input/Output  
Serial Clock Input  
Write Protect Input  
Power Supply  
A , A , A  
0
1
2
V
CC  
SDA  
SCL  
WP  
SCL  
V
CC  
CAV24C64  
SDA  
A , A , A  
2
1
0
V
Ground  
SS  
WP  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 10 of this data sheet.  
V
SS  
Figure 1. Functional Symbol  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
March, 2011 Rev. 0  
CAV24C64/D  
CAV24C64  
DEVICE MARKINGS  
(TSSOP8)  
(SOIC8)  
C64F  
AYMXXX  
G
24C64F  
AYMXXX  
G
C64F  
A
= Specific Device Code  
= Assembly Location  
Y
M
XXX  
G
= Production Year (Last Digit)  
= Production Month (1-9, O, N, D)  
= Last Three Digits of Assembly Lot Number  
= PbFree Package  
24C64F = Specific Device Code  
A
= Assembly Location  
Y
M
XXX  
G
= Production Year (Last Digit)  
= Production Month (1-9, O, N, D)  
= Last Three Digits of Assembly Lot Number  
= PbFree Package  
Table 1. ABSOLUTE MAXIMUM RATINGS  
Parameters  
Ratings  
Units  
Storage Temperature  
–65 to +150  
–0.5 to +6.5  
°C  
Voltage on Any Pin with Respect to Ground (Note 1)  
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
1. During input transitions, voltage undershoot on any pin should not exceed 1 V for more than 20 ns. Voltage overshoot on pins A , A , A  
0
1
2
2
and WP should not exceed V + 1 V for more than 20 ns, while voltage on the I C bus pins, SCL and SDA, should not exceed the absolute  
CC  
maximum ratings, irrespective of V  
.
CC  
Table 2. RELIABILITY CHARACTERISTICS (Note 2)  
Symbol Parameter  
(Note 3)  
Min  
1,000,000  
100  
Units  
Program/Erase Cycles  
Years  
N
END  
Endurance  
T
DR  
Data Retention  
2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AECQ100  
and JEDEC test methods.  
3. Page Mode, V = 5 V, 25°C.  
CC  
Table 3. D.C. OPERATING CHARACTERISTICS  
(V = 2.5 V to 5.5 V, T = 40°C to +125°C, unless otherwise specied.)  
CC  
A
Symbol  
Parameter  
Test Conditions  
= 400 kHz  
Min  
Max  
Units  
mA  
mA  
mA  
mA  
V
I
Read Current  
Read, f  
Write, f  
1
2
5
2
CCR  
SCL  
I
Write Current  
= 400 kHz  
CCW  
SCL  
I
SB  
Standby Current  
I/O Pin Leakage  
Input Low Voltage  
Input High Voltage  
All I/O Pins at GND or V  
T = 40°C to +125°C  
A
CC  
I
Pin at GND or V  
CC  
L
IL  
IH  
V
0.5  
0.7 x V  
0.7 x V  
0.3 x V  
CC  
V
A , A , A and WP  
V + 0.5  
CC  
V
0
1
2
CC  
CC  
SCL and SDA  
> 2.5 V, I = 3 mA  
5.5  
0.4  
V
Output Low Voltage  
V
V
OL  
CC  
OL  
http://onsemi.com  
2
 
CAV24C64  
Table 4. PIN IMPEDANCE CHARACTERISTICS (V = 2.5 V to 5.5 V, T = 40°C to +125°C, unless otherwise specied.)  
CC  
A
Symbol  
Parameter  
SDA I/O Pin Capacitance  
Input Capacitance (other pins)  
WP Input Current  
Conditions  
Max  
8
Units  
pF  
C
C
(Note 4)  
(Note 4)  
(Note 5)  
V
V
V
V
V
V
V
V
V
V
= 0 V, T = 25°C  
A
IN  
IN  
IN  
IN  
IN  
IN  
IN  
IN  
IN  
IN  
IN  
IN  
= 0 V, T = 25°C  
6
pF  
A
I
< V , V = 5.5 V  
130  
120  
80  
2
mA  
WP  
IH  
CC  
< V , V = 3.3 V  
IH  
CC  
< V , V = 2.5 V  
IH  
IH  
CC  
> V  
I
(Note 5)  
Address Input Current  
(A0, A1, A2)  
Product Rev F  
< V , V = 5.5 V  
50  
35  
25  
2
mA  
A
IH  
CC  
< V , V = 3.3 V  
IH  
CC  
< V , V = 2.5 V  
IH  
IH  
CC  
> V  
4. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AECQ100  
and JEDEC test methods.  
5. When not driven, the WP, A0, A1 and A2 pins are pulled down to GND internally. For improved noise immunity, the internal pulldown is relatively  
strong; therefore the external driver must be able to supply the pulldown current when attempting to drive the input HIGH. To conserve power,  
as the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x V ), the strong pulldown reverts to a weak current source.  
CC  
Table 5. A.C. CHARACTERISTICS (V = 2.5 V to 5.5 V, T = 40°C to +125°C, unless otherwise specified.) (Note 6)  
CC  
A
Standard  
Fast  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Units  
kHz  
ms  
F
SCL  
Clock Frequency  
100  
400  
t
START Condition Hold Time  
Low Period of SCL Clock  
High Period of SCL Clock  
START Condition Setup Time  
Data In Hold Time  
4
4.7  
4
0.6  
1.3  
0.6  
0.6  
0
HD:STA  
t
ms  
LOW  
t
ms  
HIGH  
t
4.7  
0
ms  
SU:STA  
HD:DAT  
t
ms  
t
Data In Setup Time  
250  
100  
ns  
SU:DAT  
t
SDA and SCL Rise Time  
SDA and SCL Fall Time  
STOP Condition Setup Time  
Bus Free Time Between STOP and START  
SCL Low to Data Out Valid  
Data Out Hold Time  
1000  
300  
300  
300  
ns  
R
t (Note 6)  
ns  
F
t
4
0.6  
1.3  
ms  
SU:STO  
t
4.7  
ms  
BUF  
t
3.5  
0.9  
ms  
AA  
DH  
t
100  
100  
ns  
T (Note 6)  
Noise Pulse Filtered at SCL and SDA Inputs  
WP Setup Time  
100  
100  
ns  
i
t
0
0
ms  
SU:WP  
HD:WP  
t
WP Hold Time  
2.5  
2.5  
ms  
t
Write Cycle Time  
5
1
5
1
ms  
ms  
WR  
t
(Notes 7, 8) Powerup to Ready Mode  
PU  
6. Test conditions according to “AC Test Conditions” table.  
7. Tested initially and after a design or process change that affects this parameter.  
8. t is the delay between the time V is stable and the device is ready to accept commands.  
PU  
CC  
Table 6. A.C. TEST CONDITIONS  
Input Levels  
0.2 x V to 0.8 x V  
CC  
CC  
Input Rise and Fall Times  
Input Reference Levels  
Output Reference Levels  
Output Load  
50 ns  
0.3 x V , 0.7 x V  
CC  
CC  
0.5 x V  
CC  
Current Source: I = 3 mA; C = 100 pF  
OL  
L
http://onsemi.com  
3
 
CAV24C64  
I2C Bus Protocol  
The 2-wire I C bus consists of two lines, SCL and SDA,  
connected to the V supply via pull-up resistors. The  
Master provides the clock to the SCL line, and either the  
Master or the Slaves drive the SDA line. A ‘0’ is transmitted  
by pulling a line LOW and a ‘1’ by letting it stay HIGH. Data  
transfer may be initiated only when the bus is not busy (see  
A.C. Characteristics). During data transfer, SDA must  
remain stable while SCL is HIGH.  
Power-On Reset (POR)  
2
Each CAV24C64 incorporates Power-On Reset (POR)  
circuitry which protects the internal logic against powering  
up in the wrong state. The device will power up into Standby  
CC  
mode after V exceeds the POR trigger level and will  
CC  
power down into Reset mode when V drops below the  
CC  
POR trigger level. This bi-directional POR behavior  
protects the device against ‘brown-out’ failure following a  
temporary loss of power.  
START/STOP Condition  
Pin Description  
An SDA transition while SCL is HIGH creates a START  
or STOP condition (Figure 2). The START consists of a  
HIGH to LOW SDA transition, while SCL is HIGH. Absent  
the START, a Slave will not respond to the Master. The  
STOP completes all commands, and consists of a LOW to  
HIGH SDA transition, while SCL is HIGH.  
SCL: The Serial Clock input pin accepts the clock signal  
generated by the Master.  
SDA: The Serial Data I/O pin accepts input data and delivers  
output data. In transmit mode, this pin is open drain. Data is  
acquired on the positive edge, and is delivered on the  
negative edge of SCL.  
Device Addressing  
A , A and A : The Address inputs set the device address  
0
1
2
The Master addresses a Slave by creating a START  
condition and then broadcasting an 8-bit Slave address. For  
the CAV24C64, the first four bits of the Slave address are set  
that must be matched by the corresponding Slave address  
bits. The Address inputs are hard-wired HIGH or LOW  
allowing for up to eight devices to be used (cascaded) on the  
same bus. When left floating, these pins are pulled LOW  
internally.  
to 1010 (Ah); the next three bits, A , A and A , must match  
2
1
0
the logic state of the similarly named input pins. The R/W  
bit tells the Slave whether the Master intends to read (1) or  
write (0) data (Figure 3).  
WP: When pulled HIGH, the Write Protect input pin  
inhibits all write operations. When left floating, this pin is  
pulled LOW internally.  
Acknowledge  
th  
During the 9 clock cycle following every byte sent to the  
Functional Description  
The CAV24C64 supports the Inter-Integrated Circuit (I C)  
bus, the transmitter releases the SDA line, allowing the  
receiver to respond. The receiver then either acknowledges  
(ACK) by pulling SDA LOW, or does not acknowledge  
(NoACK) by letting SDA stay HIGH (Figure 4). Bus timing  
is illustrated in Figure 5.  
2
Bus protocol. The protocol relies on the use of a Master  
device, which provides the clock and directs bus traffic, and  
Slave devices which execute requests. The CAV24C64  
operates as a Slave device. Both Master and Slave can  
transmit or receive, but only the Master can assign those roles.  
SCL  
SDA  
START  
CONDITION  
STOP  
CONDITION  
Figure 2. Start/Stop Timing  
1
0
1
0
A
A
A
0
R/W  
2
1
DEVICE ADDRESS  
Figure 3. Slave Address Bits  
http://onsemi.com  
4
 
CAV24C64  
BUS RELEASE DELAY (TRANSMITTER)  
BUS RELEASE DELAY (RECEIVER)  
SCL FROM  
MASTER  
1
8
9
DATA OUTPUT  
FROM TRANSMITTER  
DATA OUTPUT  
FROM RECEIVER  
ACK SETUP (t  
)
SU:DAT  
START  
ACK DELAY (t  
)
AA  
Figure 4. Acknowledge Timing  
t
t
F
t
R
HIGH  
t
t
LOW  
LOW  
SCL  
t
t
HD:DAT  
SU:STA  
t
t
t
SU:DAT  
SU:STO  
HD:STA  
SDA IN  
t
BUF  
t
AA  
t
DH  
SDA OUT  
Figure 5. Bus Timing  
WRITE OPERATIONS  
Byte Write  
Acknowledge Polling  
To write data to memory, the Master creates a START  
condition on the bus and then broadcasts a Slave address  
with the R/W bit set to ‘0’. The Master then sends two  
address bytes and a data byte and concludes the session by  
creating a STOP condition on the bus. The Slave responds  
with ACK after every byte sent by the Master (Figure 6). The  
STOP starts the internal Write cycle, and while this  
As soon (and as long) as internal Write is in progress, the  
Slave will not acknowledge the Master. This feature enables  
the Master to immediately follow-up with a new Read or  
Write request, rather than wait for the maximum specified  
Write time (t ) to elapse. Upon receiving a NoACK  
WR  
response from the Slave, the Master simply repeats the  
request until the Slave responds with ACK.  
operation is in progress (t ), the SDA output is tri-stated  
and the Slave does not acknowledge the Master (Figure 7).  
WR  
Hardware Write Protection  
With the WP pin held HIGH, the entire memory is  
protected against Write operations. If the WP pin is left  
floating or is grounded, it has no impact on the Write  
operation. The state of the WP pin is strobed on the last  
Page Write  
The Byte Write operation can be expanded to Page Write,  
by sending more than one data byte to the Slave before  
issuing the STOP condition (Figure 8). Up to 32 distinct data  
bytes can be loaded into the internal Page Write Buffer  
starting at the address provided by the Master. The page  
address is latched, and as long as the Master keeps sending  
data, the internal byte address is incremented up to the end  
of page, where it then wraps around (within the page). New  
data can therefore replace data loaded earlier. Following the  
STOP, data loaded during the Page Write session will be  
st  
falling edge of SCL immediately preceding the 1 data byte  
(Figure 9). If the WP pin is HIGH during the strobe interval,  
the Slave will not acknowledge the data byte and the Write  
request will be rejected.  
Delivery State  
The CAV24C64 is shipped erased, i.e., all bytes are FFh.  
written to memory in a single internal Write cycle (t ).  
WR  
http://onsemi.com  
5
CAV24C64  
S
T
A
R
T
BUS ACTIVITY:  
MASTER  
S
T
ADDRESS  
BYTE  
ADDRESS  
BYTE  
DATA  
BYTE  
SLAVE  
O
P
ADDRESS  
a
15  
a  
a
7
a  
d d  
7 0  
8
0
S
P
* * *  
A
C
K
A
C
K
A
C
K
A
C
K
SLAVE  
*a a are don’t care bits.  
15  
13  
Figure 6. Byte Write Sequence  
SCL  
SDA  
8th Bit  
Byte n  
ACK  
t
WR  
STOP  
START  
ADDRESS  
CONDITION  
CONDITION  
Figure 7. Write Cycle Timing  
BUS  
ACTIVITY: S  
T
A
S
T
DATA  
BYTE  
n
DATA  
BYTE  
n+1  
DATA  
BYTE  
n+P  
SLAVE  
ADDRESS  
ADDRESS  
BYTE  
ADDRESS  
BYTE  
MASTER  
R
T
O
P
S
P
A
C
K
A
C
K
A
C
K
A
C
K
A
A
C
K
A
C
K
SLAVE  
C
K
Figure 8. Page Write Sequence  
ADDRESS  
BYTE  
DATA  
BYTE  
1
1
8
9
8
d
SCL  
SDA  
a
a
0
d
7
7
0
t
SU:WP  
WP  
t
HD:WP  
Figure 9. WP Timing  
http://onsemi.com  
6
CAV24C64  
READ OPERATIONS  
Immediate Read  
Write sequence by sending data, the Master then creates a  
START condition and broadcasts a Slave address with the  
R/W bit set to ‘1’. The Slave responds with ACK after every  
byte sent by the Master and then sends out data residing at  
the selected address. After receiving the data, the Master  
responds with NoACK and then terminates the session by  
creating a STOP condition on the bus (Figure 11).  
To read data from memory, the Master creates a START  
condition on the bus and then broadcasts a Slave address  
with the R/W bit set to ‘1’. The Slave responds with ACK  
and starts shifting out data residing at the current address.  
After receiving the data, the Master responds with NoACK  
and terminates the session by creating a STOP condition on  
the bus (Figure 10). The Slave then returns to Standby mode.  
Sequential Read  
Selective Read  
If, after receiving data sent by the Slave, the Master  
responds with ACK, then the Slave will continue  
transmitting until the Master responds with NoACK  
followed by STOP (Figure 12). During Sequential Read the  
internal byte address is automatically incremented up to the  
end of memory, where it then wraps around to the beginning  
of memory.  
To read data residing at a specic address, the selected  
address must rst be loaded into the internal address register.  
This is done by starting a Byte Write sequence, whereby the  
Master creates a START condition, then broadcasts a Slave  
address with the R/W bit set to ‘0’ and then sends two  
address bytes to the Slave. Rather than completing the Byte  
N
S
T
A
R
T
O
BUS ACTIVITY:  
MASTER  
S
A T  
C O  
K P  
SLAVE  
ADDRESS  
S
P
A
DATA  
C
SLAVE  
8
BYTE  
K
SCL  
SDA  
9
8th Bit  
DATA OUT  
NO ACK  
STOP  
Figure 10. Immediate Read Sequence and Timing  
N
O
BUS ACTIVITY:  
S
T
A
R
T
S
T
A
S
T
A
C
K
ADDRESS  
BYTE  
ADDRESS  
BYTE  
SLAVE  
SLAVE  
MASTER  
R
T
O
P
ADDRESS  
ADDRESS  
S
S
P
A
C
K
A
C
K
A
C
K
A
C
K
SLAVE  
DATA  
BYTE  
Figure 11. Selective Read Sequence  
N
O
A
C
K
BUS ACTIVITY:  
MASTER  
S
T
A
C
K
A
C
K
A
C
K
SLAVE  
ADDRESS  
O
P
P
A
C
K
SLAVE  
DATA  
BYTE  
n
DATA  
BYTE  
n+1  
DATA  
BYTE  
n+2  
DATA  
BYTE  
n+x  
Figure 12. Sequential Read Sequence  
http://onsemi.com  
7
 
CAV24C64  
PACKAGE DIMENSIONS  
SOIC 8, 150 mils  
CASE 751BD01  
ISSUE O  
SYMBOL  
MIN  
NOM  
MAX  
1.35  
A
1.75  
A1  
b
0.10  
0.33  
0.19  
4.80  
5.80  
3.80  
0.25  
0.51  
0.25  
5.00  
6.20  
4.00  
c
E1  
E
D
E
E1  
e
h
L
θ
1.27 BSC  
0.25  
0.40  
0º  
0.50  
1.27  
8º  
PIN # 1  
IDENTIFICATION  
TOP VIEW  
D
h
A1  
θ
A
c
e
b
L
SIDE VIEW  
END VIEW  
Notes:  
(1) All dimensions are in millimeters. Angles in degrees.  
(2) Complies with JEDEC MS-012.  
http://onsemi.com  
8
CAV24C64  
PACKAGE DIMENSIONS  
TSSOP8, 4.4x3  
CASE 948AL01  
ISSUE O  
b
SYMBOL  
MIN  
NOM  
MAX  
A
A1  
A2  
b
1.20  
0.15  
1.05  
0.30  
0.20  
3.10  
6.50  
4.50  
0.05  
0.80  
0.19  
0.09  
2.90  
6.30  
4.30  
0.90  
E
c
E1  
D
3.00  
6.40  
E
E1  
e
4.40  
0.65 BSC  
1.00 REF  
L
L1  
0.50  
0.60  
0.75  
0º  
8º  
θ
e
TOP VIEW  
D
c
A2  
A
q1  
A1  
L1  
L
SIDE VIEW  
END VIEW  
Notes:  
(1) All dimensions are in millimeters. Angles in degrees.  
(2) Complies with JEDEC MO-153.  
http://onsemi.com  
9
CAV24C64  
Example of Ordering Information  
CAV24C64WEGT3 (Note 11)  
Prefix  
Device #  
Suffix  
CAV  
24C64  
W
E
G  
T3  
Tape & Reel (Note 13)  
Temperature Range  
Lead Finish  
Company ID  
T: Tape & Reel  
3: 3,000 / Reel  
E = Automotive (40°C to +125°C)  
G: NiPdAu  
Product Number  
24C64  
Package  
W: SOIC, JEDEC  
Y: TSSOP  
9. All packages are RoHS-compliant (Lead-free, Halogen-free).  
10.The standard lead finish is NiPdAu.  
11. The device used in the above example is a CAV24C64WEGT3 (SOIC, Automotive Temperature, NiPdAu, Tape & Reel, 3,000/Reel).  
12.For other package options, please contact your nearest ON Semiconductor Sales office.  
13.For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
2
ON Semiconductor is licensed by Philips Corporation to carry the I C Bus Protocol.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
CAV24C64/D  
 

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