FDB8441-F085 [ONSEMI]

N 沟道,PowerTrench® MOSFET,40V,80A,2.5mΩ;
FDB8441-F085
型号: FDB8441-F085
厂家: ONSEMI    ONSEMI
描述:

N 沟道,PowerTrench® MOSFET,40V,80A,2.5mΩ

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FDB8441-F085  
®
N-Channel PowerTrench MOSFET  
40V, 80A, 2.5mΩ  
Features  
Applications  
„ Automotive Engine Control  
„ Typ rDS(on) = 1.9mat VGS = 10V, ID = 80A  
„ Powertrain Management  
„ Typ Qg(10) = 215nC at VGS = 10V  
„ Low Miller Charge  
„ Solenoid and Motor Drivers  
„ Low Qrr Body Diode  
„ Electronic Steering  
„ UIS Capability (Single Pulse and Repetitive Pulse)  
„ Integrated Starter / Alternator  
„ Qualified to AEC Q101  
„ RoHS Compliant  
„ Distributed Power Architectures and VRMs  
„ Primary Switch for 12V Systems  
©2010 Semiconductor Components Industries, LLC.  
September-2017, Rev. 1  
Publication Order Number:  
FDB8441-F085/D  
MOSFET Maximum Ratings TC = 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
40  
V
V
±20  
Drain Current Continuous (TC < 160oC, VGS = 10V)  
Continuous (Tamb = 25oC, VGS = 10V, with RθJA = 43oC/W)  
Pulsed  
80  
ID  
28  
See Figure 4  
947  
A
EAS  
Single Pulse Avalanche Energy  
(Note 1)  
mJ  
W
W/oC  
oC  
Power dissipation  
Derate above 25oC  
300  
PD  
2
TJ, TSTG  
Operating and Storage Temperature  
-55 to 175  
Thermal Characteristics  
RθJC  
RθJA  
RθJA  
Thermal Resistance Junction to Case  
0.5  
62  
43  
oC/W  
oC/W  
oC/W  
Thermal Resistance Junction to Ambient  
Thermal Resistance Junction to Ambient, 1in2 copper pad area  
(Note 2)  
Package Marking and Ordering Information  
Device Marking  
Device  
FDB8441-F085  
Package  
TO-263AB  
Reel Size  
330mm  
Tape Width  
Quantity  
800 units  
FDB8441  
24mm  
Electrical Characteristics TJ = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Off Characteristics  
BVDSS  
IDSS  
Drain to Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate to Source Leakage Current  
ID = 250µA, VGS = 0V  
40  
-
-
-
-
-
-
V
1
VDS = 32V  
µA  
nA  
V
GS = 0V  
TJ = 150°C  
-
250  
±100  
IGSS  
VGS = ±20V  
-
On Characteristics  
VGS(th)  
rDS(on)  
Gate to Source Threshold Voltage  
Drain to Source On Resistance  
VDS = VGS, ID = 250µA  
D = 80A, VGS = 10V  
2
-
2.8  
1.9  
4
V
I
2.5  
mΩ  
ID = 80A, VGS = 10V,  
TJ = 175°C  
-
3.3  
4.3  
Dynamic Characteristics  
Ciss  
Input Capacitance  
-
-
-
-
-
-
-
-
-
15000  
1250  
685  
1.1  
-
pF  
pF  
pF  
VDS = 25V, VGS = 0V,  
f = 1MHz  
Coss  
Crss  
Output Capacitance  
-
Reverse Transfer Capacitance  
Gate Resistance  
-
RG  
VGS = 0.5V, f = 1MHz  
VGS = 0 to 10V  
-
280  
38  
-
Qg(TOT)  
Qg(TH)  
Qgs  
Total Gate Charge at 10V  
Threshold Gate Charge  
Gate to Source Gate Charge  
Gate Charge Threshold to Plateau  
Gate to Drain “Miller” Charge  
215  
29  
nC  
nC  
nC  
nC  
nC  
VGS = 0 to 2V  
VDD = 20V  
ID = 35A  
Ig = 1mA  
60  
Qgs2  
Qgd  
32  
-
49  
-
www.onsemi.com  
2
Electrical Characteristics TJ = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Switching Characteristics  
t(on)  
td(on)  
tr  
Turn-On Time  
-
-
-
-
-
-
-
23  
24  
75  
17.9  
-
77  
ns  
ns  
ns  
ns  
ns  
ns  
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Turn-Off Time  
-
-
V
DD = 20V, ID = 35A  
VGS = 10V, RGS = 1.5Ω  
td(off)  
tf  
-
-
toff  
147  
Drain-Source Diode Characteristics  
I
SD = 35A  
SD = 15A  
-
-
-
-
0.8  
0.8  
52  
1.25  
1.0  
68  
V
V
VSD  
Source to Drain Diode Voltage  
I
trr  
Reverse Recovery Time  
IF = 35A, di/dt = 100A/µs  
IF = 35A, di/dt = 100A/µs  
ns  
nC  
Qrr  
Reverse Recovery Charge  
76  
99  
Notes:  
o
1: Starting T = 25 C, L = 0.46mH, I = 64A.  
J
AS  
2: Pulse width = 100s.  
www.onsemi.com  
3
Typical Characteristics  
300  
250  
200  
150  
100  
50  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
CURRENT LIMITED  
BY PACKAGE  
VGS = 10V  
0
25  
50  
75  
100  
125  
150  
175  
0
25  
50  
75  
100  
125  
150  
175  
TC, CASE TEMPERATURE(oC)  
TC, CASE TEMPERATURE(oC)  
Figure 1. Normalized Power Dissipation vs Case  
Temperature  
Figure 2. Maximum Continuous Drain Current vs  
Case Temperature  
2
DUTY CYCLE - DESCENDING ORDER  
1
D = 0.50  
0.20  
0.10  
0.05  
0.02  
P
DM  
0.1  
0.01  
t
1
t
2
0.01  
NOTES:  
DUTY FACTOR: D = t /t  
1
2
PEAK T = P  
x Z  
x R  
+ T  
J
DM  
θJC  
θJC C  
SINGLE PULSE  
1E-3  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t, RECTANGULAR PULSE DURATION(s)  
Figure 3. Normalized Maximum Transient Thermal Impedance  
10000  
1000  
100  
VGS = 10V  
TRANSCONDUCTANCE  
MAY LIMIT CURRENT  
IN THIS REGION  
TC = 25oC  
FOR TEMPERATURES  
ABOVE 25oC DERATE PEAK  
CURRENT AS FOLLOWS:  
175 - TC  
I = I25  
150  
SINGLE PULSE  
10  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t, RECTANGULAR PULSE DURATION(s)  
Figure 4. Peak Current Capability  
www.onsemi.com  
4
Typical Characteristics  
4000  
1000  
500  
100  
If R = 0  
= (L)(I )/(1.3*RATED BV  
t
AV  
- V  
)
AS  
DSS  
DD  
10us  
If R  
0  
t
AV  
= (L/R)ln[(I *R)/(1.3*RATED BV  
- V ) +1]  
DSS DD  
AS  
100us  
100  
STARTING TJ = 25oC  
10  
LIMITED  
BY PACKAGE  
10  
1
STARTING TJ = 150oC  
1ms  
10ms  
DC  
1
OPERATION IN THIS SINGLE PULSE  
AREA MAY BE  
LIMITED BY r  
T
= MAX RATED  
J
o
DS(on)  
T
C
= 25 C  
0.1  
0.01  
0.1  
1
10  
100  
1000 5000  
1
10  
100  
tAV, TIME IN AVALANCHE (ms)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Figure 6. Unclamped Inductive Switching  
Capability  
Figure 5. Forward Bias Safe Operating Area  
160  
160  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5% MAX  
VGS = 10V  
VGS = 5V  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5% MAX  
V
DD = 5V  
120  
80  
40  
0
120  
80  
40  
0
VGS = 4.5V  
TJ = 175oC  
TJ = 25oC  
VGS = 4V  
TJ = -55oC  
VGS = 3.5V  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
0
1
2
3
4
VDS, DRAIN TO SOURCE VOLTAGE (V)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 7. Transfer Characteristics  
Figure 8. Saturation Characteristics  
50  
1.8  
PULSE DURATION = 80µs  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5% MAX  
DUTY CYCLE = 0.5% MAX  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
40  
30  
20  
10  
0
TJ = 25oC  
TJ = 175oC  
ID = 80A  
GS = 10V  
V
3
4
5
6
7
8
9
10  
-80  
-40  
0
40  
80  
120  
160  
200  
o
TJ, JUNCTION TEMPERATURE( C)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 9. Drain to Source On-Resistance  
Variation vs Gate to Source Voltage  
Figure 10. Normalized Drain to Source On  
Resistance vs Junction Temperature  
www.onsemi.com  
5
Typical Characteristics  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
1.2  
ID = 250µA  
VGS = VDS  
ID = 250µA  
1.0  
0.8  
0.6  
0.4  
-80  
-40  
0
40  
80  
120  
160  
200  
-80  
-40  
0
40  
80  
120  
160  
200  
TJ, JUNCTION TEMPERATURE(oC)  
TJ, JUNCTION TEMPERATURE (oC)  
Figure 11. Normalized Gate Threshold Voltage vs  
Junction Temperature  
Figure 12. Normalized Drain to Source  
Breakdown Voltage vs Junction Temperature  
10  
40000  
ID = 80A  
Ciss  
VDD = 15V  
8
10000  
VDD = 25V  
6
Coss  
VDD = 20V  
4
2
0
1000  
Crss  
f = 1MHz  
VGS = 0V  
100  
0.1  
0
50  
100  
150  
200  
250  
1
10  
50  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Qg, GATE CHARGE(nC)  
Figure 13. Capacitance vs Drain to Source  
Voltage  
Figure 14. Gate Charge vs Gate to Source Voltage  
www.onsemi.com  
6
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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