FDD3670 [ONSEMI]

N 沟道,PowerTrench® MOSFET,100V,34A,32mΩ;
FDD3670
型号: FDD3670
厂家: ONSEMI    ONSEMI
描述:

N 沟道,PowerTrench® MOSFET,100V,34A,32mΩ

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FDD3670  
100V N-Channel PowerTrenchÒ MOSFET  
Features  
General Description  
· 34 A, 100 V. RDS(ON) = 32 mW @ VGS = 10 V  
RDS(ON) = 35 mW @ VGS = 6 V  
This N-Channel MOSFET has been designed  
specifically to improve the overall efficiency of DC/DC  
converters using either synchronous or conventional  
switching PWM controllers.  
· Low gate charge (57 nC typical)  
· Fast switching speed  
These MOSFETs f eature faster switching and lower  
gate charge than other MOSFETs with comparable  
RDS(ON) specifications.  
High performance trench technology for extremely  
low RDS(ON)  
·
The result is a MOSFET that is easy and safer to drive  
(even at very high frequencies), and DC/DC power  
supply designs with higher overall efficiency.  
· High power and current handling capability  
D
D
G
G
S
TO-252  
S
Absolute Maximum Ratings TA=25oC unless otherwise noted  
Symbol  
VDSS  
Parameter  
Drain-Source Voltage  
Ratings  
Units  
V
100  
VGSS  
ID  
Gate-Source Voltage  
V
A
±20  
Drain Current – Continuous  
Drain Current – Pulsed  
Maximum Power Dissipation @ TC = 25°C  
@ TA = 25°C  
(Note 1)  
(Note 3)  
34  
100  
PD  
83  
W
(Note 1)  
(Note 1a)  
(Note 1b)  
3.8  
1.6  
@ TA = 25°C  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
–55 to +175  
°C  
Thermal Characteristics  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient  
(Note 1)  
1.8  
96  
RqJC  
°C/W  
°C/W  
(Note 1b)  
RqJA  
Package Marking and Ordering Information  
Device Marking  
Device  
Reel Size  
Tape width  
Quantity  
FDD3670  
FDD3670  
13’’  
16mm  
2500 units  
Publication Order Number:  
FDD3670/D  
Ó2001 Semiconductor Components Industries, LLC.  
November-2017, Rev. 2  
Electrical Characteristics  
TA= 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min Typ Max Units  
Drain-Source Avalanche Ratings (Note 2)  
WDSS  
Single Pulse Drain-Source  
Avalanche Energy  
VDD = 50 V,  
ID = 7.3 A  
360  
7.3  
mJ  
A
IAR  
Maximum Drain-Source Avalanche  
Current  
Off Characteristics  
BVDSS  
Drain–Source Breakdown Voltage VGS = 0 V, ID = 250 mA  
100  
V
Breakdown Voltage Temperature  
Coefficient  
92  
DBVDSS  
DTJ  
ID = 250 mA, Referenced to 25°C  
mV/°C  
IDSS  
Zero Gate Voltage Drain Current  
Gate–Body Leakage, Forward  
Gate–Body Leakage, Reverse  
VDS = 80 V, VGS = 0 V  
VGS = 20 V, VDS = 0 V  
VGS = –20 V, VDS = 0 V  
10  
mA  
nA  
nA  
IGSSF  
IGSSR  
100  
–100  
On Characteristics  
(Note 2)  
VGS(th)  
Gate Threshold Voltage  
2
2.5  
4
V
VDS = VGS, ID = 250 mA  
Gate Threshold Voltage  
Temperature Coefficient  
–7.2  
DVGS(th)  
DTJ  
ID = 250 mA, Referenced to 25°C  
mV/°C  
RDS(on)  
Static Drain–Source  
On–Resistance  
VGS = 10 V,  
VGS = 10 V, ID = 7.3 A, T = 125°C  
VGS = 6 V,  
VGS = 10 V,  
VDS = 5 V,  
ID = 7.3 A  
22  
39  
24  
32  
56  
35  
mW  
J
ID = 7.0 A  
VDS = 5 V  
ID = 7.3 A  
ID(on)  
gFS  
On–State Drain Current  
25  
15  
A
S
Forward Transconductance  
31  
Dynamic Characteristics  
C
iss  
Input Capacitance  
2490  
265  
80  
pF  
pF  
pF  
VDS = 50 V,  
f = 1.0 MHz  
V GS = 0 V,  
Coss  
Output Capacitance  
C
rss  
Reverse Transfer Capacitance  
Switching Characteristics (Note 2)  
td(on)  
tr  
td(off)  
tf  
Turn–On Delay Time  
Turn–On Rise Time  
Turn–Off Delay Time  
Turn–Off Fall Time  
Total Gate Charge  
Gate–Source Charge  
Gate–Drain Charge  
16  
10  
56  
25  
57  
11  
15  
26  
18  
84  
40  
80  
ns  
ns  
VDD = 50 V,  
VGS = 10 V,  
ID = 1 A,  
RGEN = 6 W  
ns  
ns  
Qg  
nC  
nC  
nC  
VDS = 50 V,  
VGS = 10 V  
ID = 7.3 A,  
Qgs  
Qgd  
Drain–Source Diode Characteristics and Maximum Ratings  
IS  
Maximum Continuous Drain–Source Diode Forward Current  
Drain–Source Diode Forward  
VGS = 0 V, IS = 2.7 A  
Voltage  
2.7  
1.2  
A
V
VSD  
(Note 2)  
0.72  
Notes:  
1. RqJAis the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of  
the drain pins. RqJCis guaranteed by design while RqCAis determined by the user's board design.  
o
o
a)  
R
qJA= 40 C/W when  
b) RqJA= 96 C/W on a  
2
minimum mounting pad.  
mounted on a 1in pad of  
2oz copper.  
Scale 1 : 1 on letter size paper  
Pulse Test: Pulse Width < 300ms, Duty Cycle < 2.0%  
2.  
3.  
Pulse Id refers to Figure.9 Forward Bias Safe Operation Area.  
www.onsemi.com  
2
Typical Characteristics  
2
1.8  
1.6  
1.4  
1.2  
1
60  
5.0V  
4.5V  
VGS = 10V  
50  
5.5V  
40  
30  
20  
10  
0
VGS = 4.0V  
4.0V  
4.5V  
5.0V  
5.5V  
7.0V  
10V  
3.5V  
0.8  
0
10  
20  
30  
40  
50  
60  
0
1
2
3
4
5
ID, DRAIN CURRENT (A)  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. On-Region Characteristics.  
Figure 2. On-Resistance Variation with  
Drain Current and Gate Voltage.  
2.4  
2.2  
0.06  
ID = 7.3A  
VGS = 10V  
ID = 3.7A  
0.05  
0.04  
0.03  
0.02  
0.01  
0
2
1.8  
1.6  
1.4  
1.2  
1
TA = 125oC  
TA = 25oC  
0.8  
0.6  
0.4  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
175  
3
4
5
6
7
8
9
10  
TJ, JUNCTION TEMPERATURE (oC)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 3. On-Resistance Variation with  
Temperature.  
Figure 4. On-Resistance Variation with  
Gate-to-Source Voltage.  
100  
60  
50  
40  
30  
20  
10  
0
VGS = 0V  
VDS = 5V  
10  
1
TA = 125oC  
25oC  
0.1  
o
-55oC  
125 C  
0.01  
0.001  
0.0001  
25oC  
TA = -55oC  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
2
3
4
5
6
VSD, BODY DIODE FORWARD VOLTAGE (V)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 5. Transfer Characteristics.  
Figure 6. Body Diode Forward Voltage Variation  
with Source Current and Temperature.  
www.onsemi.com  
3
Typical Characteristics  
10  
4500  
4000  
3500  
3000  
2500  
2000  
1500  
1000  
500  
ID = 7.3A  
f = 1MHz  
VGS = 0 V  
VDS = 20V  
50V  
8
6
4
2
0
80V  
CISS  
CRSS  
COSS  
0
0
10  
20  
30  
40  
50  
60  
0
20  
40  
60  
80  
100  
Qg, GATE CHARGE (nC)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Figure 7. Gate Charge Characteristics.  
Figure 8. Capacitance Characteristics.  
200  
100  
10000  
SINGLE PULSE  
θJC = 1.8 oC/W  
TC = 25 oC  
10 μs  
R
10  
1
100 μs  
1000  
THIS AREA IS  
LIMITED BY r  
DS(on)  
1 ms  
SINGLE PULSE  
TJ = MAX RATED  
RθJC = 1.8 oC/W  
10 ms  
DC  
CURVE BENT TO  
MEASURED DATA  
C = 25 oC  
100  
50  
T
0.1  
10-5  
10-4  
10-3  
t, PULSE WIDTH (sec)  
10-2  
10-1  
1
1
10  
100 200  
VDS, DRAIN to SOURCE VOLTAGE (V)  
Figure 9. Forward Bias Safe Operating Area.  
Figure 10. Single Pulse Maximum  
Power Dissipation.  
2
DUTY CYCLE-DESCENDING ORDER  
1
D = 0.5  
0.2  
0.1  
0.05  
0.02  
P
DM  
0.1  
0.01  
t
1
t
SINGLE PULSE  
2
θJC = 1.8 oC/W  
NOTES:  
DUTY FACTOR: D = t /t  
R
1
2
0.01  
PEAK T = P  
x Z  
x R  
+ T  
J
DM  
θJC  
θJC C  
0.005  
10-5  
10-4  
10-3  
t, RECTANGULAR PULSE DURATION (sec)  
10-2  
10-1  
1
Figure 11. Junction-to-Case Transient Thermal Response Curve  
www.onsemi.com  
4
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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