FDPF190N15A [ONSEMI]

N 沟道 PowerTrench® MOSFET 150V,27.4A,19mΩ;
FDPF190N15A
型号: FDPF190N15A
厂家: ONSEMI    ONSEMI
描述:

N 沟道 PowerTrench® MOSFET 150V,27.4A,19mΩ

局域网 开关 脉冲 晶体管
文件: 总10页 (文件大小:1033K)
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2015 12 月  
FDPF190N15A  
N PowerTrench MOSFET  
150 V27.4 A19 mΩ  
®
特性  
说明  
N MOSFET 采用飞兆半导体先进PowerTrench® 工艺  
生产,这一先进工艺是专为最大限度地降低通态电阻并保持卓越  
开关性能而定制的。  
RDS(on) = 14.7 mΩ (Typ.)@VGS = 10 V, ID = 27.4 A  
低栅极电荷QG = 31 nC (典型值)  
Crss (典型56 pF)  
快速开关速度  
应用  
消费电子设备  
改善dv/dt 处理能力  
RoHS 标准  
LED 电视  
ATX/Sever/Telecom PSU 的同步整流  
不间断电源  
微型太阳能逆变器  
D
G
G
D
S
TO-220F  
S
绝对最大额定TC = 25oC 除非另有说明。  
FDPF190N15A  
符号  
参数  
- DC  
单位  
VDSS  
VGSS  
150  
±20  
V
漏极-源极电压  
栅极-源极电压  
V
A
- AC  
(f > 1 Hz)  
±30  
27.4  
-连(TC = 25oC)  
-连(TC = 100oC)  
-脉冲  
ID  
漏极电流  
17.4  
IDM  
1)  
110  
A
mJ  
漏极电流  
EAS  
dv/dt  
261  
单脉冲雪崩能量  
二极管恢dv/dt 峰值  
2)  
3)  
6.0  
V/ns  
W
W/oC  
oC  
(TC = 25oC)  
-超25oC 时降额  
33  
PD  
功耗  
0.26  
TJ, TSTG  
TL  
-55 +150  
300  
工作和存储温度范围  
oC  
用于焊接的最大引脚温度,距离外1/8”,持5 秒  
热性能  
FDPF190N15A  
符号  
RθJC  
参数  
单位  
结至外壳热阻最大值  
3.3  
oC/W  
结至环境热阻最大值  
RθJA  
62.5  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
FDPF190N15A Rev. 1.5  
1
封装标识与定购信息  
器件编号  
顶标  
FDPF190N15A  
封装  
包装方法  
塑料管  
卷尺寸  
不适用  
带宽  
数量  
FDPF190N15A  
TO-220F  
不适用  
50 单元  
电气特TC = 25oC 除非另有说明。  
符号  
参数  
测试条件  
最小值 典型值 最大值  
单位  
关断特性  
BVDSS  
ID = 250 μA, VGS = 0 V  
D = 250 μA,参25oC  
150  
-
-
-
-
V
漏极-源极击穿电压  
ΔBVDSS  
/ ΔTJ  
击穿电压温度系数  
I
0.14  
V/oC  
VDS = 120 V, VGS = 0 V  
VDS = 120 V, TC = 150oC  
VGS = ±20 V, VDS = 0 V  
-
-
-
-
-
-
1
IDSS  
IGSS  
μA  
零栅极电压漏极电流  
500  
±100  
nA  
- 体漏电流  
导通特性  
VGS(th)  
RDS(on)  
gFS  
V
V
V
GS = VDS, ID = 250 μA  
GS = 10 V, ID = 27.4 A  
DS = 10 V, ID = 27.4 A  
2.0  
-
4.0  
19.0  
-
V
mΩ  
S
栅极阈值电压  
-
-
14.7  
64  
漏极至源极静态导通电阻  
正向跨导  
动态特性  
Ciss  
-
-
-
-
-
-
-
-
2020  
700  
56  
2685  
pF  
pF  
pF  
pF  
nC  
nC  
nC  
Ω
输入电容  
V
DS = 25 V, VGS = 0 V,  
Coss  
Crss  
930  
输出电容  
f = 1 MHz  
85  
-
反向传输电容  
Coss(er)  
Qg(tot)  
Qgs  
VDS = 75 V, VGS = 0 V  
252  
30  
能源相关输出电容  
10V 的栅极电荷总量  
栅极-源极栅极电荷  
栅极-漏电荷  
等效串联电(G-S)  
39  
-
VDS = 120 V, ID = 27.4 A,  
VGS = 10 V  
8.8  
7.3  
1.5  
(说4)  
Qgd  
-
ESR  
f = 1 MHz  
-
开关特性  
td(on)  
tr  
td(off)  
tf  
-
-
-
-
18  
16  
32  
8
46  
42  
74  
26  
ns  
ns  
ns  
ns  
导通延迟时间  
开通上升时间  
关断延迟时间  
关断下降时间  
VDD = 75 V, ID = 27.4 A,  
VGS = 10 V, RG = 4.7 Ω  
(说4)  
漏极-源极二极管特性  
IS  
-
-
-
-
-
-
-
27.4  
110  
1.3  
-
A
A
漏极-源极二极管最大正向连续电流  
漏极-源极二极管最大正向脉冲电流  
漏极-源极二极管正向电压  
反向恢复时间  
ISM  
VSD  
trr  
VGS = 0 V, ISD = 27.4 A  
VGS = 0 V, ISD = 27.4 A,  
dIF/dt = 100 A/μs, VDD = 120 V  
-
V
76  
0.18  
ns  
μC  
Qrr  
-
反向恢复电荷  
注意:  
1. 重复额定值:脉冲宽度受限于最大结温。  
2. L = 0.33 mHI = 29 AR = 25 Ω,启T = 25°C。  
AS  
G
J
3. I 27.4 Adi/dt 200 A/μsV BV  
,启T = 25°C。  
SD  
DD  
DSS  
J
4. 本质上独立于工作温度的典型特性。  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
FDPF190N15A Rev. 1.5  
2
典型性能特征  
1. 导通区域特性  
2. 传输特性  
200  
200  
VGS = 15.0V  
*Notes:  
10.0V  
8.0V  
7.0V  
6.5V  
6.0V  
5.5V  
5.0V  
1. VDS = 10V  
100  
100  
2. 250μs Pulse Test  
150oC  
25oC  
10  
-55oC  
10  
4
*Notes:  
1. 250μs Pulse Test  
2. TC = 25oC  
1
0.1  
1
2
2
3
4
5
6
VDS, Drain-Source Voltage[V]  
VGS, Gate-Source Voltage[V]  
3. 导通电阻变化与漏极电流和栅极电压  
4. 体二极管正向电压变化与源电流和温度  
0.020  
200  
100  
150oC  
VGS = 10V  
25oC  
0.015  
10  
VGS = 20V  
*Notes:  
1. VGS = 0V  
*Note: TC = 25oC  
100 125  
2. 250μs Pulse Test  
0.010  
1
0.0  
0
25  
50  
75  
0.5  
1.0  
1.5  
VSD, Body Diode Forward Voltage [V]  
ID, Drain Current [A]  
5. 电容特性  
6. 栅极电荷  
5000  
10  
Ciss  
VDS = 30V  
8
6
4
2
0
VDS = 75V  
1000  
VDS = 120V  
Coss  
100  
*Note:  
1. VGS = 0V  
Crss  
2. f = 1MHz  
C
C
C
= C + C (C = shorted)  
gs gd ds  
iss  
= C + C  
ds  
= C  
gd  
oss  
rss  
gd  
10  
5
*Note: ID = 27.4A  
24  
0.1  
1
10  
100 200  
0
8
16  
32  
VDS, Drain-Source Voltage [V]  
Qg, Total Gate Charge [nC]  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
3
FDPF190N15A Rev. 1.4  
典型性能特(接上页)  
7. 击穿电压变化与温度  
8. 导通电阻变化与温度  
1.10  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
1.05  
1.00  
0.95  
0.90  
*Notes:  
1. VGS = 0V  
*Notes:  
1. VGS = 10V  
2. ID = 250μA  
2. ID = 27.4A  
-100  
-50  
0
50  
100  
150  
200  
-100  
-50  
0
50  
100  
150  
200  
TJ, Junction Temperature [oC]  
TJ, Junction Temperature [oC]  
9. 最大安全工作区  
10. 最大漏极电流与壳体温度  
500  
30  
100  
10  
25  
20  
15  
10  
5
100μs  
1ms  
Operation in This Area  
is Limited by R DS(on)  
10ms  
1
0.1  
100ms  
DC  
*Notes:  
1. TC = 25oC  
2. TJ = 150oC  
3. Single Pulse  
0.01  
0
25  
0.1  
1
10  
100 300  
50  
75  
100  
125  
150  
TC, Case Temperature [oC]  
VDS, Drain-Source Voltage [V]  
11. Eoss 与漏极-源极电压  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
0
25  
50  
75  
100  
125  
150  
VDS, Drain to Source Voltage [V]  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
FDPF190N15A Rev. 1.5  
4
典型性能特(接上页)  
12. 瞬态热响应曲线  
5
1
0.5  
0.2  
0.1  
PDM  
0.05  
t1  
t2  
0.1  
0.02  
0.01  
*Notes:  
1. ZθJC(t) = 3.8oC/W Max.  
2. Duty Factor, D= t1/t2  
3. TJM - TC = PDM * ZθJC(t)  
Single pulse  
0.01  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
100  
t
1形脉冲持续时[ ]  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
FDPF190N15A Rev. 1.5  
5
I
= 常量  
G
13. 栅极电荷测试电路与波形  
RL  
VDS  
90%  
VDS  
VDD  
VGS  
RG  
10%  
VGS  
DUT  
V
GS  
td(on)  
tr  
td(off)  
tf  
t on  
t off  
14. 阻性开关测试电路与波形  
VGS  
15. 非箝位感性开关测试电路与波形  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
FDPF190N15A Rev. 1.5  
6
+
DUT  
VDS  
_
I SD  
L
Driver  
RG  
Same Type  
as DUT  
VDD  
VGS  
• dv/dt controlled by RG  
• ISD controlled by pulse period  
Gate Pulse Width  
--------------------------  
VGS  
D =  
Gate Pulse Period  
10V  
( Driver )  
IFM , Body Diode Forward Current  
I SD  
di/dt  
( DUT )  
IRM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
VSD  
VDS  
( DUT )  
VDD  
Body Diode  
Forward Voltage Drop  
16. 二极管恢dv/dt 峰值测试电路与波形  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
FDPF190N15A Rev. 1.5  
7
10.36  
9.96  
2.66  
2.42  
B
A
B
3.28  
3.08  
7.00  
3.40  
3.20  
0.70  
SEE NOTE "F"  
SEE NOTE "F"  
6.88  
6.48  
1 X 45°  
16.07  
15.67  
B
16.00  
15.60  
B
(3.23)  
3
1
1.47  
1.24  
2.96  
2.56  
2.14  
0.90  
0.70  
0.50  
10.05  
9.45  
M
A
30°  
0.45  
0.25  
0.60  
0.45  
B
2.54  
2.54  
4.90  
4.50  
B
NOTES:  
A. EXCEPT WHERE NOTED CONFORMS TO  
EIAJ SC91A.  
B
DOES NOT COMPLY EIAJ STD. VALUE.  
C. ALL DIMENSIONS ARE IN MILLIMETERS.  
D. DIMENSIONS ARE EXCLUSIVE OF BURRS,  
MOLD FLASH AND TIE BAR PROTRUSIONS.  
E. DIMENSION AND TOLERANCE AS PER ASME  
Y14.5-1994.  
F. OPTION 1 - WITH SUPPORT PIN HOLE.  
OPTION 2 - NO SUPPORT PIN HOLE.  
G. DRAWING FILE NAME: TO220M03REV5  
ON Semiconductor and  
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ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
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application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
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literature is subject to all applicable copyright laws and is not for resale in any manner.  
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