FFSB10120A-F085 [ONSEMI]

汽车碳化硅 (SiC) 肖特基二极管,1200V;
FFSB10120A-F085
型号: FFSB10120A-F085
厂家: ONSEMI    ONSEMI
描述:

汽车碳化硅 (SiC) 肖特基二极管,1200V

功效 测试 光电二极管 肖特基二极管
文件: 总6页 (文件大小:316K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
Schottky Diode – EliteSiC,  
10 A, 1200 V, D1, D2PAK-2L  
Cathode  
Anode  
Schottky Diode  
FFSB10120A-F085  
Cathode  
Description  
Silicon Carbide (SiC) Schottky Diodes use a completely new  
technology that provides superior switching performance and higher  
reliability compared to Silicon. No reverse recovery current,  
temperature independent switching characteristics, and excellent  
thermal performance sets Silicon Carbide as the next generation of  
power semiconductor. System benefits include highest efficiency,  
faster operating frequency, increased power density, reduced EMI, and  
reduced system size and cost.  
Cathode  
Anode  
2
D PAK2 (TO2632L)  
CASE 418BK  
MARKING DIAGRAM  
Features  
AYWWZZ  
FFSB  
10120A  
Max Junction Temperature 175C  
Avalanche Rated 100 mJ  
High Surge Current Capacity  
Positive Temperature Coefficient  
Ease of Paralleling  
No Reverse Recovery/No Forward Recovery  
AECQ101 qualified  
A
YWW  
ZZ  
= Assembly Plant Code  
= Date Code (Year & Week)  
= Lot Code  
Applications  
FFSB10120A = Specific Device Code  
Automotive HEVEV Onboard Chargers  
Automotive HEVEV DCDC Converters  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2  
of this data sheet.  
Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
February, 2023 Rev. 3  
FFSB10120AF085/D  
FFSB10120AF085  
ABSOLUTE MAXIMUM RATINGS (T = 25C unless otherwise noted)  
C
Symbol  
Parameter  
Ratings  
Unit  
V
V
RRM  
1200  
Peak Repetitive Reverse Voltage  
mJ  
A
E
100  
Single Pulse Avalanche Energy (Note 1)  
AS  
I
10  
Continuous Rectified Forward Current @ T < 164C  
F
C
21  
Continuous Rectified Forward Current @ T < 135C  
C
A
T
T
= 25C, 10 ms  
= 150C, 10 ms  
I
850  
NonRepetitive Peak Forward Surge Current  
C
F, Max  
800  
C
A
A
HalfSine Pulse, tp = 8.3 ms  
HalfSine Pulse, tp = 8.3 ms  
I
90  
NonRepetitive Forward Surge Current  
Repetitive Forward Surge Current  
Power Dissipation  
F, SM  
I
35  
283  
F, RM  
W
T
= 25C  
Ptot  
C
C
W
T
= 150C  
47  
C  
Ncm  
T , T  
55 to +175  
60  
Operating and Storage Temperature Range  
TO247 Mounting Torque, M3 Screw  
J
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. E of 100 mJ is based on starting T = 25C, L = 0.5 mH, I = 20 A, V = 50 V.  
AS  
J
AS  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Ratings  
Unit  
C/W  
R
0.53  
Thermal Resistance, Junction to Case, Max  
q
JC  
ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted)  
C
Symbol  
Parameter  
Forward Voltage  
Test Conditions  
I = 10 A, T = 25C  
Min  
Typ.  
1.45  
1.7  
2
Max.  
1.75  
2
Unit  
V
F
V
F
C
I = 10 A, T = 125C  
F
C
I = 10 A, T = 175C  
2.4  
200  
300  
400  
F
C
I
R
Reverse Current  
V
R
V
R
V
R
= 1200 V, T = 25C  
mA  
C
= 1200 V, T = 125C  
C
= 1200 V, T = 175C  
C
Q
Total Capacitive Charge  
Total Capacitance  
V = 800 V  
62  
612  
58  
47  
nC  
pF  
C
C
V
R
V
R
V
R
= 1 V, f = 100 kHz  
= 400 V, f = 100 kHz  
= 800 V, f = 100 kHz  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
PACKAGE MARKING AND ORDERING INFORMATION  
Part Number  
Top Mark  
Package  
D PAK2 (TO2632L)  
Shipping  
2
FFSB10120AF085  
FFSB10120A  
800 Units/  
Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
2
 
FFSB10120AF085  
TYPICAL CHARACTERISTICS (T = 25C UNLESS OTHERWISE NOTED)  
C
1
10  
8
10  
T = 55C  
J
T
J
T
J
= 25C  
= 75C  
0
10  
6
4
1  
10  
10  
10  
T
J
= 175C  
T
T
= 125C  
= 175C  
J
J
T
J
= 75C  
T
J
= 125C  
2  
3  
2
0
T
J
= 25C  
T = 55C  
J
0
1
F
2
3
4
200  
400  
600  
800  
1000  
1200  
V , FORWARD VOLTAGE (V)  
V , REVERSE VOLTAGE (V)  
R
Figure 1. Forward Characteristics  
Figure 2. Reverse Characteristics  
160  
300  
280  
D = 0.1  
120  
80  
240  
120  
60  
D = 0.2  
D = 0.3  
D = 0.5  
40  
D = 0.7  
D = 1  
0
0
25  
50  
75  
100  
125  
150  
175  
25  
50  
75  
100  
125  
150  
175  
T , CASE TEMPERATURE (5C)  
Figure 3. Current Derating  
T , CASE TEMPERATURE (5C)  
Figure 4. Power Derating  
C
C
5000  
1000  
80  
60  
40  
20  
100  
10  
0
0
200  
400  
600  
800  
1000  
0.1  
1
10  
100  
1000  
V , REVERSE VOLTAGE (V)  
R
V , REVERSE VOLTAGE (V)  
R
Figure 5. Capacitive Charge vs. Reverse Voltage  
Figure 6. Capacitive Charge vs. Reverse Voltage  
www.onsemi.com  
3
FFSB10120AF085  
TYPICAL CHARACTERISTICS (T = 25C UNLESS OTHERWISE NOTED)  
C
(CONTINUED)  
30  
20  
10  
0
0
200  
400  
600  
800  
1000  
V , REVERSE VOLTAGE (V)  
R
Figure 7. Capacitance Stored Energy  
2
1
DUTY CYCLE DESCENDING ORDER  
P
DM  
0.1  
0.5  
0.2  
0.1  
t
1
0.0  
1
t
0.05  
2
0.02  
0.01  
NOTES:  
(t) = r(t) R  
Z
R
q
q
JC  
JC  
0.001  
= 0.53C/W  
q
JC  
PEAK T = P  
Duty cycle, D = t /t  
Z  
(t) + T  
JC C  
q
J
DM  
SINGLE PULSE  
1
2
0.0001  
6  
5  
4  
3  
2  
1  
10  
10  
10  
10  
10  
10  
1
t, RECTANGULAR PULSE DURATION (sec)  
Figure 8. JunctiontoCase Transient Thermal Response Curve  
TEST CIRCUIT AND WAVEFORMS  
L = 0.5 mH  
R < 0.1 W  
V
DD  
= 50 V  
EAVL = 1/2LI2 [V  
/ (V V )]  
R(AVL) DD  
R(AVL)  
Q1 = IGBT (BV  
> DUT V  
)
CES  
R(AVL)  
V
AVL  
L
R
+
V
CURRENT  
SENSE  
DD  
I
L
I
L
Q1  
I V  
V
DD  
DUT  
t
0
t
1
t
2
t
Figure 9. Unclamped Inductive Switching Test Circuit & Waveform  
www.onsemi.com  
4
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
D2PAK2 (TO2632L)  
CASE 418BK  
ISSUE O  
DATE 02 AUG 2018  
GENERIC  
MARKING DIAGRAM*  
XXXXXXXXG  
AYWW  
XXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
G
= PbFree Package  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”,  
may or may not be present. Some products  
may not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON93788G  
D2PAK2 (TO2632L)  
PAGE 1 OF 1  
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