FGB20N60SF [ONSEMI]

600 V、20 A、2.2 V、TO-247高速场截止 IGBT;
FGB20N60SF
型号: FGB20N60SF
厂家: ONSEMI    ONSEMI
描述:

600 V、20 A、2.2 V、TO-247高速场截止 IGBT

PC 栅 瞄准线 双极性晶体管 功率控制
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March 2015  
FGB20N60SF  
600 V, 20 A Field Stop IGBT  
Features  
General Description  
High Current Capability  
Using novel field stop IGBT technology, Fairchild’s field stop  
IGBTs offer the optimum performance for solar inverter, UPS,  
welder and PFC applications where low conduction and switch-  
ing losses are essential.  
Low Saturation Voltage: VCE(sat) =2.2 V @ IC = 20 A  
High Input Impedance  
Fast Switching : EOFF = 8 uJ/A  
RoHS Compliant  
Applications  
Solar Inverter, UPS, Welder, PFC  
C
COLLECTOR  
(FLANGE)  
G
G
E
C
D2-PAK  
E
Absolute Maximum Ratings  
Symbol  
Description  
Ratings  
600  
Unit  
VCES  
Collector to Emitter Voltage  
V
Gate to Emitter Voltage  
Transient Gate-to-Emitter Voltage  
Collector Current  
±20  
VGES  
V
±30  
@ TC = 25oC  
@ TC = 100oC  
40  
A
A
A
IC  
ICM (1)  
PD  
Collector Current  
20  
@ TC = 25oC  
@ TC = 25oC  
@ TC = 100oC  
Pulsed Collector Current  
60  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction Temperature  
Storage Temperature Range  
208  
83  
W
W
oC  
oC  
TJ  
-55 to +150  
-55 to +150  
Tstg  
Maximum Lead Temp. for soldering  
Purposes, 1/8” from case for 5 seconds  
oC  
TL  
300  
Notes:  
1: Repetitive rating: Pulse width limited by max. junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Typ.  
Max.  
0.6  
Unit  
oC/W  
oC/W  
RθJC  
Thermal Resistance, Junction to Case  
-
-
RθJA  
Thermal Resistance, Junction to Ambient (PCB Mount)(2)  
40  
Notes:  
2: Mounted on 1” square PCB(FR4 or G-10 material)  
©2010 Fairchild Semiconductor Corporation  
FGB20N60SF Rev. 1.5  
1
www.fairchildsemi.com  
Package Marking and Ordering Information  
Part Number  
Top Mark  
Package Packing Method  
Reel Size  
Tape Width  
Quantity  
FGB20N60SF  
FGB20N60SF  
D2-PAK  
Reel  
13” Dia  
N/A  
800  
Electrical Characteristics of the IGBT  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Off Characteristics  
BVCES  
Collector to Emitter Breakdown Voltage VGE = 0 V, IC = 250 μA  
600  
-
-
-
-
V
ΔBVCES  
ΔTJ  
/
Temperature Coefficient of Breakdown  
VGE = 0 V, IC = 250 μA  
Voltage  
0.6  
V/oC  
ICES  
IGES  
Collector Cut-Off Current  
G-E Leakage Current  
VCE = VCES, VGE = 0 V  
VGE = VGES, VCE = 0 V  
-
-
-
-
250  
μA  
±400  
nA  
On Characteristics  
VGE(th)  
G-E Threshold Voltage  
IC = 250 μA, VCE = VGE  
4.0  
-
5.0  
2.2  
6.5  
2.8  
V
V
I
C = 20 A, VGE = 15 V  
VCE(sat)  
Collector to Emitter Saturation Voltage  
I
C = 20 A, VGE = 15 V,  
-
2.4  
-
V
TC = 125oC  
Dynamic Characteristics  
Cies  
Coes  
Cres  
Input Capacitance  
-
-
-
940  
110  
40  
-
-
-
pF  
pF  
pF  
VCE = 30 V VGE = 0 V,  
f = 1 MHz  
,
Output Capacitance  
Reverse Transfer Capacitance  
Switching Characteristics  
td(on) Turn-On Delay Time  
tr  
td(off)  
tf  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
13  
16  
-
-
ns  
ns  
Rise Time  
Turn-Off Delay Time  
Fall Time  
90  
-
ns  
V
CC = 400 V, IC = 20 A,  
RG = 10 Ω, VGE = 15 V,  
24  
48  
-
ns  
Inductive Load, TC = 25oC  
Eon  
Eoff  
Ets  
td(on)  
tr  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On Delay Time  
Rise Time  
0.37  
0.16  
0.53  
12  
mJ  
mJ  
mJ  
ns  
-
-
-
16  
-
ns  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
95  
-
ns  
V
CC = 400 V, IC = 20 A,  
RG = 10 Ω, VGE = 15 V,  
28  
-
ns  
Inductive Load, TC = 125oC  
Eon  
Eoff  
Ets  
Qg  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Total Gate Charge  
Gate to Emitter Charge  
Gate to Collector Charge  
0.4  
0.28  
0.69  
65  
-
mJ  
mJ  
mJ  
nC  
nC  
nC  
-
-
-
V
CE = 400 V, IC = 20 A,  
Qge  
Qgc  
7
-
VGE = 15 V  
33  
-
©2010 Fairchild Semiconductor Corporation  
FGB20N60SF Rev. 1.5  
2
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Output Characteristics  
60  
60  
TC = 25oC  
20V  
TC = 125oC  
12V  
10V  
20V  
12V  
15V  
10V  
15V  
40  
40  
20  
0
VGE = 8V  
20  
VGE = 8V  
0
0.0  
1.5  
3.0  
4.5  
6.0  
0.0  
1.5  
3.0  
4.5  
6.0  
Collector-Emitter Voltage, VCE [V]  
Collector-Emitter Voltage, VCE [V]  
Figure 3. Typical Saturation Voltage  
Characteristics  
Figure 4. Transfer Characteristics  
60  
60  
Common Emitter  
VCE = 20V  
TC = 25oC  
Common Emitter  
VGE = 15V  
TC = 25oC  
TC = 125oC  
TC = 125oC  
40  
40  
20  
0
20  
0
4
6
8
10  
12  
0
1
2
3
4
5
Collector-Emitter Voltage, VCE [V]  
Gate-Emitter Voltage,VGE [V]  
Figure 5. Saturation Voltage vs. Case  
Figure 6. Saturation Voltage vs. V  
GE  
Temperature at Variant Current Level  
4
3
2
1
20  
Common Emitter  
VGE = 15V  
Common Emitter  
TC = -40oC  
16  
12  
8
40A  
20A  
40A  
IC = 10A  
4
20A  
IC = 10A  
0
25  
50  
75  
100  
125  
0
4
8
12  
16  
20  
Collector-Emitter Case Temperature, TC [oC]  
Gate-Emitter Voltage, VGE [V]  
©2010 Fairchild Semiconductor Corporation  
FGB20N60SF Rev. 1.5  
3
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 7. Saturation Voltage vs. V  
Figure 8. Saturation Voltage vs. V  
GE  
GE  
20  
20  
Common Emitter  
TC = 25oC  
Common Emitter  
TC = 125oC  
16  
12  
8
16  
12  
8
40A  
20A  
12  
40A  
4
4
20A  
IC = 10A  
4
IC = 10A  
0
0
0
4
8
12  
16  
20  
0
8
16  
20  
Gate-Emitter Voltage, VGE [V]  
Gate-Emitter Voltage, VGE [V]  
Figure 9. Capacitance Characteristics  
Figure 10. Gate charge Characteristics  
15  
2500  
Common Emitter  
TC = 25oC  
Common Emitter  
VGE = 0V, f = 1MHz  
TC = 25oC  
12  
2000  
300V  
VCC = 100V  
200V  
Cies  
9
6
3
0
1500  
1000  
Coes  
500  
Cres  
0
0.1  
0
20  
40  
60  
80  
1
10  
30  
Collector-Emitter Voltage, VCE [V]  
Gate Charge, Qg [nC]  
Figure 11. SOA Characteristics  
Figure 12. Turn-on Characteristics vs.  
Gate Resistance  
100  
100  
10μs  
100μs  
10  
1ms  
10 ms  
tr  
DC  
Common Emitter  
VCC = 400V, VGE = 15V  
1
td(on)  
*Notes:  
1. TC = 25oC  
2. TJ = 150oC  
10  
5
IC = 20A  
TC = 25oC  
TC = 125oC  
3. Single Pulse  
0.1  
1
10  
100  
1000  
0
10  
20  
30  
40  
50  
60  
Collector-Emitter Voltage, VCE [V]  
Gate Resistance, RG [Ω]  
©2010 Fairchild Semiconductor Corporation  
FGB20N60SF Rev. 1.5  
4
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 13. Turn-off Characteristics vs.  
Figure 14. Turn-on Characteristics vs.  
Collector Current  
Gate Resistance  
200  
1000  
Common Emitter  
VGE = 15V, RG = 10Ω  
TC = 25oC  
Common Emitter  
VCC = 400V, VGE = 15V  
100  
IC = 20A  
TC = 25oC  
TC = 125oC  
TC = 125oC  
td(off)  
tr  
100  
tf  
td(on)  
10  
3
10  
0
10  
20  
30  
40  
0
10  
20  
30  
40  
50  
60  
Collector Current, IC [A]  
Gate Resistance, RG [Ω]  
Figure 15. Turn-off Characteristics vs.  
Collector Current  
Figure 16. Switching Loss vs.  
Gate Resistance  
3
300  
Common Emitter  
Common Emitter  
VCC = 400V, VGE = 15V  
VGE = 15V, RG = 10Ω  
TC = 25oC  
IC = 20A  
TC = 25oC  
1
TC = 125oC  
TC = 125oC  
td(off)  
100  
Eon  
Eoff  
tf  
0.1  
10  
0
10  
20  
30  
40  
50  
60  
0
10  
20  
30  
40  
Gate Resistance, RG [Ω]  
Collector Current, IC [A]  
Figure 17. Switching Loss vs.  
Collector Current  
Figure 18. Turn off Switching  
SOA Characteristics  
80  
10  
Common Emitter  
VGE = 15V, RG = 10Ω  
TC = 25oC  
TC = 125oC  
1
Eon  
10  
Eoff  
0.1  
Safe Operating Area  
VGE = 15V, TC = 125oC  
1
0.02  
0
10  
20  
30  
40  
1
10  
100  
1000  
Collector-Emitter Voltage, VCE [V]  
Collector Current, IC [A]  
©2010 Fairchild Semiconductor Corporation  
FGB20N60SF Rev. 1.5  
5
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 19.Transient Thermal Impedance of IGBT  
1
0.5  
0.2  
0.1  
0.1  
PDM  
0.05  
t1  
0.02  
t2  
0.01  
single pulse  
Duty Factor, D = t1/t2  
Peak Tj = Pdm x Zthjc + TC  
0.01  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
Rectangular Pulse Duration [sec]  
©2010 Fairchild Semiconductor Corporation  
FGB20N60SF Rev. 1.5  
6
www.fairchildsemi.com  
10.67  
9.65  
10.67  
-A-  
1.68  
1.00  
4
4
9.45  
9.65  
8.38  
10.00  
1.78 MAX  
2
0.25 MAX  
2
3.80  
PLASTIC BODY  
STUB  
1
3
1
3
1.78  
1.14  
(2.12)  
1.05  
5.08  
0.99  
0.51  
M
M
B A  
0.25  
LAND PATTERN RECOMMENDATION  
UNLESS NOTED, ALL DIMS TYPICAL  
5.08  
FRONT VIEW - DIODE PRODUCTS VERSION  
ALTERNATIVE SUPPLIER DETAIL  
-B-  
4.83  
4.06  
6.22 MIN  
1.65  
1.14  
4
4
6.86 MIN  
15.88  
14.61  
SEE  
DETAIL A  
2
2
3
1
3
1
BACK VIEW - DIODE PRODUCTS VERSION  
ALTERNATIVE SUPPLIER DETAIL  
NOTES: UNLESS OTHERWISE SPECIFIED  
A) ALL DIMENSIONS ARE IN MILLIMETERS.  
B) REFERENCE JEDEC, TO-263, VARIATION AB.  
C) DIMENSIONING AND TOLERANCING PER  
DIMENSIONING AND TOLERANCING PER  
ASME Y14.5 - 2009.  
D) LOCATION OF THE PIN HOLE MAY VARY  
(LOWER LEFT CORNER, LOWER CENTER  
AND CENTER OF THE PACKAGE).  
GAGE PLANE  
0.74  
0.25  
0.33  
ꢄƒ  
ꢃƒ  
E) LANDPATTERN RECOMMENDATION PER IPC  
TO254P1524X482-3N  
0.10  
B
F) FILENAME: TO263A02REV8  
2.79  
1.78  
ꢄƒ  
ꢃƒ  
0.25 MAX  
(5.38)  
SEATING  
PLANE  
'(7$,/ꢀ$ꢁꢀ527$7('ꢀꢂꢃƒ  
SCALE: 2X  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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