FGH4L40T120LQD [ONSEMI]

IGBT, 1200V, 40A, Ultra Field Stop, Fast-switching Co-packed Diode.;
FGH4L40T120LQD
型号: FGH4L40T120LQD
厂家: ONSEMI    ONSEMI
描述:

IGBT, 1200V, 40A, Ultra Field Stop, Fast-switching Co-packed Diode.

双极性晶体管
文件: 总11页 (文件大小:433K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
IGBT - Ultra Field Stop  
1200 V, 40 A, VCE(Sat) = 1.55V,  
TO247 4L  
FGH4L40T120LQD  
This Insulated Gate Bipolar Transistor (IGBT) features a robust and  
costeffective Ultra Field Stop Trench construction, and provides  
superior performance in demanding switching applications, offering  
both low onstate voltage and minimal switching loss. The IGBT is  
well suited for motor driver applications. Incorporated into the device  
is a soft and fast copackaged freewheeling diode with a low forward  
voltage.  
TO2474LD  
CASE 340CJ  
MARKING DIAGRAM  
Features  
FGH40T  
120LQD  
$Y&Z&3&K  
Extremely Efficient Trench with Field Stop Technology  
Maximum Junction Temperature: T = 175°C  
J
Fast and Soft Reverse Recovery Diode  
Optimized for Low V  
CE(Sat)  
FGH40T120LQD = Specific Device Code  
Typical Applications  
Solar Inverter and UPS  
Industrial Switching  
Welding  
$Y  
&Z  
&3  
&K  
= onsemi Logo  
= Assembly Plant Code  
= 3Digit Date Code  
= 2Digit Lot Traceability Code  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
V
PIN CONNECTIONS  
CollectorEmitter Voltage  
V
CE  
1200  
C
GateEmitter Voltage  
Transient GateEmitter Voltage  
V
GE  
20  
30  
V
E1: Kelvin Emitter  
E2: Power Emitter  
Collector Current @ T = 25°C (Note 1)  
I
C
80  
40  
A
C
@ T = 100°C  
C
G
Pulsed Collector Current (Note 2)  
I
160  
160  
A
A
A
LM  
E1  
E2  
Pulsed Collector Current (Note 3)  
Diode Forward Current  
I
CM  
I
F
@ T = 25°C (Note 1)  
80  
40  
C
@ T = 100°C  
C
ORDERING INFORMATION  
Maximum Power Dissipation  
P
W
D
@ T = 25°C  
306  
153  
Device  
FGH4L40T120LQD  
Package  
Shipping  
30 Units / Rail  
C
@ T = 100°C  
C
TO247  
Operating Junction and Storage  
Temperature Range  
T , T  
55 to  
+175  
°C  
°C  
J
STG  
Maximum Lead Temp. for Soldering  
Purposes (1/8from case for 5 s)  
T
260  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Value limit by bond wire  
2. V = 600 V, V = 15 V, I = 160 A, R = 15 W, Inductive Load, 100% Tested  
CC  
GE  
C
G
3. Repetitive rating: Pulse width limited by max. junction temperature  
© Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
September, 2021 Rev. 0  
FGH4L40T120LQD/D  
 
FGH4L40T120LQD  
THERMAL CHARACTERISTICS  
Rating  
Symbol  
Min  
Typ  
0.38  
0.64  
Max  
0.49  
0.84  
40  
Unit  
°C/W  
°C/W  
°C/W  
Thermal resistance junctiontocase, for IGBT  
Thermal resistance junctiontocase, for Diode  
Thermal resistance junctiontoambient  
R
q
JC  
R
q
JC  
R
q
JA  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTIC  
CollectorEmitter Breakdown Voltage  
V
V
= 0 V, I = 1 mA  
BV  
CES  
1200  
V
GE  
C
Temperature Coefficient of Breakdown  
Voltage  
= 0 V, I = 1 mA  
DBV  
/
1.3  
V/°C  
GE  
C
CES  
DT  
J
CollectorEmitter CutOff Current  
V
GE  
= 0 V, V = 1200 V  
I
500  
40  
mA  
CE  
CES  
Gate Leakage Current  
V
GE  
= 20 V, V = 0 V  
I
200  
nA  
CE  
GES  
ON CHARACTERISTIC  
GateEmitter Threshold Voltage  
CollectorEmitter Saturation Voltage  
V
= V , I = 40 mA  
V
GE(th)  
5.5  
6.5  
1.55  
2
7.5  
1.80  
V
V
GE  
CE  
C
V
= 15 V, I = 40 A, T = 25°C  
V
CE(sat)  
GE  
C
J
V
GE  
= 15 V, I = 40 A, T = 175°C  
C
J
DYNAMIC CHARACTERISTIC  
Input Capacitance  
C
C
5079  
113  
62  
pF  
nC  
ies  
Output Capacitance  
V
= 30 V, V = 0 V, f = 1 MHz  
GE  
oes  
CE  
Reverse Transfer Capacitance  
Gate Charge Total  
C
res  
Q
227  
40  
g
GatetoEmitter Charge  
GatetoCollector Charge  
Q
Q
V
CC  
= 600 V, I = 40 A, V = 15 V  
C GE  
ge  
gc  
108  
SWITCHING CHARACTERISTIC, INDUCTIVE LOAD  
Turnon Delay Time  
t
38  
13  
ns  
d(on)  
Rise Time  
t
r
T = 25°C  
J
Turnoff Delay Time  
t
227  
51  
d(off)  
V
= 600 V, I = 20 A  
CC  
C
Fall Time  
t
f
R = 10 W  
g
GE  
V
= 15 V  
Turnon Switching Loss  
Turnoff Switching Loss  
Total Switching Loss  
Turnon Delay Time  
Rise Time  
E
on  
E
off  
0.63  
0.77  
1.40  
42  
mJ  
ns  
Inductive Load  
E
ts  
t
t
d(on)  
t
r
19  
T = 25°C  
J
Turnoff Delay Time  
218  
80  
d(off)  
V
CC  
= 600 V, I = 40 A  
C
Fall Time  
t
f
R = 10 W  
g
GE  
V
= 15 V  
Turnon Switching Loss  
Turnoff Switching Loss  
Total Switching Loss  
E
on  
E
off  
1.04  
1.35  
2.39  
mJ  
Inductive Load  
E
ts  
www.onsemi.com  
2
FGH4L40T120LQD  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
SWITCHING CHARACTERISTIC, INDUCTIVE LOAD  
Turnon Delay Time  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
t
t
32  
12  
ns  
d(on)  
Rise Time  
t
r
T = 175°C  
J
Turnoff Delay Time  
264  
156  
1.05  
1.62  
2.67  
36  
d(off)  
V
CC  
= 600 V, I = 20 A  
C
Fall Time  
t
f
R = 10 W  
g
GE  
V
= 15 V  
Turnon Switching Loss  
Turnoff Switching Loss  
Total Switching Loss  
Turnon Delay Time  
Rise Time  
E
on  
E
off  
mJ  
ns  
Inductive Load  
E
ts  
t
t
d(on)  
t
r
20  
T = 175°C  
J
Turnoff Delay Time  
236  
204  
1.62  
2.51  
4.13  
d(off)  
V
CC  
= 600 V, I = 40 A  
C
Fall Time  
t
f
R = 10 W  
g
GE  
V
= 15 V  
Turnon Switching Loss  
Turnoff Switching Loss  
Total Switching Loss  
DIODE CHARACTERISTIC  
E
on  
E
off  
mJ  
V
Inductive Load  
E
ts  
Forward Voltage  
V
GE  
= 0 V, I = 40 A, T = 25°C  
V
F
3.31  
2.97  
126  
59  
3.80  
F
J
V
GE  
= 0 V, I = 40 A, T = 175°C  
F J  
Reverse Recovery Energy  
E
REC  
mJ  
ns  
nC  
mJ  
ns  
nC  
mJ  
ns  
nC  
T = 25°C  
J
Diode Reverse Recovery Time  
Diode Reverse Recovery Charge  
Reverse Recovery Energy  
I = 40 A, V = 600 V  
F
T
rr  
R
di /dt = 1000 A/ms  
F
Q
804  
540  
115  
rr  
E
REC  
T = 175°C  
J
Diode Reverse Recovery Time  
Diode Reverse Recovery Charge  
Reverse Recovery Energy  
I = 20 A, V = 600 V  
F
T
rr  
R
di /dt = 1000 A/ms  
F
Q
2090  
667  
127  
2613  
rr  
E
REC  
T = 175°C  
J
Diode Reverse Recovery Time  
Diode Reverse Recovery Charge  
T
rr  
I = 40 A, V = 600 V  
F
R
di /dt = 1000 A/ms  
F
Q
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
FGH4L40T120LQD  
TYPICAL CHARACTERISTICS  
160  
120  
80  
160  
20 V  
15 V 12 V  
20 V  
15 V  
12 V  
120  
80  
10 V  
10 V  
40  
0
40  
0
V
4
= 8 V  
GE  
V
= 8 V  
GE  
0
1
2
3
4
5
0
1
2
3
5
V
CE  
, COLLECTOREMITTER VOLTAGE (V)  
V
CE  
, COLLECTOREMITTER VOLTAGE (V)  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Output Characteristics  
(TJ = 255C)  
(TJ = 1755C)  
160  
120  
80  
80  
60  
V
GE  
= 15 V  
Common Emitter  
V
CE  
= 20 V  
T = 25°C  
J
T = 175°C  
J
40  
40  
0
20  
0
T = 175°C  
T = 25°C  
J
J
0
1
2
3
4
5
6
7
0
2
4
6
8
10  
12  
14  
V
CE  
, COLLECTOREMITTER VOLTAGE (V)  
V
GE  
, GATE EMITTER VOLTAGE (V)  
Figure 3. Typical Saturation Voltage  
Characteristics  
Figure 4. Typical Transfer Characteristics  
3.5  
3.0  
2.5  
2.0  
100K  
10K  
1K  
Common Emitter  
V
GE  
= 15 V  
C
C
iss  
I
= 80 A  
C
oss  
100  
10  
C
rss  
I
I
= 40 A  
= 25 A  
C
C
Common Emitter  
f = 1 MHz  
1.5  
1.0  
1
I
C
= 20 A  
V
GE  
= 0 V  
0.1  
100  
50  
0
50  
100  
150  
200  
0.1  
1
10  
30  
T , JUNCTION TEMPERATURE (°C)  
J
V
CE  
, COLLECTORTOEMITTER VOLTAGE (V)  
Figure 5. Saturation Voltage vs. Junction  
Temperature  
Figure 6. Capacitances Characteristics  
www.onsemi.com  
4
FGH4L40T120LQD  
TYPICAL CHARACTERISTICS  
300  
15  
12  
V
CC  
= 400 V  
100  
10  
V
CC  
= 500 V  
10 ms  
V
CC  
= 600 V  
100 ms  
9
6
1 ms  
10 ms  
100  
1
T
= 25°C  
C
3
0
Single Pulse  
T = 175°C  
Common Emitter  
= 40 A  
DC  
J
I
C
0.1  
0
50  
100  
150  
200  
250  
1
10  
1000  
Q , GATE CHARGE (nC)  
g
V
CE  
, COLLECTOREMITTER VOLTAGE (V)  
Figure 7. Gate Charge Characteristics  
Figure 8. SOA Characteristics (FBSOA)  
1000  
1000  
t
d(off)  
V
V
= 600 V  
= 15 V  
= 40 A  
T = 25°C  
T = 175°C  
J
CC  
J
GE  
I
C
t
t
f
d(on)  
100  
10  
100  
10  
t
r
V
V
I
= 600 V  
= 15 V  
= 40 A  
CC  
T = 25°C  
T = 175°C  
J
GE  
J
C
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
R , GATE RESISTANCE (W)  
G
R , GATE RESISTANCE (W)  
G
Figure 9. Turnon Characteristics vs. Gate  
Figure 10. Turnoff Characteristics vs. Gate  
Resistance  
Resistance  
200  
100  
500  
100  
t
d(off)  
t
d(on)  
t
f
10  
1
t
r
V
V
R
= 600 V  
= 15 V  
= 10 W  
V
V
R
= 600 V  
= 15 V  
= 10 W  
CC  
CC  
GE  
GE  
G
G
T = 25°C  
J
T = 25°C  
J
J
J
T = 175°C  
T = 175°C  
10  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
0
10  
20  
30  
40  
50  
60  
70  
80 90  
I , COLLECTOR CURRENT (A)  
C
I , COLLECTOR CURRENT (A)  
C
Figure 11. Turnon Characteristics vs.  
Figure 12. Turnoff Characteristics vs.  
Collector Current  
Collector Current  
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5
FGH4L40T120LQD  
TYPICAL CHARACTERISTICS  
10  
5
10  
V
V
= 600 V  
= 15 V  
= 40 A  
V
V
= 600 V  
= 15 V  
CC  
CC  
E
off  
GE  
GE  
I
C
I = 40 A  
C
R
= 10 W  
G
E
off  
E
on  
1
E
on  
T = 25°C  
T = 175°C  
J
T = 25°C  
T = 175°C  
J
J
J
0.5  
0.1  
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
60  
70  
80 90  
R , GATE RESISTANCE (W)  
G
I , COLLECTOR CURRENT (A)  
C
Figure 13. Switching Loss vs. Gate Resistance  
Figure 14. Switching Loss vs. Collector  
Current  
80  
60  
40  
50  
40  
di/dt 1000 A/ms  
di/dt 500 A/ms  
30  
20  
T = 175°C  
J
T = 25°C  
J
20  
0
10  
0
T = 25°C  
T = 175°C  
J
J
0
1
2
3
4
0
10  
20  
30  
40  
50  
60  
70  
80 90  
V , FORWARD VOLTAGE (V)  
F
I , FORWARD CURRENT (A)  
F
Figure 15. (Diode) Forward Characteristics  
Figure 16. (Diode) Reverse Recover Current  
vs. Forward Current  
200  
150  
100  
4000  
3000  
2000  
T = 25°C  
T = 175°C  
J
J
di/dt 1000 A/ms  
di/dt 1000 A/ms  
di/dt 500 A/ms  
di/dt 500 A/ms  
50  
0
1000  
0
T = 25°C  
T = 175°C  
J
J
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
0
10  
20  
30  
40  
50  
60  
70  
80 90  
I , FORWARD CURRENT (A)  
F
I , FORWARD CURRENT (A)  
F
Figure 17. (Diode) Reverse Recovery Time  
Figure 18. (Diode) Stored Charge  
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6
FGH4L40T120LQD  
TYPICAL CHARACTERISTICS  
1
0.5 Duty Cycle  
0.2  
Duty Factor, D = t /t  
0.1  
1
2
P
i:  
0.1  
0.05  
0.02  
DM  
Peak T = P  
x Z  
+ T  
q
J
DM  
JC C  
R
R
2
1
t
1
t
2
0.01  
0.01  
C = t / R  
C = t / R  
2 2 2  
1
1
1
Single Pulse  
1
2
3
4
ri [K/W]: 0.01438  
0.08956  
0.07977  
0.09921  
T [s]: 1.452E05 2.162E04 6.944E04 3.525E03  
0.001  
5  
4  
3  
2  
1  
0
1
10  
10  
10  
10  
10  
10  
10  
RECTANGULAR PULSE DURATION (sec)  
Figure 19. Transient Thermal Impedance of IGBT  
1
0.5 Duty Cycle  
Duty Factor, D = t /t  
1
2
0.2  
0.1  
P
i:  
DM  
Peak T = P  
x Z  
+ T  
q
J
DM  
JC C  
R
R
2
1
t
1
0.1  
0.05  
0.02  
t
2
C = t / R  
C = t / R  
2 2 2  
0.01  
1
1
1
1
2
3
4
Single Pulse  
ri [K/W]: 0.0291  
T [s]:  
0.0619  
0.1610  
0.1572  
4.272E06 5.358E05 3.408E04 2.119E03  
0.01  
5  
4  
3  
2  
1  
0
1
10  
10  
10  
10  
10  
10  
10  
RECTANGULAR PULSE DURATION (sec)  
Figure 20. Transient Thermal Impedance of Diode  
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7
FGH4L40T120LQD  
Figure 21. Test Circuits for Switching Characteristics  
Figure 22. Definition of TurnOn Waveforms  
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8
FGH4L40T120LQD  
Figure 23. Definition of TurnOff Waveforms  
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9
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2474LD  
CASE 340CJ  
ISSUE A  
DATE 16 SEP 2019  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13852G  
TO2474LD  
PAGE 1 OF 1  
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IGBT,650V,50A,场截止 4 沟槽
ONSEMI

FGH50T65UPD

650 V, 50 A Field Stop Trench IGBT
FAIRCHILD