FGH60T65SQD-F155 [ONSEMI]

IGBT,650V,60A,场截止沟槽;
FGH60T65SQD-F155
型号: FGH60T65SQD-F155
厂家: ONSEMI    ONSEMI
描述:

IGBT,650V,60A,场截止沟槽

双极性晶体管
文件: 总10页 (文件大小:557K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IGBT - Field Stop, Trench  
650 V, 60 A  
FGH60T65SQD-F155  
Description  
Using novel field stop IGBT technology, ON Semiconductor’s new  
th  
series of field stop 4 generation IGBTs offer the optimum  
www.onsemi.com  
performance for solar inverter, UPS, welder, telecom, ESS and PFC  
applications where low conduction and switching losses are essential.  
V
I
C
CES  
Features  
650 V  
60 A  
Max Junction Temperature 175°C  
Positive Temperature Coefficient for Easy Parallel Operating  
High Current Capability  
C
E
Low Saturation Voltage: V  
= 1.6 V (Typ.) @ I = 60 A  
C
CE(sat)  
G
100% of the Parts Tested for ILM(1)  
High Input Impedance  
Fast Switching  
Tighten Parameter Distribution  
This Device is PbFree and is RoHS Compliant  
E
C
G
Applications  
Solar Inverter, UPS, Welder, Telecom, ESS, PFC  
COLLECTOR  
(FLANGE)  
TO2473LD  
CASE 340CH  
MARKING DIAGRAM  
$Y&Z&3&K  
FGH60T65  
SQD  
$Y  
= ON Semiconductor Logo  
&Z  
&3  
&K  
= Assembly Plant Code  
= Numeric Date Code  
= Lot Code  
FGH60T65SQD  
= Specific Device Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
FGH60T65SQDF155/D  
November, 2019 Rev. 3  
FGH60T65SQDF155  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Description  
FGH60T65SQDF155  
Unit  
V
V
CES  
GES  
Collector to Emitter Voltage  
Gate to Emitter Voltage  
650  
20  
V
V
Transient Gate to Emitter Voltage  
Collector Current  
30  
V
I
@ TC < 25°C  
@ TC < 100°C  
@ TC < 25°C  
120  
60  
A
C
I
Pulsed Collector Current  
Pulsed Collector Current  
240  
A
A
LM  
(Note 1)  
I
240  
CM  
(Note 2)  
I
Diode Forward Current  
@ TC < 25°C  
@ TC < 100°C  
60  
30  
A
A
A
F
Diode Forward Current  
I
Repetitive Forward Surge Current  
240  
FM  
(Note 2)  
P
D
Maximum Power Dissipation  
@ TC < 25°C  
@ TC < 100°C  
333  
167  
W
W
T
Operating Junction Temperature Range  
55 to +175  
55 to +175  
300  
°C  
°C  
°C  
J
T
Storage Temperature Range  
STG  
T
L
Maximum Lead Temp. For soldering Purposes, 18” from case for 5 sec  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. V = 400 V, V = 15 V, I = 240 A, R = 21 W, Inductive Load.  
CC  
GE  
C
G
2. Repetitive rating: Pulse width limited by max. junction temperature.  
THERMAL CHARACTERISTICS  
Symbol  
(IGBT)  
Parameter  
FGH60T65SQDF155  
Unit  
R
R
Thermal Resistance, Junction to Case, Max.  
Thermal Resistance, Junction to Case, Max.  
Thermal Resistance, Junction to Ambient, Max.  
0.45  
1.25  
40  
_C/W  
_C/W  
_C/W  
q
JC  
(Diode)  
q
JC  
R
q
JA  
PACKAGE MARKING AND ORDERING INFORMATION  
Packing  
Method  
Part Number  
Top Mark  
Package  
Reel Size  
Tape Width  
Quantity  
FGH60T65SQDF155  
FGH60T65SQD  
TO2473LD  
Tube  
30  
www.onsemi.com  
2
 
FGH60T65SQDF155  
ELECTRICAL CHARACTERISTICS OF THE IGBT (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
BV  
Collector to Emitter Breakdown Voltage  
/ DT Temperature Coefficient of Breakdown Voltage  
V
= 0 V, I = 1 mA  
650  
V
V/°C  
mA  
CES  
GE  
C
DBV  
I = 1 mA, Reference to 25°C  
C
0.6  
CES  
J
I
Collector CutOff Current  
GE Leakage Current  
V
CE  
V
GE  
= V  
= V  
, V = 0 V  
250  
400  
CES  
GES  
CES  
GE  
I
, V = 0 V  
nA  
GES  
CE  
ON CHARACTERISTICS  
V
GE Threshold Voltage  
I
I
I
= 60 mA, V = V  
GE  
2.6  
4.5  
1.6  
6.4  
2.1  
V
V
GE(th)  
C
C
C
CE  
= 60 A V = 15 V  
,
GE  
V
Collector to Emitter Saturation Voltage  
CE(sat)  
= 60 A V = 15 V,  
,
GE  
1.92  
V
T
= 175°C  
C
DYNAMIC CHARACTERISTICS  
C
Input Capacitance  
3813  
90  
pF  
pF  
pF  
ies  
V
= 30 V V = 0 V,  
, GE  
CE  
C
Output Capacitance  
oes  
f = 1MHz  
C
Reverse Transfer Capacitance  
13  
res  
SWITCHING CHARACTERISTICS  
V
= 400 V, I = 15 A,  
C
t
TurnOn Delay Time  
Rise Time  
CC  
G
20.8  
8
ns  
ns  
ns  
ns  
mJ  
mJ  
mJ  
d(on)  
R
= 4.7 W, V = 15 V,  
GE  
t
r
Inductive Load, T = 25°C  
C
t
TurnOff Delay Time  
Fall Time  
102  
11.2  
227  
100  
327  
d(off)  
t
f
E
on  
E
off  
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
E
ts  
V
= 400 V, I = 30 A,  
C
t
t
TurnOn Delay Time  
Rise Time  
CC  
G
21.6  
14.4  
97.6  
4.8  
ns  
ns  
ns  
ns  
mJ  
mJ  
mJ  
d(on)  
R
= 4.7 W, V = 15 V,  
GE  
t
r
Inductive Load, T = 25°C  
C
TurnOff Delay Time  
Fall Time  
d(off)  
t
f
E
on  
E
off  
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
585  
167  
752  
E
ts  
V
= 400 V, I = 15 A,  
C
T
TurnOn Delay Time  
Rise Time  
CC  
G
19.2  
9.6  
ns  
ns  
ns  
ns  
mJ  
d(on)  
R
= 4.7 W, V = 15 V,  
GE  
T
r
Inductive Load, T = 175°C  
C
T
TurnOff Delay Time  
Fall Time  
115  
11.2  
d(off)  
T
f
E
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
448  
199  
647  
on  
off  
mJ  
mJ  
E
E
ts  
www.onsemi.com  
3
FGH60T65SQDF155  
ELECTRICAL CHARACTERISTICS OF THE IGBT (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
SWITCHING CHARACTERISTICS  
V
= 400 V, I = 30 A,  
C
T
TurnOn Delay Time  
CC  
G
20.8  
16  
ns  
ns  
ns  
ns  
mJ  
d(on)  
R
= 4.7 W, V = 15 V,  
GE  
T
r
Rise Time  
Inductive Load, T = 175°C  
C
T
TurnOff Delay Time  
Fall Time  
106  
8.8  
d(off)  
T
f
E
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
942  
386  
on  
off  
mJ  
mJ  
E
E
1328  
ts  
V
CE  
V
GE  
= 400 V, I = 60 A,  
Q
Total Gate Charge  
79  
22  
27  
nC  
nC  
nC  
C
g
= 15 V  
Q
ge  
Q
gc  
Gate to Emitter Charge  
Gate to Collector Charge  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
ELECTRICAL CHARACTERISTICS OF THE DIODE (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Test Conditions  
= 25°C  
Min  
Typ  
2.3  
Max  
2.7  
Unit  
I = 30 A  
T
C
V
V
FM  
Diode Forward Voltage  
F
T
= 175°C  
= 175°C  
= 25°C  
1.9  
C
C
I = 30 A,  
dI /dt = 200 A/ms  
T
mJ  
E
rec  
Reverse Recovery Energy  
F
50  
F
T
ns  
T
rr  
Diode Reverse Recovery Time  
34.6  
197  
58.6  
810  
C
T
= 175°C  
= 25°C  
C
T
nC  
Q
Diode Reverse Recovery Charge  
C
rr  
T
C
= 175°C  
www.onsemi.com  
4
FGH60T65SQDF155  
TYPICAL CHARACTERISTICS  
240  
180  
120  
60  
240  
20 V  
15 V  
12 V  
20 V  
15 V  
12 V  
T
C
= 25°C  
T
C
= 175°C  
180  
120  
60  
10 V  
= 8 V  
10 V  
= 8 V  
V
GE  
V
GE  
0
0
0
1
2
3
4
5
0
1
2
3
4
5
CollectorEmitter Voltage, V [V]  
CollectorEmitter Voltage, V [V]  
CE  
CE  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Output Characteristics  
240  
180  
120  
60  
3
Common Emitter  
Common Emitter  
V
GE  
= 15 V  
V
GE  
= 1.5 V  
T
C
T
C
= 25°C  
= 175°C  
120 A  
60 A  
2
1
I
= 30 A  
50  
C
0
0
1
2
3
4
5
100  
50  
0
100  
150  
200  
CollectorEmitter Case Temperature, T [5C]  
CollectorEmitter Voltage, V [V]  
C
CE  
Figure 3. Typical Saturation Voltage Characteristics  
Figure 4. Saturation Voltage vs. Case  
Temperature at Variant Current Level  
20  
20  
16  
12  
8
Common Emitter  
Common Emitter  
T
C
= 25°C  
T
C
= 175°C  
16  
12  
8
I
C
= 30 A  
60 A  
I
C
= 30 A  
60 A  
120 A  
120 A  
4
4
0
0
0
4
8
12  
16  
20  
0
4
8
12  
16  
20  
GateEmitter Voltage, V [V]  
GateEmitter Voltage, V [V]  
GE  
GE  
Figure 5. Saturation Voltage vs. VGE  
Figure 6. Saturation Voltage vs. VGE  
www.onsemi.com  
5
FGH60T65SQDF155  
TYPICAL CHARACTERISTICS (Continued)  
10000  
1000  
100  
10  
15  
Common Emitter  
= 25°C  
T
C
C
ies  
12  
9
300 V  
400 V  
V
= 200 V  
CC  
C
oes  
6
C
res  
Common Emitter  
= 0 V, f = 1 MHz  
3
0
V
GE  
T
C
= 25°C  
1
10  
30  
1
0
25  
50  
75  
100  
CollectorEmitter Voltage, V [V]  
Gate Charge, Q [nC]  
CE  
q
Figure 7. Capacitance Characteristics  
Figure 8. Gate Charge Characteristics  
200  
100  
1000  
t
d(off)  
t
r
t
f
100  
t
d(on)  
Common Emitter  
= 400 V, V = 15 V  
Common Emitter  
= 400 V, V = 15 V  
V
CC  
GE  
V
CC  
GE  
I
C
= 60 A  
I
C
= 60 A  
T
C
T
C
= 25°C  
= 175°C  
T
C
T
C
= 25°C  
= 175°C  
10  
5
10  
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
Gate Resistance, R [W]  
Gate Resistance, R [W]  
G
G
Figure 9. Turnon Characteristics vs.  
Figure 10. Turnoff Characteristics  
Gate Resistance  
vs. Gate Resistance  
5000  
1000  
E
on  
t
r
E
off  
t
d(on)  
Common Emitter  
= 400 V, V = 15 V  
V
CC  
GE  
Common Emitter  
= 15 V, R = 4.7 W  
I
C
= 60 A  
V
GE  
G
T
C
T
C
= 25°C  
= 175°C  
T
C
T
C
= 25°C  
= 175°C  
100  
0
10  
20  
30  
40  
50  
0
25  
50  
75  
100  
125  
150  
Gate Resistance, R [W]  
G
Collector Current, I [A]  
C
Figure 11. Switching Loos vs.  
Gate Resistance  
Figure 12. Turnon Characteristics vs.  
Collector Current  
www.onsemi.com  
6
FGH60T65SQDF155  
TYPICAL CHARACTERISTICS (Continued)  
500  
100  
10000  
1000  
E
on  
t
d(off)  
t
f
E
off  
10  
1
Common Emitter  
Common Emitter  
V
T
= 15 V, R = 4.7 W  
= 25°C  
V
T
= 15 V, R = 4.7 W  
= 25°C  
GE  
G
GE  
G
C
C
C
100  
50  
T
C
= 175°C  
T
= 175°C  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
Collector Current, I [A]  
Collector Current, I [A]  
C
C
Figure 13. Turnoff Characteristics vs.  
Figure 14. Switching Loos vs.  
Collector Current  
Collector Current  
300  
250  
200  
150  
100  
50  
400  
100  
Square Wave  
T
175°C, D = 0.5,  
J
V
= 400 V, V = 15/0 V, R = 4.7 W  
CE  
GE  
G
10 ms  
DC  
ms  
100  
T
C
= 25°C  
1 ms  
10 ms  
T
C
= 75°C  
10  
1
T
C
= 100°C  
Notes:  
1. T = 25°C  
2. T = 175°C  
C
J
3. Single Pulse  
0
0.1  
1k  
10k  
100k  
1M  
1
10  
100  
1000  
Switching Frequency, f[Hz]  
CollectorEmitter Voltage, V [V]  
CE  
Figure 15. Load Current vs. Frequency  
Figure 16. SOA Characteristics  
180  
100  
12  
9
T
T
= 25°C  
= 175°C  
C
C
di/dt = 200 A/ms  
T
C
= 25°C  
T
C
= 175°C  
T
C
= 75°C  
6
3
0
di/dt = 100 A/ms  
di/dt = 200 A/ms  
di/dt = 100 A/ms  
10  
1
0
1
2
3
4
5
6
0
20  
40  
60  
80  
Forward Voltage, V [V]  
F
Forward Current, I [A]  
F
Figure 17. Forward Characteristics  
Figure 18. Reverse Recovery Current  
www.onsemi.com  
7
FGH60T65SQDF155  
TYPICAL CHARACTERISTICS (Continued)  
400  
300  
200  
100  
0
1000  
T
C
T
C
= 25°C  
= 175°C  
T
C
T
C
= 25°C  
= 175°C  
800  
600  
400  
200  
di/dt = 200 A/ms di/dt = 100 A/ms  
di/dt = 100 A/ms  
di/dt = 200 A/ms  
0
0
20  
40  
60  
80  
0
20  
40  
60  
80  
Forward Current, I [A]  
Forward Current, I [A]  
F
F
Figure 19. Reverse Recovery Time  
Figure 20. Stored Charge  
0.6  
0.5  
0.1 0.2  
0.1  
0.05  
0.02  
0.01  
PDM  
t1  
t2  
single pulse  
0.01  
Duty Factor, D = t1/t2  
Peak T = P  
× Z  
+ T  
J
DM  
THJC  
C
0.005  
5  
4  
3  
2  
1  
0
10  
10  
10  
10  
10  
10  
Rectangular Pulse Duration [sec]  
Figure 21. Transient Thermal Impedance of IGBT  
2
1
0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
PDM  
t1  
t2  
Duty Factor, D = t1/t2  
single pulse  
Peak T = P  
× Z  
+ T  
J
DM  
THJC  
C
0.01  
5  
4  
3  
2  
1  
0
10  
10  
10  
10  
10  
10  
Rectangular Pulse Duration [sec]  
Figure 22. Transient Thermal Impedance of Diode  
www.onsemi.com  
8
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2473LD  
CASE 340CH  
ISSUE A  
DATE 09 OCT 2019  
GENERIC  
MARKING DIAGRAM*  
XXXXXXXXX  
AYWWG  
XXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
G
= PbFree Package  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13853G  
TO2473LD  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
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