NDF08N60ZG [ONSEMI]

N-Channel Power MOSFET 600 V, 0.95 Ω; N沟道功率MOSFET的600 V , 0.95 Ω
NDF08N60ZG
型号: NDF08N60ZG
厂家: ONSEMI    ONSEMI
描述:

N-Channel Power MOSFET 600 V, 0.95 Ω
N沟道功率MOSFET的600 V , 0.95 Ω

晶体 晶体管 功率场效应晶体管 脉冲 局域网
文件: 总6页 (文件大小:108K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NDF08N60Z, NDP08N60Z  
N-Channel Power MOSFET  
600 V, 0.95 W  
Features  
Low ON Resistance  
Low Gate Charge  
http://onsemi.com  
100% Avalanche Tested  
These Devices are PbFree and are RoHS Compliant  
V
DSS  
R
(MAX) @ 3.5 A  
DS(ON)  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
600 V  
0.95 W  
Rating  
Symbol NDF08N60Z NDP08N60Z Unit  
DraintoSource Voltage  
V
600  
7.5 (Note 1)  
V
A
DSS  
NChannel  
Continuous Drain Current  
R
I
D
7.5  
4.8  
30  
D (2)  
q
JC  
Continuous Drain Current  
I
D
4.8 (Note 1)  
30 (Note 1)  
35  
A
A
R
q
JC  
T = 100°C  
A
Pulsed Drain Current,  
@ 10 V  
I
DM  
G (1)  
V
GS  
Power Dissipation  
P
139  
W
V
D
GatetoSource Voltage  
Single Pulse Avalanche  
V
30  
GS  
S (3)  
TO220FP  
CASE 221D  
STYLE 1  
E
235  
mJ  
AS  
Energy, I = 7.5 A  
MARKING  
DIAGRAM  
D
ESD (HBM)  
(JESD 22A114)  
V
4000  
V
V
esd  
RMS Isolation Voltage  
V
4500  
ISO  
(t = 0.3 sec., R.H. 30%,  
T = 25°C) (Figure 14)  
A
NDF08N60ZG  
or  
NDP08N60ZG  
AYWW  
Peak Diode Recovery  
dv/dt  
4.5  
7.5  
V/ns  
A
Continuous Source  
Current (Body Diode)  
I
S
Maximum Temperature for  
Soldering Leads  
T
260  
°C  
°C  
Gate  
Source  
L
TO220  
CASE 221A  
STYLE 5  
Operating Junction and  
Storage Temperature Range  
T , T  
55 to 150  
J
stg  
Drain  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
A
Y
WW  
G
= Location Code  
= Year  
= Work Week  
= PbFree Package  
1. Limited by maximum junction temperature  
2. I v 7.5 A, di/dt 200 A/ms, V BV  
, T 150°C.  
J
D
DD  
DSS  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
© Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
July, 2010 Rev. 0  
NDF08N60Z/D  
 
NDF08N60Z, NDP08N60Z  
THERMAL RESISTANCE  
Parameter  
Symbol  
NDF08N60Z  
NDP08N60Z  
Unit  
JunctiontoCase (Drain)  
R
3.6  
50  
0.9  
50  
°C/W  
q
JC  
JunctiontoAmbient Steady State (Note 3)  
R
q
JA  
3. Insertion mounted  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Characteristic  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
V
GS  
= 0 V, I = 1 mA  
BV  
DSS  
600  
V
D
Breakdown Voltage Temperature  
Coefficient  
Reference to 25°C,  
= 1 mA  
DBV  
DT  
/
0.6  
V/°C  
DSS  
I
D
J
DraintoSource Leakage Current  
25°C  
I
1
mA  
DSS  
V
DS  
= 600 V, V = 0 V  
GS  
125°C  
50  
10  
GatetoSource Forward Leakage  
ON CHARACTERISTICS (Note 4)  
V
GS  
=
20 V  
I
mA  
GSS  
Static DraintoSource  
OnResistance  
V
= 10 V, I = 3.5 A  
R
DS(on)  
0.82  
6.3  
0.95  
4.5  
W
GS  
D
Gate Threshold Voltage  
V
DS  
= V , I = 100 mA  
V
GS(th)  
3.0  
V
S
GS  
D
Forward Transconductance  
V
= 15 V, I = 3.5 A  
g
FS  
DS  
D
DYNAMIC CHARACTERISTICS  
Input Capacitance  
C
1140  
129  
30  
pF  
nC  
iss  
V
= 25 V, V = 0 V,  
f = 1.0 MHz  
DS  
GS  
Output Capacitance  
C
oss  
Reverse Transfer Capacitance  
Total Gate Charge  
C
rss  
Q
39  
g
gs  
GatetoSource Charge  
GatetoDrain (“Miller”) Charge  
Plateau Voltage  
Q
Q
7.5  
21  
V
DD  
= 300 V, I = 7.5 A,  
D
V
GS  
= 10 V  
gd  
GP  
V
6.2  
1.6  
V
Gate Resistance  
R
W
g
RESISTIVE SWITCHING CHARACTERISTICS  
TurnOn Delay Time  
t
14  
22  
36  
15  
ns  
d(on)  
Rise Time  
t
r
V
V
= 300 V, I = 7.5 A,  
D
DD  
= 10 V, R = 5 W  
GS  
G
TurnOff Delay Time  
Fall Time  
t
d(off)  
t
f
SOURCEDRAIN DIODE CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Diode Forward Voltage  
I
S
= 7.5 A, V = 0 V  
V
SD  
1.6  
V
GS  
Reverse Recovery Time  
t
320  
2.2  
ns  
mC  
rr  
V
= 0 V, V = 30 V  
DD  
GS  
I
S
= 7.5 A, di/dt = 100 A/ms  
Reverse Recovery Charge  
Q
rr  
4. Pulse Width 380 ms, Duty Cycle 2%.  
http://onsemi.com  
2
 
NDF08N60Z, NDP08N60Z  
TYPICAL CHARACTERISTICS  
20  
20  
18  
16  
14  
12  
10  
8
V
DS  
= 25 V  
18  
16  
14  
12  
10  
8
V
GS  
= 10 V  
7.0 V  
6.5 V  
6.0 V  
T = 25°C  
J
6
6
T = 150°C  
J
4
4
T = 55°C  
J
5.5 V  
5.0 V  
2
2
0
3
0
0
5
10  
15  
20  
25  
4
5
6
7
8
9
10  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 1. OnRegion Characteristics  
Figure 2. Transfer Characteristics  
1.25  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
0.80  
0.75  
1.25  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
0.80  
0.75  
V
= 10 V  
GS  
J
I
= 3.5 A  
D
T = 25°C  
T = 25°C  
J
5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0  
0
1
2
3
4
5
6
7
8
9
10  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 3. OnRegion versus GatetoSource  
Figure 4. OnResistance versus Drain  
Voltage  
Current and Gate Voltage  
2.75  
2.50  
2.25  
2.00  
1.75  
1.50  
1.25  
1.00  
0.75  
0.50  
0.25  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
I
V
= 3.5 A  
D
I
= 1 mA  
D
= 10 V  
GS  
50  
25  
0
25  
50  
75  
100  
125  
150  
50 25  
0
25  
50  
75  
100 125 150  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 5. OnResistance Variation with  
Figure 6. BVDSS Variation with Temperature  
Temperature  
http://onsemi.com  
3
NDF08N60Z, NDP08N60Z  
TYPICAL CHARACTERISTICS  
2750  
2500  
2250  
2000  
1750  
100  
10  
1
T = 25°C  
J
V
GS  
= 0 V  
C
iss  
f = 1 MHz  
C
oss  
T = 150°C  
J
C
rss  
1500  
1250  
1000  
750  
500  
250  
0
T = 125°C  
J
0.1  
0
50 100 150 200 250 300 350 400 450 500 550 600  
, DRAINTOSOURCE VOLTAGE (V)  
0.01  
0.1  
1
10  
100  
V
DS  
V
, DRAINTOSOURCE VOLTAGE (V)  
DS  
Figure 7. DraintoSource Leakage Current  
Figure 8. Capacitance Variation  
versus Voltage  
15  
14  
13  
12  
11  
10  
9
8
7
6
5
350  
300  
250  
Q
T
V
DS  
V
GS  
200  
Q
Q
GD  
GS  
150  
100  
4
3
2
1
V
I
= 300 V  
DS  
= 7.5 A  
D
50  
0
T = 25°C  
J
0
0
4
8
12 16 20 24 28 32 36 40  
Q , TOTAL GATE CHARGE (nC)  
Figureg9. GatetoSource Voltage and  
DraintoSource Voltage versus Total Charge  
1000  
100  
10  
10.0  
V
I
V
= 300 V  
= 7.5 A  
DD  
D
= 10 V  
GS  
t
d(off)  
T = 150°C  
J
t
t
r
f
25°C  
t
d(on)  
1.0  
125°C  
55°C  
1
0.1  
1
10  
R , GATE RESISTANCE (W)  
100  
0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2  
, SOURCETODRAIN VOLTAGE (V)  
V
SD  
G
Figure 10. Resistive Switching Time Variation  
versus Gate Resistance  
Figure 11. Diode Forward Voltage versus  
Current  
http://onsemi.com  
4
NDF08N60Z, NDP08N60Z  
100  
10  
V
v 30 V  
GS  
SINGLE PULSE  
1 ms  
100 ms 10 ms  
T
C
= 25°C  
10 ms  
dc  
1
0.1  
0.01  
R
LIMIT  
DS(on)  
THERMAL LIMIT  
PACKAGE LIMIT  
0.1  
1
10  
100  
1000  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 12. Maximum Rated Forward Biased  
Safe Operating Area NDF08N60Z  
10  
1
DUTY CYCLE = 0.5  
0.2  
0.1  
0.05  
0.02  
0.1  
0.01  
0.01  
R
= 3.6°C/W  
q
JC  
SINGLE PULSE  
1E05 1E04  
Steady State  
1E06  
1E03  
1E02  
1E01  
1E+00  
1E+01  
1E+02 1E+03  
PULSE TIME (s)  
Figure 13. Thermal Impedance (JunctiontoCase) for NDF08N60Z  
LEADS  
HEATSINK  
0.110MIN  
Figure 14. Isolation Test Diagram  
Measurement made between leads and heatsink with all leads shorted together.  
*For additional mounting information, please download the ON Semiconductor  
Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.  
ORDERING INFORMATION  
Order Number  
Package  
Shipping  
NDF08N60ZG  
TO220FP  
(PbFree)  
50 Units / Rail  
NDP08N60ZG  
TO220AB  
(PbFree)  
50 Units / Rail  
(In Development)  
http://onsemi.com  
5
NDF08N60Z, NDP08N60Z  
PACKAGE DIMENSIONS  
TO220 FULLPAK  
CASE 221D03  
ISSUE K  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
SEATING  
PLANE  
T−  
B−  
C
2. CONTROLLING DIMENSION: INCH  
3. 221D-01 THRU 221D-02 OBSOLETE, NEW  
STANDARD 221D-03.  
F
S
Q
H
INCHES  
DIM MIN MAX  
MILLIMETERS  
U
MIN  
15.67  
9.96  
4.50  
0.60  
2.95  
MAX  
16.12  
10.63  
4.90  
A
B
C
D
F
0.617  
0.392  
0.177  
0.024  
0.116  
0.635  
0.419  
0.193  
0.039  
0.129  
A
1
2 3  
1.00  
3.28  
G
H
J
0.100 BSC  
2.54 BSC  
Y−  
K
0.118  
0.018  
0.503  
0.048  
0.135  
0.025  
0.541  
0.058  
3.00  
0.45  
3.43  
0.63  
K
L
12.78  
1.23  
13.73  
1.47  
G
N
J
N
Q
R
S
U
0.200 BSC  
5.08 BSC  
R
0.122  
0.099  
0.092  
0.239  
0.138  
0.117  
0.113  
0.271  
3.10  
2.51  
2.34  
6.06  
3.50  
2.96  
2.87  
6.88  
L
D 3 PL  
STYLE 1:  
PIN 1. GATE  
2. DRAIN  
M
M
0.25 (0.010)  
B
Y
3. SOURCE  
TO220  
CASE 221A09  
ISSUE AF  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION Z DEFINES A ZONE WHERE ALL  
BODY AND LEAD IRREGULARITIES ARE  
ALLOWED.  
SEATING  
PLANE  
T−  
C
B
F
T
S
INCHES  
DIM MIN MAX  
MILLIMETERS  
4
1
MIN  
14.48  
9.66  
4.07  
0.64  
3.61  
2.42  
2.80  
0.36  
12.70  
1.15  
4.83  
2.54  
2.04  
1.15  
5.97  
0.00  
1.15  
---  
MAX  
15.75  
10.28  
4.82  
0.88  
4.09  
2.66  
3.93  
0.64  
14.27  
1.52  
5.33  
3.04  
2.79  
1.39  
6.47  
1.27  
---  
A
B
C
D
F
0.570  
0.380  
0.160  
0.025  
0.142  
0.095  
0.110  
0.014  
0.500  
0.045  
0.190  
0.100  
0.080  
0.045  
0.235  
0.000  
0.045  
---  
0.620  
0.405  
0.190  
0.035  
0.161  
0.105  
0.155  
0.025  
0.562  
0.060  
0.210  
0.120  
0.110  
0.055  
0.255  
0.050  
---  
A
K
Q
Z
2
3
U
H
G
H
J
K
L
N
Q
R
S
T
L
R
V
J
G
U
V
Z
D
0.080  
2.04  
N
STYLE 5:  
PIN 1. GATE  
2. DRAIN  
3. SOURCE  
4. DRAIN  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
NDF08N60Z/D  

相关型号:

NDF10N60Z

N-Channel Power MOSFET 0.65 Ω, 600 Volts
ONSEMI

NDF10N60ZG

N-Channel Power MOSFET 0.65 Ω, 600 Volts
ONSEMI

NDF10N60ZH

N-Channel Power MOSFET 600 V, 0.75 Ohm
ONSEMI

NDF10N62Z

N-Channel Power MOSFET 620 V, 0.65 Ω
ONSEMI

NDF10N62ZG

N-Channel Power MOSFET 620 V, 0.65 Ω
ONSEMI

NDF11N50Z

N-Channel Power MOSFET 500 V, 0.52 
ONSEMI

NDF11N50ZG

N-Channel Power MOSFET 500 V, 0.52 
ONSEMI

NDF11N50ZH

N-Channel Power MOSFET 500 V, 0.52 Ohm
ONSEMI

NDF206AL

2000mA, 60V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-226
TI

NDF206BL

1800mA, 60V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-226
TI

NDF60N360U1

N-Channel Power MOSFET
ONSEMI

NDF60N360U1G

N-Channel Power MOSFET
ONSEMI