NHP160SFT3G [ONSEMI]
平面 Ultrafast 整流器，Ultrafast，1 A，600 V;
| 型号： | NHP160SFT3G |
| 厂家： | 
ONSEMI |
| 描述： | 平面 Ultrafast 整流器，Ultrafast，1 A，600 V |
| 文件： | 总6页 (文件大小：138K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NHP160SF, NRVHP160SF
Surface Mount
Ultrafast Power Rectifier
Plastic SOD−123FL Package
This SOD−123FL ultrafast rectifier provides fast switching
performance with soft recovery in a compact thermally efficient
package. Its compact footprint makes it ideally suited to portable and
automotive applications where board space is at a premium. Its low
profile makes it a good option for flat panel display and other
applications with limited vertical clearance. The device offers low
leakage over temperature making it a good match for applications
requiring low quiescent current.
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ULTRAFAST RECTIFIER
1.0 AMPERES
600 VOLTS
Features
• Fast Soft Switching for Reduced EMI and Higher Efficiency
• Low Profile − Maximum Height of 1.0 mm
2
SOD−123FL
CASE 498
• Small Footprint − Footprint Area of 5.94 mm
• NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
MARKING DIAGRAM
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
P16MG
G
Mechanical Characteristics:
• Case: Molded Epoxy
P16
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: 11.7 mg (Approximately)
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Maximum for 10 Seconds
• MSL 1
(Note: Microdot may be in either location)
ORDERING INFORMATION
Applications
†
Device
Package
Shipping
• Automotive HID Lighting
• Diesel Piezo Injection
NHP160SFT3G
SOD−123 10000/Tape & Reel
(Pb−Free)
• Power Factor Correction in Mini Adapters
• Freewheeling Diode Where Space is at a Premium
NRVHP160SFT3G SOD−123 10000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
March, 2018 − Rev. 0
NHP160SF/D
NHP160SF, NRVHP160SF
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
600
V
RRM
V
RWM
V
R
Average Rectified Forward Current
(T = 150°C)
L
I
1.0
2.0
A
A
O
Peak Repetitive Forward Current
I
FRM
(Square Wave, 20 kHz, T = 145°C)
L
Non−Repetitive Peak Surge Current
I
15
A
FSM
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Storage and Operating Junction Temperature Range (Note 1)
T
stg
, T
J
−65 to +175
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dP /dT < 1/R
.
q
D
J
JA
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
12
Unit
°C/W
°C/W
°C/W
Thermal Resistance, Junction−to−Lead (Note 2)
Thermal Resistance, Junction−to−Ambient (Note 2)
Thermal Resistance, Junction−to−Ambient (Note 3)
ELECTRICAL CHARACTERISTICS
Characteristic
Y
JCL
R
86.7
330
q
q
JA
JA
R
Test Conditions
Symbol
Typ
Max
Unit
(I = 1 A, T = 125°C)
V
F
1.9
3.0
2.6
3.8
V
Instantaneous Forward Voltage (Note 4)
F
C
(I = 1 A, T = 25°C)
F
C
Instantaneous Reverse Current (Note 4)
(Rated DC Voltage, T = 125°C)
I
R
5
0.02
20
2.0
mA
C
(Rated DC Voltage, T = 25°C)
C
Reverse Recovery Time
Peak Reverse Recovery Current
Total Reverse Recovery Charge
Softness Factor
(I = 1 A, d /d = −50 A/ms, T = 25°C)
t
9
50
3
50
3
ns
A
nC
−
F
IF
t
C
rr
I
0.5
2.1
0.8
RM
Q
S
rr
Reverse Recovery Time
Peak Reverse Recovery Current
Total Reverse Recovery Charge
Softness Factor
(I = 1 A, d /d = −50 A/ms, T = 125°C)
t
rr
RM
30
0.7
12
−
−
−
−
ns
A
nC
−
F
IF
t
C
I
Q
rr
S
2.4
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2
2
2. Mounted with 700 mm copper pad size (Approximately 1 in ) 1 oz FR4 Board.
2
3. Mounted with pad size approximately 20 mm copper, 1 oz FR4 Board.
4. Pulse Test: Pulse Width ≤ 380 ms, Duty Cycle ≤ 2.0%.
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2
NHP160SF, NRVHP160SF
TYPICAL CHARACTERISTICS
10
10
T = 175°C
A
T = 175°C
A
T = 150°C
A
T = 150°C
A
T = 125°C
A
T = 125°C
A
T = 85°C
A
T = 85°C
A
1
1
T = 25°C
A
T = 25°C
A
T = −40°C
T = −40°C
A
A
0.1
0.1
0
1.0
2.0
3.0
4.0
5.0
6.0
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
Figure 1. Typical Instantaneous Forward
Characteristics
Figure 2. Maximum Instantaneous Forward
Characteristics
1E−04
1E−05
1E−06
1E−07
1E−03
1E−04
1E−05
1E−06
1E−07
T = 175°C
A
T = 175°C
A
T = 150°C
A
T = 150°C
A
T = 125°C
A
T = 125°C
A
T = 85°C
A
T = 85°C
A
1E−08
1E−09
1E−10
T = 25°C
A
T = 25°C
A
T = −55°C
A
T = −55°C
A
100
200
300
400
500
600
100
200
300
400
500
600
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Figure 3. Typical Reverse Characteristics
Figure 4. Maximum Reverse Characteristics
100
2
R
= 12°C/W
q
JC
T = 25°C
J
DC
Square Wave
1
10
1
0
0
0
20 40 60 80 100 120 140 160 180 200
20
40
60
80 100 120 140 160 180
V , REVERSE VOLTAGE (V)
R
T , CASE TEMPERATURE (°C)
C
Figure 5. Typical Junction Capacitance
Figure 6. Current Derating
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3
NHP160SF, NRVHP160SF
TYPICAL CHARACTERISTICS
2.0
1.5
1.0
I /I = 20
I
PK AV
/I = 10
PK AV
I
/I = 5
PK AV
Square Wave
0.5
0
DC
0
0.2
0.4
0.6
0.8
1.0
I , AVERAGE FORWARD CURRENT (A)
F(AV)
Figure 7. Forward Power Dissipation
1000
100
50% (DUTY CYCLE)
25%
10%
5.0%
10 2.0%
1.0%
1.0
0.1
SINGLE PULSE
0.01
0.000001 0.00001
0.0001
0.001
0.01
PULSE TIME (s)
0.1
1.0
10
100
1000
Figure 8. Thermal Response, Junction−to−Ambient (20 mm2 pad)
100
10
50% (DUTY CYCLE)
25%
10%
5.0%
2.0%
1.0%
1.0
0.1
SINGLE PULSE
0.01
0.000001
0.00001
0.0001
0.001
0.01
PULSE TIME (s)
0.1
1.0
10
100
1000
Figure 9. Thermal Response, Junction−to−Ambient (1 in2 pad)
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOD−123FL
CASE 498
ISSUE D
DATE 10 MAY 2013
SCALE 4:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
E
q
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION
OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
D
1
2
MILLIMETERS
INCHES
NOM
0.037
0.002
0.035
0.006
0.065
0.106
0.030
0.142
−
DIM
A
A1
b
c
D
MIN
0.90
0.00
0.70
0.10
1.50
2.50
0.55
3.40
0°
NOM
0.95
0.05
0.90
0.15
1.65
2.70
0.75
3.60
−
MAX
MIN
0.035
0.000
0.028
0.004
0.059
0.098
0.022
0.134
0°
MAX
0.039
0.004
0.043
0.008
0.071
0.114
0.037
0.150
8°
A1
A
0.98
0.10
1.10
0.20
1.80
2.90
0.95
3.80
8°
POLARITY INDICATOR
OPTIONAL AS NEEDED
TOP VIEW
END VIEW
E
L
q
H
E
q
GENERIC
MARKING DIAGRAM*
H
E
c
SIDE VIEW
XXXMG
2X
L
G
2X
b
XXX = Specific Device Code
M
G
= Date Code
= Pb−Free Package
BOTTOM VIEW
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
4.20
2X
1.25
2X
1.22
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON11184D
SOD−123FL
PAGE 1 OF 1
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