NHP620MFDT3G [ONSEMI]
Switch-Mode Power Rectifier;
| 型号： | NHP620MFDT3G |
| 厂家： | 
ONSEMI |
| 描述： | Switch-Mode Power Rectifier |
| 文件： | 总5页 (文件大小：71K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NHP620MFD,
NRVHP620MFD
Switch-Mode
Power Rectifier
This ultrafast rectifier in the dual flag SO−8 flat lead package offers
designers a unique degree of versatility and design freedom. The two
devices are electrically independent and can be used separately, as
common cathode, as common anode or in series as a function of board
level layout. The exposed pad design provides low thermal resistance.
The clip attach design creates a package with very efficient die size to
board area ratio. While thermal performance is nearly the same as the
DPAK package height and board footprint are less than half.
http://onsemi.com
ULTRAFAST RECTIFIER
6 AMPERES (3x2), 200 VOLTS
7,8
5,6
1
3
Features
• New Package Provides Capability of Inspection and Probe After
Board Mounting
MARKING DIAGRAM
• Low Forward Voltage Drop
• 175°C Operating Junction Temperature
• NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
C1 C1
1
A1
NC
A2
C1
C1
C2
C2
DFN8 5x6
(SO8FL)
CASE 506BT
HP620D
AYWZZ
NC
C2 C2
• These are Pb−Free and Halide−Free Devices
HP620D = Specific Device Code
Mechanical Characteristics:
A
Y
W
ZZ
= Assembly Location
= Year
= Work Week
= Lot Traceability
• Case: Epoxy, Molded
• Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.
• Lead Finish: 100% Matte Sn (Tin)
• Lead and Mounting Surface Temperature for Soldering Purposes:
ORDERING INFORMATION
260°C Max. for 10 Seconds
• Device Meets MSL 1 Requirements
Device
Package
Shipping†
NHP620MFDT1G
DFN8
1500 /
Applications
(Pb−Free) Tape & Reel
• Excellent Alternative to DPAK in Space−Constrained Automotive
Applications
NHP620MFDT3G
DFN8 5000 /
(Pb−Free) Tape & Reel
DFN8 1500 /
(Pb−Free) Tape & Reel
DFN8 5000 /
(Pb−Free) Tape & Reel
• Output Rectification in Switching Power Supplies
• Freewheeling Diode used with Inductive Loads
NRVHP620MFDT1G
NRVHP620MFDT3G
NRVHP620MFDWT3G
DFN8
5000 /
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
December, 2014 − Rev. 0
NHP620MFD/D
NHP620MFD, NRVHP620MFD
MAXIMUM RATINGS (per diode unless noted)
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
RRM
V
RWM
V
200
3.0
R
Average Rectified Forward Current
I
A
A
A
F(AV)
(Rated V , T = 167°C)
R
C
Peak Repetitive Forward Current,
I
6.0
80
FRM
(Rated V , Square Wave, 20 kHz, T = 165°C)
R
C
Non−Repetitive Peak Surge Current
I
FSM
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Storage Temperature Range
T
−65 to +175
°C
°C
mJ
stg
Operating Junction Temperature
T
−55 to +175
J
Unclamped Inductive Switching Energy (10 mH Inductor, Non−repetitive)
ESD Rating (Human Body Model)
E
AS
10
3B
M4
ESD Rating (Machine Model)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS (per diode unless noted)
Characteristic
Symbol
Typ
Max
Unit
Thermal Resistance, Junction−to−Case, Steady State
(Assumes 600 mm 1 oz. copper bond pad, on a FR4 board)
R
−
3.4
°C/W
θ
JC
2
ELECTRICAL CHARACTERISTICS (per diode unless noted)
Instantaneous Forward Voltage (Note 1)
v
V
F
(i = 3.0 Amps, T = 125°C)
0.76
0.935
0.86
0.85
1.0
0.91
1.090
F
J
(i = 3.0 Amps, T = 25°C)
F
J
(i = 6.0 Amps, T = 125°C)
F
J
(i = 6.0 Amps, T = 25°C)
1.02
F
J
Instantaneous Reverse Current (Note 1)
i
R
mA
(Rated dc Voltage, T = 125°C)
6.00
0.012
35
0.5
J
(Rated dc Voltage, T = 25°C)
J
Reverse Recovery Time
t
t
18
25
ns
ns
rr
I = 3.0 A, V = 30 V, dl/dt = 50 A/ms, T = 25°C
F
R
J
Reverse Recovery Time
I = 3.0 A, V = 30 V, dl/dt = 50 A/ms, T = 50°C
40
50
rr
F
R
J
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
http://onsemi.com
2
NHP620MFD, NRVHP620MFD
TYPICAL CHARACTERISTICS
100
10
1
100
T = 175°C
A
T = 175°C
A
10
1
T = 150°C
A
T = 150°C
A
T = 125°C
A
T = 125°C
A
0.1
0.1
T = 25°C
A
T = 25°C
A
0.01
0.01
T = −40°C
T = −40°C
A
A
0.001
0.001
0.1
0.3
0.5
0.7
0.9
1.1
1.3
0
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
V , INSTANTANEOUS FORWARD VOLTAGE (V)
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
F
Figure 1. Typical Instantaneous Forward
Characteristics
Figure 2. Maximum Instantaneous Forward
Characteristics
1.E−03
1.E−04
1.E−05
1.E−06
1.E−07
1.E−08
1.E−09
1.E−03
1.E−04
1.E−05
1.E−06
1.E−07
1.E−08
1.E−09
1.E−10
T = 175°C
A
T = 175°C
A
T = 125°C
A
T = 125°C
A
T = 150°C
A
T = 150°C
A
T = 25°C
A
T = 25°C
A
T = −40°C
A
T = −40°C
A
1.E−10
1.E−11
1.E−11
1.E−12
0
20 40 60
80 100 120 140 160 180 200
20 40 60 80 100 120 140 160 180 200
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Figure 3. Typical Reverse Characteristics
Figure 4. Maximum Reverse Characteristics
1000
6
5
4
3
2
T = 25°C
J
DC
Square Wave
100
R
= 3.4°C/W
1
0
q
JC
10
0
20 40 60 80 100 120 140 160 180 200
20
40
60
80
100 120 140 160 180
V , REVERSE VOLTAGE (V)
R
T , CASE TEMPERATURE (°C)
C
Figure 5. Typical Junction Capacitance
Figure 6. Current Derating
http://onsemi.com
3
NHP620MFD, NRVHP620MFD
TYPICAL CHARACTERISTICS
3.0
2.5
2.0
1.5
1.0
T = 175°C
I /I = 20
PK AV
I /I = 10
PK AV
J
I
/I = 5
PK AV
Square Wave
DC
0.5
0
0
0.5
1.0
1.5
2.0
I , AVERAGE FORWARD CURRENT (A)
F(AV)
Figure 7. Forward Power Dissipation
100
10
1
50% Duty Cycle
20%
10%
5%
2%
1%
0.1
Single Pulse
0.01
0.001
0.000001 0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE TIME (sec)
Figure 8. Thermal Response
http://onsemi.com
4
NHP620MFD, NRVHP620MFD
PACKAGE DIMENSIONS
DFN8 5x6, 1.27P Dual Flag (SO8FL−Dual)
CASE 506BT
ISSUE E
2X
NOTES:
0.20
C
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED
BETWEEN 0.15 AND 0.30 MM FROM THE TERMINAL TIP.
4. PROFILE TOLERANCE APPLIES TO THE EXPOSED PAD AS WELL
AS THE TERMINALS.
5. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
6. SEATING PLANE IS DEFINED BY THE TERMINALS. A1 IS DEFINED
AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
D
A
B
E
2X
D1
0.20
C
8
7
6
5
7. A VISUAL INDICATOR FOR PIN 1 MUST BE LOCATED IN THIS AREA.
E1
PIN ONE
IDENTIFIER
4X
h
MILLIMETERS
DIM
A
A1
b
b1
c
MIN
0.90
−−−
0.33
0.33
0.20
MAX
−−−
−−−
0.42
0.42
MAX
1.10
0.05
0.51
0.51
0.33
NOTE 7
c
A1
1
2
3
4
−−−
TOP VIEW
D
5.15 BSC
4.90
4.10
1.70
6.15 BSC
5.90
4.15
1.27 BSC
0.55
−−−
−−−
D1
D2
D3
E
E1
E2
e
G
h
K
K1
L
4.70
3.90
1.50
5.10
4.30
1.90
0.10
0.10
C
DETAIL A
A
5.70
3.90
6.10
4.40
C
SEATING
PLANE
NOTE 6
C
NOTE 4
SIDE VIEW
0.45
−−−
0.65
DETAIL A
12
−−−
−−−
_
0.51
0.56
0.48
3.25
1.80
D2
D3
−−−
0.61
3.50
2.00
0.71
3.75
2.20
SOLDERING FOOTPRINT*
4X L
K
M
N
e
1
4.56
4
2X
2X
DETAIL B
ALTERNATE
CONSTRUCTION
8X
2.08
0.56
DETAIL B
0.75
4X
b1
N
E2
M
4X
1.40
6.59
4.84
2.30
8
5
4X
G
b
3.70
8X
0.10
0.05
C
C
A B
K1
NOTE 3
BOTTOM VIEW
0.70
4X
1.27
PITCH
1.00
5.55
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
NHPM620MFD/D
相关型号：
©2020 ICPDF网 联系我们和版权申明