NRVB460MFST3G [ONSEMI]
SWITCHMODE Power Rectifiers;
| 型号： | NRVB460MFST3G |
| 厂家： | 
ONSEMI |
| 描述： | SWITCHMODE Power Rectifiers 功效 瞄准线 光电二极管 |
| 文件： | 总5页 (文件大小：112K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MBR460MFS, NRVB460MFS
SWITCHMODE
Power Rectifiers
These state−of−the−art devices have the following features:
Features
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• Low Power Loss / High Efficiency
• New Package Provides Capability of Inspection and Probe After
Board Mounting
SCHOTTKY BARRIER
RECTIFIERS
• Guardring for Stress Protection
4 AMPERES
60 VOLTS
• Low Forward Voltage Drop
• 175°C Operating Junction Temperature
• NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
5,6
1,2,3
• These are Pb−Free and Halide−Free Devices
MARKING
DIAGRAM
Mechanical Characteristics:
• Case: Epoxy, Molded
A
C
C
1
• Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.
• Lead Finish: 100% Matte Sn (Tin)
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
B460
AYWZZ
A
A
SO−8 FLAT LEAD
CASE 488AA
STYLE 2
Not Used
• Device Meets MSL 1 Requirements
B460
A
Y
= Specific Device Code
= Assembly Location
= Year
Applications
W
ZZ
= Work Week
= Lot Traceability
• Ideally Suited for use as an Output Rectifier in High Frequency
(up to 2 MHz) Automotive and Non−Automotive Applications
• Output Rectification in Compact Portable Consumer Applications
• Freewheeling Diode used with Inductive Loads
ORDERING INFORMATION
Device
Package
Shipping†
1500 /
MBR460MFST1G
SO−8 FL
(Pb−Free) Tape & Reel
MBR460MFST3G
NRVB460MFST1G
SO−8 FL 5000 /
(Pb−Free) Tape & Reel
SO−8 FL 1500 /
(Pb−Free) Tape & Reel
SO−8 FL 5000 /
(Pb−Free) Tape & Reel
NRVB460MFST3G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
June, 2013 − Rev. 0
MBR460MFS/D
MBR460MFS, NRVB460MFS
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
V
V
RRM
RWM
60
R
Average Rectified Forward Current
(Rated V , T = 165°C)
I
4.0
A
A
A
F(AV)
R
C
Peak Repetitive Forward Current,
I
8.0
40
FRM
(Rated V , Square Wave, 20 kHz, T = 165°C)
R
C
Non−Repetitive Peak Surge Current
I
FSM
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Storage Temperature Range
T
−65 to +175
°C
°C
mJ
stg
Operating Junction Temperature
T
−55 to +175
J
Unclamped Inductive Switching Energy (10 mH Inductor, Non−repetitive)
ESD Rating (Human Body Model)
E
AS
10
3B
M4
ESD Rating (Machine Model)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Typ
Max
Unit
Thermal Resistance, Junction−to−Case, Steady State
(Assumes 600 mm 1 oz. copper bond pad, on a FR4 board)
R
−
2.4
°C/W
θ
JC
2
ELECTRICAL CHARACTERISTICS
Instantaneous Forward Voltage (Note 1)
v
V
F
(i = 4 Amps, T = 125°C)
0.65
0.71
0.72
0.74
F
J
(i = 4 Amps, T = 25°C)
F
J
Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, T = 125°C)
i
R
mA
6.5
0.01
20
0.2
J
(Rated dc Voltage, T = 25°C)
J
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
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2
MBR460MFS, NRVB460MFS
TYPICAL CHARACTERISTICS
100
10
100
T = 175°C
A
T = 175°C
A
10
T = 125°C
A
T = 125°C
A
T = 150°C
A
T = 150°C
A
1
1
T = 25°C
A
T = 25°C
A
T = −40°C
A
T = −40°C
A
0.1
0.1
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
0
0.1 0.2
0.3 0.4 0.5
0.6 0.7 0.8 0.9
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
Figure 1. Typical Instantaneous Forward
Characteristics
Figure 2. Maximum Instantaneous Forward
Characteristics
1.E+00
1.E−01
1.E−02
1.E−03
1.E+00
1.E−01
1.E−02
1.E−03
T = 175°C
T = 175°C
A
A
T = 125°C
A
T = 125°C
A
1.E−04
1.E−05
1.E−06
1.E−07
1.E−08
T = 150°C
A
T = 150°C
A
1.E−04
1.E−05
1.E−06
1.E−07
T = 25°C
A
T = 25°C
A
T = −40°C
A
T = −40°C
A
1.E−08
1.E−09
1.E−09
1.E−10
0
10
20
30
40
50
60
0
10
20
30
40
50
60
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Figure 3. Typical Reverse Characteristics
Figure 4. Maximum Reverse Characteristics
1000
100
10
9
T = 25°C
J
R
= 2.4°C/W
q
JC
8
7
DC
6
5
Square Wave
4
3
2
1
0
10
0
10
20
30
40
50
60
60
80
100
120
140
160
V , REVERSE VOLTAGE (V)
R
T , CASE TEMPERATURE (°C)
C
Figure 5. Typical Junction Capacitance
Figure 6. Current Derating TO−220AB
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3
MBR460MFS, NRVB460MFS
TYPICAL CHARACTERISTICS
8
7
I /I = 20
PK AV
I /I = 10
PK AV
T = 175°C
J
6
5
4
3
2
I
/I = 5
PK AV
Square Wave
DC
1
0
0
1
2
3
4
I , AVERAGE FORWARD CURRENT (A)
F(AV)
Figure 7. Forward Power Dissipation
100
10
1
50% Duty Cycle
20%
10%
5%
2%
Assumes 25°C ambient and soldered to
a 600 mm − oz copper pad on PCB
2
1%
0.1
Single Pulse
0.01
0.000001 0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE TIME (sec)
Figure 8. Thermal Characteristics
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4
MBR460MFS, NRVB460MFS
PACKAGE DIMENSIONS
DFN5 5x6, 1.27P
(SO−8FL)
CASE 488AA
ISSUE G
2 X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
0.20
C
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
BURRS.
D
A
2
B
E
2 X
D1
MILLIMETERS
0.20
C
DIM
A
A1
b
MIN
0.90
0.00
0.33
0.23
NOM
1.00
−−−
0.41
0.28
MAX
1.10
0.05
0.51
0.33
4 X
q
E1
2
c
D
5.15 BSC
4.90
−−−
6.15 BSC
5.80
−−−
1.27 BSC
0.61
1.35
0.61
D1
D2
E
E1
E2
e
G
K
L
L1
M
4.50
3.50
5.10
4.22
c
A1
5.50
3.45
6.10
4.30
1
2
3
4
0.51
1.20
0.51
0.05
3.00
0
0.71
1.50
0.71
0.20
3.80
TOP VIEW
C
3 X
e
SEATING
0.17
3.40
−−−
PLANE
0.10
0.10
C
C
DETAIL A
q
12
A
_
_
STYLE 2:
PIN 1. ANODE
2. ANODE
SIDE VIEW
3. ANODE
DETAIL A
4. NO CONNECT
SOLDERING FOOTPRINT*
5. CATHODE
b
8X
3X
1.270
4X
0.750
0.10
0.05
C
c
A
B
4X
1.000
e/2
L
1
4
K
0.965
0.29X05
0.475
1.330
E2
PIN 5
2X
0.495
M
L1
(EXPOSED PAD)
4.530
3.200
D2
BOTTOM VIEW
G
2X
1.530
4.560
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
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MBR460MFS/D
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