NSVMMBT589LT1G [ONSEMI]

30 V,1.0 A,高电流,PNP,低饱和压,双极晶体管;
NSVMMBT589LT1G
型号: NSVMMBT589LT1G
厂家: ONSEMI    ONSEMI
描述:

30 V,1.0 A,高电流,PNP,低饱和压,双极晶体管

小信号双极晶体管
文件: 总5页 (文件大小:64K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MMBT589LT1  
High Current Surface Mount  
PNP Silicon Switching  
Transistor for Load  
Management in  
Portable Applications  
http://onsemi.com  
30 VOLTS, 2.0 AMPS  
PNP TRANSISTORS  
Features  
Pb−Free Packages are Available  
COLLECTOR  
3
MAXIMUM RATINGS (T = 25°C)  
A
Rating  
Symbol  
Value  
Unit  
1
CollectorEmitter Voltage  
V
V
V
−30  
Vdc  
CEO  
CBO  
EBO  
BASE  
CollectorBase Voltage  
EmitterBase Voltage  
−50  
−5.0  
−1.0  
−2.0  
Vdc  
Vdc  
Adc  
A
2
EMITTER  
Collector Current − Continuous  
Collector Current − Peak  
I
C
I
CM  
3
THERMAL CHARACTERISTICS  
SOT−23 (TO−236)  
1
CASE 318  
STYLE 6  
Characteristic  
Symbol  
Max  
Unit  
2
Total Device Dissipation FR−5 Board,  
P
D
(Note 1) T = 25°C  
310  
2.5  
mW  
mW/°C  
A
Derate above 25°C  
Thermal Resistance, Junction−to−Ambient  
(Note 1)  
R
403  
°C/W  
q
JA  
MARKING DIAGRAM  
Total Device Dissipation Alumina  
P
D
Substrate, (Note 2) T = 25°C  
710  
5.7  
mW  
mW/°C  
A
G3 M G  
Derate above 25°C  
G
Thermal Resistance, Junction−to−Ambient  
(Note 2)  
R
176  
°C/W  
q
JA  
1
G3 = Device Code  
Total Device Dissipation (Ref. Figure 8)  
(Single Pulse < 10 sec.)  
P
Dsingle  
M
= Date Code*  
575  
mW  
G
= Pb−Free Package  
Junction and Storage Temperature  
T , T  
−55 to +150  
°C  
J
stg  
(Note: Microdot may be in either location)  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR4 @ Minimum Pad  
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
ORDERING INFORMATION  
2. FR4 @ 1.0 X 1.0 inch Pad  
Device  
Package  
Shipping  
MMBT589LT1  
SOT−23 3,000 / Tape & Reel  
MMBT589LT1G  
SOT−23 3,000 / Tape & Reel  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
January, 2007 − Rev. 4  
MMBT589LT1/D  
 
MMBT589LT1  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
OFF CHARACTERISTICS  
Symbol  
Min  
Max  
Unit  
CollectorEmitter Breakdown Voltage  
V
−30  
−50  
−5.0  
Vdc  
Vdc  
(BR)CEO  
(BR)CBO  
(BR)EBO  
(I = −10 mAdc, I = 0)  
C
B
CollectorBase Breakdown Voltage  
(I = −0.1 mAdc, I = 0)  
V
V
C
E
EmitterBase Breakdown Voltage  
(I = −0.1 mAdc, I = 0)  
Vdc  
E
C
Collector Cutoff Current  
(V = −30 Vdc, I = 0)  
I
−0.1  
−0.1  
−0.1  
mAdc  
mAdc  
mAdc  
CBO  
CB  
E
Collector−Emitter Cutoff Current  
(V = −30 Vdc)  
I
CES  
CES  
Emitter Cutoff Current  
I
EBO  
(V = −4.0 Vdc)  
EB  
ON CHARACTERISTICS  
DC Current Gain (Note 3) (Figure 1)  
h
FE  
(I = −1.0 mA, V = −2.0 V)  
100  
100  
80  
300  
C
CE  
(I = −500 mA, V = −2.0 V)  
C
CE  
(I = −1.0 A, V = −2.0 V)  
C
CE  
(I = 2.0 A, V = −2.0 V)  
40  
C
CE  
CollectorEmitter Saturation Voltage (Note 3) (Figure 3)  
(I = −0.5 A, I = −0.05 A)  
V
V
CE(sat)  
−0.25  
−0.30  
−0.65  
C
B
(I = −1.0 A, I = 0.1 A)  
C
B
(I = −2.0 A, I = −0.2 A)  
C
B
BaseEmitter Saturation Voltage (Note 3) (Figure 2)  
(I = −1.0 A, I = −0.1 A)  
V
−1.2  
−1.1  
V
V
BE(sat)  
C
B
BaseEmitter Turn−on Voltage (Note 3)  
V
BE(on)  
(I = −1.0 A, V = −2.0 V)  
C
CE  
Cutoff Frequency  
f
T
100  
MHz  
pF  
(I = −100 mA, V = −5.0 V, f = 100 MHz)  
C
CE  
Output Capacitance  
(f = 1.0 MHz)  
Cobo  
15  
3. Pulsed Condition: Pulse Width = 300 msec, Duty Cycle 2%  
http://onsemi.com  
2
 
MMBT589LT1  
200  
150  
100  
230  
V
CE  
= −1.0 V  
V
CE  
= −2.0 V  
210  
190  
170  
150  
130  
110  
90  
125°C  
25°C  
50  
0
−55°C  
70  
50  
0.001  
0.01  
0.1  
1.0  
10  
1.0  
10  
100  
1000  
I , COLLECTOR CURRENT (AMPS)  
C
I , COLLECTOR CURRENT (mA)  
C
Figure 1. DC Current Gain versus  
Collector Current  
Figure 2. DC Current Gain versus  
Collector Current  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
1.0  
0.95  
0.9  
V
BE(sat)  
I /I = 10  
C B  
0.85  
0.8  
V
BE(on)  
0.75  
0.7  
I /I = 100  
C B  
0.65  
0.6  
0.1  
0
0.55  
0.5  
V
CE(sat)  
1.0  
10  
100  
1000  
0.001  
0.01  
0.1  
1.0  
10  
I , COLLECTOR CURRENT (mA)  
C
I , COLLECTOR CURRENT (AMPS)  
C
Figure 3. “On” Voltages  
Figure 4. Base Emitter Saturation Voltage  
versus Collector Current  
1.0  
0.8  
0.6  
0.4  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
I /I = 100  
C B  
1000 mA  
100 mA  
I /I = 10  
C B  
0.2  
0
50 mA  
0.2  
0
10 mA  
0.01  
0.1  
1.0  
10  
100  
1000  
0.001  
0.01  
0.1  
1.0  
10  
I , BASE CURRENT (mA)  
B
I , COLLECTOR CURRENT (AMPS)  
C
Figure 5. Collector Emitter Saturation Voltage  
versus Collector Current  
Figure 6. Collector Emitter Saturation Voltage  
versus Collector Current  
http://onsemi.com  
3
MMBT589LT1  
10  
SINGLE PULSE TEST AT T = 25°C  
amb  
1 s  
100 ms 10 ms 1 ms  
100 ms  
1.0  
2 s  
0.1  
0.01  
0.1  
1.0  
, COLLECTOR EMITTER VOLTAGE (VOLTS)  
10  
100  
V
CE  
Figure 7. Safe Operating Area  
0.5  
0.2  
0.1  
1.0E+00  
1.0E−01  
0.05  
0.02  
D = 0.01  
1.0E−02  
1.0E−03  
r(t)  
1E−05  
0.0001  
0.001  
0.01  
0.1  
1.0  
10  
100  
1000  
t, TIME (sec)  
Figure 8. Normalized Thermal Response  
http://onsemi.com  
4
MMBT589LT1  
PACKAGE DIMENSIONS  
SOT−23 (TO−236)  
CASE 318−08  
ISSUE AN  
NOTES:  
D
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
SEE VIEW C  
2. CONTROLLING DIMENSION: INCH.  
3. MAXIMUM LEAD THICKNESS INCLUDES  
LEAD FINISH THICKNESS. MINIMUM LEAD  
THICKNESS IS THE MINIMUM THICKNESS OF  
BASE MATERIAL.  
3
H
E
E
4. 318−01 THRU −07 AND −09 OBSOLETE,  
NEW STANDARD 318−08.  
c
1
2
MILLIMETERS  
INCHES  
NOM  
DIM  
A
A1  
b
c
D
E
e
L
L1  
MIN  
0.89  
0.01  
0.37  
0.09  
2.80  
1.20  
1.78  
0.10  
0.35  
2.10  
NOM  
1.00  
0.06  
0.44  
0.13  
2.90  
1.30  
1.90  
0.20  
0.54  
2.40  
MAX  
1.11  
0.10  
0.50  
0.18  
3.04  
1.40  
2.04  
0.30  
0.69  
2.64  
MIN  
MAX  
0.044  
0.004  
0.020  
0.007  
0.120  
0.055  
0.081  
0.012  
0.029  
0.104  
b
0.25  
0.035  
0.001  
0.015  
0.003  
0.110  
0.047  
0.070  
0.004  
0.014  
0.083  
0.040  
0.002  
0.018  
0.005  
0.114  
0.051  
0.075  
0.008  
0.021  
0.094  
e
q
A
L
A1  
L1  
VIEW C  
H
E
STYLE 6:  
PIN 1. BASE  
2. EMITTER  
3. COLLECTOR  
SOLDERING FOOTPRINT*  
0.95  
0.037  
0.95  
0.037  
2.0  
0.079  
0.9  
0.035  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
0.8  
0.031  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
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MMBT589LT1/D  

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