NVH4L080N120SC1 [ONSEMI]

Silicon Carbide (SiC) MOSFET, N‐Channel - EliteSiC, 80 mohm, 1200 V, M1, TO247−4L;
NVH4L080N120SC1
型号: NVH4L080N120SC1
厂家: ONSEMI    ONSEMI
描述:

Silicon Carbide (SiC) MOSFET, N‐Channel - EliteSiC, 80 mohm, 1200 V, M1, TO247−4L

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DATA SHEET  
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Silicon Carbide (SiC)  
MOSFET – 80 mohm,  
1200ꢀV, M1, TO-247-4L  
V
R
TYP  
I MAX  
D
DSS  
DS(ON)  
1200 V  
80 mW  
29 A  
NCHANNEL MOSFET  
D
NVH4L080N120SC1  
Description  
Silicon Carbide (SiC) MOSFET uses a completely new technology  
that provide superior switching performance and higher reliability  
compared to Silicon. In addition, the low ON resistance and compact  
chip size ensure low capacitance and gate charge. Consequently,  
system benefits include highest efficiency, faster operation frequency,  
increased power density, reduced EMI, and reduced system size.  
S1: Kelvin Source  
S2: Power Source  
G
S1 S2  
Features  
1200 V @ T = 175°C  
J
Max R  
= 110 mW at V = 20 V, I = 20 A  
GS D  
DS(on)  
High Speed Switching with Low Capacitance  
100% Avalanche Tested  
D
S2  
S1  
AECQ101 Qualified and PPAP Capable  
This Device is Halide Free and RoHS Compliant with exemption 7a,  
PbFree 2LI (on second level interconnection)  
G
TO2474LD  
CASE 340CJ  
Applications  
MARKING DIAGRAM  
Automotive Auxiliary Motor Drive  
Automotive On Board Charger  
Automotive DCDC Converter for EV/HEV  
AYWWZZ  
NVH4L080  
N120SC1  
A
= Assembly Location  
Y
= Year  
WW  
ZZ  
= Work Week  
= Lot Traceability  
NVH4L080N120SC1 = Specific Device Code  
ORDERING INFORMATION  
Device  
Package  
Shipping  
30 Units /  
Tube  
TO2474L  
NVH4L080N120SC1  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
May, 2022Rev. 2  
NVH4L080N120SC1/D  
NVH4L080N120SC1  
ABSOLUTE MAXIMUM RATINGS (T = 25°C, unless otherwise noted)  
A
Symbol  
Parameter  
Ratings  
1200  
Unit  
V
V
DraintoSource Voltage  
Max. GatetoSource Voltage  
DSmax  
GSmax  
V
@ T < 150°C  
15 / +25  
5 / +20  
V
C
V
V
(DC)  
Recommended operation Values of  
@ T < 150°C  
V
GSop  
C
Gate Source Voltage  
(AC)  
Recommended operation Values of  
@ T < 150°C  
5 / +20  
V
A
GSop  
C
Gate Source Voltage (f > 1 Hz)  
I
D
Continuous Drain Current  
Pulse Drain Current  
V
V
= 20 V, T = 25°C  
29  
21  
GS  
C
= 20 V, T = 100°C  
GS  
C
I
Pulse width tp limited by  
Tj max  
125  
A
D(Pulse)  
E
Single Pulse Avalanche Energy (Note 1)  
Power Dissipation  
171  
170  
mJ  
W
AS  
P
T
T
= 25°C  
tot  
C
= 150°C  
28  
C
T , T  
Operating and Storage Junction Temperature Range  
55 to +175  
°C  
J
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. E of 171 mJ is based on starting Tj = 25°C, L = 1 mH, I = 18.5 A, , V = 50 V, R = 25 W.  
AS  
AS  
DD  
G
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Ratings  
0.88  
Unit  
R
Thermal Resistance, JunctiontoCase  
_C/W  
q
JC  
JA  
R
Thermal Resistance, JunctiontoAmbient  
40  
q
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2
 
NVH4L080N120SC1  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
BV  
DraintoSource Breakdown Voltage  
I
I
= 100 mA, V = 0 V  
1200  
V
DSS  
D
GS  
DBV  
/DT  
Breakdown Voltage Temperature  
Coefficient  
= 5 mA, Referenced to 25_C  
0.3  
V/_C  
DSS  
J
D
I
Zero Gate Voltage Drain Current  
V
DS  
= 1200 V, V = 0 V  
T = 25°C  
C
C
100  
1.0  
mA  
mA  
DSS  
GS  
T
= 150°C  
I
GatetoSource Leakage Current  
V
V
= 25 V, V = 0 V  
1
mA  
mA  
GSS  
GS  
DS  
I
GatetoSource Leakage Current,  
Reverse  
= 15 V, V = 0 V  
1  
GSSR  
GS  
DS  
ON CHARACTERISTICS  
V
GatetoSource Threshold Voltage  
Static DraintoSource On Resistance  
V
GS  
V
GS  
V
GS  
V
DS  
V
DS  
= V , I = 5 mA  
1.8  
2.75  
80  
4.3  
110  
162  
V
GS(th)  
DS(on)  
DS  
D
R
= 20 V, I = 20 A  
mW  
D
= 20 V, I = 20 A, T = 150°C  
127  
11.3  
9.8  
D
C
g
FS  
Forward Transconductance  
= 20 V, I = 20 A  
S
D
= 20 V, I = 20 A, T = 150°C  
D
C
DYNAMIC CHARACTERISTICS  
C
Input Capacitance  
V
DS  
= 800 V, V = 0 V, f = 1 MHz  
1112  
80  
1670  
120  
10  
pF  
pF  
pF  
mJ  
iss  
GS  
C
Output Capacitance  
oss  
C
Reverse Transfer Capacitance  
6.5  
32  
rss  
E
oss  
C
Stored Energy  
oss  
SWITCHING CHARACTERISTICS  
t
Turn-On Delay Time  
Rise Time  
V
V
= 800 V, I = 20 A,  
9
18  
10  
43  
11  
ns  
ns  
ns  
ns  
mJ  
mJ  
mJ  
nC  
nC  
nC  
W
d(on)  
CC  
GS  
C
= 5/20 V, R = 4.7 W  
G
t
r
4.2  
26.8  
5.4  
314  
32  
Inductive Load, T = 25°C  
C
t
Turn-Off Delay Time  
Fall Time  
d(off)  
t
f
E
on  
E
off  
Turnon Switching Loss  
Turnoff Switching Loss  
Total Switching Loss  
Total Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
Gate input resistance  
E
ts  
346  
56  
Q
V
DD  
V
GS  
= 600 V, I = 20 A  
g
D
= 5/20 V  
Q
11  
gs  
gd  
Q
12  
R
f = 1 MHz, DS short  
1.7  
G
DIODE CHARACTERISTICS  
V
SourcetoDrain Diode Forward  
V
SD  
= 5 V,  
T
C
= 25°C  
= 150°C  
= 150°C  
= 25°C  
3.7  
3.3  
29  
18  
31  
80  
212  
9
V
SD  
GS  
Voltage  
I
= 10 A  
T
C
E
rec  
Reverse Recovery Energy  
I
= 20 A,  
T
C
mJ  
SD  
V
V
= 5 V,  
GS  
R
t
Diode Reverse Recovery Time  
T
C
ns  
rr  
= 600 V,  
dI /dt = 1000 A/ms  
SD  
T
= 150°C  
= 25°C  
C
C
Q
Diode Reverse Recovery Charge  
Peak Reverse Recovery Current  
T
nC  
A
rr  
T
= 150°C  
T = 25°C  
C
C
I
rrm  
T
C
= 150°C  
14  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
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3
NVH4L080N120SC1  
TYPICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
70  
56  
42  
28  
14  
0
8
V
GS = 20 V  
VGS = 19 V  
VGS = 18 V  
VGS = 8 V  
PULSE DURATION = 80 ms  
DUTY CYCLE = 0.5% MAX  
V
GS = 15 V  
VGS = 16 V  
GS = 17 V  
6
4
2
0
VGS = 10 V  
V
PULSE DURATION = 80 ms  
DUTY CYCLE = 0.5% MAX  
VGS = 18 V  
VGS = 17 V  
VGS = 10 V  
VGS = 8 V  
VGS = 16 V  
VGS = 15 V  
VGS = 20 V  
VGS = 19 V  
0
4
8
12  
16  
20  
0
10  
20  
30  
40  
50  
60  
70  
V
DS, DRAIN TO SOURCE VOLTAGE (V)  
ID, DRAIN CURRENT (A)  
Figure 1. On Region Characteristics  
Figure 2. Normalized OnResistance vs. Drain  
Current and Gate Voltage  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
450  
PULSE DURATION = 80 ms  
DUTY CYCLE = 0.5% MAX  
ID = 20 A  
VGS = 20 V  
360  
270  
180  
90  
ID = 20 A  
TJ = 150oC  
TJ = 25 o  
C
0
75 50 25  
0
25 50 75 100 125 150 175  
8
10  
12  
14  
16  
18  
20  
TJ, JUNCTION TEMPERATURE (oC)  
V
GS, GATE TO SOURCE VOLTAGE (V)  
Figure 3. Normalized On Resistance vs.  
Junction Temperature  
Figure 4. OnResistance vs. GatetoSource  
Voltage  
70  
56  
42  
28  
14  
0
100  
PULSE DURATION = 80 ms  
DUTY CYCLE = 0.5% MAX  
VGS = 0 V  
TJ = 150 o  
C
VDS = 20 V  
TJ = 25oC  
10  
1
TJ = 175 o  
C
TJ = 55 oC  
TJ = 25 o  
C
TJ = 55 oC  
0.1  
0
3
6
9
12  
15  
0
2
4
6
8
VGS, GATE TO SOURCE VOLTAGE (V)  
VSD, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. SourcetoDrain Diode Forward  
Voltage vs. Source Current  
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4
NVH4L080N120SC1  
TYPICAL CHARACTERISTICS (T = 25°C unless otherwise noted) (continued)  
J
20  
15  
10  
5
10000  
ID = 20 A  
Ciss  
VDD = 400 V  
1000  
VDD = 600 V  
Coss  
VDD = 800 V  
100  
Crss  
10  
f = 1 MHz  
VGS = 0 V  
1
0.1  
0
0
10  
20  
30  
40  
50  
60  
1
10  
100  
800  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Qg, GATE CHARGE (nC)  
Figure 7. Gate Charge Characteristics  
Figure 8. Capacitance vs. DraintoSource  
Voltage  
30  
10  
40  
30  
20  
10  
0
R
qJC = 0.88 oC/W  
TJ = 25oC  
V
GS = 20 V  
TJ = 150 oC  
1
0.001  
0.01  
0.1  
1
10  
25  
50  
75  
100  
125  
150  
175  
TC, CASE TEMPERATURE (oC)  
tAV, TIME IN AVALANCHE (ms)  
Figure 9. Unclamped Inductive Switching  
Capability  
Figure 10. Maximum Continuous Drain  
Current vs. Case Temperature  
500  
100000  
10000  
1000  
SINGLE PULSE  
qJC = 0.88oC/W  
C = 25oC  
R
100  
10  
1
T
10 ms  
THIS AREA IS  
LIMITED BY RDS(on)  
100 ms  
1 ms  
10 ms  
100 ms  
SINGLE PULSE  
TJ = MAX RATED  
0.1  
R
T
qJC = 0.88oC/W  
Curve Bent to  
Measured Data  
C = 25 oC  
0.01  
100  
0.00001  
0.0001  
0.001  
0.01  
0.1  
0.1  
1
10  
100  
1000 5000  
VDS, DRAIN to SOURCE VOLTAGE (V)  
t, PULSE WIDTH (sec)  
Figure 11. Forward Bias Safe Operating Area  
Figure 12. Single Pulse Maximum Power  
Dissipation  
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5
NVH4L080N120SC1  
TYPICAL CHARACTERISTICS T = 25°C unless otherwise noted (continued)  
J
2
1
DUTY CYCLEDESCENDING ORDER  
D = 0.5  
P
DM  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
t
1
t
2
NOTES:  
0.01  
Z
(t) = r(t) x R  
o
qJC  
qJC  
SINGLE PULSE  
R
= 0.88 C/W  
qJC  
Peak T = P  
x Z (t) + T  
J
DM  
qJC C  
Duty Cycle, D = t / t  
1
2
0.001  
105  
104  
103  
102  
101  
t, RECTANGULAR PULSE DURATION (sec)  
Figure 13. JunctiontoCase Transient Thermal Response Curve  
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6
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2474LD  
CASE 340CJ  
ISSUE A  
DATE 16 SEP 2019  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13852G  
TO2474LD  
PAGE 1 OF 1  
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