NVHL050N65S3F [ONSEMI]

N-Channel, SUPERFET III MOSFETm 650V, 50 mΩ, 58A;
NVHL050N65S3F
型号: NVHL050N65S3F
厂家: ONSEMI    ONSEMI
描述:

N-Channel, SUPERFET III MOSFETm 650V, 50 mΩ, 58A

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onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or  
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MOSFET – Power,  
N‐Channel, SUPERFET III,  
FRFET  
650 V, 50 mW, 58 A  
NVHL050N65S3F  
Description  
www.onsemi.com  
SUPERFET III MOSFET is ON Semiconductor’s brandnew high  
voltage superjunction (SJ) MOSFET family that is utilizing charge  
balance technology for outstanding low on-resistance and lower gate  
charge performance. This advanced technology is tailored to minimize  
conduction loss, provide superior switching performance, and  
withstand extreme dv/dt rate.  
V
R
MAX  
I MAX  
D
DSS  
DS(ON)  
650 V  
50 mW  
58 A  
D
Consequently, SUPERFET III MOSFET is very suitable for the  
various power system for miniaturization and higher efficiency.  
SUPERFET III FRFET MOSFET’s optimized reverse recovery  
performance of body diode can remove additional component and  
improve system reliability.  
G
Features  
700 V @ T = 150°C  
S
J
Typ. R  
= 42 mW  
DS(on)  
Ultra Low Gate Charge (Typ. Q = 121 nC)  
g
Low Effective Output Capacitance (Typ. C  
= 1119 pF)  
oss(eff.)  
100% Avalanche Tested  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
G
D
Compliant  
S
TO247 long leads  
Applications  
CASE 340CX  
Automotive On Board Charger HEVEV  
Automotive DC/DC Converter HEVEV  
MARKING DIAGRAM  
$Y&Z&3&K  
NVHL050  
N65S3F  
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= Date Code (Year & Week)  
= Lot  
NVHL050N65S3F = Specific Device Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
October, 2020 Rev. 1  
NVHL050N65S3F/D  
NVHL050N65S3F  
ABSOLUTE MAXIMUM RATINGS (T = 25°C, Unless otherwise noted)  
C
Symbol  
Parameter  
Value  
650  
Unit  
V
V
DSS  
V
GSS  
Drain to Source Voltage  
Gate to Source Voltage  
DC  
30  
V
AC (f > 1 Hz)  
30  
I
D
Drain Current  
Continuous (T = 25°C)  
58  
A
C
Continuous (T = 100°C)  
36  
C
I
Drain Current  
Pulsed (Note 1)  
145  
A
mJ  
A
DM  
E
Single Pulsed Avalanche Energy (Note 2)  
Avalanche Current (Note 2)  
Repetitive Avalanche Energy (Note 1)  
MOSFET dv/dt  
830  
AS  
AS  
I
7.5  
E
4.03  
100  
mJ  
V/ns  
AR  
dv/dt  
Peak Diode Recovery dv/dt (Note 3)  
Power Dissipation  
50  
P
(T = 25°C)  
403  
W
W/°C  
°C  
D
C
Derate Above 25°C  
3.23  
55 to +150  
300  
T , T  
Operating and Storage Temperature Range  
J
STG  
T
Maximum Lead Temperature for Soldering, 1/8from Case for 5 seconds  
°C  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Repetitive rating: pulsewidth limited by maximum junction temperature.  
2. I = 7.5 A, R = 25 W, starting T = 25°C.  
AS  
G
J
3. I 29 A, di/dt 200 A/ms, V 400 V, starting T = 25°C.  
SD  
DD  
J
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
0.31  
40  
Unit  
R
Thermal Resistance, Junction to Case, Max.  
Thermal Resistance, Junction to Ambient, Max.  
_C/W  
q
JC  
JA  
R
q
PACKAGE MARKING AND ORDERING INFORMATION  
Part Number  
Top Marking  
Package  
Packing Method  
Reel Size  
Tape Width  
Quantity  
30 Units  
NVHL050N65S3F  
NVHL050N65S3F  
TO247  
Tube  
N/A  
N/A  
www.onsemi.com  
2
 
NVHL050N65S3F  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
DraintoSource Breakdown Voltage  
BV  
BV  
V
= 0 V, I = 1 mA, T = 25°C  
650  
700  
V
V
DSS  
GS  
D
J
V
GS  
= 0 V, I = 1 mA, T = 150°C  
D J  
DSS  
Breakdown Voltage Temperature  
Coefficient  
DBV  
/
I
= 10 mA, Referenced to 25_C  
640  
19  
mV/_C  
DSS  
J
D
DT  
Zero Gate Voltage Drain Current  
I
mA  
V
GS  
= 0 V, V = 650 V  
10  
DSS  
DS  
V
= 520 V, T = 125_C  
DS  
C
GatetoBody Leakage Current  
ON CHARACTERISTICS  
Gate Threshold Voltage  
I
V
=
30 V, V = 0 V  
100  
nA  
GSS  
GS  
DS  
V
GS(th)  
V
V
= V , I = 1.7 mA  
3.0  
5.0  
50  
V
mV/_C  
mW  
S
GS  
DS  
D
Threshold Temperature Coefficient  
Static DraintoSource On Resistance  
Forward Transconductance  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
DV  
/DT  
= V , I = 1.7 mA  
8  
42  
GS(th)  
J
GS  
DS  
D
R
V
= 10 V, I = 29 A  
D
DS(on)  
GS  
DS  
g
FS  
V
= 20 V, I = 29 A  
32.8  
D
pF  
C
5404  
110  
iss  
Output Capacitance  
C
oss  
V
GS  
= 0 V, V = 400 V, f = 1 MHz  
DS  
Reverse Transfer Capacitance  
Effective Output Capacitance  
Energy Related Output Capacitance  
Total Gate Charge at 10 V  
Threshold Gate Charge  
C
13  
rss  
oss(eff.)  
C
V
V
= 0 V to 400 V, V = 0 V  
1119  
198  
123  
22.9  
39.5  
51.4  
1.7  
pF  
pF  
nC  
DS  
GS  
C
Q
= 0 V to 400 V, V = 0 V  
GS  
oss(er.)  
G(TOT)  
DS  
Q
G(TH)  
V
= 10 V, V = 400 V, I = 29 A  
DS D  
GS  
(Note 4)  
GatetoSource Gate Charge  
GatetoDrain “Miller” Charge  
Equivalent Series Resistance  
SWITCHING CHARACTERISTICS  
Turn-On Delay Time  
Q
GS  
GD  
Q
ESR  
f = 1 MHz  
W
t
t
38  
47  
87  
6
ns  
ns  
ns  
ns  
d(on)  
V
= 10 V, V = 400 V,  
DD  
Turn-On Rise Time  
t
GS  
D
r
I
= 29 A, R = 2.2 W  
g
Turn-Off Delay Time  
d(off)  
(Note 4)  
Turn-Off Fall Time  
t
f
SOURCEDRAIN DIODE CHARACTERISTICS  
Maximum Continuous Sourceto−  
I
58  
145  
1.3  
A
A
S
V
V
= 0 V  
= 0 V  
GS  
Drain Diode Forward Current  
Maximum Pulsed SourcetoDrain  
Diode Forward Current  
I
SM  
GS  
SourcetoDrain Diode Forward  
Voltage  
V
SD  
V
V
GS  
= 0 V, I = 29 A  
SD  
ns  
Reverse Recovery Time  
Charge Time  
t
133  
106  
27  
rr  
t
a
b
V
GS  
= 0 V, dI /dt = 100 A/ms,  
F
I
= 29 A  
SD  
Discharge Time  
t
Reverse Recovery Charge  
Q
603  
nC  
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. Essentially independent of operating temperature typical characteristics.  
www.onsemi.com  
3
 
NVHL050N65S3F  
TYPICAL CHARACTERISTICS  
200  
100  
200  
V
GS  
= 10 V  
V
GS  
= 10 V  
8.0 V  
250 ms Pulse Test  
= 150°C  
8.0 V  
7.0 V  
6.5 V  
100  
T
C
7.0 V  
6.5 V  
6.0 V  
5.5 V  
6.0 V  
5.5 V  
10  
10  
1
250 ms Pulse Test  
= 25°C  
T
C
1
0.2  
2.0  
, DRAINSOURCE VOLTAGE (V)  
20  
0.2  
2.0  
20  
V
DS  
V
DS  
, DRAINSOURCE VOLTAGE (V)  
Figure 1. OnRegion Characteristics  
Figure 2. OnRegion Characteristics  
200  
100  
80  
60  
250 ms Pulse Test  
= 20 V  
T
C
= 25°C  
V
DS  
T = 150°C  
J
T = 25°C  
J
V
= 10 V  
= 20 V  
GS  
10  
1
40  
20  
V
GS  
T = 55°C  
J
3
4
5
6
7
8
0
20  
40  
60  
80 100 120 140 160 180  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 3. Transfer Characteristics  
Figure 4. OnResistance Variation vs. Drain  
Current and Gate Voltage  
100K  
10K  
1K  
1000  
100  
10  
250 ms Pulse Test  
= 0 V  
V
GS  
C
iss  
T = 150°C  
J
1
C
oss  
100  
T = 25°C  
J
0.1  
10  
1
0.01  
f = 1 MHz  
= 0 V  
C
rss  
V
GS  
T = 55°C  
J
0.001  
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0  
, BODY DIODE FORWARD VOLTAGE (V)  
0.1  
1
10  
100  
V
SD  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 5. Body Diode Forward Voltage  
Figure 6. Capacitance Characteristics  
Variation vs. Source Current and Temperature  
www.onsemi.com  
4
NVHL050N65S3F  
TYPICAL CHARACTERISTICS  
10  
8
1.2  
V = 130 V  
DD  
I
D
= 29 A  
V
= 0 V  
= 10 mA  
GS  
I
D
1.1  
1.0  
V
DD  
= 400 V  
6
4
0.9  
0.8  
2
0
0
26  
52  
78  
104  
130  
75 50 25  
0
25 50 75 100 125 150 175  
Q , TOTAL GATE CHARGE (nC)  
g
T , JUNCTION TEMPERATURE (°C)  
J
Figure 7. Gate Charge Characteristics  
Figure 8. Breakdown Voltage Variation vs.  
Temperature  
200  
100  
3.0  
2.5  
2.0  
1.5  
1.0  
V
= 10 V  
= 29 A  
GS  
I
D
100 ms  
10  
1 ms  
10 ms  
Operation in this Area  
1
0.1  
is Limited by R  
DS(ON)  
100 ms  
T
= 25°C  
C
0.5  
0
T = 150°C  
J
Single Pulse  
0.01  
75 50 25  
0
25 50  
75 100 125 150 175  
1
10  
100  
1K  
T , JUNCTION TEMPERATURE (°C)  
J
V
DS  
, DRAINSOURCE VOLTAGE (V)  
Figure 9. OnResistance Variation vs.  
Figure 10. Maximum Safe Operating Area  
Temperature  
70  
60  
50  
40  
30  
20  
30  
24  
18  
12  
6
0
10  
0
25  
50  
75  
100  
125  
150  
0
100  
200  
300  
400  
500  
600  
T , CASE TEMPERATURE (°C)  
C
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 11. Maximum Drain Current vs. Case  
Temperature  
Figure 12. EOSS vs. DraintoSource Voltage  
www.onsemi.com  
5
NVHL050N65S3F  
TYPICAL CHARACTERISTICS  
250  
200  
150  
1.2  
1.0  
0.8  
V
= V  
DS  
= 1.7 mA  
GS  
I
D
T = 150°C  
A
100  
50  
0
T = 25°C  
A
Pulse Duration = 250 ms  
Duty Cycle = 0.5% Max  
= 29 A  
I
D
0.6  
80  
5
6
7
8
9
10  
40  
0
40  
80  
120  
160  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
T , JUNCTION TEMPERATURE (°C)  
J
Figure 13. RDS(ON) vs. Gate Voltage  
Figure 14. Normalized Gate Threshold Voltage  
vs. Temperature  
100  
10  
T
= 25°C  
J(initial)  
T
= 100°C  
J(initial)  
1
1E06 1E05 1E04 1E03 1E02 1E01 1E+00  
t , TIME IN AVALANCHE (sec)  
AV  
Figure 15. Unclamped Inductive Switching  
Capability  
10  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.05  
0.1  
0.02  
P
DM  
Z
R
(t) = r(t) x R  
q
JC  
q
JC  
0.01  
0.01  
= 0.31°C/W  
q
JC  
t
1
Peak T = PDM x Z (t) + T  
Duty Cycle, D = t / t  
q
J
JC  
C
Single Pulse  
t
2
1
2
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
t, RECTANGULAR PULSE DURATION (s)  
Figure 16. Transient Thermal Response Curve  
SUPERFET and FRFET are registered trademarks of Semiconductor Components Industries, LLC.  
www.onsemi.com  
6
NVHL050N65S3F  
PACKAGE DIMENSIONS  
TO2473LD  
CASE 340CX  
ISSUE O  
www.onsemi.com  
7
NVHL050N65S3F  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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