SMMBFJ175LT1G [ONSEMI]
P 沟道 JFET 晶体管，30 V;
| 型号： | SMMBFJ175LT1G |
| 厂家： | 
ONSEMI |
| 描述： | P 沟道 JFET 晶体管，30 V 光电二极管 小信号场效应晶体管 |
| 文件： | 总2页 (文件大小：102K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MMBFJ175LT1G
JFET Chopper
P−Channel − Depletion
Features
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
http://onsemi.com
Compliant
2 SOURCE
MAXIMUM RATINGS
3
Rating
Drain−Gate Voltage
Symbol
Value
Unit
GATE
V
DG
25
V
Reverse Gate−Source Voltage
V
GS(r)
−25
V
1 DRAIN
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR−5 Board,
P
D
3
SOT−23 (TO−236)
CASE 318
(Note 1) T = 25°C
225
1.8
mW
A
Derate above 25°C
mW/°C
1
STYLE 10
2
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature
R
q
JA
556
°C/W
°C
T , T
−55 to +150
J
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.062 in.
MARKING DIAGRAM
6W M G
G
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
1
Characteristic
Symbol Min Max
Unit
OFF CHARACTERISTICS
6W = Device Code
M
G
= Date Code*
= Pb−Free Package
Gate−Source Breakdown Voltage
(V = 0, I = 1.0 mA)
V
30
−
−
V
nA
V
(BR)GSS
DS
D
(Note: Microdot may be in either location)
Gate Reverse Current
(V = 0 V, V = 20 V)
I
1.0
6.0
GSS
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
DS
GS
Gate−Source Cutoff Voltage
(V = 15, I = 10 nA)
V
3.0
GS(OFF)
DS
D
ON CHARACTERISTICS
ORDERING INFORMATION
Zero Gate−Voltage Drain Current (Note 2)
I
7.0
−
60
1.0
125
mA
nA
W
DSS
†
Device
Package
Shipping
(V = 0, V = 15 V)
GS
DS
MMBFJ175LT1G
SOT−23 3000 / Tape & Reel
(Pb−Free)
Drain Cutoff Current
(V = 15 V, V = 10 V)
I
D(off)
DS
GS
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Drain Source On Resistance
r
−
DS(on)
(I = 500 mA)
D
Input Capacitance
C
−
−
11
iss
V
DS
= 0, V = 10V
GS
pF
Reverse Transfer
Capacitance
C
5.5
rss
f = 1.0 MHz
2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.
©
Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
August, 2009 − Rev. 5
MMBFJ175LT1/D
MMBFJ175LT1G
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
SEE VIEW C
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
3
H
E
E
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
c
1
2
MILLIMETERS
INCHES
b
DIM
A
A1
b
c
D
E
e
L
L1
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
MAX
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
MIN
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.25
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
e
q
A
L
A1
L1
VIEW C
H
2.10
2.40
2.64
0.083
0.094
0.104
E
STYLE 10:
PIN 1. DRAIN
2. SOURCE
3. GATE
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
mm
inches
ǒ
Ǔ
SCALE 10:1
0.8
0.031
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MMBFJ175LT1/D
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