NP043A1 [PANASONIC]

Small Signal Bipolar Transistor, 0.08A I(C), 50V V(BR)CEO, 2-Element, NPN and PNP, Silicon, ROHS COMPLIANT, SSSMINI6-F1, 6 PIN;
NP043A1
型号: NP043A1
厂家: PANASONIC    PANASONIC
描述:

Small Signal Bipolar Transistor, 0.08A I(C), 50V V(BR)CEO, 2-Element, NPN and PNP, Silicon, ROHS COMPLIANT, SSSMINI6-F1, 6 PIN

开关 光电二极管 晶体管
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中文:  中文翻译
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Composite Transistors  
NP043A1  
Silicon NPN epitaxial planar type (Tr1)  
Silicon PNP epitaxial planar type (Tr2)  
Unit: mm  
For digital circuits  
0.12+0.03  
0.02  
6
5
4
Features  
0 to 0.02  
Two elements incorporated into one package (Each transistor is separated)  
SSSMini type package, reduction of the mounting area and assembly cost  
Maximum package height (0.4 mm) contributes to develop thinner equipments  
1
2
3
(0.35) (0.35)  
1.00±0.05  
Display at No.1 lead  
Basic Part Number  
UNR32A1 + UNR31A1  
Absolute Maximum Ratings T
a
= 25
°
C  
Parameter  
Symbol  
Rating  
Unit  
1: Emitter (Tr1)  
4: Emitter (Tr2)  
5: Base (Tr2)  
Collector-base voltage  
(Emitter open)  
VCBO  
50  
V
2: Base (Tr1)  
3: Collector (Tr2)  
6: Collector (Tr1)  
SSSMini6-F1 Package  
Collector-emitter voltage  
(Base open)  
Tr1  
VCEO  
IC  
50  
80  
V
mA  
V
Marking Symbol: 7X  
Collector current  
Internal Connection  
Collector-base voltage  
(Emitter open)  
VCBO  
50  
(C1) (B2) (E2)  
6
5
4
Collector-emitter voltage  
(Base open)  
R1  
Tr2  
R2  
10 k  
VCEO  
V
50  
10 kΩ  
Tr1  
Tr2  
R2  
10 kΩ  
R1  
10 kΩ  
Collector current  
IC  
PT  
Tj  
mA  
mW  
°
C  
80  
125  
Total power dissipation
*  
Junction temperature  
Storage temperature  
1
2
3
(E1) (B1) (C2)  
125  
Overall  
T
stg  
55 to +125  
°
C  
Note) : Measuring on substrate at 17 mm 10 mm 1 mm  
*
Publication date: June 2005  
SJJ00324AED  
1
NP043A1  
Electrical Characteristics T
a
= 25
°
C±3
°
C  
Tr1  
Parameter  
Symbol  
VCBO I
C
= 10 µA, I
E
= 0  
VCEO IC = 2 mA, IB = 0  
Conditions  
Min  
50  
Typ  
Max  
Unit  
V
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)
*  
Collector-base cutoff current (Emitter open)  
Collector-emitter cutoff current (Base open)  
Emitter-base cutoff current (Collector open)  
Forward current transfer ratio  
Collector-emitter saturation voltage  
Output voltage high-level  
50  
V
ICBO  
ICEO  
IEBO  
hFE  
VCB = 50 V, I
E
= 0  
VCE = 50 V, IB = 0  
VEB = 6 V, I
C
= 0  
0.1  
0.5  
0.5  
µA  
µA  
mA  
VCE = 10 V, I
C
= 5 mA  
35  
VCE(sat) IC = 10 mA, IB = 0.3 mA  
0.25  
V
VOH  
VOL  
R1  
VCC = 5 V, VB = 0.5 V, R
L
= 1 kΩ  
4.9  
V
Output voltage low-level  
VCC = 5 V, VB = 2.5 V, R
L
= 1 kΩ  
0.2  
+30%  
1.2  
V
Input resistance  
10  
1.0  
150  
kΩ  
30%  
0.8  
Resistance ratio  
R1 / R2  
fT  
Transition frequency  
VCB = 10 V, I
E
2 mA, f = 200 MHz  
MHz  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2. : Pulse measurement  
*
Tr2  
Parameter  
Symbol  
Conditions  
Min  
50  
50  
Typ  
Max  
Unit  
V
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)  
Collector-base cutoff current (Emitter open)  
Collector-emitter cutoff current (Base open)  
Emitter-base cutoff current (Collector open)  
Forward current transfer ratio  
Collector-emitter saturation voltage  
Output voltage high-level  
VCBO I
C
10 µA, I
E
= 0  
VCEO I
C
2 mA, IB = 0  
V
ICBO  
ICEO  
IEBO  
hFE  
VCB
50 V, I
E
= 0  
V
CE
50 V, IB = 0  
VEB
6 V, IC = 0  
0.1  
0.5  
0.5  
µA  
µA  
mA  
V
CE
10 V, IC
5 mA  
35  
VCE(sat) I
C
10 mA, IB
0.3 mA  
V
0.25  
VOH  
VOL  
R1  
V
CC
5 V, VB
0.5 V, R
L
= 1 kΩ  
V
CC
5 V, VB
2.5 V, R
L
= 1 kΩ  
V
4.9  
Output voltage low-level  
V
0.2  
+30%  
1.2  
Input resistance  
10  
1.0  
80  
kΩ  
30%  
0.8  
Resistance ratio  
R1 / R2  
fT  
Transition frequency  
VCB
10 V, IE = 1 mA, f = 200 MHz  
MHz  
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2
SJJ00324AED  
NP043A1  
Common characteristics chart  
PT
T  
a
120  
80  
40  
0
0
40  
80  
120  
(
)
Ambient temperature Ta °C  
Characteristics charts of Tr1  
IC
V
CE  
VCE(sat)
I
C  
hFE
IC  
10  
1
80  
IB = 1.0 mA  
0.9 mA  
0.8 mA  
0.7 mA  
0.6 mA  
0.5 mA  
0.4 mA  
Ta = 25°C  
IC /IB = 10  
V
CE = 10 V  
200  
60  
40  
Ta = 85°C  
25°C  
0.3 mA  
0.2 mA  
25°C  
100  
0.1  
Ta = 85°C  
25°C  
20  
0
25°C  
0.1 mA  
0
0.01  
1
10  
100  
0
4
8
12  
1
10  
100  
(
)
Collector-emitter voltage VCE (V)  
Collector current IC (mA)  
Collector current IC mA  
Cob
VCB  
IO
V
IN  
VIN
IO  
10  
100  
10  
1
10  
VO = 5 V  
Ta = 25°C  
f = 1 MHz  
Ta = 25°C  
VO = 0.2 V  
Ta = 25°C  
0.1  
1
0.01  
1
0.1  
0
10  
20  
30  
40  
0
1
2
1
10  
100  
( )  
V
Collector-base voltage VCB  
Input voltage VIN (V)  
Output current IO (mA)  
SJJ00324AED  
3
NP043A1  
Characteristics charts of Tr2  
IC
V
CE  
VCE(sat)
I
C  
hFE
IC  
10  
1  
IC /IB = 10  
Ta = 25°C  
80  
V
CE = −10 V  
IB = 1.0 mA  
0.9 mA  
160  
120  
80  
0.8 mA  
0.7 mA  
0.6 mA  
0.5 mA  
60  
40  
0.4 mA  
0.3 mA  
Ta = 85°C  
25°C  
25°C  
Ta = 85°C  
0.1  
0.2 mA  
25°C  
25°C  
20  
40  
0
0.1 mA  
0
0.01  
0
4  
8  
12  
1  
10  
100  
0.1  
1  
10  
100  
(
)
Collector-emitter voltage VCE (V)  
Collector current IC (mA)  
Collector current IC mA  
Cob
VCB  
IO
V
IN  
VIN
IO  
10  
100  
10  
1  
10  
VO = 0.2 V  
Ta = 25°C  
f = 1 MHz  
Ta = 25°C  
1  
VO = 0.2 V  
Ta = 25°C  
1
0.1  
0.1  
0
10  
20  
30  
40  
0
1  
2  
3  
0.1  
1  
10  
100  
( )  
V
Collector-base voltage VCB  
Input voltage VIN (V)  
Output current IO (mA)  
4
SJJ00324AED  
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd. Industrial Co., Ltd.  

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