XN01501G [PANASONIC]

Small Signal Bipolar Transistor, 0.1A I(C), 50V V(BR)CEO, 2-Element, NPN, Silicon, ROHS COMPLIANT, MINI5-G2, 5 PIN;
XN01501G
型号: XN01501G
厂家: PANASONIC    PANASONIC
描述:

Small Signal Bipolar Transistor, 0.1A I(C), 50V V(BR)CEO, 2-Element, NPN, Silicon, ROHS COMPLIANT, MINI5-G2, 5 PIN

放大器 光电二极管 晶体管
文件: 总4页 (文件大小:205K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
This product complies with the RoHS Directive (EU 2002/95/EC).  
Composite Transistors  
XN01501G  
Silicon NPN epitaxial planar type  
For general amplification  
Package  
Features  
Two elements incorporated into one package  
(Emitter-coupled transistors)  
Code  
Mini5-G2  
Reduction of the mounting area and assembly cost by onhalf  
Pin Name  
1: C(Tr1) 4: Emitter  
2: Cr2) 5: Base (Tr1)  
ase )  
Basic Part Number  
2SD0601A × 2  
Absolute Maximum Ratings Ta = 5°C  
Marking Symbol: 5R  
Parameter  
Symbl  
g  
Unit  
V
Collector-base voltage (Emitter open) VCBO  
Collector-emitter voltage (Base oVCO  
Emitter-base voltage (Collector VEBO  
60  
50  
7
Internal Connection  
V
V
(B2) (E) (B1)  
3
4
5
Collector current  
IC  
ICP  
PT  
10
00  
mA  
mA  
mW  
°C  
Peak collector curren
Total power dissipon  
Junction temperure  
Storage empture  
Tr2  
Tr1  
300  
150  
55 to +150  
°C  
2
(C2)  
1
(C1)  
Electrracteristics Ta = 25°C 3°C  
r  
Symbol  
VCBO  
VCEO  
VEBO  
ICBO  
Conditions  
Min  
60  
50  
7
Typ  
Max  
Unit  
V
Collector-bas(Emitter open)  
Collector-emitter voltage (Base open)  
Emitter-base voltage (Collector open)  
Collector-base cutoff current (Emitter open)  
Collector-emitter cutoff current (Base open)  
Forward current transfer ratio  
IC = 10 µA, IE = 0  
IC = 2 mA, IB = 0  
V
IE = 10 µA, IC = 0  
VCB = 20 V, IE = 0  
VCE = 10 V, IB = 0  
VCE = 10 V, IC = 2 mA  
V
0.1  
100  
460  
µA  
µA  
ICEO  
hFE  
160  
h
FE ratio *  
hFE(Small/ VCE = 10 V, IC = 2 mA  
Large)  
0.50  
0.99  
Collector-emitter saturation voltage  
Transition frequency  
VCE(sat) IC = 100 mA, IB = 10 mA  
0.1  
150  
3.5  
0.3  
V
MHz  
pF  
fT  
VCB = 10 V, IE = −2 mA, f = 200 MHz  
VCB = 10 V, IE = 0, f = 1 MHz  
Collector output capacitance  
Cob  
(Common base, input open circuited)  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2. : Ratio between 2 elements  
*
Publication date: March 2009  
SJJ00444AED  
1
This product complies with the RoHS Directive (EU 2002/95/EC).  
XN01501G  
PT Ta  
IC VCE  
IC IB  
240  
60  
500  
400  
300  
200  
100  
0
Ta = 25°C  
VCE = 10 V  
Ta = 25°C  
IB = 160 µA  
200  
160  
120  
80  
50  
40  
30  
20  
10  
0
140 µA  
12µA  
100 A  
0 µA  
µA  
40 µA  
0  
20 µA  
0.2  
0.4  
6  
0.8  
1.0  
0
4
6
8
1
0
40  
80  
120  
160  
)
Base current IB (mA  
(
ollectoemitter voltage VCE  
(
)
Ambient temperature Ta °C  
IB VBE  
IC VBE  
VCE(sat) IC  
102  
10  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
240  
200  
16
120  
IC / IB = 10  
CE = 10 V  
VCE =
Ta =
25°C  
1
Ta = 75°C  
25°C  
25°C  
101  
T= 75°C  
40  
25°C  
102  
101  
0
1
10  
102  
0.2  
0.4  
0.6  
0.8  
1.0  
0
0.4  
0.8  
1.2  
1.6  
2.0  
V
)
(
)
Bvoltae VBE  
Colletor current IC mA  
(
V
)
Base-emitter voltage VBE  
IC  
fIE  
NV IC  
600  
500  
400  
300  
200  
100  
0
300  
240  
180  
120  
60  
240  
200  
160  
120  
80  
VCE = 10 V  
VCB = 10 V  
Ta = 25°C  
VCE = 10 V  
GV = 80 dB  
Function = FLAT  
Ta = 25°C  
Ta = 75°C  
25°C  
Rg = 100 kΩ  
25°C  
22 kΩ  
4.7 kΩ  
40  
0
0
10  
101  
1
10  
102  
101  
–1  
–10  
–102  
102  
Collector current IC µA  
103  
(
)
(
)
Emitter current IE mA  
(
)
Collector current IC mA  
SJJ00444AED  
2
This product complies with the RoHS Directive (EU 2002/95/EC).  
XN01501G  
Mini5-G2  
Unit: mm  
2.90 +00..0250  
1.9 0.1  
3 +00..0025  
(0.95)  
(0.5)  
3
4
5
2
1
0.30 +00.150  
8°  
SJJ00444AED  
3
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability requied, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subjet to change wit notice for modification and/or im-  
provement. At the final stage of your design, purchasingr use of the roducts, therfor the most up-to-date Product  
Standards in advance to make sure that the latest specifictions stisfy your requirements.  
(5) When designing your equipment, comply with he ange f absolute maximing nd the guaranteed operating conditions  
(operating power supply voltage and operating nvirent etc.). Especiall, plee be ceful not to exceed the range of absolute  
maximum rating on the transient state, such as powpower-off and modeswitching. Otherwise, we will not be liable for any  
defect which may arise later in your equpmen
Even when the products are used withthe guaanteed values, kinto he cosideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the sytems such as redundant design, arresting the spread of fire  
or preventing glitch are recommin ordto prevent physicinjury, fre, social damaes, for example, by using the products.  
(6) Comply with the instructios for se in rder to prevent breakdwn and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanicastress) at the time of andlig, mounting or at customer's process. When using products for which  
damp-proof packinis reqired, stisfy the condtions, sch as shelf life and the elapsed time since first opening the packages.  
(7) This book may e not eprinted or reprodhethr wholly or partially, without the prior written permission of our company.  
2008080

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