BD6383EFV_11 [ROHM]
Silicon monolithic integrated circuits; 硅单片集成电路型号: | BD6383EFV_11 |
厂家: | ROHM |
描述: | Silicon monolithic integrated circuits |
文件: | 总5页 (文件大小:143K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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STRUCTURE
PRODUCT SERIES
TYPE
Silicon monolithic integrated circuits
Bipolar stepping motor driver
BD6383EFV
FUNCTION
・PWM constant current controllable two H bridge driver
・Built-in translator circuit for CLK-IN control
・Full, Half, Quarter step
・Mixed Decay control
・Parallel IN control
○Absolute maximum ratings(Ta=25℃)
Item
Symbol
VCC0,1,2
Limit
Unit
Supply voltage
-0.2~+36.0
V
1
1.6※
4.7※
W
Power dissipation
Pd
2
W
Input voltage for control pin
RNF maximum voltage
VIN
VRNF
IOUT
Topr
-0.2~+5.5
V
0.5
1.0※
V
A/phase
℃
3
Maximum output current
Operating temperature range
Storage temperature range
Junction temperature
-25~+75
-55~+150
150
Tstg
℃
Tjmax
℃
1
2
3
※
※
※
70mm×70mm×1.6mm glass epoxy board. Derating in done at 12.8mW/℃ for operating above Ta=25℃.
4-layer recommended board. Derating in done at 37.6mW/℃ for operating above Ta=25℃.
Do not, however exceed Pd, ASO and Tjmax=150℃.
○Recommended operating conditions (Ta=-25~+75℃)
Item
Supply voltage
Output current
Symbol
VCC0,1,2
IOUT
Min
10
-
Typ
24
Max
28
0.7※
Unit
V
4
0.5
A/phase
4
※
Do not, however exceed Pd, ASO.
This product isn’t designed for protection against radioactive rays.
REV. A
2/4
○Electrical characteristics (Unless otherwise specified Ta=25℃, VCC0,1,2=24V)
Limit
Item
Symbol
Unit
Conditions
Min
Typ
Max
Whole
Circuit current at standby
Circuit current
ICCST
ICC
-
-
1.0
4.5
3.0
10
mA
mA
PS=L
PS=H, VREFX=2V
Control input (SELECT, CW_CCW, CLK, PS, MODE0, MODE1, ENABLE)
H level input voltage
L level input voltage
H level input current
L level input current
VINH
VINL
IINH
IINL
2.0
-
-
-
-
0.8
85
-
V
V
35
-10
50
0
μA
μA
VIN=5V
VIN=0V
Output (OUT1A, OUT1B, OUT2A, OUT2B)
IOUT=0.5A,
Output ON resistance
RON
-
-
1.50
-
1.95
10
Ω
Sum of upper and lower
Output leak current
Current control
ILEAK
μA
RNFXS input current
RNFX input current
VREFX input current
VREFX input voltage range
MTHX input current
MTHX input voltage range
Comparator threshold
Minimum on time
IRNFS
IRNF
-2.0
-40
-2.0
0
-0.2
-20
-0.1
-
-
-
μA
μA
μA
V
RNFXS =0V
RNFX=0V
IVREF
VREF
IMTH
-
VREFX=0V
2.0
-
-2.0
0
-0.1
-
μA
V
MTHX=0V
VMTH
VCTH
tONMIN
3.5
0.44
1.2
0.36
0.3
0.40
0.7
V
VREFX=2V
μs
R=39kΩ,C=1000pF
REV. A
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○Package outline
Product No.
BD6383EFV
Lot No.
HTSSOP-B40 (Unit:mm)
○Block diagram
○Pin No. / Pin name
Pin No.
1
Pin name
Pin No.
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Pin name
VCC0
NC
Buffer
Current Limit Comp.
NC
RNF1
RNF1S
NC
VREF1 14
DAC
9 VCC1
2
7 OUT1A
5 OUT1B
Predriver
Logic
3
GND
CR
Timer
11
CR1
4
MODE0
MODE1
ENABLE
VREF2
MTH2
NC
2 RNF1
5
OUT1B
NC
OCP
Reg
MTH1 13
3 RNF1S
6
CLK 18
MODE0 24
7
OUT1A
NC
21 VCC0
23 GND
25
MODE1
8
Translator
16
TSD
RESET
CW_CCW
OVLO
UVLO
9
VCC1
NC
26
ENABLE
15
10
11
12
13
14
15
16
17
18
19
20
CR2
SELECT
19
PS
CR1
NC
Buffer
Current Limit Comp.
NC
VCC2
NC
VREF2 27
DAC
32 VCC2
MTH1
VREF1
SELECT
CW_CCW
NC
34 OUT2A
36 OUT2B
OUT2A
NC
Predriver
Logic
CR
CR2 30
MTH2 28
TEST 20
Timer
39 RNF2
OUT2B
NC
OCP
38 RNF2S
40 GND
CLK
RNF2S
RNF2
GND
PS
TEST
NC : Non Connection
REV. A
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○Operation Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating
conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a
short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings,
consider adding circuit protection devices, such as fuses.
(2) Power supply lines
As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor
between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no
problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor
to decide capacity value. If the connected power supply does not have sufficient current absorption capacity,
regenerative current will cause the voltage on the power supply line to rise, which combined with the
product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to
implement a physical safety measure such as the insertion of a voltage clamp diode between the power
supply and GND pins
(3) GND potential
The potential of GND pin must be minimum potential in all operating conditions.
(4) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual
operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed
to use after providing heat dissipation treatment to improve heat dissipation efficiency . Try to occupy as
wide as possible with heat dissipation pattern not only on the board surface but also the backside.
(5) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the
IC to malfunction.
(6) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(7) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃,
and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to
prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not
use the TSD function to protect peripheral equipment.
(8) Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the ground potential of application so that the pattern wiring
resistance and voltage variations caused by large currents do not cause variations in the small signal
ground voltage. Be careful not to change the GND wiring pattern of any external components, either.
(9) TEST pin
Be sure to connect TEST pin to GND.
REV. A
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
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use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
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