BD83854GWL [ROHM]
BD83854GWL是小型TFT-LCD显示器用的升压开关稳压器/电荷泵变频器。该IC的输入电压范围大，为2.5V~4.5V，并采用小型封装，适用于便携式设备。;
| 型号： | BD83854GWL |
| 厂家： | 
ROHM |
| 描述： | BD83854GWL是小型TFT-LCD显示器用的升压开关稳压器/电荷泵变频器。该IC的输入电压范围大，为2.5V~4.5V，并采用小型封装，适用于便携式设备。 开关 便携式 便携式设备 泵 CD 显示器 稳压器 |
| 文件： | 总22页 (文件大小：1450K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Single-chip Type with Built-in FET Switching Regulator Series
Step-up and inverted Output
Power Supply for TFT-LCD Displays
BD83854GWL
General Description
Key Specifications
BD83854GWL is a step-up switching regulator and
charge pump inverter for small TFT-LCD Displays. It has
a wide input voltage range of 2.5V to 4.5V that is
suitable for portable applications. In addition, its small
package design is ideal for miniaturizing the power
supply.
2.5V to 4.5V
5.4V(typ)
■
■
■
■
■
■
■
■
Input Voltage Range
Output Boost Voltage
Output Inverted Voltage
Maximum Current
Operating Frequency
Efficiency
-5.4V(typ)
50mA(max)
1.0MHz(typ)
>85 %(typ)
±2 %(typ)
Features
Output Voltage Accuracy
Standby Current
Wide input voltage range of 2.5V to 4.5V
High frequency operation
1µA(max)
Output Discharge Independent ON/OFF
signal(STBYP, STBYN)
Package
W(Typ) x D(Typ) x H(Max)
Circuit protection
Over Current Protection (OCP)
Short Current Protection (SCP)
Under Voltage Lock Out (UVLO)
Thermal Shutdown (TSD)
Applications
TFT LCD Smart phones
TFT LCD Tablets
UCSP50L1C
1.80mm x 1.50mm x 0.57mm
Typical Application Circuit
LLX
4.7µH
LX
VREG
VIN
VIN
C1
CVREG
2.5V to 4.5V
4.7µF
4.7µF
PGND1
PGND2
AGND
V+
5.4V/max50mA
CVOP
VOUTP
4.7µF
CP1
CP2
STBYP
STBYN
CCP
2.2µF
V-
VOUTN
-5.4V/max50mA
CVON
4.7µF
Figure 1. Application Circuit
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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Contents
General Description....................................................................................................................................................1
Features.......................................................................................................................................................................1
Applications ................................................................................................................................................................1
Key Specifications......................................................................................................................................................1
Package W(Typ) x D(Typ) x H(Max) .......................................................................................................................1
Typical Application Circuit.........................................................................................................................................1
Pin Configuration........................................................................................................................................................3
Pin Description............................................................................................................................................................3
Block Diagram.............................................................................................................................................................4
Absolute Maximum Ratings (Ta = 25°C)...................................................................................................................4
Recommended Operating Conditions ......................................................................................................................4
Electrical Characteristics (Unless otherwise specified VIN=3.7V Ta=25°C) ..........................................................5
Typical Performance Curves .....................................................................................................................................6
Application Information ...........................................................................................................................................11
Description of Protection Circuits .......................................................................................................................11
Application Example .............................................................................................................................................13
Selection of External Components......................................................................................................................13
Power Dissipation.....................................................................................................................................................14
I/O Equivalent Circuit ...............................................................................................................................................15
Operational Notes.....................................................................................................................................................16
Ordering Information................................................................................................................................................18
Physical Dimension, Tape and Reel Information...................................................................................................18
Revision History .......................................................................................................................................................19
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Pin Configuration
C
B
A
1
2
3
4
Figure 2. Pin assignment
(Bottom view)
Pin Description
Pin No.
B-1
A-3
B-2
C-1
B-4
C-4
A-1
C-2
B-3
C-3
A-2
A-4
Pin Name
Function
CP2
PGND1
PGND2
CP1
Negative charge pump flying capacitor
Boost Power ground
Charge pump Power ground
Negative charge pump flying capacitor
Boost converter output
VREG
VOUTP
VOUTN
AGND
STBYN
STBYP
VIN
LDO output (V+)
Charge pump inverter (V-) output
Analog ground
Charge pump inverter (V-) enable (only STBYP=H)
LDO enable (V+)
Input voltage supply
LX
Boost converter switch
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Block Diagram
VIN
CVIN
CVREG
(Battery Voltage)
4.7µF
4.7µF
LLX 4.7µH
VIN
PGND1
LX
VREG
Backgate
Control
OCP
VREF
LDO
VOUTP
V+
TSD
UVLO
VREF
CVOP
4.7µF
BOOST
SCP
VREF
CONVERTER
VREG
UVLO
OSC500k
STBYP
STBYN
CP1
OSC1M
LOGIC
CHARGE
PUMP
PGND2
SOFT
START
SEQ.
CCP
2.2µF
CP2
VREF
OSC1M
OSC500k
OSC1M
VREF
REF
VOUTN
V-
CVON
AGND
4.7µF
Figure 3. Block diagram
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Rating
Unit
V
VIN
STBYP,STBYN
LX
-0.3 to 7.0
-0.3 to 7.0
-0.3 to 7.0
-0.3 to 7.0
0.69
Maximum power supply voltage
V
V
Voltage range
VOUTP
Pd
V
Power dissipation(note1)
Storage temperature range
Junction temperature
W
°C
°C
Tstg
-55 to +150
+150
Tjmax
(Note 1) Derate by 5.5mW/°C when operating above Ta=25°C (when mounted in ROHM’s standard board).
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Standard value
Parameter
Symbol
Units
MIN
2.5
TYP
-
MAX
4.5
Power supply voltage
VDD
Topr
V
Operating temperature range
-40
25
85
°C
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Electrical Characteristics (Unless otherwise specified VIN=3.7V Ta=25°C)
Standard value
Parameter
【Power Supply】
Symbol
Unit
Conditions
MIN
TYP
MAX
Input Voltage Range
VIN
2.5
-
4.5
V
V
V
V
UVLO Detect Voltage
UVLO UnDetect Voltage
UVLO Hysteresis Voltage
VUVLO1
VUVLO2
VHYS
2.20
2.26
2.39
0.13
-
2.50
-
-
-
【Soft Start Sequence】
VOUTP Soft Start Time
VOUTN Soft Start Time
tSSVP
tSSVN
0.4
3.7
0.5
4.1
1.0
4.6
ms
ms
CVOP=4.7µF+4.7µF
CVON=4.7µF+6.8µF
【Boost Converter】
LX Switching Frequency
LX OCP Current
fSWLX
OCPLXL
VVREG
0.90
0.6
1.00
-
1.10
-
MHz
A
VREG Output Voltage
VREGUVLO Voltage 1
VREGUVLO Voltage 2
5.50
1.9
5.65
2.1
4.55
5.80
2.3
4.75
V
VRUVLO1
VRUVLO2
V
Among Soft Start Operation
4.35
V
【Output VOUTP】
Output Voltage
VOUTP
VOUTPAQ
IOUTP
5.292
5.400
-
5.508
V
%
Output Voltage Accuracy
Maximum Output Current
Line Regulation
-2
-
2
50
-
-
mA
%/V
mV
Ω
VOPLINE
VOPLOAD
ROPDIS
-
0.1
10
40
Iout=10mA
Iout=50mA
VREG=5.25V
Load Regulation
-
-
Discharge Resistor
20
80
【Output VOUTN】
CP Switching Frequency
Output Voltage
fSWCP
VOUTN
VOUTNAQ
IOUTN
450
500
-5.400
-
550
kHz
V
-5.508
-5.292
Output Voltage Accuracy
Maximum Output Current
Line Regulation
-2
-
2
50
-
%
-
mA
%/V
mV
Ω
VONLINE
VONLOAD
RONDIS
-
0.1
10
Iout=10mA
Iout=50mA
VREG=5.25V
Load Regulation
-
-
Discharge Resistor
10
20
40
【STBYP,STBYN】
Active
VSTBH
VSTBL
RSTB1
1.5
-0.3
500
-
-
VIN
0.3
V
V
STBY pin
Control voltage
Non-active
STBY pin pull down resistance
800
1100
kΩ
【Circuit current】
Standby current
ISTB
IDD
-
0
1
µA
STBYP=STBYN=L
STBYP=STBYN=H
VOUTP IL=0,VOUTN IL=0
Circuit current of operation VIN
1.3
2.5
5.0
mA
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Typical Performance Curves
VUVLO2
VUVLO1
85°C
-40, 25°C
Figure 4. Standby Current vs VIN Voltage
Figure 5. VIN UVLO Voltage vs Temperature
(Ta –40, 25, 85°C)
85°C
STBYN VSTBH /VSTBL
25°C
-40°C
STBYP VSTBH /VSTBL
Figure 6. Circuit Current of Operation VIN vs VIN Voltage
Figure 7. STBY Control Voltage vs Temperature
(VIN =3.7V)
(Ta –40, 25, 85°C)
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Typical Performance Curves – continued
25°C
-40°C
Iout=10mA
Iout=1mA
85°C
Iout=50mA
Figure 8. VOUTP Output Voltage vs Temperature
(VIN =3.7V, Iout=1m, 10m, 50mA)
Figure 9. VOUTP Load Regulation
(Ta –40°C, 25°C, 85°C)
Iout=1mA
Iout=10mA
85°C
25°C
-40°C
Iout=50mA
Figure 10. VOUTN Output Voltage vs Temperature
(VIN =3.7V, Iout=1m, 10m, 50mA)
Figure 11. VOUTN Load Regulation
(Ta –40, 25, 85°C)
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Typical Performance Curves – continued
85°C
25°C
-40°C
Figure 13. VREG Output Voltage vs Temperature
(VIN =3.7V, Iout=0)
Figure 12. LX Frequency vs VIN Voltage
(Ta –40, 25, 85°C)
1269AS-H-4R7N
25°C
85°C
MLP2520V-4R7M
-40°C
Figure 14. Efficiency vs Iout
(VIN =3.7V, Ta 25°C)
Figure 15. VOUTP vs IVOUTP
(Ta –40, 25, 85°C)
Efficiency
= (VOUTP x Iout - VOUTN x Iout) / (VIN x Idd)
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Timing Chart
Recommended Power ON Sequence (STBYP has same timing as STBYN)
STBYP & STBYN are recommended simultaneously to be in H when after VIN becomes more than 2.5V (working
range voltage). The through rate should be less than 100µs when STBYP and STBYN are set H simultaneously. It is
not relating to soft start but to prevent chattering. STBYN must be high within 5ms from STBYP=H.
Table 1. Function of STBYP and STBYN
STBYP STBYN VOUTP VOUTN
Function Description
L
L
L->H
H->L
L
L->H
L
+0V
+0V
+5.4V
+0V
-0V
-0V
-0V
-0V
The output of VOUTP/N stay "L" before STBYP become "H"
VOUTP can be controlled independently when STBYN is "L"
L
STBYP and STBYN should be controlled almost at the same timing
Gap of STBYP/N should less than 5ms
L->H
H
L->H
L->H
+5.4V
+0V
-5.4V
-0V
VOUTP will be drived to "L" when setting STBYN to "H" later more than 5ms
Otherwise the internal sequence will be disrupted
2.5V <
30µs
VIN
1.5V <
STBYP
STBYN
VOUTP + 0.25V
VREG
512 µs(typ)
2048 µs(typ)
0V
0V
VOUTP = 5.4V
VOUTN = -5.4V
VOUTP
VOUTN
STBYN Disable Time
4096 µs(typ)
4096 µs(typ)
Soft Start Operation
8192 µs (typ)
Figure 16. Power ON Sequence Timing (STBYP=STBYN)
2.5V <
30µs
VIN
1.5V <
STBYN delay capable 5ms(max)
STBYP
STBYN
VOUTP + 0.25V
VOUTP = 5.4V
VREG
512 µs(typ)
2048 µs(typ)
0V
VOUTP
VOUTN
0V
VOUTN = -5.4V
STBYN Disable Time
4096 µs(typ)
4096 µs(typ)
Soft Start Operation
8192 µs (typ)
Figure 17. Power ON Sequence Timing (STBYP≠STBYN)
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Recommended OFF Sequence (STBYP has same timing as STBYN)
30µs
STBYP
STBYN
VREG
90% down 4.0ms(typ)
+5.4V
90% down 356µs(typ)
VOUTP
0V
-5.4V
VOUTN
90% down 216µs
Shutdown Time
4.0ms (typ)
Figure 18. OFF Sequence Timing (STBYP=STBYN)
Recommended OFF Sequence
STBYP
30 µs
No Limitation
STBYN
VREG
90% down 4.0ms(typ)
90% down 356µs(typ)
VOUTP+5.4V
VOUTN -5.4V
0V
90% down 216µs
Shutdown Time
4.0ms + tSTBYP (typ)
Figure 19. OFF Sequence Timing
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Application Information
Description of Protection Circuits
(1) UVLO
Circuit for preventing malfunction at low voltage input.
This circuit prevents malfunction at the start of DC/DC converter operation when there is low input voltage by
monitoring the voltage at VIN pin. If VIN voltage is lower than 2.2V, all DC/DC converter outputs are turned OFF,
and the timer latch for soft-start circuit is reset.
35µs
VIN
35µs
2.2V
2.4V
2ms
2ms
VREG
VOUTP
VOUTN
UVLO
Detect
UVLO
UnDetect
normal operation
mode
normal operation
mode
Figure 20. UVLO Detect and Release Sequence Timing
(2) LX OCP (BOOST CONVERTER)
Circuit for preventing malfunction at over-current.
If input inductor current being supplied by VIN exceeds rated electrical characteristics, LX Lside terminal of
DC/DC converter turns OFF.
(3) SCP
Short-circuit protection(SCP) function based on latch system that monitor VREG voltage among ON state.
The SCP detection level will be change from 2.1V to 4.55V after Soft Start Operation. When VREG pin voltage is
lower than the SCP detection level, the internal SCP circuit turns OFF all DC/DC converter outputs. To reset the
latch output circuit, turn OFF STBYP and STBYN pins once then turn it ON or power up the supply again.
STBYP
STBYN
SCP function
VREG
ON
SCP ON
VREG monitor 2.1Ｖ
VREG monitor 4.55Ｖ (typ)
(typ)
SCP detect level
VOUTP
VOUTN
1.5ms
(typ)
8.2ms(typ)
Soft Start Operation
Figure 21. SCP function ON Sequence Timing
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Restart
STBYP
STBYN
LX
LX OCP Level
ILX
OCP
Over Current Load
IVREG
VREG
VOUTP
SCP Detect Level
0V
SCP
Detect
VOUTN
normal operation mode
normal operation mode
Figure 22. OCP and SCP Detect Sequence Timing
(4) TSD
Circuit for preventing malfunction at high Temperature.
When it detects an abnormal temperature exceeding Maximum Junction Temperature (Tj=150°C), all outputs are
turned OFF.
10µs
30µs
150 ℃
125 ℃
TEMP
2ms
2ms
VREG
VOUTP
VOUTN
TSD
Detect
TSD
UnDetect
normal operation
mode
normal operation
mode
Figure 23. TSD Detect and Release Sequence Timing
(5) VOUTP OCP (LDO)
Circuit for preventing malfunction at over-current.
If VOUTP load current exceeds 200mA, over-current protection circuit is activated and output current of LDO is
decreased with respect to VOUTP voltage. If short or overload condition is removed from VOUTP, then the
output returns to normal voltage regulation mode.
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Application Example
Figure 24. Suggested Layout
Table 2. Inductor Selection
Selection of External Components
Component Code
1269AS-H-4R7N
MLP2520V-4R7M
Inductor [µH]
Vendor
Toko
EIA Size (Thickness max.)
DCR (Typ.) [Ω]
0.25
4.7
4.7
1008(1.0mm)
1008(1.0mm)
TDK
0.24
Table 3. Capacitor Selection
Component Code
Capacitor [µF]
Vendor
Murata
Murata
EIA Size (Thickness max.)
Voltage Rating [V]
GRM188R61C225KAAD
GRM188R61C475KAAJ
2.2
4.7
0603 (0.9mm)
0603 (0.9mm)
16
16
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Power Dissipation
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I/O Equivalence Circuit
VIN, STBYP, STBYN, AGND
VREG, LX, PGND１, AGND
VIN
VREG
Back
Gate
STBYP
STBYN
LX
Body
Diode
AGND
PGND1
AGND
VOUTP, VREG, AGND
CP1, VREG, PGND2
VREG
VREG
Body
Diode
Body
Diode
CP1
VOUTP
Body
Diode
PGND2
AGND
VIN, AGND, PGND1, PGND2
CP2, VOUTN, PGND2
PGND2
CP2
VIN
PGND1
AGND
PGND2
VOUTN
P Substrate
Figure 25. I/O Equivalent Circuit
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Except for pins the output the input of which were designed to go below ground, ensure that no pins are at a voltage
below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 26. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
17. Disturbance light
In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due
to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip
from being exposed to light.
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TSZ02201-0242AAJ00030-1-2
29.Aug.2014 Rev. 002
© 2014 ROHM Co., Ltd. All rights reserved.
17/19
TSZ22111 • 15 • 001
BD83854GWL
Ordering Information
B D
8
3
8
5
4 G W L
-
E2
Part No.
Part No.
Package
Packaging and forming specification
E2: Embossed tape and reel
MUV:UCSP50L1C
Physical Dimension, Tape and Reel Information
Package Name
UCSP50L1C(BD83854GWL)
3854
Unit: mm
< Tape and Reel Information >
Tape
Quantity
Embossed carrier tape
3,000 pcs
Direction of
feed
E2
The direction is the pin 1 of product is at the upper left when
you hold reel on the left hand and you pull out the tape on the
right hand
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TSZ02201-0242AAJ00030-1-2
29.Aug.2014 Rev. 002
© 2014 ROHM Co., Ltd. All rights reserved.
18/19
TSZ22111 • 15 • 001
BD83854GWL
Revision History
Date
Revision
001
Changes
4.Jun.2014
New Release
Page 2/19 Added Contents
Page 4/19 Updated Note1 and added Caution
Page 17/19 Updated Ground Voltage and added Disturbance light
Page 18/19 Updated Physical Dimension Tape and Reel Information
29.Aug.2014
002
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TSZ02201-0242AAJ00030-1-2
29.Aug.2014 Rev. 002
© 2014 ROHM Co., Ltd. All rights reserved.
19/19
TSZ22111 • 15 • 001
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-GE
Rev.003
© 2013 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-GE
Rev.003
© 2013 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
相关型号：
BD839
Power Bipolar Transistor, 1.5A I(C), 45V V(BR)CEO, 1-Element, NPN, Silicon, TO-202, Plastic/Epoxy, 3 Pin
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BD83A04EFV-M
该IC是一款适用于LCD背光的白色LED驱动器，内置升压用的MOS和LED驱动用的4通道电流驱动器，非常适合用来驱动高亮度LED。由于LED引脚支持的最大电压为50V，因此适合驱动中型LCD显示器。可通过PWM信号进行调光，最高可设置为20,000：1@100Hz。该产品还支持模拟调光，通过与PWM调光相组合，可以支持更高亮度范围。可控制支持升压应用的DC-DC转换器，工作输入电压范围为4.5V ~ 48V。
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