BD91N01NUX [ROHM]
BD91N01NUX是一款Sink侧端口用IC，搭载了USB Type-C插头方向检测、插拔检测和USB Type-C电流判断功能。具有Pch-MOSFET开关控制功能，可保护后置系统侧电路免受VBUS过压和欠压影响。;
| 型号： | BD91N01NUX |
| 厂家： | 
ROHM |
| 描述： | BD91N01NUX是一款Sink侧端口用IC，搭载了USB Type-C插头方向检测、插拔检测和USB Type-C电流判断功能。具有Pch-MOSFET开关控制功能，可保护后置系统侧电路免受VBUS过压和欠压影响。 开关 |
| 文件： | 总21页 (文件大小：1392K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
USB Type-C Sink Port Detection and
Protection IC
BD91N01NUX
General Description
Key Specifications
BD91N01NUX integrates USB Type-C CC detection
including plug attach, detach, orientation and current
value for power sink side port.
VBUS Voltage Range:
VDDIO Voltage Range:
VBUS, CC Pin Tolerance Voltage:
Operation Temperature Range:
4.0 V to 5.5 V
1.7 V to 5.5 V
28 V
-30 °C to +85 °C
The Pch-MOSFET switch control function protects next
stage system side circuit from VBUS over voltage and
under voltage.
Package
VSON010X3020
W (Typ) x D (Typ) x H (Max)
3.00 mm x 2.00 mm x 0.60 mm
Features
USB Type-C Specification 1.0 to 1.3 Support
USB Type-C Plug Attach and Detach Detection
USB Type-C Plug Orientation Detection
USB Type-C Current Detection
VBUS Over Voltage and Under Voltage Protection
Direct VBUS Power Supply Operation Support
Dead-battery Operation Support
Integrated Rd Resistor
Applications
USB Type-C Power Sink/UFP Side Equipment:
Printer, Scanner, Electric Cigarette, AI Speaker, Camera
Typical Application Circuit
VBUS
VSRC
VB
SWDRV
VDDIO
IO Power
HOST I/F
USB
Type-C
SWMONI
CC1
CC2
CC1
CC2
BD91N01NUX
Receptacle
ORIENT
TCC0
TCC1
GND
GND
GND
〇Product structure: Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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Contents
General Description ................................................................................................................................................................1
Features.................................................................................................................................................................................1
Applications............................................................................................................................................................................1
Key Specifications...................................................................................................................................................................1
Package.................................................................................................................................................................................1
Typical Application Circuit........................................................................................................................................................1
Contents.................................................................................................................................................................................2
Pin Configuration ....................................................................................................................................................................3
Pin Descriptions......................................................................................................................................................................3
Block Diagram ........................................................................................................................................................................3
Description of Blocks...............................................................................................................................................................4
Absolute Maximum Ratings.....................................................................................................................................................5
Thermal Resistance................................................................................................................................................................5
Recommended Operating Conditions ......................................................................................................................................6
Electrical Characteristics.........................................................................................................................................................6
Typical Performance Curves....................................................................................................................................................7
Figure 1. Supply Current vs VDDIO Voltage .........................................................................................................................7
Figure 2. TCC Detection Results vs CC Voltage....................................................................................................................7
Figure 3. RD Resistance vs CC Voltage ................................................................................................................................7
Timing Chart...........................................................................................................................................................................8
Figure 4. Plug Attached Timing Chart ...................................................................................................................................8
Figure 5. Plug Detached Timing Chart..................................................................................................................................9
Figure 6. VBUS Over Voltage Detection Timing Chart.........................................................................................................10
Figure 7. I/O Output Timing Chart....................................................................................................................................... 11
Application Example..............................................................................................................................................................12
Selection of Components Externally Connected .....................................................................................................................12
I/O Equivalence Circuits........................................................................................................................................................13
Operational Notes.................................................................................................................................................................14
1.
2.
3.
4.
5.
6.
7.
8.
Reverse Connection of Power Supply ......................................................................................................................14
Power Supply Lines.................................................................................................................................................14
Ground Voltage.......................................................................................................................................................14
Ground Wiring Pattern.............................................................................................................................................14
Recommended Operating Conditions.......................................................................................................................14
Inrush Current.........................................................................................................................................................14
Testing on Application Boards..................................................................................................................................14
Inter-pin Short and Mounting Errors .........................................................................................................................15
Unused Input Pins...................................................................................................................................................15
Regarding the Input Pin of the IC.............................................................................................................................15
Ceramic Capacitor...................................................................................................................................................15
9.
10.
11.
Ordering Information.............................................................................................................................................................16
Marking Diagram...................................................................................................................................................................16
Physical Dimension and Packing Information.........................................................................................................................17
Revision History....................................................................................................................................................................18
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Pin Configuration
(TOP VIEW)
VB
1
10 VDDIO
SWDRV 2
9
8
7
6
SWMONI
ORIENT
TCC0
CC1
CC2
GND
3
4
5
EXP-PAD
TCC1
Pin Descriptions
Pin No.
Pin Name
VB
Description
1
2
3
Power supply from VBUS
Pch-MOSFET switch driver output
USB Type-C configuration channel 1
USB Type-C configuration channel 2
Ground
SWDRV
CC1
4
5
CC2
GND
6
TCC1
USB Type-C current detection result data 1
USB Type-C current detection result data 0
USB Type-C plug orientation detection result
Pch-MOSFET control state output
Power supply for I/O
7
TCC0
8
ORIENT
SWMONI
VDDIO
EXP-PAD
9
10
-
The EXP-PAD is connected to GND.
Block Diagram
VB
SWDRV
VDDIO
VBUS
SWMONI
Over Voltage
Under Voltage
Protection
POWER
I/Os
ORIENT
TCC0
CC1
CC2
CC
Detection
CONTROL
TCC1
GND
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Description of Blocks
(CC Detection)
The CC pin has a built-in pull-down resistor Rd to connect to the USB Type-C Source device.
When the Source side is connected to the CC pin, a divided voltage is generated at the CC pin by the pull-up resistor
(current source) on the Source side. With this voltage, the IC detects plug insertion (USB Type-C Plug Attach state), plug
orientation, and USB Type-C Source side current type (USB Default, USB Type-C 1.5 A, USB Type-C 3.0 A).
CC1 Pin
< 0.15 V
CC2 Pin
< 0.15 V
Detection State
Pch-MOSFET
OFF
ORIENT
TCC1
TCC0
USB Type-C Plug Detach
“L”
“L”
“L”
CC1 connection,
USB Default
USB Default
“L”
“H”
“H”
“L”
“H”
“H”
“H”
“L”
“H”
“H”
“L”
“H”
USB Type-C
1.5 A
USB Type-C
3.0 A
CC1 connection,
USB Type-C 1.5 A
CC1 connection,
USB Type-C 3.0 A
CC2 connection,
USB Default
CC2 connection,
USB Type-C 1.5 A
CC2 connection,
USB Type-C 3.0 A
< 0.15 V
“L”
ON
USB Default
USB Type-C
1.5 A
USB Type-C
3.0 A
< 0.15 V
“H”
When the CC pin voltage is following case, it detects as abnormal condition.
CC1 Pin
CC2 Pin
Detection State
Connection of a product breaking
the USB Type-C standard
Pch-MOSFET
OFF
ORIENT
TCC1
TCC0
0.25 V to 2.18 V 0.25 V to 2.18 V
“L”
“L”
“L”
> 2.5 V
-
-
Abnormality
of
the
pull-up
> 2.5 V
resistance value at the DFP side
(VBUS Over Voltage, Under Voltage Protection)
When the IC detects a VBUS over voltage, the SWDRV pin outputs a high and turns off the external Pch-MOSFET switch.
If the over voltage detection state continues for a fixed period of time, the switch off state is latched. The latch state lasts
until the VBUS voltage falls below the UVLO detection voltage and IC is reset.
If the over voltage detection state does not continue for a fixed period of time, the switch off state automatically recovers.
The SWDRV pin is a driver output for external Pch-MOSFET switch. The SWMONI pin outputs the state of the driver.
The SWDRV pin is decided in a state of the CC pin when the IC is booted up by supply of VB. It does not be OFF even if
the condition becomes OFF condition once after it is turned on.
SWDRV Pin Output
“H” (VBUS Voltage)
“L” (GND Voltage)
Pch-MOSFET Switch State
SWMONI Pin Data
OFF
ON
“L”
“H”
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
VBUS Input Range (VB Pin)
GND Input Range
VB
VG
-0.3 to +28.0
0
V
V
VDDIO Input Range
VDDIO
VSWD
VCC
-0.3 to +7.0
-0.3 to +28.0
-0.3 to +28.0
-0.3 to +7.0
150
V
SWDRV Pin Voltage
V
CC1/CC2 Pin voltage
Others Pins
V
VMAX
Tjmax
Tstg
V
Maximum Junction Temperature
°C
Storage Temperature Range
-55 to +150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
VSON010X3020
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
274.8
31
39.4
6
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A (Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
Thermal Via(Note 5)
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Pitch
Diameter
4 Layers
1.20 mm
Φ0.30 mm
Top
Copper Pattern
Bottom
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 5) This thermal via connects with the copper pattern of all layers.
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BD91N01NUX
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
VBUS Input Voltage (VB Pin)
VDDIO Input Voltage
VB
4.0
1.7
-30
5.0
3.3
5.5
5.5
V
V
VDDIO
Topr
Operating Temperature
+25
+85
°C
Electrical Characteristics
(Unless otherwise specified VB = 5.0 V, VDDIO = 3.3 V, Ta = 25 °C)
Parameter
Symbol
Min
Typ
Max
Unit
Condition
ICC
VDDIO ICC
VB ICC
IDDIO
IB
-
-
-
15
-
μA
μA
-
-
125
VBUS Voltage Detection (VB)
VBUS Detection Voltage
VUVREL
VUVDET
VOVDET
-
-
-
3.67
-
V
V
V
UVLO release
UVLO detect
VBUS UVLO Voltage
2.95
6.0
VBUS Over Voltage Detection
6.7
7.0
-
CC Pin Detection (CC1, CC2)
Power Source Attached Detection
Voltage Range
VRPDET
VCDEF
VC15
0.25
0.25
0.70
-
-
-
2.18
0.61
1.16
V
V
V
-
-
-
-
Type-C Current @USB Default
Detection Voltage Range
Type-C Current @1.5 A
Detection Voltage Range
Type-C Current @3.0 A
Detection Voltage Range
CC Pin Resistance Rd
SWDRV Characteristic
H Level Output Voltage
L Level Output Voltage
VC30
RD
1.31
4.59
-
2.04
5.61
V
5.10
kΩ
IL = 0.2 mA
VOHSW
VOLSW
4.75
-
-
-
-
V
V
IL = +1 mA
IL = -1 mA
0.12
I/O Characteristic (SWMONI, ORIENT, TCC1, TCC0)
H Level Output Voltage
L Level Output Voltage
VOH
VOL
2.805
-
-
-
-
V
V
IL = +100 μA
IL = -100 μA
0.3
TCC Detection Removal Pulse
Width
tF
100
-
500
μs
-
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Typical Performance Curves
50
Ta = 25 °C
3
2
1
0
40
30
20
10
0
1
2
3
4
5
6
0.0
0.5
1.0
1.5
2.0
2.5
VDDIO Voltage [V]
CC Voltage [V]
Figure 1. Supply Current vs VDDIO Voltage
Figure 2. TCC Detection Results vs CC Voltage
(TCC Detection Results:
0: Non-Connection, 1: Default, 2: 1.5 A, 3: 3.0 A)
7
6
5
4
3
Ta = 25 °C
0.2
0.6
1.0
1.4
1.8
2.2
2.6
3.0
CC Voltage [V]
Figure 3. RD Resistance vs CC Voltage
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Timing Chart
Plug Attached
CC1
CC2
VBUS
5 V
3.67 V
0 V
3.3 V
VDDIO
t1
ORIENT
TCC[1:0]
SWDRV
SWMONI
VSRC
“L”
“L”
USB Type-C Current
00 b
“OFF”
“L”
“OFF”
“ON”
“H”
t2
5 V
0 V
Figure 4. Plug Attached Timing Chart
Parameter
Symbol
Min
Typ
Max
12
Unit
ms
Detection Data Invalid Time
SWDRV Turn on Time
t1
t2
-
-
-
-
10
ms
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Timing Chart – continued
Plug Detached
CC1
CC2
5 V
3.1 V
VBUS
VDDIO
3.3 V
ORIENT
TCC[1:0]
SWDRV
SWMONI
VSRC
“L”
“L”
00 b
“OFF”
“ON”
“H”
“L”
5 V
Figure 5. Plug Detached Timing Chart
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Timing Chart – continued
Plug Attached
CC1
CC2
6.7 V
5 V
VBUS
0 V
t3
3.3 V
VDDIO
ORIENT
TCC[1:0]
SWDRV
SWMONI
VSRC
“L”
USB Type-C Current
00 b
“OFF”
“L”
00 b
“OFF”
“OFF”
“OFF”
“ON”
“H”
“ON”
“H”
“L”
“L”
5 V
0 V
Figure 6. VBUS Over Voltage Detection Timing Chart
Parameter
Auto Recovery Pulse Width(Note 6)
Symbol
t3
Min
-
Typ
-
Max
10
Unit
μs
(Note 6) When VBUS Over Voltage Detection period is shorter than this, the Pch-MOSFET switch is turned on again.
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Timing Chart – continued
Plug Attached
CC1
CC2
5 V
VBUS
0 V
0 V
3.3 V
VDDIO
ORIENT
TCC[1:0]
SWDRV
SWMONI
VSRC
0.9 V
“L”
USB Type-C Current
00 b
“OFF”
“L”
“OFF”
tF
“ON”
“H”
5 V
0 V
Figure 7. I/O Output Timing Chart
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Application Example
VBUS
VSRC
C3
C4
Q1
C1
VB
SWDRV
VDDIO
IO Power
USB
Type-C
C2
CC1
CC2
CC1
CC2
SWMONI
ORIENT
TCC0
Receptacle
BD91N01NUX
HOST I/F
TCC1
GND
GND
GND
Selection of Components Externally Connected
(Q1)
Use Pch-MOSFET having tolerance voltage between the source gate more than the expected maximum abnormal VBUS voltage.
Connect the source pin to the USB Type-C receptacle VBUS side so that VBUS current does not pass through the parasitic diode.
When backflow by parasitic diode from the VSRC side to VBUS is an issue, use two Q1 in a reverse direction each other.
VBUS current of up to 3 A passes through Q1. Therefore, use Pch-MOSFET of the low “ON-Resistance” (RON).
(C1, C2)
Some sort of noise can occur and be a problem if the wiring between VBUS and the VB pin and between IO Power and the
VDDIO pin become long. In this case, connect a power supply by-pass capacitor which has appropriate value of C1 and C2
against to the noise.
(C3)
If the IC is connected to a Power Adapter corresponds to the USB Type-C Power Delivery (USBPD), capacitance of the sink port
until connection complete (PD contract) is limited to 10 μF or less in the USBPD Adaptor stipulation. Therefore, be careful about
the sum total of C1 and C3 value.
(C4)
If the IC is connected to a Power Adapter corresponds to the USB Type-C Power Delivery (USBPD), capacitance of the sink port
until connection complete (PD contract) is limited to 100 μF or less in the USBPD Adaptor stipulation. Therefore, be careful about
the sum total of C1, C3 and C4 value.
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I/O Equivalence Circuits
Pin No.
Pin Name
Equivalent Circuit Diagram
VB
SWDRV
1
2
VB
SWDRV
GND GND GND
CC1
CC2
3
4
5
CC1
CC2
GND
GND
GND
VDDIO
TCC1
TCC0
ORIENT
SWMONI
6
7
8
9
10
TCC1
TCC0
ORIENT
SWMONI
VDDIO
GND GND
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the
electrical characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions
during transport and storage.
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Operational Notes – continued
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result
in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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Ordering Information
B D 9 1 N 0 1 N
U X -
E 2
Part Number
Package
NUX: VSON010X3020
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
VSON010X3020 (TOP VIEW)
Part Number Marking
LOT Number
B D 9 1
N 0 1 1
Pin 1 Mark
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© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0232AH500730-1-2
07.Jun.2019 Rev.001
16/18
BD91N01NUX
Physical Dimension and Packing Information
Package Name
VSON010X3020
www.rohm.com
© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0232AH500730-1-2
07.Jun.2019 Rev.001
17/18
BD91N01NUX
Revision History
Date
Revision
001
Changes
07.Jun.2019
New Release
www.rohm.com
TSZ02201-0232AH500730-1-2
07.Jun.2019 Rev.001
© 2019 ROHM Co., Ltd. All rights reserved.
18/18
TSZ22111 • 15 • 001
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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