BM6109FV-C [ROHM]
内置绝缘电压2500Vrms、输入输出延迟时间700ns、最小输入脉冲宽度600ns的绝缘元件的栅极驱动器。内置故障信号输出功能、低电压时误动作防止功能(UVLO)、短路保护功能(SCP)、过电流保护功能(OCP)、过热保护功能(OT)、米勒钳位功能、温度监测功能。此产品不在网络代理商出售。请联系我们的销售人员进行咨询。;
| 型号： | BM6109FV-C |
| 厂家： | 
ROHM |
| 描述： | 内置绝缘电压2500Vrms、输入输出延迟时间700ns、最小输入脉冲宽度600ns的绝缘元件的栅极驱动器。内置故障信号输出功能、低电压时误动作防止功能(UVLO)、短路保护功能(SCP)、过电流保护功能(OCP)、过热保护功能(OT)、米勒钳位功能、温度监测功能。此产品不在网络代理商出售。请联系我们的销售人员进行咨询。 栅极驱动 脉冲 过电流保护 驱动器 |
| 文件： | 总43页 (文件大小：1668K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Gate Driver Providing Galvanic Isolation Series
1ch Gate Driver Providing Galvanic Isolation
2500 Vrms Isolation Voltage
BM6109FV-C
General Description
Key Specifications
BM6109FV-C is a gate driver with an isolation voltage of
2500 Vrms. It has an I/O delay time of 700 ns, minimum
input pulse width of 600 ns, and incorporates the fault
signal output function, under voltage lockout (UVLO)
function, Short circuit protection (SCP) function,
overcurrent protection (OCP) function, overheat
protection function, active miller clamping function and
temperature monitoring function.
Isolation Voltage:
Maximum Gate Drive Voltage:
I/O Delay Time:
2500 Vrms
18 V
700 ns(Max)
600 ns
Minimum Input Pulse Width:
Package
SSOP-B28W
W(Typ) x D(Typ) x H(Max)
9.2 mm x 10.4 mm x 2.4 mm
Features
AEC-Q100 Qualified(Note 1)
Fault Signal Output Function
Under Voltage Lockout Protection Function
Short Circuit Protection Function
Overcurrent Protection Function
Overheat Protection Function
Soft Turn Off Function
(Adjustable Turn OFF Time)
Active Miller Clamping
Temperature Monitor
(Note 1) Grade1
Applications
Automotive Inverter
Automotive DC-DC Converter
Industrial Inverter System
UPS System
Typical Application Circuit
GND1
GND2
PROOUT
OUT1L
NC
OSC
SYNC
RT
OSC
S
R
Q
PRE
DRI
VER
LOGIC
DUTY
GEN
TOUT
FLT2
NC
OUT1H
VCC2
OUT2
VREG
SCPIN2
SCPIN1
TC
LOGIC
＋
－
UVLO
＋
－
FLT1
INA
VREG
＋
－
Q
S
R
＋
－
ECU
EDGE
＋
－
INB
VCC1
SSDIN
FLTRLS
GND1
UVLO
＋
－
CURRENT
SOURCE
TO2
＋
－
＋
－
＋
－
FLT
TO1
HIGH
SELECT
＋
－
GND2
Pin 1
OSC
Figure 1. Basic Application Circuit
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays
.
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Contents
General Description......................................................................................................................................................................1
Features.........................................................................................................................................................................................1
Applications ..................................................................................................................................................................................1
Key Specifications........................................................................................................................................................................1
Package .........................................................................................................................................................................................1
Typical Application Circuit...........................................................................................................................................................1
Contents ........................................................................................................................................................................................2
Pin Configurations........................................................................................................................................................................3
Pin Description .............................................................................................................................................................................3
Description of Recommended Range Of External Constants...................................................................................................4
Absolute Maximum Ratings.........................................................................................................................................................4
Thermal Resistance(Note 5) .............................................................................................................................................................5
Recommended Operating Condition ..........................................................................................................................................5
Insulation Related Characteristics..............................................................................................................................................5
Electrical Characteristics.............................................................................................................................................................6
Typical Performance Curves........................................................................................................................................................9
Description of Pins and Cautions on Layout of Board............................................................................................................25
Description of Functions and Examples of Constant Setting.................................................................................................27
1.
2.
3.
4.
5.
6.
7.
8.
Fault Status Output.........................................................................................................................................................27
Under Voltage Lockout (UVLO) ......................................................................................................................................27
Short Circuit Protection (SCP) Function .........................................................................................................................28
Overcurrent Protection (OCP) Function..........................................................................................................................29
Miller Clamp Function.....................................................................................................................................................30
Temperature Monitor Function........................................................................................................................................31
Overheat Protection (OT) Function.................................................................................................................................31
Operation Truth Table.....................................................................................................................................................32
I/O Equivalence Circuits.............................................................................................................................................................33
Operational Notes.......................................................................................................................................................................36
Ordering Information..................................................................................................................................................................38
Marking Diagram.........................................................................................................................................................................38
Physical Dimension and Packing Information .........................................................................................................................39
Revision History .........................................................................................................................................................................40
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Pin Configurations
(TOP VIEW)
GND2
TO1
1
2
3
4
5
6
7
8
9
28 GND1
27 FLTRLS
26 SSDIN
25 VCC1
24 INB
TO2
TC
SCPIN1
SCPIN2
VREG
OUT2
VCC2
23 INA
22 FLT1
21 NC
20 FLT2
19 TOUT
18 RT
OUT1H 10
NC 11
OUT1L 12
PROOUT 13
GND2 14
17 SYNC
16 OSC
15 GND1
Figure2. Pin Configurations
Pin Description
Pin No.
Pin Name
Function
1
GND2
TO1
Secondary side ground pin
2
Constant current output / Sensor voltage input pin 1
Constant current output / Sensor voltage input pin 2
Constant current setting resistor connection pin
Short circuit and overcurrent detection pin 1
Short circuit and overcurrent detection pin 2
Secondary side internal power supply pin
Miller Clamp Control pin
3
TO2
4
TC
5
SCPIN1
SCPIN2
VREG
OUT2
VCC2
OUT1H
NC
6
7
8
9
Secondary side power supply
Source side output / Gate voltage input pin
No connection
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
OUT1L
PROOUT
GND2
GND1
OSC
Sink side output pin
Soft shutdown output pin
Secondary side ground pin
Primary side ground pin
Output pin for oscillation frequency
External clock input pin
SYNC
RT
Oscillation frequency setup resistor connection pin
Temperature information output pin
Fault signal output pin
TOUT
FLT2
NC
No connection
FLT1
Fault signal output pin
INA
Control input pin
INB
Control input pin
VCC1
SSDIN
FLTRLS
GND1
Primary side power supply pin
Soft shutdown control input pin
Fault output holding time setup pin
Primary side ground pin
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Description of Recommended Range Of External Constants
Recommended Value
Pin Name
Symbol
Unit
Min
Typ
Max
TC
RTC
RTC
0.5
-
25
kΩ
(As Temperature monitor)
TC
0.1
1
10
MΩ
(No Temperature monitor)
RT
RRT
40.2
-
100
0.01
200
-
402
1.50
1000
-
kΩ
μF
kΩ
μF
μF
μF
FLTRLS
FLTRLS
VCC1
CFLTRLS
RFLTRLS
CVCC1
CVCC2
CVREG
50
0.2
0.4
0.1
VCC2
-
-
VREG
1
10
CVCC1 : Power supply for driving the internal transformer
CVCC2 : Power supply for driving MOS FET/IGBT gate
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Primary Side Supply Voltage
VCC1
VCC2
VIN
-0.3 to +7.0 (Note 2)
-0.3 to +20.0 (Note 3)
-0.3 to VCC1+0.3 or 7.0 (Note 2)
V
V
Secondary Side Supply Voltage
Input Voltage for INA, INB, SSDIN and SYNC Pins
Input Voltage for SCPIN1 and SCPIN2 Pins
Input Voltage for TO1 and TO2 Pins
Input Voltage for FLT Pin
V
VSCPIN
VTO
-0.3 to +6.0 (Note 3)
-0.3 to VCC2+0.3 (Note 3)
-0.3 to +7.0 (Note 2)
V
V
V
VFLT
IFLT
Output Current for FLT Pin
10
10
mA
mA
mA
A
Output Current for TOUT Pin
ITOUT
Output Current for OSC Pin
IOSC
10
Output Current for OUT1H Pin (Peak10 μs)
Output Current for OUT1L Pin (Peak10 μs)
Output Current for PROOUT Pin (Peak10 μs)
Output Current for OUT2 Pin (Peak10 μs)
Output Current for VREG Pin
IOUT1HPEAK
IOUT1LPEAK
IPROOUTPEAK
ISOUTPEAK
IVREG
5 (Note 4)
5 (Note 4)
5 (Note 4)
5 (Note 4)
10
A
A
A
mA
C
C
Storage Temperature Range
Tstg
-55 to +150
+150
Maximum Junction Temperature
Tjmax
(Note 2) Relative to GND1
(Note 3) Relative to GND2
(Note 4) On the supposition that requirements for Tj=150C are satisfied
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
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BM6109FV-C
Thermal Resistance(Note 5)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 7)
2s2p(Note 8)
SSOP-B28W
Junction to Ambient
Junction to Top Characterization Parameter(Note 6)
θJA
112.9
34
64.4
23
°C/W
°C/W
ΨJT
(Note 5) Based on JESD51-2A(Still-Air).
(Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 7) Using a PCB board based on JESD51-3.
(Note 8) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
Recommended Operating Condition
Parameter
Symbol
Min
Typ
Max Unit
VCC1 Supply Voltage (Note 9)
VCC2 Supply Voltage (Note 10)
TO1 and TO2 Input Voltage (Note 10)
SYNC Input Frequency
VCC1
VCC2
VTO
4.5
14
1.4
5
5.0
16
-
5.5
18
V
V
3.5
V
fSYNC
Topr
20
-
50
kHz
C
Operating Temperature
-40
+125
(Note 9) Relative to GND1
(Note 10) Relative to GND2
Insulation Related Characteristics
Parameter
Symbol
RS
Characteristic
>109
Unit
Ω
Insulation Resistance (VIO=500 V)
Insulation Withstand Voltage / 1 min
Insulation Test Voltage / 1 s
VISO
2500
Vrms
Vrms
VISO
3000
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BM6109FV-C
Electrical Characteristics
(Unless otherwise specified Ta=-40 °C to 125 °C, VCC1=4.5 V to 5.5 V, VCC2=14 V to 18 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
General
Primary Side Circuit Current 1
Primary Side Circuit Current 2
Primary Side Circuit Current 3
Primary Side Circuit Current 4
Secondary Side Circuit Current
VREG Output Voltage
ICC11
ICC12
ICC13
ICC14
ICC2
2.1
2.1
2.2
2.3
1.6
4.8
4.8
4.8
4.9
5.0
3.2
5.0
10.1
10.1
10.3
10.4
4.8
mA
mA
mA
mA
mA
V
OUT=L
OUT=H
INA=10 kHz, Duty=50 %
INA=20 kHz, Duty=50 %
RTC=4.7 kΩ
5.2
VREG
Logic Input
0.7 x
VCC1
Logic High Level Input Voltage
Logic Low Level Input Voltage
VINH
VINL
-
-
VCC1
V
V
INA, INB, SSDIN, SYNC
INA, INB, SSDIN, SYNC
0.3 x
VCC1
1000
0
Logic Pull Down Resistance
Logic Pull Up Resistance
Logic Input Filter Time
RIND
RINU
250
250
5
500
500
35
kΩ
kΩ
ns
ns
ns
ns
INA, SSDIN, SYNC
INB
1000
65
tINFIL
INA, INB, SSDIN
INA, INB
70
70
50
130
130
80
190
190
110
Minimum Input Pulse Width(High pulse)
Minimum Input Pulse Width(Low pulse)
Minimum Input Pulse Width (SSDIN)
Output
tINMINH
tINMINL
tSSDINMIN
INA, INB
SSDIN
Turn ON Time
tPON
tPOFF
110
110
-110
50
50
-
220
220
0
440
440
ns
ns
ns
ns
ns
Ω
Turn OFF Time
Propagation Distortion
tPDIST
+110
190
OUT1H-OUT1L Deadtime H
OUT1H-OUT1L Deadtime L
OUT1H ON Resistance
OUT1L ON Resistance
tHLOFFH
tHLOFFL
RON1H
RON1L
120
120
0.45
0.45
For output L to H
For output H to L
IOUT1H=-100 mA
IOUT1L=100 mA
190
1.00
1.00
-
Ω
Design guarantee,
VCC2=16 V
Design guarantee,
VCC2=16 V
OUT1H Maximum Current
OUT1L Maximum Current
IOUTHMAX1
IOUTLMAX1
4.5
4.5
-
-
-
-
A
A
Soft Shutdown Output Delay Time
PROOUT ON Resistance
OUT2 ON Threshold
tSSD
RONPRO
VOUT2ON
tOUT2
100
150
0.9
3.0
-
200
2.0
3.3
100
4.5
5.5
ns
Ω
-
IPROOUT=100 mA
2.7
V
OUT2 Delay Time
-
-
-
ns
Ω
OUT2 ON Resistance (Source side)
OUT2 ON Resistance (Sink side)
RON2H
RON2L
2.0
2.6
IOUT2=-100 mA
IOUT2=100 mA
Ω
VREG
0.45
-
VREG
0.2
-
OUT2 H Voltage
VOUT2H
CM
VREG
-
V
IOUT2=-100 mA
Common Mode Transient Immunity
100
-
kV/μs Design guarantee
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BM6109FV-C
Electrical Characteristics-continued
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Temperature Monitor
TC Output Voltage
VTC
ITO
0.916
194
0.940
200
0.964
206
V
TOx Constant Current
μA
TOx=TO1, TO2, RTC=4.7 kΩ
TO1=TO2=1.40 V (Duty=10.00 %),
SYNC=20 kHz
TOUT Duty Accuracy 1
TOUT Duty Accuracy 2
TOUT Duty Accuracy 3
TOUT Duty Accuracy 4
DTOUT1
DTOUT2
DTOUT3
DTOUT4
-2.35
-2.85
-3.58
-4.27
0.00
0.00
0.00
0.00
+2.35
+2.85
+3.58
+4.27
%
%
%
%
TO1=TO2=1.95 V (Duty=30.95 %),
SYNC=20 kHz
TO1=TO2=2.75 V (Duty=61.43 %),
SYNC=20 kHz
TO1=TO2=3.50 V (Duty=90.00 %),
SYNC=20 kHz
High Selector Accuracy
VHS
fTRI
-7
8
0
+7
14
mV
Design guarantee
Design guarantee
Internal Triangular Wave Frequency
10
kHz
Design guarantee fSYNC=20
kHz
TOUT Delay Time
tTOUT
RONTH
RONTL
-
-
-
-
15
ms
Ω
TOUT ON Resistance (Source side)
TOUT ON Resistance
(Sink side)
60
60
160
160
ITOUT=-1 mA
Ω
ITOUT=1 mA
TOx Disconnected Detection Voltage
OSC Oscillation Frequency
VTOH
fOSC
7
8
20.0
60
60
20
-
9
V
kHz
Ω
TOx=TO1, TO2
RRT=100 kΩ
IOSC=-1 mA
17.5
22.5
160
160
-
OSC ON Resistance (Source side)
OSC ON Resistance (Sink side)
External Synchronization Frequency
External Synchronization Delay Time
RONOSCH
RONOSCL
fSYNC
-
-
Ω
IOSC=1 mA
-
kHz
ns
SYNC=20 kHz
tSYNC
60
350
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BM6109FV-C
Electrical Characteristics-continued
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Protective Function
Primary Side UVLO OFF Voltage
Primary Side UVLO ON Voltage
Primary Side UVLO Hysteresis
4.05
3.95
0.05
4.25
4.15
0.1
4.45
4.35
0.15
V
V
V
VUV1H
VUV1L
VHYSUV1
Primary Side UVLO Delay Time
(OUT1H, OUT1L)
Primary Side UVLO Delay Time
(FLT1, FLT2)
tUV1OUT
tUV1FLT
2
2
10
10
30
30
μs
μs
Secondary Side UVLO OFF Voltage
Secondary Side UVLO ON Voltage
Secondary Side UVLO Hysteresis
11.9
11.4
0.25
12.5
12.0
0.50
13.1
12.6
0.75
V
V
V
VUV2H
VUV2L
VHYSUV2
Secondary Side UVLO Delay Time
(OUT1H, OUT1L)
tUV2OUT
2
10
30
μs
Secondary Side UVLO Delay Time
(FLT1, FLT2)
tUV2FLT
VSCDET
tSCOUT
3
-
65
0.660
500
μs
V
Short Circuit Detection Voltage
Short Circuit Detection Delay Time
(OUT1H, OUT1L)
0.540
160
0.600
330
ns
Short Circuit Detection Delay Time
(FLT1, FLT2)
Overcurrent Detection Voltage
tSCFLT
VOCDET
tOCOUT
1
0.282
7
-
35
0.318
13
μs
V
0.300
10
Overcurrent Detection Delay Time
(OUT1H, OUT1L)
μs
Overcurrent Detection Delay Time
(FLT1, FLT2)
tOCFLT
VTO
8
-
48
μs
V
Overheat Detection Voltage
Overheat Detection Delay Time
(OUT1H, OUT1L)
1.25
160
1.32
330
1.39
500
tTOOUT
ns
Overheat Detection Delay Time
(FLT1, FLT2)
tTOFLT
1
-
35
μs
FLT ON Resistance
RONFLT
tRLS
-
3.7
-
10
Ω
IFLT =10 mA
Fault Release Delay Time
100
330
μs
0.64 x VCC1
-0.1
0.64 x VCC1
+0.1
FLTRLS Threshold
VFLTRLS
0.64 x VCC1
V
FLTRLS Discharge Switch ON
Resistance
RONFLTRLS
ILFLTRLS
-
3.7
0
10
+1
Ω
IFLTRLS =10 mA
FLTRLS Leak Current
-1
μA
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BM6109FV-C
Typical Performance Curves
(Reference data)
10.1
9.1
8.1
7.1
10.1
9.1
8.1
7.1
6.1
5.1
4.1
3.1
2.1
Ta=-40 °C
Ta=+25 °C
Ta=+125 °C
6.1
5.1
4.1
3.1
2.1
VCC1=5.5 V
VCC1=5.0 V
VCC1=4.5 V
4.5
4.8
5.0
5.3
5.5
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Primary Side Supply Voltage : VCC1 [V]
Figure 3. Primary Side Circuit current 1 vs Primary Side
Figure 4. Primary Side Circuit Current 1 vs Temperature
(OUT=L)
Supply Voltage
(OUT=L)
10.1
10.1
9.1
8.1
7.1
6.1
5.1
4.1
3.1
2.1
9.1
8.1
7.1
6.1
5.1
4.1
3.1
2.1
Ta=-40 °C
Ta=+25 °C
Ta=+125 °C
VCC1=5.5 V
VCC1=5.0 V
VCC1=4.5 V
4.5
4.8
5.0
5.3
5.5
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Primary Side Supply Voltage : VCC1 [V]
Figure 5. Primary Side Circuit Current 2 vs Primary Side
Figure 6. Primary Side Circuit Current 2 vs Temperature
(OUT=H)
Supply Voltage
(OUT=H)
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BM6109FV-C
Typical Performance Curves - continued
(Reference data)
10.3
9.5
8.7
7.9
7.1
6.3
5.4
4.6
3.8
3.0
2.2
10.3
9.5
8.7
7.9
7.1
6.3
5.4
4.6
3.8
3.0
2.2
Ta=-40 °C
Ta=+25 °C
Ta=+125 °C
VCC1=5.0 V
VCC1=5.5 V
VCC1=4.5 V
4.5
4.8
5.0
5.3
5.5
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Primary Side Supply Voltage : VCC1 [V]
Figure 8. Primary Side Circuit Current 3 vs Temperature
(INA=10 kHz, Duty=50 %)
Figure 7. Primary Side Circuit Current 3 vs Primary Side
Supply Voltage
(INA=10 kHz, Duty=50 %)
10.4
9.6
8.8
8.0
7.2
6.4
5.5
4.7
3.9
3.1
2.3
10.4
9.6
8.8
8.0
7.2
6.4
5.5
4.7
3.9
3.1
2.3
Ta=-40 °C
Ta=+25 °C
Ta=+125 °C
VCC1=5.5 V
VCC1=5.0 V
VCC1=4.5 V
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
4.5
4.8
5.0
5.3
5.5
Primary Side Supply Voltage : VCC1 [V]
Figure 9. Primary Side Circuit Current 4 vs Primary Side Figure 10. Primary Side Circuit Current 4 vs Temperature
(INA=20 kHz, Duty=50 %)
Supply Voltage
(INA=20 kHz, Duty=50 %)
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TSZ22111 • 15 • 001
BM6109FV-C
Typical Performance Curves - continued
(Reference data)
4.8
4.4
4.0
3.6
4.8
4.4
4.0
3.6
3.2
2.8
2.4
2.0
1.6
VCC2=16 V
Ta=+25 °C
Ta=+125 °C
VCC2=18 V
3.2
2.8
2.4
2.0
1.6
VCC2=14 V
Ta=-40 °C
14.0
15.0
16.0
17.0
18.0
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Secondary Side Supply Voltage : VCC2 [V]
Figure 11. Secondary Side Circuit Current vs Secondary
Side Supply Voltage
Figure 12. Secondary Side Circuit Current vs Temperature
5.20
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
5.15
5.10
5.05
5.00
4.95
4.90
4.85
4.80
Ta=-40 °C
Ta=+25 °C
Ta=+125 °C
Ta=-40 °C
Ta=+25 °C
Ta=+125 °C
H Level
L Level
Ta=-40 °C
Ta=+25 °C
Ta=+125 °C
4.5
4.7
4.9
5.1
5.3
5.5
14.0
15.0
16.0
17.0
18.0
Secondary Side Supply Voltage : VCC2 [V]
Primary Side Supply Voltage : VCC1 [V]
Figure 13. VREG Output Voltage vs Secondary Side
Supply Voltage
Figure 14. Logic H/L Level Input Voltage vs Primary Side
Supply Voltage
(INA, INB, SSDIN, SYNC)
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BM6109FV-C
Typical Performance Curves - continued
(Reference data)
1000
850
700
550
400
250
1000
850
VCC1=4.5 V
VCC1=5.0 V
VCC1=5.5 V
700
VCC1=4.5 V
VCC1=5.0 V
VCC1=5.5 V
550
400
250
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Figure 15. Logic Pull Down Resistance vs Temperature
(INA, SSDIN, SYNC)
Figure 16. Logic Pull Up Resistance vs Temperature
(INB)
65
55
45
35
25
15
5
190
170
150
130
110
90
VCC1=4.5 V
VCC1=5.0 V
VCC1=5.5 V
VCC1=4.5 V
VCC1=5.0 V
VCC1=5.5 V
70
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Figure 17. Logic Input Filter Time vs Temperature
(INA, INB, SSDIN)
Figure 18. Minimum Input Pulse Width H vs Temperature
(INA, INB)
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BM6109FV-C
Typical Performance Curves - continued
(Reference data)
110
100
90
190
VCC1=4.5 V
VCC1=5.0 V
VCC1=5.5 V
170
150
130
110
90
VCC1=4.5 V
VCC1=5.0 V
VCC1=5.5 V
80
70
60
50
70
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Figure 19. Minimum Input Pulse Width L vs Temperature
(INA, INB)
Figure 20. Minimum Input Pulse Width vs Temperature
(SSDIN)
440
410
380
350
320
290
260
230
200
170
140
110
440
410
380
350
320
290
260
230
200
170
140
110
VCC2=14 V
VCC2=16 V
VCC2=18 V
VCC2=14 V
VCC2=16 V
VCC2=18 V
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
-40 -25 -10 5 20 35 50 65 80 95 110125
Temperature : Ta [°C]
Figure 21. Turn ON Time vs Temperature
Figure 22. Turn OFF Time vs Temperature
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TSZ22111 • 15 • 001
BM6109FV-C
Typical Performance Curves - continued
(Reference data)
190
170
150
130
110
90
190
VCC2=14 V
VCC2=16 V
VCC2=18 V
170
150
130
110
90
VCC2=14 V
VCC2=16 V
VCC2=18 V
70
70
-40 -25 -10 5 20 35 50 65 80 95 110125
Temperature : Ta [°C]
-40 -25 -10 5 20 35 50 65 80 95 110125
Temperature : Ta [°C]
Figure 23. OUT1H-OUT1L Deadtime H
vs Temperature (Output L to H)
Figure 24. OUT1H-OUT1L Deadtime L
vs Temperature (Output H to L)
1.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
VCC2=14 V
VCC2=16 V
VCC2=18 V
VCC2=14 V
VCC2=16 V
VCC2=18 V
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature : Ta [°C]
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Figure 25. OUT1H ON Resistance vs Temperature
Figure 26. OUT1L ON Resistance vs Temperature
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TSZ22111 • 15 • 001
BM6109FV-C
Typical Performance Curves - continued
(Reference data)
200
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
190
VCC2=14 V
VCC2=16 V
VCC2=18 V
180
170
160
150
140
130
120
110
100
VCC2=14 V
VCC2=16 V
VCC2=18 V
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Figure 27. Soft Shutdown Output Delay Time
vs Temperature
Figure 28. PROOUT ON Resistance
vs Temperature
3.3
3.2
3.1
3.0
2.9
2.8
2.7
100
VCC2=14 V
VCC2=16 V
VCC2=18 V
90
80
70
60
50
40
30
20
10
VCC2=14 V
VCC2=16 V
VCC2=18 V
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Figure 29. OUT2 ON Threshold vs Temperature
Temperature : Ta [°C]
Figure 30. OUT2 Delay Time vs Temperature
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25.Oct.2018 Rev.001
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BM6109FV-C
Typical Performance Curves - continued
(Reference data)
4.5
4.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.5
VCC2=14 V
VCC2=16 V
VCC2=18 V
VCC2=14 V
VCC2=16 V
VCC2=18 V
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Figure 31. OUT2 ON Resistance vs Temperature
(Source)
Figure 32. OUT2 ON Resistance vs Temperature
(Sink)
5.00
4.95
4.90
4.85
4.80
4.75
4.70
4.65
4.60
4.55
0.964
0.958
0.952
0.946
0.940
0.934
0.928
0.922
0.916
VCC2=14 V
VCC2=16 V
VCC2=18 V
VCC2=14 V
VCC2=16 V
VCC2=18 V
-40 -25 -10 5 20 35 50 65 80 95 110125
Temperature : Ta [°C]
-40 -25 -10 5 20 35 50 65 80 95 110125
Temperature : Ta [°C]
Figure 33. OUT2 H Voltage vs Temperature
Figure 34. TC Output Voltage vs Temperature
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BM6109FV-C
Typical Performance Curves - continued
(Reference data)
100
90
80
70
60
50
40
30
20
10
0
206
VCC2=14 V
VCC2=16 V
VCC2=18 V
204
202
200
198
196
194
Ta=-40 °C
Ta=+25 °C
Ta=+125 °C
1.40 1.70 2.00 2.30 2.60 2.90 3.20 3.50
TO1, TO2 Input Voltage : VTO [V]
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Figure 35. TO1, TO2 Constant Current vs Temperature
Figure 36. TOUT Duty Accuracy vs TO1, TO2 Input Voltage
14.0
7.0
6.0
5.0
Ta=-40 °C
Ta=+25 °C
Ta=+125 °C
13.0
12.0
11.0
10.0
9.0
4.0
3.0
VCC2=14 V
VCC2=16 V
VCC2=18 V
2.0
1.0
0.0
-1.0
-2.0
-3.0
-4.0
-5.0
-6.0
-7.0
8.0
1.40 1.70 2.00 2.30 2.60 2.90 3.20 3.50
TO1, TO2 Input Voltage : VTO [V]
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Figure 37. High Selector Accuracy vs TO1, TO2 Input Voltage
Figure 38. Internal Triangular Wave Frequency
vs Temperature
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TSZ22111 • 15 • 001
BM6109FV-C
Typical Performance Curves - continued
(Reference data)
160
140
120
100
80
160
140
120
VCC2=14 V
VCC2=16 V
VCC2=18 V
VCC2=14 V
VCC2=16 V
VCC2=18 V
100
80
60
40
20
0
60
40
20
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 39. TOUT ON Resistance vs Temperature
(Source)
Figure 40. TOUT ON Resistance vs Temperature
(Sink)
9.0
8.8
8.6
8.4
8.2
8.0
7.8
7.6
7.4
7.2
7.0
22.5
22.0
21.5
21.0
20.5
20.0
19.5
19.0
18.5
18.0
17.5
VCC2=14 V
VCC2=16 V
VCC2=18 V
VCC2=14 V
VCC2=16 V
VCC2=18 V
-40 -25 -10 5 20 35 50 65 80 95 110125
Temperature : Ta [°C]
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Figure 41. TO1, TO2 Disconnected Detection Voltage
vs Temperature
Figure 42. OSC Oscillation Frequency vs Temperature
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TSZ22111 • 15 • 001
BM6109FV-C
Typical Performance Curves - continued
(Reference data)
160
140
120
100
80
160
140
VCC2=14 V
VCC2=16 V
VCC2=18 V
120
100
VCC2=14 V
VCC2=16 V
VCC2=18 V
80
60
40
20
0
60
40
20
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 43. OSC ON Resistance vs Temperature
(Source)
Figure 44. OSC ON Resistance vs Temperature
(Sink)
350
321
292
263
234
205
176
147
118
89
6.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=+125 °C
Ta=-40 °C
Ta=+25 °C
Max
Min
60
-40 -25 -10 5 20 35 50 65 80 95 110125
Temperature : Ta [°C]
4.00 4.05 4.10 4.15 4.20 4.25 4.30 4.35 4.40
Primary Side Supply Voltage : VCC1 [V]
Figure 45. External Synchronization Delay Time
vs Temperature
Figure 46. FLT Voltage vs Primary Side Supply Voltage
(Primary Side UVLO ON/OFF Voltage)
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BM6109FV-C
Typical Performance Curves - continued
(Reference data)
30.0
26.0
22.0
18.0
14.0
10.0
6.0
30.0
26.0
22.0
18.0
VCC2=14 V
VCC2=16 V
VCC2=18 V
VCC2=14 V
VCC2=16 V
VCC2=18 V
14.0
10.0
6.0
2.0
2.0
-40 -25 -10 5 20 35 50 65 80 95 110125
Temperature : Ta [°C]
-40-25-10 5 20 35 50 65 80 95110125
Temperature : Ta [°C]
Figure 47. Primary Side UVLO Delay Time vs Temperature
(OUT1H, OUT1L)
Figure 48. Primary Side UVLO Delay Time vs Temperature
(FLT1, FLT2)
6.0
5.0
30.0
26.0
Ta=+125 °C
4.0
22.0
VCC2=14 V
VCC2=16 V
VCC2=18 V
18.0
Ta=-40 °C
3.0
14.0
10.0
6.0
Ta=+25 °C
2.0
1.0
0.0
2.0
11.2 11.4 11.6 11.8 12.0 12.2 12.4 12.6 12.8 13.0
Secondary Side Supply Voltage : VCC2 [V]
-40 -25 -10 5 20 35 50 65 80 95 110125
Temperature : Ta [°C]
Figure 49. FLT Voltage vs Secondary Side Supply Voltage Figure 50. Secondary Side UVLO Delay Time vs Temperature
(Secondary Side UVLO ON/OFF Voltage)
(OUT1H, OUT1L)
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TSZ22111 • 15 • 001
BM6109FV-C
Typical Performance Curves - continued
(Reference data)
0.66
0.64
0.62
0.60
0.58
0.56
0.54
65
59
53
46
VCC2=14 V
VCC2=16 V
VCC2=18 V
Max
40
34
28
22
Min
15
9
3
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature : Ta [°C]
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Figure 52. Short Circuit Detection Voltage vs Temperature
Figure 51. Secondary Side UVLO Delay Time vs Temperature
(FLT1, FLT2)
500.0
35.0
VCC2=14 V
VCC2=16 V
VCC2=18 V
31.6
28.2
24.8
21.4
18.0
14.6
11.2
7.8
VCC2=14 V
VCC2=16 V
VCC2=18 V
457.5
415.0
372.5
330.0
287.5
245.0
202.5
160.0
Max
Min
4.4
1.0
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature : Ta [°C]
-40 -25 -10 5 20 35 50 65 80 95 110125
Temperature : Ta [°C]
Figure 53. Short Circuit Detection Delay Time vs Temperature
(OUT1H, OUT1L)
Figure 54. Short Circuit Detection Delay Time vs Temperature
(FLT1, FLT2)
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TSZ22111 • 15 • 001
BM6109FV-C
Typical Performance Curves - continued
(Reference data)
13.0
12.0
11.0
10.0
9.0
0.318
0.314
VCC2=14 V
VCC2=16 V
VCC2=18 V
VCC2=14 V
VCC2=16 V
VCC2=18 V
0.310
0.306
0.302
0.298
0.294
0.290
0.286
0.282
8.0
7.0
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature : Ta [°C]
-40 -25 -10 5 20 35 50 65 80 95 110125
Temperature : Ta [°C]
Figure 56. Overcurrent Detection Delay Time vs Temperature
(OUT1H, OUT1L)
Figure 55. Overcurrent Detection Voltage vs Temperature
48.0
44.0
40.0
1.39
1.37
1.35
VCC2=14 V
VCC2=16 V
VCC2=18 V
Max
36.0
32.0
28.0
24.0
1.33
VCC2=14 V
VCC2=16 V
VCC2=18 V
1.31
Min
20.0
1.29
1.27
16.0
12.0
8.0
1.25
-40 -25 -10 5 20 35 50 65 80 95 110125
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 57. Overcurrent Detection Delay Time vs Temperature
(FLT1, FLT2)
Figure 58. Overheat Detection Voltage vs Temperature
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TSZ22111 • 15 • 001
BM6109FV-C
Typical Performance Curves - continued
(Reference data)
35.0
30.0
25.0
20.0
15.0
10.0
5.0
500.0
VCC2=14 V
VCC2=16 V
VCC2=18 V
457.5
VCC2=14 V
VCC2=16 V
VCC2=18 V
Max
415.0
372.5
330.0
287.5
245.0
202.5
160.0
Min
0.0
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature : Ta [°C]
-40 -25 -10 5 20 35 50 65 80 95 110125
Temperature : Ta [°C]
Figure 60. Overheat Detection Delay Time vs Temperature
(FLT1, FLT2)
Figure 59. Overheat Detection Delay Time vs Temperature
(OUT1H, OUT1L)
330
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
304
VCC2=14 V
VCC2=16 V
VCC2=18 V
279
253
228
202
177
151
126
100
Output Side
Input Side
VCC2=14 V
VCC2=16 V
VCC2=18 V
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Figure 61. FLT ON Resistance vs Temperature
Figure 62. Fault Release Delay Time vs Temperature
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BM6109FV-C
Typical Performance Curves - continued
(Reference data)
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
3.30
3.28
3.26
VCC2=14 V
VCC2=16 V
VCC2=18 V
3.24
VCC2=14 V
VCC2=16 V
VCC2=18 V
3.22
3.20
3.18
3.16
3.14
3.12
3.10
-40 -25 -10 5 20 35 50 65 80 95 110125
Temperature : Ta [°C]
-40 -25 -10 5 20 35 50 65 80 95 110125
Temperature : Ta [°C]
Figure 63. FLTRLS Threshold vs Temperature
Figure 64. FLTRLS Discharge Switch ON Resistance vs
Temperature
1.0
0.8
0.6
VCC2=14 V
VCC2=16 V
VCC2=18 V
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta [°C]
Figure 65. FLTRLS Leak Current vs Temperature
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TSZ22111 • 15 • 001
BM6109FV-C
Description of Pins and Cautions on Layout of Board
1. VCC1 (Primary side power supply pin)
This is the primary side power supply pin. Connect a bypass capacitor between the VCC1 and the GND1 pins in order to
suppress voltage variations by the driving current flowing in the IC’s internal transformer.
2. GND1 (Primary side ground pin)
This is the primary side ground pin.
3. VCC2 (Secondary side power supply pin)
This is the secondary side power supply pin. Connect a bypass capacitor between the VCC2 and the GND2 pins in order to
suppress voltage variations by the driving current and output current flowing in the IC’s internal transformer.
4. GND2 (Secondary side ground pin)
This is the secondary side ground pin. Connect the output device’s emitter/source to this pin.
5. VREG (Secondary side internal power supply pin)
This is the secondary side internal power supply pin. Connect a bypass capacitor between the VREG and the GND2 pins in
order to prevent oscillation.
6. INA, INB and SSDIN (Control input pins and soft shutdown control input pin)
These are pins for determining the output logic. For SSDIN=H, OUT1L will be turned on after the miller clamp function is
activated.
SSDIN
INB
L
INA
L
OUT1H
OFF
ON
OUT1L
ON
PROOUT
OFF
L
L
L
L
H
L
H
OFF
ON
OFF
H
L
OFF
OFF
OFF
OFF
H
H
ON
OFF
X
X
OFF
ON
X: Don't care
7. OUT1H and OUT1L (Source side output / Gate voltage input pin and sink side output pin)
These are gate driving pins. For output logic, see the truth table for IN and SSDIN pins shown in item 6 above. The OUT1H
pin is used also as a gate voltage input pin for the miller clamp function.
8. OUT2 (Control pin for Miller clamp)
This is the miller clamp pin for controlling Nch MOSFET to prevent the gate voltage from rising due to the miller current
flowing in the output element that is connected to the OUT1H and OUT1L pins. The OUT2 pin should be open when the
miller clamp function is not used.
9. PROOUT (Soft shutdown output pin)
This pin is used for operation of soft shutdown of the output element during short circuit protection, overcurrent protection or
overheat protection.
10. SCPIN1 and SCPIN2 (Short circuit and overcurrent detection pins)
These pins are current detection pins for short circuit and overcurrent protections. If the SCPIN1 or SCPIN2 pin voltage of
VSCDET or more lasts tSCOUT or more, the short circuit protection function is activated. If the SCPIN1 or SCPIN2 pin voltage of
VOCDET or more lasts tOCOUT or more, the overcircuit protection function is activated. In the open state, the IC may possibly
malfunction. To avoid this risk, if the SCPIN1 pin or the SCPIN2 pin is not used, keep it connected to the GND2 pin.
11. FLT1 and FLT2 (Fault signal output pin)
These pins are used for outputting fault signals. In the event of a fault (leading to the operation of the protection against low
primary/secondary voltage (UVLO), short circuit protection (SCP), overcurrent protection (OCP) or overheat protection (OT)),
the Nch MOS FET inserted between FLT1 and FLT2 pins will be turned OFF.
State
FLT
ON
Normal
Fault
OFF
(primary side UVLO, secondary side UVLO, SCP, OCP or OT)
12. FLTRLS (Fault output holding time setup pin)
This pin is used for specifying the holding time of a fault signal. Connect a capacitor between GND1 pin. Connect resistor
between the VCC1 pin.
A fault signal is retained until the FLTRLS pins voltage reaches VFLTRLS or higher. If set the holding time to 0 ms, do not insert
a capacitor. When it shorts to the VCC1 pin, large current flows into the FLTRLS pin and could lead to malfunction in the
open state. To avoid this risk, please insert a resistor between the VCC1 pin.
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Description of Pins and Cautions on Layout of Board-continued
13. TC (Constant current setting resistor connection pin)
The TC pin has a resistor connection for setting the constant current output. By inserting arbitrary resistance between the
TC and the GND2 pins, the current from the TO1 pin and the TO2 pin are set to a constant value.
14. TO1 and TO2 (Constant current output / Sensor voltage input pin)
These are constant current output / voltage input pins. Insert impedance between the TO1 and the GND2 pins, and between
the TO2 and the GND2 pins. They can be used as a sensor input. Furthermore, the TO1 pin and TO2 pin disconnect detection
function is built-in.
15. TOUT (Temperature information output pin)
This is a pin which outputs the voltage either TO1 or TO2, whichever is lower, converted to Duty cycle, in phase with the
clock signal input to the SYNC pin.
16. SYNC (External clock input pin)
This is an input pin for external clock signal. It can be connected also to the OSC pin. It contains a filter that is effective for
removing noise that could lead to erroneous operation.
17. OSC (Output pin for oscillation frequency)
This is an output pin for clock signals. Oscillation frequency is calculated by substituting the value of the resistance connected
to the RT pin to the following equation.
fOSC [kHz] = 2000 / RRT [kΩ]
18. RT (Oscillation frequency setup resistor connection pin)
This pin is used for connecting a resistor that determines the oscillation frequency of the clock signal output from the OSC
pin. Regardless of clock signal being used or not, insert a resistance between the RT and the GND1 pins.
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Description of Functions and Examples of Constant Setting
1. Fault Status Output
When a fault occurs (the primary side or secondary side under voltage lockout function (UVLO), short circuit protection (SCP),
overcurrent protection (OCP) or overheat protection (OT) occurs), the Nch MOS FET between the FLT1 and FLT2 pins are
turned OFF whereby a fault signal output. The signal retains until the elapse of fault output holding time tFLTRLS is cleared.
The fault output holding time is determined by the following equation that consists of the capacitor CFLTRLS and resistor RFLTRLS
connected to the FLTRSL pin, and the fault release delay time tRLS
.
tFLTRLS=CFLTRLS x RFLTRLS + tRLS
State
Fault
Nch MOS FET between
the FLT1 and FLT2 pins
State
OFF
Nch MOS FET
between the FLT1
and FLT2
Normal
Fault
ON
ON
H
OFF
OUT1H
OUT1L
Hi-Z
Hi-Z
L
Fault Output Holding Time (tFLTRLS)
Figure 66. Fault Output Timing Chart
2. Under Voltage Lockout (UVLO)
Function both the primary side power supply (VCC1) and secondary side power supply (VCC2) have an under voltage
lockout (UVLO) function. When the power supply voltage drops to the UVLO ON voltage, the OUT1H and OUT1L pins are
turned OFF and ON respectively, and the interconnection between the FLT1 and FLT2 pins are turned OFF. When the power
supply voltage rises to the UVLO OFF voltage, these pins will revert. However, during the fault output holding time as
specified by item 1 above, the OUT1H and OUT1L pins remain OFF and ON respectively, and the interconnection between
FLT1 and FLT2 pins remain OFF. During the operation of the under voltage lockout (UVLO) function, the miller clamp function
as described by item 5 below remains effective. In addition, to remove noise that could lead to malfunction, both the primary
side and secondary side power supplies have a filter.
H
IN
L
VUV1H
VUV1L
VCC1
FLT1-FLT2
OUT1H
OFF
Fault output holding
time
Fault output holding
time
ON
ON
OFF
OFF
OUT1L
OUT1H voltage
OUT2
ON
VOUT2ON
H
L
H
TOUT
L
(Note 11) Delay time is omitted for the purpose of readily understandable presentation
Figure 67. Primary Side UVLO Operation Timing Chart
H
L
IN
VUV2H
VUV2L
VCC2
FLT1-FLT2
OUT1H
OFF
Fault output holding
time
Fault output holding
time
ON
ON
OFF
OFF
OUT1L
OUT1H voltage
OUT2
ON
VOUT2ON
H
L
H
TOUT
L
(Note 12) Delay time is omitted for the purpose of readily understandable presentation
Figure 68. Secondary Side UVLO Operation Timing Chart
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Description of Functions and Examples of Constant Setting - continued
3. Short Circuit Protection (SCP) Function
When the SCPIN1 pin or the SCPIN2 pin voltage continues to exceed VSCDET for tSCOUT or more, the short circuit protection
function is activated. Once the function is activated, both the OUT1H and the OUT1L pins turn OFF, the PROOUT pin turns
ON, and the interconnection between the FLT1 and the FLT2 pins turn off. After the elapse of a specified fault output holding
time since the voltage of both the SCPIN1 and the SCPIN2 pins decreases to VOCDET or below, the short circuit protection is
deactivated. However, if the INA pin = L when the function is deactivated, the PROOUT pin will remain ON until the INA pin
changes to H. Even if the short circuit protection function is active, the miller clamp function as described by the item 5 below
is kept available.
H
INA
L
VSCDET
SCPINx
OUT1H
VOCDET
tSCOUT
tSCOUT
ON
OFF
OFF
OUT1L
ON
OFF
PROOUT
ON
H
L
OUT2
FLT1-FLT2
OFF
tSCFLT
tSCFLT
ON
tOUT2
tOUT2
OUT1H voltage
VOUT2ON
Fault Output Holding Time
Fault Output Holding Time
SCPINx : SCPIN1 or SCPIN2
Figure 69. SCP Operation Timing Chart
Start
OUT1L=ON, OUT2=ON
No
No
VSCPINx>VSCDET
Yes
No
tFLTRLS elapse?
Yes
tSCOUT elapse?
Yes
OUT1H=OFF, OUT1L=OFF,
PROOUT=ON, FLT1-FLT2=OFF
FLT1-FLT2=ON
No
No
No
VSCPINx<VOCDET
Yes
INA=H, SSDIN=L
Yes
OUT1H=ON, OUT1L=OFF,
OUT2=OFF, PROOUT=OFF
VOUT1H<VOUT2ON
Yes
SCPINx : SCPIN1 or SCPIN2
Figure 70. SCP Operation Flowchart
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Description of Functions and Examples of Constant Setting - continued
4. Overcurrent Protection (OCP) Function
If the SCPIN1 pin or the SCPIN2 pin voltage over VOCDET lasts for tOCOUT or more, the overcurrent protection function is
activated. Once the function is activated, both the OUT1H and the OUT1L pins turn off, the PROOUT pin turn on, and the
interconnection between the FLT1 and the FLT2 pins turn off. After the elapse of a specified fault output holding time since
the voltage of both the SCPIN1 and the SCPIN2 pins decreases to VOCDET or below, the overcurrent protection is deactivated.
However, if the INA pin = L when the function is deactivated, the PROOUT pin will remain ON until the INA pin changes to
H. Even if the overcurrent protection is active, the miller clamp function as described by the item 5 below is kept available.
H
L
INA
SCPINx
OUT1H
VOCDET
ON
OFF
OFF
tOCOUT
tOCOUT
OUT1L
ON
OFF
PROOUT
ON
H
L
OUT2
FLT1-FLT2
OFF
tOCFLT
tOCFLT
ON
tOUT2
tOUT2
OUT1Hvoltage
VOUT2ON
Fault Output Holding Time
Fault Output Holding Time
SCPINx : SCPIN1 or SCPIN2
Figure 71. OCP Operation Timing Chart
Start
OUT1L=ON, OUT2=ON
No
No
VSCPINx>VOCDET
Yes
No
tFLTRLS elapse?
Yes
tOCOUT elapse?
Yes
OUT1H=OFF, OUT1L=OFF,
PROOUT=ON, FLT1-FLT2=OFF
FLT1-FLT2=ON
No
No
No
VSCPINx<VOCDET
Yes
INA=H, SSDIN=L
Yes
OUT1H=ON, OUT1L=OFF,
OUT2=OFF, PROOUT=OFF
VOUT1H<VOUT2ON
Yes
SCPINx : SCPIN1 or SCPIN2
Figure 72. OCP Operation Flowchart
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Description of Functions and Examples of Constant Setting - continued
5. Miller Clamp Function
When the OUT1H pin=OFF and the OUT1H pin voltage < VOUT2ON, the OUT2 pin outputs H and miller clamp function is
activated. After miller clamp function is activated, the OUT2 pin=H remains until the OUT1H pin=ON occurs. With the SSDIN
pin=H, even while a fault protection (the primary side or secondary side under voltage lockout function (UVLO), short circuit
protection (SCP), overcurrent protection (OCP) or overheat protection (OT) is active), the miller clamp function is kept
available.
State
IN
H
L
OUT1H voltage
X
OUT2
L
L
Normal
VOUT2ON or larger
Smaller than VOUT2ON
VOUT2ON or larger
Smaller than VOUT2ON
VOUT2ON or larger
Smaller than VOUT2ON
L
H
L
X
X
X
X
SSDIN=H
Fault
H
L
H
X: Don't care
H
L
IN
H
SSDIN
L
ON
OUT1H
OFF
OFF
OUT1L
ON
OUT1H voltage
VOUT2ON
H
OUT2
L
OFF
PROOUT
ON
(Note 13) Delay time is omitted for understandable presentation
Figure 73. Miller Camp Function Operation Timing Chart
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Description of Functions and Examples of Constant Setting - continued
6. Temperature Monitor Function
This IC has a built-in constant current circuit in which a constant current is supplied from TO1 and TO2 pins. This current
value can be adjusted in accordance to the resistance value connected between the TC pin and the GND2 pin. Furthermore,
TO1 and TO2 pins have voltage input function, and outputs the TO1 pin or the TO2 pin voltage which is smaller, as converted
to Duty, from the TOUT pin. The Duty ranging between 10% and 90% is output in phase with the clock signal input to the
SYNC pin. The IC has a built-in clock signal generator that uses the OSC pin to output the clock signal. Oscillation frequency
can be adjusted by using the resistance between RT pin and GND1 pin. To make the clock signal generator available,
connect between OSC pin and SYNC pin. However, even if the generator is not used, connect a resistor between RT pin
and GND1 pin to prevent erroneous operation.
When the primary side or secondary side under voltage lockout function (UVLO) is active, or either of the TO1 pin or the
TO2 pin measures a voltage over the “not connected” detection voltage VTOH, the TOUT pin outputs L. Therefore, if using
one the TO1 pin or the TO2 pin only, connect a resistor between the other pin and the GND2 pin to keep the voltage VTOH or
less.
푉푇퐶
Constant current value =
푅푇퐶
VTOH
3.5 V
TO1 or TO2 pin
input voltage
TO2 or TO1 pin
input voltage
1.4 V
a%
a%
a%
a%
a%
Internal Duty
SYNC
90%
a%
10%
10%
10%
90%
TOUT(Note 14)
(Note 14) Delay time is omitted for a readily understandable presentation
Figure 74. Temperature Monitor Timing Chart
7. Overheat Protection (OT) Function
If the TO1 pin or the TO2 pin voltage below VTO lasts for tTOOUT or more, the overheat protection function is activated. Once
the function is activated, both OUT1H and OUT1L pins turn off, the PROOUT pin will turns on, and the interconnection
between FLT1 and FLT2 pins turn off. After the elapse of the specified fault output holding time since the voltage of both TO1
and TO2 pins increases to VTO or above, the overheat protection is deactivated. However, if the INA pin = L when the function
is deactivated, the PROOUT pin will remain ON until the INA pin changes to H. Even if the overheat protection is active, the
miller clamp function as described by the item 5 above is kept available.
H
IN
L
VTO
ON
TO1 or TO2
OUT1H
OUT1L
OFF
OFF
ON
OFF
Fault holding time
Fault holding time
FLT1-FLT2
ON
VOUT2ON
H
OUT1H voltage
OUT2
L
OFF
PROOUT
ON
(Note 15) Delay time is omitted for the purpose of readily understandable presentation
Figure 75. Overheat protection timing chart
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Description of Functions and Examples of Constant Setting - continued
8. Operation Truth Table
Input
Output
SCPIN1 TO1
or or
SCPIN2 TO2
State
VCC1
VCC2
1
2
UVLO
X
X
X
X
X
X
X
X
X
X
L
X
X
X
X
L
X
X
X
X
H
H
H
H
X
X
X
X
X
X
L
X
X
X
X
L
H
L
OFF ON OFF
OFF ON OFF
OFF ON OFF
OFF ON OFF
OFF OFF ON
L
H
L
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
VCC1 UVLO
VCC2 UVLO
UVLO
X
X
3
X
X
○
○
○
○
○
○
○
○
○
○
○
○
○
UVLO
X
H
L
4
UVLO
X
H
L
5
○
○
○
○
○
○
○
○
○
○
○
○
○
OCP
H
L
Overcurrent
protection
6
OCP
L
L
OFF ON
OFF OFF ON
OFF ON ON
OFF OFF ON
OFF ON ON
OFF OFF ON
OFF ON ON
ON
H
L
7
SCP
L
L
H
L
Short circuit
protection
8
SCP
L
L
L
H
L
9
X
X
X
X
H
H
L
X
X
H
H
L
H
L
Overheat
protection
10
11
12
13
14
15
16
17
L
L
H
L
L
H
H
H
H
H
H
H
H
L
External SSD
L
H
L
ON
L
H
L
OFF ON OFF
OFF ON OFF
OFF ON OFF
OFF ON OFF
ON OFF OFF
ON
L
L
H
L
ON
Normal operation
L
L
H
L
ON
L
L
L
L
H
L
ON
L
L
H
L
X
ON
○ : VCC1, VCC2 > UVLO, X: Don't care
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I/O Equivalence Circuits
Pin Name
Pin No.
Input Output Equivalent Circuit Diagram
Pin Function
TO1
VCC2
VREG
2
Constant current output
/ Sensor voltage input pin 1
TO1
TO2
TO2
3
4
Constant current output
/ Sensor voltage input pin 2
TC
TC
Constant current setting resistor
connection pin
GND2
SCPIN1
Internal
power
supply
VCC2
5
6
Short circuit and overcurrent detection
pin 1
SCPIN1
SCPIN2
SCPIN2
Short circuit and overcurrent detection
pin 2
GND2
VCC2
VREG
Internal power
supply
VREG
7
Secondary side internal power supply
pin
GND2
VCC2
OUT2
VREG
8
OUT2
GND2
Miller Clamp Control pin
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I/O Equivalence Circuits - continued
Pin Name
Pin No.
Input Output Equivalent Circuit Diagram
VCC2
Pin Function
OUT1H
10
Source side output
/ Gate voltage input pin
OUT1H
OUT1L
OUT1L
12
Sink side output pin
GND2
VCC2
PROOUT
13
PROOUT
Soft shutdown output pin
GND2
VCC1
OSC
16
OSC
Output pin for oscillation frequency
GND2
VCC1
SYNC
17
SYNC
External clock input pin
GND1
VCC1
RT
18
RT
Oscillation frequency setup resistor
connection pin
GND1
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I/O Equivalence Circuits - continued
Pin Name
Pin Function
Pin No.
Input Output Equivalent Circuit Diagram
VREG1
TOUT
19
TOUT
Temperature information output pin
GND2
FLT2
FLT2
20
Fault signal output pin
FLT1
FLT1
22
Fault signal output pin
GND1
VCC1
INA
23
INA
Control input pin
GND1
VCC1
INB
24
INB
Control input pin
GND1
VCC1
SSDIN
26
SSDIN
Soft shutdown control input pin
GND1
VCC1
FLTRLS
27
FLTRLS
GND1
Fault output holding time setup pin
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BM6109FV-C
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
10. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 76. Example of IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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Ordering Information
B M 6 1 0 9 F V
-
CE 2
part Number
Package
FV: SSOP-B28W
Product class
C : for Automotive applications
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SSOP-B28W(TOP VIEW)
Part Number Marking
B M 6 1 0 9
LOT Number
Pin 1 Mark
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TSZ02201-0818ACH00020-1-2
25.Oct.2018 Rev.001
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TSZ22111 • 15 • 001
BM6109FV-C
Physical Dimension and Packing Information
Package Name
SSOP-B28W
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0818ACH00020-1-2
25.Oct.2018 Rev.001
39/40
BM6109FV-C
Revision History
Date
Revision
001
Changes
25.Oct.2018
New Release
www.rohm.com
TSZ02201-0818ACH00020-1-2
25.Oct.2018 Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111 • 15 • 001
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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