BU1511KV2 [ROHM]

Silicon monolithic integrated circuit; 硅单片集成电路


型号：	BU1511KV2
厂家：	ROHM
描述：	Silicon monolithic integrated circuit 硅单片集成电路微控制器和处理器外围集成电路 uCs集成电路 uPs集成电路
文件：	总5页 (文件大小：155K)
中文：	中文翻译
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1/4

Structure

Product Name

Type

Silicon monolithic integrated circuit

System LSI for Event data recorder

BU1511KV2

Function

BU1511KV2 is a system LSI for event data recorder that makes developing it easier

BU1511KV2 have built-in specific hardware to communicate and control with a 3-axis

accelerometer and a camera module, SD card, etc. that are recommended for event data

recorder.

The specific hardware are controllerable by built-in ARM946E-S, which can execute various

applications.

The following function blocks are built-in.

･ARM946E-S

･External Memory Interface

･Interrupt Controller

･Timer/Timer Counter

･GPIO(16ch, PWM 4ch(shared), IRQ 4ch(shared)) ･UART(2ch)

･SD Card Interface/SD Card Controller

･SSI(Synchronous Serial Interface)

･Watch Dog Timer

･I2C Master Controller

･Camera Interface (up to 2M pixels)

･JPEG Codec

･ADPCM Audio Codec with IIS Interface

･TV Encoder(within 75Ω driver)

･Clock Controller/PLL

･A/D Converter(4ch)

○

Absolute maximum ratings

Parameter

Symbol

DAVDD

Rating

Unit

Parameter

Symbol

VIN1

VIN2

VIN3

VIN4

VIN5

VIN6

Tstg

Rating

Unit

Power supply voltage 1 (DAC)

Power supply voltage 2 (ADC)

Power supply voltage 3 (I2C-1)

Power supply voltage 4 (I2C-2)

Power supply voltage 5 (SD-CARD)

Power supply voltage 6(CAMERA)

Power supply voltage 7(Other IO)

-0.3～+4.2

Input voltage（ADC）

Input voltage（I2C-1）

Input voltage（I2C-2）

Input voltage（SD-CARD）

Input voltage（CAMERA）

Input voltage（Other IO）

Storage temperature range

Power dissipation

-0.3～ADVDD+0.3

-0.3～I1VDD+0.3

-0.3～I2VDD+0.3

-0.3～SDVDD+0.3

-0.3～CAVDD+0.3

-0.3～IOVDD+0.3

-40～+150

ADVDD -0.3～+4.2

I1VDD

I2VDD

-0.3～+4.2

SDVDD -0.3～+4.2

CAVDD

IOVDD

-0.3～+4.2

-0.3～+2.1

ºC

Power supply voltage 8(Digital CORE) DVDD

1200*1, 1700*2

*1 IC only. In the case of exceeding 25C, 12.0 mW should be reduced at the rating 1C.

*2 When packaging a glass epoxy board of 270x70x1.6mm. If exceeding 25ºC, 17mW should be reduced at the rating 1ºC.

Has not been designed to withstand radiation.

Because this product is specifically designed for a particular device or unit, check in advance if the device or unit is a strategic material stated in the Foreign

Exchange law.

Be careful of handling this document because contents of this document may fall under the service (technology in the design, the manufacture and the use)

defined in the Foreign Exchange and Foreign Trade Control law of Japan.

REV.C

2/4

○ Recommended operating conditions

Parameter

Power supply voltage 1

(DAC)

Power supply voltage 2

(ADC)

Power supply voltage 3

(I2C-1)

Power supply voltage 4

(I2C-2)

Power supply voltage 5

(SD-CARD)

Power supply voltage 6

(CAMERA)

Power supply voltage 7

(Other IO)

Symbol

Min

Typ

Max

3.60

Unit

Parameter

Input voltage range

（ADC）

Input voltage range

（I2C-1）

Input voltage range

（I2C-2）

Input voltage range

（SD-CARD）

Input voltage range

（CAMERA）

Input voltage range

（Other IO）

Output "H" Current

Output "L Current

Operating temperature

range

Symbol

VIN1

Min Typ

Max

ADVDD

+0.3

I1VDD

+0.3

I2VDD

+0.3

Unit

DAVDD 3.00

ADVDD 3.00

3.30

-0.3

-13

3.30

2.85

3.30

1.50

3.60

3.30

3.60

1.55

VIN2

VIN3

VIN4

VIN5

VIN6

IOH

I1VDD

I2VDD

2.40

SDI1

VDD+0.3

CAVDD

+0.3

IOVDD

+0.3

SDVDD 2.70

CAVDD 2.30

IOVDD 1.70

ºC

Power supply voltage 8

(Digital CORE)

DVDD

1.45

IOL

Topr

-40

*1 Sum of absolute current of IOs in IOVDD system must be less than 100mA, and every sum of absolute current of IOs in CAVDD,

SDVDD, I1VDD and I2VDD system must be less than 26mA.

* Please supply power source in order of CORE(DVDD) → IO（IOVDD,CAVDD,SDVDD,I1VDD,I2VDD,ADVDD,DAVDD）

* Please keep RESETB terminal is LOW, until power supply is stable.

○ Electric characteristics

(Unless otherwise specified, DVDD=1.50V, DAVDD=ADVDD=I1VDD=I2VDD=SDVDD=IOVDD=3.30V, CAVDD=2.85V,

DAVSS=ADVSS=DVSS=0.0V, Ta=25ºC, fXIN=13.5MHz, fAXIN=16.384MHz, fSYS=41.0MHz(Internal Clock with PLL)

IOPWR is a generic name of I1VDD,I2VDD,SDVDD,CAVDD,IOVDD.)

Specification

Parameter

Symbol

Unit

Conditions

Min

Max

Common

Input frequency 1

fXIN

fAXIN

fSYS

5.0

30.0

32.768

41.0

MHz XIN (Duty 50±10%), When PLL is ON.

MHz AXIN(Duty 50±10%)

Input frequency 2

8.284

Internal clock frequency 1

Internal clock frequency 2

Static consumption current

Logic Block

MHz When PLL is ON, Except I2S Audio Block

MHz I2S Audio Block

ｆAUD

IDDST

32.768

200

μA When all clock stop

Input "H" Leakcurrent

Input "L" Leak current

Input Pull down "H" current 1

Input Pull down "H" current 2

Input Pull down "L" current

Input ”H” voltage 1

IIHL

-10

μA VIH=IOPWR

-10

μA VIL=０V

IIHPD1

IIHPD2

IILPD

VIH1

100

μA Pull down pin, VIH=IOVDD

μA Pull down pin, VIH=CAVDD

μA Pull down pin, VIL=０V

100

-10

IOPWR×0.8

-0.3

IOPWR+0.3

IOPWR×0.2

IOPWR+0.3

IOPWR×0.15

IOPWR

0.4

Normal Input

Input ”L” voltage 1

VIL1

Input ”H” voltage 2

VIH2

IOPWR×0.85

-0.3

Hysteresis input pin

(TIM_TRIG,NTRST,RESETB,BIT_SEL,TCM_SEL,AUTO_READ)

Input ”L” voltage 12

Output ”H” voltage 1

Output ”L” voltage 1

Output ”H” voltage 2

Output ”L” voltage 2

DACBlock

VIL2

VOH1

VOL1

VOH2

VOL2

IOPWR-0.4

0.0

IOH=-2.0mA(DC), Output except SD_CLK, When CAVDD=3.3V

IOL=2.0mA(DC), Output except SD_CLK, When CAVDD=3.3V.

IOH=-4.0mA(DC)、SD_CLK

IOPWR-0.4

0.0

IOPWR

0.4

IOL=4.0mA(DC)、SD_CLK

DAC Bit Width

RES_DA

IDDDA

bits

DAC Operating current

DAC Static consumption current

Integral Non-linearity

Differential Non-linearity

Full scale voltage

mA R_L=37.5Ω、R_IREF=2.4kΩ、DAVDD Pin current

uA R_L=37.5Ω、R_IREF=2.4kΩ、DAVDD Pin current

LSB R_L=37.5Ω、R_IREF=2.4kΩ

IDDSTDA

INL_DA

DNL_DA

VFS_DA

-8.0

-2.0

1.1

+8.0

+2.0

1.4

LSB R_L=37.5Ω、R_IREF=2.4kΩ

R_L=37.5Ω、R_IREF=2.4kΩ

ADCBlock

ADC Bit Width

RES_AD

bits

Input voltage range(Upper Limit) VIN_AD_T ADVDD×0.85 ADVDD×0.95

Input voltage range(Lower Limit) VIN_AD_B ADVDD×0.05 ADVDD×0.15

Integral Non-linearity

INL_AD

DNL_AD

ｆADC

-2.0

4.0

+2.0

16.0

LSB

MHz

Differential Non-linearity

Change Standard clock cycle

Sample per second

Need 130*ADC_CLK for conversion by sweeping

Change cycle

fsps

30.8K

123K

sps

REV. C

3/4

○Pin Function Descriptions

PIN No.

Pin Name

Function

PIN No.

Pin Name

SSI_CSB0

SSI_WPB

SSI_DOUT

SSI_DIN

DVDD

Function

PIN No.

Pin Name

TCM_SEL

AUTO_READ

ADVDD

ADVSS

ADIN3

ADIN2

ADIN1

ADIN0

VOUT

DAVSS

IREF

DAVDD

I1VDD

DVSS

SDC1

SDA1

SDC2

SDA2

I2VDD

CAMCKO

CAVDD

CAMHS

CAMVS

CAMD7

CAMD6

CAMD5

CAMD4

DVDD

CAMD3

CAMD2

CAMD1

CAMD0

CAMCKI

SD_CLK

SD_CMD

SD_DAT3

SD_DAT2

SD_DAT1

SD_DAT0

SDVDD

DVSS

Function

System setting

EXT_ADR20

EXT_ADR19

EXT_ADR18

EXT_ADR17

EXT_ADR16

EXT_ADR15

EXT_ADR14

EXT_ADR13

EXT_ADR12

EXT_ADR11

EXT_ADR10

EXT_ADR9

EXT_ADR8

EXT_ADR7

EXT_ADR6

EXT_ADR5

IOVDD

Serial

100

101

102

103

104

105

106

107

108

109

110

111

112

113

114

115

116

117

118

119

120

121

122

123

124

125

126

127

128

129

130

131

132

133

134

135

136

137

138

139

140

141

142

143

144

TIM_TRIG

GPIO15

GPIO14

GPIO13

GPIO12

GPIO11

GPIO10

GPIO9

GPIO8

GPIO7

GPIO6

GPIO5

GPIO4

IOVDD

DVSS

GPIO3

GPIO2

GPIO1

GPIO0

TX1

RX1

RTS1

CTS1

TX2

Counter trigger

ADC input

External

Bus

Video output (75Ω)

Video output Reference

GPIO

I2C Master

Interface

GPIO/PWM

DVSS

EXT_ADR4

EXT_ADR3

EXT_ADR2

EXT_ADR1

EXT_DATA15

EXT_DATA14

EXT_DATA13

EXT_DATA12

IOVDD

Camera Interface

External

Bus

GPIO/IRQ

Camera Interface

UART1

UART2

DVSS

EXT_DATA11

EXT_DATA10

EXT_DATA9

EXT_DATA8

EXT_DATA7

EXT_DATA6

EXT_DATA5

EXT_DATA4

EXT_DATA3

EXT_DATA2

EXT_DATA1

EXT_DATA0

EXT_CSB2

EXT_CSB1

EXT_CSB0

EXT_WEB

EXT_OEB

RX2

TDI

TDO

TCK

Camera Interface

JTAG

TMS

NTRST

AUDCKI

AUDLRI

AUDDTI

AUDCKO

AUDLRO

AUDDTO

AUDMCKO

IOVDD

DVSS

SD card Interface

I2S input

Interface

External

Bus

I2S output

Interface

AXIN

Clock input

or X'tal

Clock input

or X'tal

AXOUT

IOVDD

XIN

XOUT

DVSS

DVDD

RESETB

TEST

EXT_WPB

SSI_CLK

SSI_CSB1

System setting

Serial

BIT_SEL

EXT_ADR21

External Bus

○ Physical dimensions

○ Block diagram

JTAG

Serial EEPROM/FLASH FLASH,SRAM

Camera Module Amp,MIC

Imaging Bock

画像処理ブロック

IIS IF /

ADPCM

Codec

Camera

I-TCM

64KB

I-Cache

4KB

JPEG

Auto Read

External Memory

Controller

D-Cache

4KB

Codec

ARM946E-S

SPI Controller

BU1511KV2

D-TCM

4KB

AHB

Timer

2ch

WatchDog

timer

AHB/APB

Bridge

Interrupt

I2C

Controller

1PIN mark

Lot No.

Master

Controller

Encoder

APB

Timer

UART

2ch

GPIO 16ch

ADC

4ch

Clock

PLL

(IRQ 4ch

Counter

Controller

/PWM 4ch)

VQFP-T144 (Unit:mm)

Sensor

UART PHY

LED,Buzzer

Sensor

X'tal, Clock Source

I2C Slave

SD Card

TV monitor

REV. C

4/4

○ Cautions on use

(1) Absolute Maximum Ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break

down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode

exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including

the use of fuses, etc.

(2) Recommended Operating conditions

These conditions represent a range within which characteristics can be provided approximately as expected. The electrical

characteristics are guaranteed under the conditions of each parameter.

(3) Reverse connection of power supply connector

The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to

the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.

(4) Power supply line

Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.

In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the

same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the

diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the

GND line, give consideration to design the patterns in a similar manner.

Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the

same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used

present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.

(5) GND voltage

Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore,

check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.

(6) Short circuit between terminals and erroneous mounting

In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break

down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and

the power supply or the GND terminal, the ICs can break down.

(7) Operation in strong electromagnetic field

Be noted that using ICs in the strong electromagnetic field can malfunction them.

(8) Inspection with set PCB

On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore,

be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig

for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of

the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static

electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set

PCB.

(9) Input terminals

In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic

element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal.

Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than

the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when

no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a

voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.

(10) Ground wiring pattern

If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from

the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring

pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention

not to cause fluctuations in the GND wiring pattern of external parts as well.

(11) External capacitor

In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in

the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.

REV. C

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,

fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of

any of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

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R0039

BU1511KV2 [ROHM]

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