BU64240GWZ [ROHM]

Silicon Monolithic Integrated Circuit; 硅单片集成电路


型号：	BU64240GWZ
厂家：	ROHM
描述：	Silicon Monolithic Integrated Circuit 硅单片集成电路
文件：	总6页 (文件大小：140K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

1/5

STRUCTURE

Silicon Monolithic Integrated Circuit

PRODUCT SERIES

Motor Driver for electronic camera module

TYPE

BU64240GWZ

FEATURES

・Linear current sink driver

・10bit resolution current control

・I²C serial Interface

・Integrated current sense resistor

・Intelligent Slew Rate Control(ISRC) for mechanical ringing compensation

Absolute maximum ratings

Parameter

Symbol

VCC

VPS

VIN

Limit

Unit

Power supply voltage

-0.5 to +5.5

-0.5 to 5.5

Power save input voltage

Control input voltage^※

Power dissipation

220^※

°C

Operating temperature range

Junction temperature

Topr

Tjmax

Tstg

-25 to +85

125

Storage temperature range

-55 to +125

+200^※

Output current

Iout

¹VIN is I2C BUS input pin (SCL, SDA).

※

²Reduced by 2.2 mW/°C over 25°C, when mounted on a glass epoxy board (50mm  58mm  1.75mm; 8 layers)

※

³Must not exceed Pd, ASO, or Tjmax of 125°C.

※

Operating Conditions (Ta= -25°C to +85°C)

Parameter

Symbol

VCC

VPS

VIN

Min.

Typ.

Max.

4.8

Unit

Power supply voltage

Power save input voltage

Control input voltage

I²C Bus Frequency

2.3

3.0

4.8

fCLK

Iout

400

130^※

kHz

Output current

⁴Must not exceed Pd, ASO.

※

REV. A

2/5

 Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=3.0V )

Limit

Parameter

Overall

Symbol

Unit

Conditions

Min.

Typ.

Max.

Circuit current

ICCST

ICC

μA

PS=0V

during standby operation

Circuit current

0.6

1.0

PS=3V, SCL=400kHz

Power save input

High level input voltage

Low level input voltage

Low level input current

High level input current

VPSH

VPSL

IPSL

1.26

VCC

0.5

-10

μA

VPS=0V

VPS=3V

IPSH

Control input (VIN=SCL, SDA)

High level input voltage

Low level input voltage

Low level output voltage

High level input current

Low level input current

UVLO

VINH

1.26

VCC

0.5

0.4

VINL

VINOL

IINH

IIN=+3.0mA (SDA)

-10

μA

Input voltage=0.9×VIN

Input voltage=0.1×VIN

IINL

UVLO voltage

VUVLO

1.6

2.2

10bit D/A converter(for setting limit voltage)

Resolution

DRES

DDNL

DINL

Bits

LSB

Differential Nonlinearity

Integral Nonlinearity

-1

-4

Constant-Current Driver block

Output current resolution

Output maximum current

Zero code offset current

Output Voltage

IORES

117

126

130

μA

IOMAX

IOOFS

VOUT

143

DACcode = 3’h3FF

DACcode = 3’h000

Io = 100mA

150

200

VCC

Maximum applied voltage VOMAX

This specification is supposed to be revised for improvement etc.

REV. A

3/5

Package Outline

Pin Arrangement (Top View)

Top View

SCL

SDA

OUT

GND

VCC

Fig.2 BU64240GWZ Pin Arrangement (Top View)

Block Diagram

Side View

0.1～10uF

VCC

Power Save

TSD & UVLO

BandGap

I_SINK

OUT

I2C bus

Interface

SDA

SCL

Pre Driver

Bottom View

slew rate control

V/I

convertor

OSC

10bit DAC

VREF

RNF

=0.5

BandGap

Fig.1 UCSP30L1 Package (Unit: mm)

GND

Fig.3 BU64240GWZ Block Diagram

I2C BUS Format (Fast mode: SCL=400kHz )

Write mode（R/W = 0)

Output from Master

Output from Slave

Update

R/W

PS EN W2 W1 W0

D9 D8

D7 D6 D5 D4 D3 D2 D1 D0 A

Read mode

PS EN W2 W1 W0

※

Update W (register address)

Write

CD9 CD8

CD7 CD6 CD5 CD4 CD3 CD2 CD1 CD0

Read

S : start signal

A : acknowledge

P : stop signal

nA : non acknowledge

※ : Don`t care

name

Setting item

Description

Serial power save

OUT pin status

'0' = Standby mode, '1' = Operating mode

'0' = Hi-impedance, '1' = Constant current sink.

'0' = ISRC Mode Disabled, '1' = ISRC Mode Enabled

‘000’ = Limit Voltage setting, '001' = Operating parameter setting1

‘010’ = Operating parameter setting2, ‘011’ = Operating parameter setting 3

‘100’ = Operating parameter setting4

Mode select signal

W2W1W0

Limit Voltage

Target position DAC code[D9:D0]

Operating parameter1

Operating parameter2

Operating parameter3

Resonance frequency setting[D7:D3], Slew rate speed setting[D1:D0]

VCM un-control current setting1[D9:D0]

D9～D0

VCM un-control current setting2[D9:D0]

Step resolution[D7:D5] ( Minimum step resolution = 1LSB@10bit_DAC)

Step time setting[D4:D0] ( Minimum step time resolution = 50us )

Operating parameter4

REV. A

4/5

Characteristics of the SDA and SCL bus lines for 2-wire serial interface.

(Unless otherwise specified, Ta=-25～+85°C, VCC=2.3～4.8V )

※

STANDARD-MODE

FAST-MODE

Unit

Parameter

Symbol

Min.

-0.5

1.26

Max.

0.5

4.8

Min.

-0.5

1.26

0.15

Max.

0.5

4.8

LOW level input voltage

VIL

VIH

High level input voltage

Hysteresis of Schmitt trigger inputs

Vhys

VOL

LOW level output voltage at 3mA sink current

Pulse width of spikes which must be suppressed by

the input filter

0.4

tSP

Input current each I/O pin with an input voltage

between 0.1V and 0.9VIN_max

-10

100

-10

400

kHz

SCL clock frequency

fSCL

Hold time (repeated) START condition. After this

period, the first clock pulse is generated

LOW period of the SCL clock

tHD;STA

4.0

0.6

tLOW

tHIGH

4.7

4.0

4.7

1.3

0.6

High period of the SCL clock

Set-up time for repeated START condition

Data hold time

tSU;STA

tHD;DAT

tSU;DAT

tSU;STO

tBUF

3.45

0.9

Data set-up time

250

4.0

4.7

100

0.6

1.3

Set-up time for STOP condition

Bus free time between a STOP and START condition

※

STANDARD-MODE and FAST-MODE 2-wire serial interface devices must be able to transmit or receive at that speed.

The maximum bit transfer rates of 100 kbit/s for STANDARD-MODE devices and 400 kbit/s for FAST-MODE devices

This transfer rates is provided the maximum transfer rates, for example it is able to drive 100 kbit/s of clocks with FAST-MODE.

Definition of timing on the 2-wire serial interface

tHIGH

SCL

SDA

tHD : DAT

tSU : DAT

tLOW

tSU : STA

tSU : STO

tHD : STA

tBUF

SDA

STOP BIT

START BIT

Fig.4 Definition of timing for serial data

Fig.5 Definition of timing for START and STOP bit

REV. A

5/5

Operation Notes

(1) Absolute maximum ratings

Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range

(Topr) may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or

open mode) when such damage is suffered. The implementation of a physical safety measure such as a fuse

should be considered when use of the IC in a special mode where the absolute maximum ratings may be

exceeded is anticipated.

(2) Power supply lines

Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the

power supply and ground pins to serve as a route for regenerated current. Determine the capacitance in full

consideration of all the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose

some capacitance at low temperatures. If the connected power supply does not have sufficient current absorption

capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the

product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a

physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins.

(3) Ground potential

Ensure a minimum GND pin potential in all operating conditions.

(4) Setting of heat

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating

conditions.

(5) Actions in strong magnetic field

Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to

malfunction.

(6) ASO

When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or

ASO.

(7) Thermal shutdown circuit

This IC incorporates a TSD (thermal shutdown) circuit (TSD circuit). If the temperature of the chip reaches the

following temperature, the motor coil output will be opened. The thermal shutdown circuit (TSD circuit) is

designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or

guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment

where the operation of this circuit is assumed.

TSD ON temperature [°C]

Hysteresis temperature [°C]

(Typ.)

150

(Typ.)

(8) Ground Wiring Pattern

When using both small signal and large current GND patterns, it is recommended to isolate the two ground

patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance

and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be

careful not to change the GND wiring pattern of any external components, either.

(9) Power Save (PS) terminal

PS holds the reset function on logic concurrently. Please release PS after the start-up of VCC. Reset is not

normally done when VCC is short-circuited to PS and it uses it, and there is a possibility of malfunctions.

This specification is supposed to be revised for improvement etc

REV. A

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-

controller or other safety device). ROHM shall bear no responsibility in any way for use of any

of the Products for the above special purposes. If a Product is intended to be used for any

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More detail product informations and catalogs are available, please contact us.

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http://www.rohm.com/contact/

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R1120

BU64240GWZ [ROHM]

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