BV1HD090FJ-C [ROHM]
BV1HD090FJ-C是车载用1ch高边开关。配备过电流保护功能 (OCP)、过热保护功能 (TSD)、负载开路检测功能(OLD)、低电压时输出OFF功能 (UVLO) ，备有异常检出时诊断输出端子 (ST) 。;
| 型号： | BV1HD090FJ-C |
| 厂家： | 
ROHM |
| 描述： | BV1HD090FJ-C是车载用1ch高边开关。配备过电流保护功能 (OCP)、过热保护功能 (TSD)、负载开路检测功能(OLD)、低电压时输出OFF功能 (UVLO) ，备有异常检出时诊断输出端子 (ST) 。 开关 过电流保护 |
| 文件： | 总23页 (文件大小：1575K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Automotive IPD series
1ch High-side Switch IC
BV1HD090FJ-C
Features
Product Summary
AEC-Q100 qualified (Note 1)
Wide Operating Input Range
4.5V to 36V
90mΩ
Built-in overcurrent limiting circuit (OCP)
Built-in thermal shutdown circuit (TSD)
Built-in open load detection function (at output OFF)
Direct control enabled from CMOS logic IC, etc.
Built-in under voltage lockout function
Built-in Output State Pin
On-state Resistance (Tj=25°C, Typ)
Overcurrent limit (Tj=25°C, Typ)
Active Clamp Energy (Tj=150°C)
5.5A
68mJ
On-Resistance RON=90mΩ(Typ)
Package
W(Typ) x D(Typ) x H(Max)
4.90mm x 6.00mm x 1.65mm
(VBB=14V, Tj=25°C, IOUT=0.5A)
SOP-J8
Monolithic power management IC with the control
block (CMOS) and power MOS FET mounted on a
single chip
Enables operation at low voltage down to 4.2V
(Note 1:Grade1)
General Description
BV1HD090FJ-C is an automotive 1ch high side switch IC,
which has built-in overcurrent limiting circuit(OCP),
thermal shutdown circuit(TSD), open load detection
function (OLD) and under voltage lockout function
(UVLO). It is also equipped with the diagnostic output
when detecting an error (ST).
SOP-J8
Applications
Onboard vehicle device (engine ECU, air conditioner,
body-control etc )
Block Diagram
Fige 1. Block Diagram
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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Pin Configurations
( Top view )
1
IN
ST
8
7
6
5
VBB
VBB
VBB
VBB
2
GND
OUT
3
4
Figure 2. Pin Configurations
Pin Descriptions
Pin No.
Unit
IN
Function
1
Input pin. This input has a pull-down resister.
Self-diagnostic output terminal, which outputs “Low” at overcurrent or
2
ST
overtemperature, and “High” at open load. It has an n-channel open drain circuit
structure.
GND pin
3
4
GND
OUT
VBB
Output terminal, which limits the output current to protect the IC when the load is
short-circuited and current exceeding the overcurrent detection value (2.7A min)
flows to the output terminal.
5, 6, 7, 8
Power Supply Voltage
Definition
IBB
IIN
VDS
VBB
IN
IOUT
VBB
VIN
OUT
IST
ST
VOUT
GND
VST
GND
Figure 3. Voltage/Current Definition
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Absolute Maximum Ratings (Tj = 25°C)
Parameter
Symbol
Rating
Unit
VBB-OUT Voltage
VDS
VBB
VIN
45 (internal limit)
40
V
V
Power Supply Voltage
Input Voltage
-0.3 to +7.0
-0.3 to +7.0
V
Diagnostic Output Voltage
Output Current
VST
IOUT
IST
V
(Note 1)
9.0(Internal limit IOC
10
)
A
Diagnostic Output Current
Junction Temperature Range
Storage Temperature Range
Maximum Junction Temperature
mA
°C
°C
°C
Tj
-40 to +150
-55 to +150
+150
Tstg
Tjmax
Active Clamp Energy (single pulse)
Tj(start)=25°C(Note 2)
EAS(25°C)
242
68
mJ
mJ
Active Clamp Energy (single pulse)
Tj(start)=150°C(Note 2) (Note 3)
EAS(150°C)
(Note 1) Internally limited by the overcurrent limiting circuit. Value is a maximum.
(Note 2) Maximum Active clamp energy, using single non-repetitive pulse of IAR = 1.5A and VBB = 14V.
During demagnetization of inductive loads, energy must be dissipated in the BV1HD090FJ-C.
This energy can be calculated with following equation:
ꢆ
ꢀꢁꢂ = ꢃꢄꢂ ×ꢅ ꢅ× [ꢅ
ꢇꢈ
ꢃ
ꢉꢉ − ꢃꢄꢂ
ꢇꢈ ꢅ× ꢋꢁꢌ
ꢅ× ln ꢊ1 −
ꢍ + ꢋꢁꢌ
]
ꢇꢈ
ꢃꢉꢉ − ꢃꢄꢂ
Following equation simplifies under the assumption of RL=0Ω.
1
2
ꢃꢉꢉ
ꢀꢁꢂ
=
ꢅ× ꢆꢅ ×ꢅꢋꢁꢎꢌ ꢅ× (ꢅ1 −ꢅ
ꢅ)
ꢃꢉꢉ − ꢃꢄꢂ
(Note 3) This active clamp energy is guaranteed by design.
Recommended Operating Conditions (Tj= -40°C to +150°C)
Parameter
Symbol
VBB
Min
4.5
Typ
14
Max
36
Unit
Power Supply Voltage
V
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Thermal Resistance(Note 1)
Parameter
Symbol
Typ
Unit
Condition
SOP-J8
143.7
86.9
67.5
°C / W
°C / W
°C / W
1s(Note 2)
2s(Note 3)
Between Junction and Surroundings Temperature
Thermal Resistance
θJA
2s2p(Note 4)
(Note 1) The thermal impedance is based on JESD51 - 2A (Still - Air) standard. It is used the chip of BV1HD090FJ-C
(Note 2) JESD51 - 3 standard FR4 114.3 mm × 76.2 mm × 1.57 mm 1-layer (1s)
(Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.)
(Note 3) JESD51 -5 standard FR4 114.3 mm × 76.2 mm × 1.60 mm 2-layer (2s)
(Top copper foil: ROHM recommended footprint + wiring to measure /
Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm, 2 oz. copper (top & reverse sidee) )
(Note 4) JESD51 -5 / -7 standard FR4 114.3 mm × 76.2 mm × 1.60 mm 4-layer (2s2p)
(Top copper foil: ROHM recommended footprint + wiring to measure /
2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side / inner layers) 2oz. / 1oz.)
■
PCB Layout 1 Layer (1s)
Footprint Only
Figure 4. PCB Layout 1 Layer (1s)
Dimension
Value
Board Finish Thickness
Board Dimension
1.57 mm ± 10%
76.2 mm x 114.3 mm
FR4
Board Material
Copper Thickness (Top/Bottom Layers)
0.070mm (Cu:2oz)
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■
PCB Layout 2 Layers (2s)
Top Layer
Bottom Layer
Cross Section
Top Layer
Bottom Layer
Figure 5. PCB Layout 2 Layers (2s)
Dimension
Value
1.60 mm ± 10%
76.2 mm x 114.3 mm
FR4
Board Finish Thickness
Board Dimension
Board Material
Copper Thickness (Top/Bottom Layers)
0.070mm (Cu + Plating)
■
PCB Layout 4 Layers(2s2p)
Top Layer
2nd Layer
3rd Layer
Bottom Layer
Cross Section
Top Layer
2nd/3rd/Bottom Layers
Figure 6. PCB Layout 4 Layers (2s2p)
Dimension
Value
1.60 mm ± 10%
76.2 mm x 114.3 mm
FR4
Board Finish Thickness
Board Dimension
Board Material
Copper Thickness (Top/Bottom Layers)
Copper Thickness (Inner Layers)
0.070mm (Cu + Plating)
0.035mm
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■
Thermal Resistance (Single Pulse)
Figure 7. Thermal Resistance
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Electrical Characteristics
(Unless otherwise specified Tj = -40 °C to +150 °C, VBB = 4.5V to 36V)
Unit
Conditions
Parameter
Symbol
Min
Typ
Max
Power Supply
VBB=14V, VIN=0V, VOUT=0V,
Tj=25°C
IBBS1
-
-
200
250
330
500
µA
µA
Standby Current
VBB=14V, VIN=0V, VOUT=0V,
Tj=150°C
IBBS2
Bias Current
IBB
-
-
-
3.0
3.6
0.2
6.0
4.2
-
mA
V
VBB=14V, VIN=5V, VOUT=open
Under Voltage Lockout Threshold
Under Voltage Hysteresis Threshold
Input
VUVLO
VUVHYS
V
High-Level Input Voltage
Low-Level Input Voltage
Input Hysteresis
VINH
VINL
2.8
-
-
-
V
V
-
-
1.5
-
VINHYS
IINH
0.4
50
-
V
High-Level Input Current
Low-Level Input Current
Power MOS
-
150
+10
μA
μA
VIN=5V
VIN=0V
IINL
-10
RON1
RON2
RON3
-
-
-
90
160
-
120
215
500
mΩ
mΩ
mΩ
VBB=8V to 36V, Tj=25°C
VBB=8V to 36V, Tj=150°C
VBB=4.2V
On-State Resistance
VBB=14V, VIN=0V, VOUT=0V,
Tj=25°C
-
130
160
-90
200
μA
μA
μA
μA
IOUTL1
IOUTL2
IOUTH3
IOUTH4
VBB=14V, VIN=0V, VOUT=0V,
Tj=150°C
-
250
Leak Current
Slew Rate
VBB=14V, VIN=0V, VOUT=VBB
Tj=25°C
,
-160
-400
-
-
VBB=14V, VIN=0V, VOUT=VBB
Tj=150°C
,
-110
SRON
SROFF
tOUTON
tOUTOFF
VDS
0.23
0.53
-
0.70
1.60
30
-
-
V/μs
V/μs
μs
VBB=14V, RL=10Ω, Tj=25°C
VBB=14V, RL=10Ω, Tj=25°C
VBB=14V, RL=10Ω, Tj=25°C
VBB=14V, RL=10Ω, Tj=25°C
VIN=0V, IOUT=-10mA
Propagation Delay at ON
Propagation Delay at OFF
Output Clamp Voltage
Output States
90
60
56.5
-
20
μs
45
50
V
VBB=6V to 36V,
VIN=0V, IST=-0.6mA
ST ON Voltage
VSTL
ISTH
-
-10
-
-
-
0.3
-
V
ST Leak Current
μA
μs
VIN=5V, VST=5V
Diagnostic Output Delay Time at Input
ON
tSTON
11
33
VBB=14V, RL=10Ω, Tj=25°C
Diagnostic Output Delay Time at Input
OFF
tSTOFF
-
30
90
μs
VBB=14V, RL=10Ω, Tj=25°C
Protection Circuit
Overcurrent Detection Current
Overcurrent Detection OFF Time
Overcurrent Detection ON Duty
Open Load Detection Resistance (Note1)
Open Load Detection Voltage (Note1)
TSD Detection Temperature(Note2)
TSD Hysteresis(Note2)
IOC
tOCOFF
DOC
2.7
5.5
550
-
9.0
1100
30
A
μs
%
-
-
ROLD
VOLD
6
-
36
kΩ
V
VIN=0V
VIN=0V
1.5
175
-
-
2.5
205
-
TTSD
190
15
°C
°C
TTSDHYS
(Note1) The detectable power voltage range for open load is VBB ≥ 6V.
(Note2) This temperature is guaranteed by design.
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Typical Performance Curves
(Unless otherwise specified VBB =14V, VIN=5V, Tj=25°C)
6.0
5.0
4.0
3.0
2.0
1.0
0.0
6.0
5.0
VBB=14V
4.0
IBB
IBB
3.0
2.0
1.0
IBBS
IBBS
0.0
-50
0
50
100
150
0
10
20
30
40
Junction Temperature: Tj [°C]
Power Supply Voltage : VBB [V]
Figure 9. Circuit Current vs. Temperature
Figure 8. Circuit Current vs. Power Supply Voltage
4.0
3.0
2.0
1.0
0.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
VINH
VINL
-50
0
50
100
150
-50
0
50
100
150
Junction Temperature : Tj [°C]
Junction Temperature : Tj [°C]
Figure 10. Under Voltage Lockout Threshold
vs. Temperature
Figure 11. Input Threshold Voltage vs. Temperature
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Typical Performance Curves - continued
600
500
400
300
200
100
0
150
120
90
60
30
0
-50
0
50
100
150
0
10
20
30
40
Power Supply Voltage : VBB [V]
Junction Temperature : Tj [°C]
Figure 13. On-state Resistance vs. Power Supply Voltage
Figure 12. Input Current vs. Temperature
250
300
250
200
150
100
50
VBB=14V
200
150
100
50
0
0
-50
0
50
100
150
-50
0
50
100
150
Junction Temperature : Tj [°C]
Junction Temperature : Tj [°C]
Figure 14. On-state Resistance vs. Temperature
Figure 15. Leak Current vs. Temperature
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Typical Performance Curves - continued
0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
VBB=14V
-100
-200
-300
-400
SROFF
SRON
-50
0
50
100
150
-50
0
50
100
150
Junction Temperature : Tj [°C]
Junction Temperature : Tj [°C]
Figure 16. Leak Current vs. Temperature
Figure 17. Slew Rate vs. Tempareture
100
80
60
40
20
0
60
50
40
30
20
10
0
-50
0
50
100
150
-50
0
50
100
150
Junction Temperature : Tj [°C]
Junction Temperature : Tj [°C]
Figure 19. Propagation Delay at OFF
vs. Temperature
Figure 18. Propagation Delay at ON
vs. Temperature
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Typical Performance Curves - continued
60
55
50
45
40
0.30
0.25
0.20
0.15
0.10
0.05
0.00
-50
0
50
100
150
-50
0
50
100
150
Junction Temperature : Tj [°C]
Junction Temperature : Tj [°C]
Figure 21. ST ON Voltage vs. Temperature
Figure 20. Output Clamp Voltage vs. Temperature
50
40
30
20
10
0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
VBB=14V
tSTOFF
tSTON
-50
0
50
100
150
-50
0
50
100
150
Junction Temperature : Tj [°C]
Junction Temperature : Tj [°C]
Figure 22. Diagnostic Output Delay Time
vs. Temperature
Figure 23. Overcurrent Detection vs. Temperature
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Typical Performance Curves - continued
1200
1000
800
600
400
200
0
35
30
25
20
15
10
5
0
-50
0
50
100
150
0
10
20
30
40
Junction Temperature : Tj [°C]
Power Supply Voltage : VBB [V]
Figure 24. Overcurrent Detection Off Time
vs. Temperature
Figure 25. Open Detection Resistance vs.
Power Supply Voltage
35
30
25
20
15
10
5
10000
1000
100
Tj(start)=25°C
Tj(start)=150°C
10
0
0.0
1.0
2.0
-50
0
50
100
150
Output Current : IOUT [A]
Junction Temperature : Tj [°C]
Figure 26. Open Detection Resistance vs. Temperature
Figure 27. Active Clamp Energy vs. Output Current
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Measurement Circuit
VBB
VBB
V
ST
IN
OUT
IOUT
VIN
GND
Figure 29. Under Voltage Lockout Threshold
Under Voltage Hysteresis Threshold
High-Level Input Voltage
Low-Level Input Voltage
Figure 30. On-state Resistance
Output Clamp Voltage
Figure 28. Standby Current
Bias Current
High-level Input Current
Low-level Input Current
Input Hysteresis
TSD Detection Temperature
TSD Hysteresis
VBB
VBB
ST
V
OUT
IN
1k
VIN
GND
Figure 32. Slew Rate
Propagation Delay at ON
Propagation Delay at OFF
Diagnostic Output Delay Time
at Input ON
Figure 33. ST ON Voltage
Figure 31. Leak Current
Diagnostic Output Delay Time
at Input OF
VBB
VBB
VBB
VBB
10k
5V
10k
ST
IN
ST
Monitor
V
5V
OUT
OUT
A
IN
A
Monitor
GND
GND
VIN
VIN
VOUT
Figure 34. Overcurrent Detection Current
Overcurrent Detection OFF Time
Overcurrent Detection ON Duty
Figure 35. Open Load Detection Resistance
Open Load Detection Voltage
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Measurement conditions
Figure 36. Slew Rate
Figure 37. Diagnostic Output Delay Time
I/O Pin Truth Table
Diagnostic Output
(ST)
Error Detection
Reset Condition
Operating Status
Input Signal
Output Level
Low
High
Low
High
Low
High
Low
High
Low
High
Low
High
Low
Low
Low
Low
High
High
Normal
-
Low
Overtemperature
Overcurrent
Self-Reset
Self-Reset
Self-Reset
Low
Low
Switching
High
Open Load Detected
High
Timing Chart
Figure 38. Timing Chart
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I/O Equivalent Circuits
IN
ST
OUT
ST
100Ω
Resistance values shown in the diagrams above represent a typical limit, respectively
Figure 39. I/O Equivalent Circuits
Application Circuits
5V
CVBB
RSTPU
VBB
ST
BV1HD090
OUT
MCU
RL
IN
GND
RGND
DGND
Figure 40. Application Circuits
Symbol
RSTPU
Value
10kΩ
1kΩ
Purpose
ST terminal is open drain output. ST terminal is pulled up by MCU
power supply.
Current limitation during reverse battery.
RGND
CVBB
DGND
100nF
-
Filter of the voltage spikes on the VBB line.
Protection of the BV1HD090FJ-C during reverse battery.
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Precautions for use
1. Ground Wiring Pattern
When both small signal ground and large current ground are provided, it is recommended to isolate the large current
ground pattern from the small signal ground pattern and ground at one point at the reference point of the set PCB so
as to prevent change of the small signal ground voltage caused by the pattern wiring resistance and large current.
Also, pay attention not to change the voltage of ground wiring pattern of the external parts. When wiring the ground
line, be sure to set it to low impedance.
2. Thermal Design
The generated calorific value Pc is determined by Pc ≒ VDS×IOUT+VBB×IBB, using VBB - OUT potential difference
(VDS), amperage flowing through load (IOUT) and operating current (IBB).
In consideration of the thermal resistance value in the actual service condition, complete the thermal design having
sufficient margins.
Should the project be used in the condition exceeding Tjmax = 150 °C, the essential IC properties may be
deteriorated.
Since the thermal resistance value described in this specification is measured in the PCB conditions and
environments recommended by JEDEC, you should remember that the value in the actual service environments may
differ from that.
3. Absolute Maximum Rating
If the temperature value exceeds the absolute maximum rating due to overvoltage applied or rise in temperature, the
IC may be broken. If a special mode is assumed where a short circuit between terminals or an excess of the absolute
maximum rating may occur, it is recommended to take physical safety measures such as fuses.
4. Inspection Using a Set PCB
In the assembly process, apply grounding as a measure against IC damage caused by static electricity and pay
special attention during transportation and storage.
When connecting the IC to or removing the IC from the mount board in the inspection process, be sure to turn OFF
the power supply. If a terminal to which a capacitor is connected is included, residual charge may apply stress to the
IC. To avoid this, be sure to discharge electricity before performing the following inspection.
5. Mis-mounting and Short Circuit Between Terminals
When mounting the IC on the PCB, pay special attention to the IC direction, displacement and short circuit between
terminals. Mis-mounting or short circuit between terminals may cause IC damage.
6. Ceramic Capacitor Characteristic Variation
When using a ceramic capacitor as the external component, determine the constant in consideration of lowering of
nominal capacity due to direct current bias and change of capacity caused by thermal conditions.
7. Thermal Shut Down Function
The IC integrates the thermal shut down function. When the IC chip temperature exceeds 190°C (Typ), the function
turns OFF the output and sets the diagnostic output (ST) to Low. When the temperature becomes lower than 175°C
(Typ), the IC returns to the normal operation.
The thermal shut down function is provided only in order to shut down a thermal runaway, not in order to protect or
secure the IC. Since the thermal shut down function turns ON in the state exceeding the absolute maximum rating, be
sure to avoid designing a set PCB pre-requiring use of this function.
8. Overcurrent Protection Function
The IC integrates the overcurrent protection function. When overcurrent flows, the function limits the output current to
5.5A (Typ), turns OFF the output if the limited state continues for 3μs (Typ) or longer and sets the diagnostic output
(ST) to Low. If the output OFF state continues for 550μs (Typ), the IC resets itself. During the erroneous state
where overcurrent flows, the function turns ON/OFF the output repeatedly.
The overcurrent protection function is to protect the IC from damage caused only by a sudden abnormality such as a
load short circuit and short circuit between terminals. Be sure to avoid designing a set PCB pre-requiring use of this
function.
9. Active Clamp Operation
The IC integrates the active clamp circuit to internally absorb the counter electromotive force generated when the
inductive load is turned OFF. When the active clamp operates, VBB - OUT voltage becomes 50V (Typ) and the IC chip
temperature rises. However, since this is the operation at IN=0V, the thermal shut down function does not turn ON. To
drive the inductive load, refer to Figure. 27 to determine the load which will be below the active clamp tolerance dose.
10. Power Supply Line
Since the power supply line where large current flows may influence the normal operation, design the power supply
line so that the power supply pattern wiring resistance will become smaller.
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GBG0BD00150-1-2
27.Dec.2016 Rev.001
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Daattaasshheeeett
BV1HD090FJ-C
11. Reverse Connection of Power Connector (VBB - GND)
A reverse connection of the power connector (between VBB and GND) incurs a risk to break the IC.
In order to prevent the IC from damage at reverse connection, take an appropriate measure, for example, to insert a
diode and resistor between the GND terminal of the PCB ground and that of the IC, or to insert a diode between VBB
of the power supply and that of the IC. (Refer to Figure No.40)
12. Power Terminal in The Open State
When the power terminal (VBB) becomes open at ON (IN=High), the output is switched to OFF irrespective of input
voltage.
If an inductive load is connected, the active clamp operates when VBB is open, and then becomes the same potential
as that on the ground and the output voltage drops down to - 50V (Typ).
13. GND Terminal in The Open State
When the GND terminal becomes open at ON (IN=High), the output is switched to OFF irrespective of input voltage. If
an inductive load is connected, the active clamp operates when the GND terminal is open.
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GBG0BD00150-1-2
27.Dec.2016 Rev.001
17/20
Daattaasshheeeett
BV1HD090FJ-C
Ordering Information
B V 1 H D 0 9
0
F
J
-
CE2
Part Number
Package
FJ:SOP-J8
Packaging and forming specification
C : Automotive product
E2 : Embossed tape and reel
Marking Diagrams
SOP-J8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Part Number Marking
1HD90
Package
SOP-J8
Orderable Part Number
BV1HD090FJ-CE2
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GBG0BD00150-1-2
27.Dec.2016 Rev.001
18/20
Datashheeeett
BV1HD090FJ-C
Physical Dimension, Tape and Reel Information
Package Name
SOP-J8
<Tape and Reel information>
Tape
Embossed carrier tape
2500pcs
Quantity
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
Direction of feed
1pin
Reel
O rder quantity needs to be multiple of the minimum quantity.
∗
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GBG0BD00150-1-2
27.Dec.2016 Rev.001
19/20
Daattaasshheeeett
BV1HD090FJ-C
Revision History
Date
Revision
001
Changes
27.Dec.2016
New Release
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GBG0BD00150-1-2
27.Dec.2016 Rev.001
20/20
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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