uClamp0541Z.TFT [SEMTECH]
Ultra Small μClamp® 1-Line ESD Protection;
| 型号： | uClamp0541Z.TFT |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | Ultra Small μClamp® 1-Line ESD Protection |
| 文件： | 总8页 (文件大小：176K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
uClamp0541Z
Ultra Small μClamp®
1-Line ESD Protection
PROTECTION PRODUCTS - Z-PakTM
Features
Description
μClamp® TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. It is
designed to replace 0201 size multilayer varistors (MLVs)
in portable applications such as cell phones, notebook
computers, and other portable electronics. It features
large cross-sectional area junctions for conducting high
transient currents. This device offers desirable charac-
teristics for board level protection including fast response
time, low operating and clamping voltage, and no device
degradation.
High ESD withstand Voltage: +/-17kV (Contact/Air)
per IEC 61000-4-2
Able to withstand over 1000 ESD strikes per IEC
61000-4-2 Level 4
Ultra-small 0201 package
Protects one data or power line
Low reverse current: <10nA typical (VR=5V)
Working voltage: +/- 5V
Low capacitance: 6.5pF typical
Solid-state silicon-avalanche technology
μClamp®0541Z is in a 2-pin SLP0603P2X3 package. It
measures 0.6 x 0.3 mm with a nominal height of only
0.25mm. Leads are finished with lead-free NiAu. Each
device will protect one line operating at 5 volts. It
gives the designer the flexibility to protect single lines in
applications where arrays are not practical. The
combination of small size and high ESD surge capability
makes them ideal for use in portable applications such
as cellular phones, digital cameras, and MP3 players.
Mechanical Characteristics
SLP0603P2X3 package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Marking : Marking code + dot matrix date code
Packaging : Tape and Reel
Applications
Cellular Handsets & Accessories
Keypads, Side Keys, Audio Ports
Portable Instrumentation
Digital Lines
Tablet PC
Nominal Dimensions
Schematic
0.62
1
0.22
0.32
0.16
0.355 BSC
2
0.25
SLP0603P2X3 (Bottom View)
www.semtech.com
2/6/2015
1
uClamp0541Z
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Symbol
Ppk
Value
Units
Watts
Amps
kV
Peak Pulse Power (tp = 8/20μs)
25
2
Maximum Peak Pulse Current (tp = 8/20μs)
Ipp
ESD per IEC 61000-4-2 (Air)1
VESD
+/- 17
+/- 17
ESD per IEC 61000-4-2 (Contact)1
Operating Temperature
Storage Temperature
TJ
-55 to +125
-55 to +150
°C
°C
TSTG
Electrical Characteristics (T=25oC)
Parameter
Symbol
VRWM
Conditions
Minimum
Typical
Maximum
Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Pin 1 to 2 or 2 to 1
5
V
V
VBR
It = 1mA
Pin 1 to 2 or 2 to 1
6
8.2
3
9.5
Reverse Leakage Current
Clamping Voltage
IR
VRWM = 5V, T=25°C
Pin 1 to 2 or 2 to 1
50
12
15
nA
V
VC
VC
IPP = 1A, tp = 8/20μs
Pin 1 to 2 or 2 to 1
Clamping Voltage
IPP = 2A, tp = 8/20μs
V
Pin 1 to 2 or 2 to 1
Dynamic Resistance2, 3
Junction Capacitance
Notes
RDYN
Cj
tlp = 0.2 / 100ns
VR = 0V, f = 1MHz
0.78
6.5
Ohms
pF
9
1)ESD gun return path connected to ESD ground reference plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
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© 2015 Semtech Corporation
2
uClamp0541Z
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
15
1
10
5
0.1
0.01
0.001
Waveform
Parameters:
tr = 8μs
td = 20μs
0
0.1
1
10
100
0
0.5
1
1.5
2
2.5
Peak Pulse Current - IPP (A)
Pulse Duration - tp (µs)
Junction Capacitance vs. Reverse Voltage
TLP Characteristic
1.2
1
25
20
15
10
5
Transmission Line Pulse Test (TLP)
Settings:
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
f = 1 MHz
0.8
0.6
0.4
0.2
0
0
0
5
10
15
20
25
0
1
2
3
4
5
TLP Voltage (V)
Reverse Voltage - VR (V)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
ESD Clamping (-8kV Contact per IEC 61000-4-2)
40
10
0
-10
-20
30
20
10
Measured with 50 Ohm scope
input impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
-30
0
-40
-10
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
www.semtech.com
© 2015 Semtech Corporation
3
uClamp0541Z
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21
CH1S21 LOG
6 dB / REF 0 dB
1: -2.0678 dB
800 MHz
2: -2.2545 dB
900 MHz
0 dB
1
2
3: -6.6417 dB
1.8 GHz
-6 dB
3
5
-12 dB
-18 dB
-24 dB
4: -12.722 dB
2.5 GHz
4
-30 dB
-36 dB
-42 dB
-48 dB
1
10
100
3
1
MHz
MHz
MHz
GHz GHz
STOP 3000.000000 MHz
.
START 030MHz
Applications Information
Assembly Guidelines
Stencil Aperture
Mounting Pad
Package
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufactur-
ing parameters will require some experimentation to
get the desired solder application.
0.175
0.250
0.272
0.298
0.270
Assembly Parameter
Recommendation
Solder Stencil Design
Laser cut, Electro-polished
Rectangular with rounded
corners
Recommended Mounting Pattern
Aperture shape
Solder Stencil Thickness
Solder Paste Type
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
www.semtech.com
© 2015 Semtech Corporation
4
uClamp0541Z
PROTECTION PRODUCTS
Outline Drawing - SLP0603P2X3
B
E
A
D
DIMENSIONS
MILLIMETERS
MIN NOM MAX
0.235 0.25 0.265
DIM
A
A1 0.00
0.02 0.025
0.22 0.24
b
D
E
e
0.20
0.62
0.32
0.585
0.655
0.355
0.285
0.355 BSC
0.14
TOP VIEW
L
0.16 0.18
2
N
aaa
0.08
0.10
bbb
A
SEATING
PLANE
aaa C
A1
C
bxN
A
bbb
C
B
2xL
e
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP0603P2X3
DIMENSIONS
DIM MILLIMETERS
(0.425)
0.175
0.270
0.250
0.675
C
G
X
Y
Z
Z
(C)
G
Y
X
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
www.semtech.com
© 2015 Semtech Corporation
5
uClamp0541Z
PROTECTION PRODUCTS
Marking Code
K
Notes:
1) Dots represent matrix date code
Ordering Information
Qty per
Reel
Carrier
Tape
Reel
Size
Ordering Number
Comments
Not Recommended
for New Designs
uClamp0541Z.TNT
10,000
Plastic
7 Inch
uClamp0541Z.TFT
uClamp0541Z.TVT
Notes:
15,000
50,000
Paper
Paper
7 Inch
13 Inch
1) MicroClamp, uClamp and μClamp are trademarks of
Semtech Corporation
www.semtech.com
© 2015 Semtech Corporation
6
uClamp0541Z
PROTECTION PRODUCTS
Carrier Tape Specification
Plastic Tape
Bo
Ko
Ao
Paper Tape
Note: All dimensions in mm unless otherwise specified
Device Orientation in Tape
Date Code Location
(Away from Sprocket Holes)
www.semtech.com
© 2015 Semtech Corporation
7
uClamp0541Z
PROTECTION PRODUCTS
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
© 2015 Semtech Corporation
8
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