UCLAMP0571P [SEMTECH]
High-Power μClamp® 1-Line Surge Protection;型号: | UCLAMP0571P |
厂家: | SEMTECH CORPORATION |
描述: | High-Power μClamp® 1-Line Surge Protection |
文件: | 总14页 (文件大小:942K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
uClamp0571P - uClamp3671P
High-Power μClamp®
1-Line Surge Protection
®
PROTECTION PRODUCTS - MicroClamp
Features
Description
μClamp® TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to EOS, light-
ning, CDE, and ESD. They feature large cross-sectional
area junctions for conducting high transient currents.
These devices offer desirable characteristics for board
level protection including fast response time, low oper-
ating and clamping voltage, and no device degradation.
Transient protection for high-speed data lines to
IEC 61000-4-2 (ESD) 30kV (air), 30kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 20 - 80A (8/20μs)
Protects one data or power line
Low leakage current
High peak pulse current capability
Operating voltage options: 5V, 8V, 10V, 12V, 15V,
18V, 22V, 26V, 36V
The μClamp®xx71P series are in 2-pin SGP1610N2
package measuring 1.6 x 1.0 mm with a nominal
height of 0.57mm. The leads are finished with lead-
free NiPdAu. They may be used to protect 5V, 8V, 10V,
12V, 15V, 18V, 22V, 26V, and 36V systems. They
feature high surge current capability and low clamping
voltage making them ideal for use in harsh transient
environments.
Qualified to AEC-Q100
Solid-state silicon-avalanche technology
Mechanical Characteristics
SGP1610N2 package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 1.6 x 1.0 x 0.57 mm
Lead Finish: NiPdAu
Marking: Marking code
Packaging: Tape and Reel
Applications
Cellular Handsets & Accessories
USB Voltage Bus
Battery Protection
Digital Lines
Proximity Sensors
Automotive Applications
Nominal Dimensions
Schematic
1.60
1
1.00
0.40
1.10 BSC
0.57
2
All Dimensions in mm
SGP1610N2 (Bottom View)
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1
Revision 9/25/2014
uClamp0571P - uClamp3671P
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Symbol
Ppk
Value
Units
Watts
kV
Peak Pulse Power (tp = 8/20μs)1
1200 - 1500
ESD per IEC 61000-4-2 (Air)2
VESD
+/- 30
+/- 30
ESD per IEC 61000-4-2 (Contact)2
Operating Temperature
Storage Temperature
TJ
-40 to +125
-55 to +150
°C
°C
TSTG
Electrical Characteristics (T=25oC unless otherwise specified)
uClamp0571P
Parameter
Symbol
VRWM
Conditions
Minimum
Typical
Maximum
Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Pin 1 to 2
5
9
V
V
VBR
It = 1mA
6
7
Pin 1 to 2
Reverse Leakage Current
Peak Pulse Current
Clamping Voltage
IR
VRWM = 5V, T=25°C
Pin 1 to 2
<10
100
80
10
nA
A
IPP
VC
VC
tp = 8/20μs
Pin 1 to 2
IPP = 40A, tp = 8/20μs
V
Pin 1 to 2
Clamping Voltage
IPP = 80A, tp = 8/20μs
15
V
Pin 1 to 2
Dynamic Resistance3, 4
Junction Capacitance
RDYN
Cj
tlp = 0.2 / 100ns
VR = 0V, f = 1MHz
0.05
Ohms
pF
675
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© 2014 Semtech Corporation
2
uClamp0571P - uClamp3671P
PROTECTION PRODUCTS
uClamp0871P
Parameter
Symbol
VRWM
Conditions
Minimum
Typical
Maximum
Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Pin 1 to 2
8
V
V
VBR
It = 1mA
9.5
11
13
Pin 1 to 2
Reverse Leakage Current
Peak Pulse Current
Clamping Voltage
IR
VRWM = 8V, T=25°C
Pin 1 to 2
<10
100
65
nA
A
IPP
VC
VC
tp = 8/20μs
Pin 1 to 2
IPP = 10A, tp = 8/20μs
15
V
Pin 1 to 2
Clamping Voltage
IPP = 65A, tp = 8/20μs
23
V
Pin 1 to 2
Dynamic Resistance3, 4
Junction Capacitance
RDYN
Cj
tlp = 0.2 / 100ns
VR = 0V, f = 1MHz
0.05
Ohms
pF
475
uClamp1071P
Parameter
Symbol
VRWM
Conditions
Minimum
Typical
Maximum
10
Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Pin 1 to 2
V
V
VBR
It = 1mA
Pin 1 to 2
12
13.5
<10
15.5
Reverse Leakage Current
Peak Pulse Current
Clamping Voltage
IR
VRWM = 10V, T=25°C
Pin 1 to 2
100
60
17
nA
A
IPP
VC
VC
tp = 8/20μs
Pin 1 to 2
IPP = 10A, tp = 8/20μs
V
Pin 1 to 2
Clamping Voltage
IPP = 60A, tp = 8/20μs
25
V
Pin 1 to 2
Dynamic Resistance3, 4
Junction Capacitance
RDYN
Cj
tlp = 0.2 / 100ns
VR = 0V, f = 1MHz
0.05
Ohms
pF
350
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© 2014 Semtech Corporation
3
uClamp0571P - uClamp3671P
PROTECTION PRODUCTS
Electrical Characteristics (T=25oC unless otherwise specified)
uClamp1271P
Parameter
Symbol
VRWM
Conditions
Minimum
Typical
Maximum
Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Pin 1 to 2
12
19
V
V
VBR
It = 1mA
14
16
Pin 1 to 2
Reverse Leakage Current
Peak Pulse Current
Clamping Voltage
IR
VRWM = 12V, T=25°C
Pin 1 to 2
<10
100
45
nA
A
IPP
VC
VC
tp = 8/20μs
Pin 1 to 2
IPP = 10A, tp = 8/20μs
22
V
Pin 1 to 2
Clamping Voltage
IPP = 45A, tp = 8/20μs
30
V
Pin 1 to 2
Dynamic Resistance3, 4
Junction Capacitance
RDYN
Cj
tlp = 0.2 / 100ns
VR = 0V, f = 1MHz
0.05
Ohms
pF
275
uClamp1571P
Parameter
Symbol
VRWM
Conditions
Minimum
Typical
Maximum
Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Pin 1 to 2
15
23
V
V
VBR
It = 1mA
17.5
20
Pin 1 to 2
Reverse Leakage Current
Peak Pulse Current
Clamping Voltage
IR
VRWM = 15V, T=25°C
Pin 1 to 2
<10
100
40
nA
A
IPP
VC
VC
tp = 8/20μs
Pin 1 to 2
IPP = 10A, tp = 8/20μs
25
V
Pin 1 to 2
Clamping Voltage
IPP = 40A, tp = 8/20μs
40
V
Pin 1 to 2
Dynamic Resistance3, 4
Junction Capacitance
RDYN
Cj
tlp = 0.2 / 100ns
VR = 0V, f = 1MHz
0.05
Ohms
pF
220
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4
uClamp0571P - uClamp3671P
PROTECTION PRODUCTS
uClamp1871P
Parameter
Symbol
VRWM
Conditions
Minimum
Typical
Maximum
Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Pin 1 to 2
18
25
V
V
VBR
It = 1mA
20
22
Pin 1 to 2
Reverse Leakage Current
Peak Pulse Current
Clamping Voltage
IR
VRWM = 18V, T=25°C
Pin 1 to 2
<10
100
35
nA
A
IPP
VC
VC
tp = 8/20μs
Pin 1 to 2
IPP = 10A, tp = 8/20μs
28
V
Pin 1 to 2
Clamping Voltage
IPP = 35A, tp = 8/20μs
45
V
Pin 1 to 2
Dynamic Resistance3, 4
Junction Capacitance
RDYN
Cj
tlp = 0.2 / 100ns
VR = 0V, f = 1MHz
0.10
Ohms
pF
225
uClamp2271P
Parameter
Symbol
VRWM
Conditions
Minimum
Typical
Maximum
22
Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Pin 1 to 2
V
V
VBR
It = 1mA
25.5
29
33.5
Pin 1 to 2
Reverse Leakage Current
Peak Pulse Current
Clamping Voltage
IR
VRWM = 22V, T=25°C
Pin 1 to 2
<10
100
25
nA
A
IPP
VC
VC
tp = 8/20μs
Pin 1 to 2
IPP = 10A, tp = 8/20μs
40
V
Pin 1 to 2
Clamping Voltage
IPP = 25A, tp = 8/20μs
55
V
Pin 1 to 2
Dynamic Resistance3, 4
Junction Capacitance
RDYN
Cj
tlp = 0.2 / 100ns
VR = 0V, f = 1MHz
0.10
Ohms
pF
165
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© 2014 Semtech Corporation
5
uClamp0571P - uClamp3671P
PROTECTION PRODUCTS
Electrical Characteristics (T=25oC unless otherwise specified)
uClamp2671P
Parameter
Symbol
VRWM
Conditions
Minimum
Typical
Maximum
Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Pin 1 to 2
26
35
V
V
VBR
It = 1mA
29
32
Pin 1 to 2
Reverse Leakage Current
Peak Pulse Current
Clamping Voltage
IR
VRWM = 26V, T=25°C
Pin 1 to 2
<10
100
23
nA
A
IPP
VC
VC
tp = 8/20μs
Pin 1 to 2
IPP = 10A, tp = 8/20μs
50
V
Pin 1 to 2
Clamping Voltage
IPP = 23A, tp = 8/20μs
65
V
Pin 1 to 2
Dynamic Resistance3, 4
Junction Capacitance
RDYN
Cj
tlp = 0.2 / 100ns
VR = 0V, f = 1MHz
0.15
Ohms
pF
155
uClamp3671P
Parameter
Symbol
VRWM
Conditions
Minimum
Typical
Maximum
Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Pin 1 to 2
36
44
V
V
VBR
It = 1mA
37
Pin 1 to 2
Reverse Leakage Current
Peak Pulse Current
Clamping Voltage
IR
VRWM = 36V, T=25°C
Pin 1 to 2
<10
100
18
nA
A
IPP
VC
VC
tp = 8/20μs
Pin 1 to 2
IPP = 2A, tp = 1.2/50μs
48
V
Pin 1 to 2
Clamping Voltage
IPP = 18A, tp = 8/20μs
80
V
Pin 1 to 2
Dynamic Resistance3, 4
Junction Capacitance
RDYN
Cj
tlp = 0.2 / 100ns
VR = 0V, f = 1MHz
0.29
Ohms
pF
150
Notes
1)Peak Pulse Power = Vc(max) x IPP (Max) (tp = 8/20us)
2)ESD gun return path connected to ESD ground reference plane.
3)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns.
4) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
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© 2014 Semtech Corporation
6
uClamp0571P - uClamp3671P
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
75
100
TA = 25OC
Waveform: tp=8x20us
70
TA = 25OC
uClamp3671P
65
60
55
50
45
40
35
30
25
20
15
10
5
uClamp2271P
10
1500W @ 20uS
1350W @ 20uS
uClamp1571P
uClamp1271P
uClamp1071P
1
1200W @ 20uS
uClamp0871P
uClamp0571P
0.1
0.1
1
10
100
1000
0
Pulse Duration - tp (µs)
0
10
20
30
40
50
60
70
80
90
Peak Pulse Current - IPP (A)
Forward Voltage vs. Peak Pulse Current (tp=8/20us)
TLP Characteristic
6
40
35
30
25
20
15
10
5
TA = 25OC
Waveform: tp= 8x20us
Transmission Line Pulse Test (TLP)
Settings:
tp = 100ns, tr = 0.2ns,
uClamp1071P
5
4
3
2
1
0
I
TLP and VTLP averaging window:
1 = 70ns to t2 = 90ns
uClamp0871P
uClamp0571P
t
uClamp1271P
uClamp1571P
uClamp2271P
uClamp3671P
0
0
5
10
15
20
25
30
35
40
45
50
55
0
10
20
30
40
50
60
70
80
90
Peak Pulse Current - IPP (A)
Clamping Voltage (V)
ESD Clamping - uClamp0571P
ESD Clamping - uClamp0571P
(+8kV Contact per IEC 61000-4-2)
(-8kV Contact per IEC 61000-4-2)
35
15
UC0571P_P8_ESD
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
10
5
30
25
20
15
10
5
0
-5
-10
-15
-20
-25
-30
-35
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
0
UC0571P_AR_N8_ESD
-5
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
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© 2014 Semtech Corporation
7
uClamp0571P - uClamp3671P
PROTECTION PRODUCTS
Typical Characteristics
ESD Clamping - uClamp0871P
ESD Clamping - uClamp0871P
(+8kV Contact per IEC 61000-4-2)
(-8kV Contact per IEC 61000-4-2)
40
35
30
25
20
15
10
5
10
5
0
-5
-10
-15
-20
-25
Measured with 50 Ohm scope input
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-30
0
-35
-5
-10
0
10
20
30
40
50
60
70
80
-40
Time (ns)
-10
0
10
20
30
40
50
60
70
80
Time (ns)
ESD Clamping - uClamp1071P
(+8kV Contact per IEC 61000-4-2)
ESD Clamping - uClamp1071P
(-8kV Contact per IEC 61000-4-2)
50
40
30
20
10
0
10
0
-10
-20
-30
-40
-50
Measured with 50 Ohm scope input
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-10
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
ESD Clamping - uClamp1271P
(+8kV Contact per IEC 61000-4-2)
ESD Clamping - uClamp1271P
(-8kV Contact per IEC 61000-4-2)
50
40
30
20
10
0
10
5
0
-5
-10
-15
-20
-25
-30
-35
-40
Measured with 50 Ohm scope input
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-10
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
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© 2014 Semtech Corporation
8
uClamp0571P - uClamp3671P
PROTECTION PRODUCTS
Typical Characteristics
ESD Clamping - uClamp1571P
ESD Clamping - uClamp1571P
(+8kV Contact per IEC 61000-4-2)
(-8kV Contact per IEC 61000-4-2)
60
50
40
30
20
10
0
10
5
0
-5
-10
-15
-20
-25
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
Measured with 50 Ohm scope input
-30
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-35
-40
-10
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
ESD Clamping - uClamp1871P
(+8kV Contact per IEC 61000-4-2)
ESD Clamping - uClamp1871P
(-8kV Contact per IEC 61000-4-2)
60
50
40
30
20
10
0
10
0
-10
-20
-30
-40
-50
Measured with 50 Ohm scope input
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-10
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
ESD Clamping - uClamp2271P
(+8kV Contact per IEC 61000-4-2)
ESD Clamping - uClamp2271P
(-8kV Contact per IEC 61000-4-2)
70
60
50
40
30
20
10
0
10
5
0
-5
-10
-15
-20
-25
-30
-35
-40
Measured with 50 Ohm scope input
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-10
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
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© 2014 Semtech Corporation
9
uClamp0571P - uClamp3671P
PROTECTION PRODUCTS
Typical Characteristics
ESD Clamping - uClamp2671P
ESD Clamping - uClamp2671P
(+8kV Contact per IEC 61000-4-2)
(-8kV Contact per IEC 61000-4-2)
80
70
60
50
40
30
20
10
0
10
0
-10
-20
-30
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-40
-50
-10
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
ESD Clamping - uClamp3671P
(+8kV Contact per IEC 61000-4-2)
ESD Clamping - uClamp3671P
(-8kV Contact per IEC 61000-4-2)
90
80
70
60
50
40
30
20
10
0
10
0
-10
-20
-30
-40
-50
Measured with 50 Ohm scope input
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-10
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
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© 2014 Semtech Corporation
10
uClamp0571P - uClamp3671P
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
The table below provides Semtech's recommended
assembly guidelines for mounting this device. The
figure at the right details Semtech’s recommended
aperture based on the below recommendations. Note
that these are only recommendations and should
serve only as a starting point for design since there
are many factors that affect the assembly process.
The exact manufacturing parameters will require some
experimentation to get the desired solder application.
Stencil Opening
Land Pad ( Follow drawing )
1.600
0.700
Assembly Parameter
Recommendation
Solder Stencil Design
Laser cut, Electro-polished
1.000
1.025
Rectangular with rounded
corners
Aperture shape
Solder Stencil Thickness
Solder Paste Type
0.125 mm (0.005")
Type 3 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
All Dimensions are in mm.
Land Pad.
Stencil opening
Component
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
Recommended Mounting Pattern
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11
uClamp0571P - uClamp3671P
PROTECTION PRODUCTS
Outline Drawing - SGP1610N2
D
A
B
DIMENSIONS
MILLIMETERS
DIM
MIN NOM MAX
A
0.52 0.57 0.62
E
A1 0.000 0.015 0.05
b
D
E
e
0.35
1.55
0.95
0.40 0.45
1.60
1.65
1.00
1.05
1.10 BSC
L
0.85 0.90 0.95
TOP VIEW
N
2
0.08
0.10
aaa
bbb
A
SEATING
PLANE
aaa C
C
A1
D/2
0.025-0.075
E/2
LxN
R0.100
Pin 1 ID
bxN
bbb
C A B
e/2
e
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SGP1610N2
DIMENSIONS
DIM MILLIMETERS
(1.225)
0.60
1.00
0.625
1.85
C
G
X
Y
Z
Z
G
(C)
Y
X
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
www.semtech.com
© 2014 Semtech Corporation
12
uClamp0571P - uClamp3671P
PROTECTION PRODUCTS
Example Device Marking
Ordering Information
Marking
Code
Working
Voltage
Qty per
Reel
Part Number
uClamp0571P.TNT
uClamp0871P.TNT
uClamp1071P.TNT
uClamp1271P.TNT
uClamp1571P.TNT
uClamp1871P.TNT
uClamp2271P.TNT
uClamp2671P.TNT
uClamp3671P.TNT
06
11
12
16
18
24
26
30
37
5V
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
8V
10V
12V
15V
18V
22V
26V
36V
06
Notes:
1) Marking includes marking code, pin 1 bar, and 2x5 matrix
date code
Notes:
MicroClamp, uClamp and μClamp are trademarks of Semtech
Corporation
www.semtech.com
© 2014 Semtech Corporation
13
uClamp0571P - uClamp3671P
PROTECTION PRODUCTS
Carrier Tape Specification
Note: All dimensions in mm unless otherwise specified
PIN 1 Location
(Towards Sprocket Holes)
Device Orientation in Tape
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
© 2014 Semtech Corporation
14
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