SGM61012 [SGMICRO]
1.2A/2A High-Efficiency Buck Converter with AHP-COT Mode;
| 型号： | SGM61012 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | 1.2A/2A High-Efficiency Buck Converter with AHP-COT Mode |
| 文件： | 总19页 (文件大小：1326K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM61012/SGM61022
1.2A/2A High-Efficiency
Buck Converters with AHP-COT Mode
GENERAL DESCRIPTION
FEATURES
● Input Voltage Range: 2.3V to 5.5V
● Output Current:
The SGM61012 and SGM61022 are efficient
high-frequency synchronous Buck converters with an
input voltage range of 2.3V to 5.5V and a wide output
current range that is optimized for compact solutions. It
operates in PWM mode at heavy loads and
automatically enters power-save mode (PSM) at light
loads to maintain its high efficiency.
SGM61012: 1.2A
SGM61022: 2A
● 8.5μA (TYP) Ultra-Low Quiescent Current in DSM
● AHP-COT Architecture
● Fast Transient Regulation
● 100% Duty Cycle Capability
● High-Efficiency DSM under Light Load
● Output Discharge
● Short-Circuit Protection
● Power Good Output
● Thermal Shutdown
Setting the MODE pin can enable deep sleep mode
(DSM). This device operates with an ultra-low
quiescent current, and it can maintain high efficiency at
very low load. This function keeps the standby current
at its lowest level, and can increase the standby time of
battery-powered application. To meet the requirements
of system power rails, the output capacitors with values
above 100μF can be used by the internal loop
compensation.
● Available in a Green TDFN-2×2-8AL Package
APPLICATIONS
With its adaptive hysteresis and pseudo-constant
on-time control (AHP-COT) architecture, the load
transient performance is excellent and the output
voltage regulation accuracy is achieved.
General Purpose Point-of-Load Power Supplies
Battery-Powered Applications
The SGM61012 and SGM61022 are available in a
Green TDFN-2×2-8AL package.
TYPICAL APPLICATION
Power Good
PG
VIN
VIN
R3
180kΩ
10kΩ
1μH
C1
C2
EN
SW
SENSE
FB
VOUT
SGM61012/
SGM61022
C3
R1
C4
MODE
GND
R2
Figure 1. Typical Application Circuit
SG Micro Corp
JUNE 2022 – REV. A
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1.2A/2A High-Efficiency,
SGM61012/SGM61022
Buck Converters with AHP-COT Mode
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
GKG
XXXX
SGM61012
SGM61022
TDFN-2×2-8AL
TDFN-2×2-8AL
SGM61012XTDE8G/TR
SGM61022XTDE8G/TR
Tape and Reel, 3000
Tape and Reel, 3000
-40℃ to +125℃
-40℃ to +125℃
GJZ
XXXX
MARKING INFORMATION
NOTE: XXXX = Date Code, Trace Code and Vendor Code.
Serial Number
Y Y Y
X X X X
Vendor Code
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
VIN, PG and SENSE Voltages............................. -0.3V to 6V
SW Voltage (DC) ......................................-0.3V to VIN + 0.3V
SW Voltage (AC, Less than 10ns) while Switching
............................................................................... .-2V to 9V
FB Voltage........................................................ -0.3V to 3.6V
EN and MODE Voltages...........................-0.3V to VIN + 0.3V
Sink Current at PG...........................................0mA to 0.5mA
Package Thermal Resistance
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged by ESD if you don’t
pay attention to ESD protection. SGMICRO recommends that
all integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because very small parametric changes could cause the
device not to meet its published specifications.
TDFN-2×2-8AL, θJA.................................................... 91℃/W
Junction Temperature.................................................+150℃
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
HBM.............................................................................4000V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Input Voltage Range...........................................2.3V to 5.5V
Output Voltage Range ...........................................0.5V to 4V
Operating Junction Temperature Range......-40℃ to +125℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
JUNE 2022
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2
1.2A/2A High-Efficiency,
SGM61012/SGM61022
PIN CONFIGURATION
Buck Converters with AHP-COT Mode
(TOP VIEW)
EN
GND
MODE
FB
VIN
1
2
3
4
8
7
6
5
SW
GND
PG
SENSE
TDFN-2×2-8AL
PIN DESCRIPTION
PIN
1
NAME
EN
I/O (1)
DESCRIPTION
Logic high sets the device active, logic low disables it and turns it into shutdown mode. It can
connect a 10kΩ resistor to VIN pin if it is needed. Do not leave this pin floating.
I
G
I
2
GND
MODE
FB
Power and Signal Ground.
Enable Setting for Deep Sleep Mode. The device adaptively goes into deep sleep mode when
logic high, and does not enter it when logic low. Do not leave this pin floating.
3
4
I
Feedback Input. An external feedback divider is needed for setting the output voltage.
5
SENSE
PG
I
Output Voltage Sense Pin. Must be connected to output voltage.
Power Good Open-Drain Output. If the output voltage is less than the regulation limit, this pin is
pulled low. Leave this pin floating when not in use.
6
O
P
P
—
7
SW
Switching Node.
8
VIN
Power Supply Voltage Input.
Exposed
Pad
GND
Connect it to GND. The thermal pad must be soldered to improve heat dissipation.
NOTE: 1. I = input, O = output, P = power, G = ground.
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1.2A/2A High-Efficiency,
SGM61012/SGM61022
Buck Converters with AHP-COT Mode
ELECTRICAL CHARACTERISTICS
(VIN = 3.6V, MODE = Low, TJ = -40℃ to +125℃, typical values are at TJ = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply
Input Voltage Range
VIN
IQ
2.3
5.5
40
V
Quiescent Current into VIN
IOUT = 0mA, device no switching
25
8.5
µA
Quiescent Current into VIN (Deep Sleep
Mode)
IOUT = 0mA, device no switching, MODE = High
17
0.01
1
EN = Low, TJ = -40℃ to +85℃
EN = Low
Shutdown Current into VIN
ISD
µA
3.5
1.9
Under-Voltage Lockout
Under-Voltage Lockout Hysteresis
Thermal Shutdown
Input voltage falling
Rising above VUVLO
1.7
1.8
130
V
VUVLO
mV
Temperature rising
+155
+25
TJSD
℃
Thermal Shutdown Hysteresis
Logic Interface (EN Mode)
High Level Input Voltage
Low Level Input Voltage
Input Leakage Current
Power Good
Temperature falling below TJSD
VIH
VIL
VIN = 2.3V to 5.5V
VIN = 2.3V to 5.5V
1
V
V
0.4
0.5
ILKG
0.01
µA
Power Good Threshold
Power Good Hysteresis
Low Level Voltage
VOUT falling referenced to VOUT nominal
-15
-10
5
-4
VPG
%
VOL
ISINK = 500µA
VPG = 5.0V
0.065
0.001
0.1
0.4
V
PG Leakage Current
Output
IPG,LKG
µA
Output Voltage Range
VOUT
0.5
4
V
MODE = High, use VOUT at 1A load as reference,
VIN = 2.8V to 5V, VOUT = 0.9V to 3.3V, ILOAD = 1mA
DSM Output Voltage Accuracy
2
%
Feedback Regulation Voltage
Feedback Input Bias Current
Output Discharge Resistor
Line Regulation
VFB
IFB
VIN ≥ 2.3V and VIN ≥ VOUT + 1V
VFB = 0.45V
0.438
0.45
1
0.462
10
V
nA
RDIS
EN = Low, VOUT = 1.8V
0.95
0.03
120
75
kΩ
%/V
VOUT = 1.2V, VIN = 2.3V to 6V, ILOAD = 1A
ISW = 500mA
High-side MOSFET On-Resistance
Low-side MOSFET On-Resistance
RDSON
mΩ
ISW = 500mA
Rising inductor current (SGM61012)
Rising inductor current (SGM61022)
1.7
2.3
2.8
3.6
3.8
5.1
A
A
High-side MOSFET Switch Current
Limit
ILIM
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1.2A/2A High-Efficiency,
SGM61012/SGM61022
Buck Converters with AHP-COT Mode
TYPICAL PERFORMANCE CHARACTERISTICS
TA = +25℃, unless otherwise noted.
Efficiency vs. Load Current
Output Voltage vs. Load Current
100
90
80
70
60
50
40
30
20
10
0
3.305
3.300
3.295
3.290
3.285
3.280
3.275
VIN = 4.2V, DSM
IN = 5.0V, DSM
V
V
V
IN = 4.2V, PSM
IN = 5.0V, PSM
VIN = 4.2V
VOUT = 3.3V
VOUT = 3.3V
V
IN = 5.0V
2
0.00001 0.0001 0.001
0.01
0.1
1
0.00001 0.0001 0.001
0.01
0.1
1
2
Load Current (A)
Load Current (A)
Output Voltage vs. Input Voltage
Efficiency vs. Load Current
3.33
3.31
3.29
3.27
3.25
3.23
100
90
80
70
60
50
40
30
20
10
0
VIN = 3.6V, DSM
V
V
IN = 4.2V, DSM
IN = 5.0V, DSM
V
V
V
IN = 3.6V, PSM
IN = 4.2V, PSM
IN = 5.0V, PSM
Load = 10mA
Load = 1A
VOUT = 3.3V
VOUT = 2.5V
3.0
3.5
4.0
4.5
5.0
5.5
6.0
0.00001 0.0001 0.001
0.01
0.1
1 2
Input Voltage (V)
Load Current (A)
Output Voltage vs. Load Current
Output Voltage vs. Input Voltage
2.510
2.505
2.500
2.495
2.490
2.485
2.53
2.51
2.49
2.47
2.45
2.43
VIN = 3.6V
V
V
IN = 4.2V
IN = 5.0V
Load = 10mA
Load = 1A
VOUT = 2.5V
VOUT = 2.5V
2
0.00001 0.0001 0.001
0.01
0.1
1
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Load Current (A)
Input Voltage (V)
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1.2A/2A High-Efficiency,
SGM61012/SGM61022
Buck Converters with AHP-COT Mode
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25℃, unless otherwise noted.
Efficiency vs. Load Current
Output Voltage vs. Load Current
100
90
80
70
60
50
40
30
20
10
0
1.815
1.810
1.805
1.800
1.795
1.790
1.785
VIN = 2.8V, DSM
V
V
IN = 3.6V, DSM
IN = 4.2V, DSM
V
V
V
IN = 2.8V, PSM
IN = 3.6V, PSM
IN = 4.2V, PSM
VIN = 2.8V
V
V
IN = 3.6V
IN = 4.2V
VOUT = 1.8V
VOUT = 1.8V
2
2
0.00001 0.0001 0.001
0.01
0.1
1
0.00001 0.0001 0.001
0.01
0.1
1
Load Current (A)
Load Current (A)
Output Voltage vs. Input Voltage
Efficiency vs. Load Current
1.810
1.805
1.800
1.795
1.790
1.785
1.780
100
90
80
70
60
50
40
30
20
10
0
VIN = 2.8V, DSM
V
V
IN = 3.6V, DSM
IN = 4.2V, DSM
V
V
V
IN = 2.8V, PSM
IN = 3.6V, PSM
IN = 4.2V, PSM
Load = 10mA
Load = 1A
VOUT = 1.8V
VOUT = 1.2V
2
1
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
0.00001 0.0001 0.001
0.01
0.1
Input Voltage (V)
Load Current (A)
Output Voltage vs. Load Current
Output Voltage vs. Input Voltage
1.215
1.210
1.205
1.200
1.195
1.190
1.185
1.215
1.210
1.205
1.200
1.195
1.190
1.185
VIN = 2.8V
V
IN = 3.6V
Load = 10mA
Load = 1A
VOUT = 1.2V
VIN = 4.2V
VOUT = 1.2V
2
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
0.00001 0.0001 0.001
0.01
0.1
1
Input Voltage (V)
Load Current (A)
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1.2A/2A High-Efficiency,
SGM61012/SGM61022
Buck Converters with AHP-COT Mode
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25℃, unless otherwise noted.
Efficiency vs. Load Current
Output Voltage vs. Load Current
100
90
80
70
60
50
40
30
20
10
0
0.915
0.910
0.905
0.900
0.895
0.890
0.885
VIN = 2.8V, DSM
V
V
IN = 3.6V, DSM
IN = 4.2V, DSM
VIN = 2.8V
VIN = 3.6V
VIN = 4.2V
V
V
V
IN = 2.8V, PSM
IN = 3.6V, PSM
IN = 4.2V, PSM
VOUT = 0.9V
VOUT = 0.9V
2
2
0.00001 0.0001 0.001
0.01
0.1
1
0.00001 0.0001 0.001
0.01
0.1
1
Load Current (A)
Load Current (A)
Output Voltage vs. Input Voltage
Switching Frequency vs. Load Current
0.915
0.910
0.905
0.900
0.895
0.890
0.885
3,000
2,500
2,000
1,500
1,000
500
VIN = 2.3V
V
V
V
IN = 3.3V
IN = 4.2V
IN = 5.0V
Load = 10mA
Load = 1A
VOUT = 0.9V
VOUT = 0.9V
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Input Voltage (V)
Load Current (A)
Switching Frequency vs. Load Current
Quiescent Current vs. Input Voltage in PSM
3,000
2,500
2,000
1,500
1,000
500
33
30
27
24
21
18
-40℃
+25℃
VIN = 3.3V
+85℃
V
V
IN = 4.2V
IN = 5.0V
+125℃
VOUT = 2.5V
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
2.3
2.8
3.3
3.8
4.3
4.8
5.3
Load Current (A)
Input Voltage (V)
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1.2A/2A High-Efficiency,
SGM61012/SGM61022
Buck Converters with AHP-COT Mode
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25℃, unless otherwise noted.
Quiescent Current vs. Input Voltage in DSM
High-side FET RDSON vs. Input Voltage
16
14
12
10
8
210
190
170
150
130
110
90
-40℃
+25℃
+85℃
+125℃
6
-40℃
+25℃
+85℃
+125℃
4
70
50
2
2.3
2.8
3.3
3.8
4.3
4.8
5.3
2.3
2.8
3.3
Input Voltage (V)
Low-side FET RDSON vs. Input Voltage
3.8
4.3
4.8
5.3
Input Voltage (V)
170
150
130
110
90
-40℃
+25℃
+85℃
+125℃
70
50
30
10
2.3
2.8
3.3
3.8
4.3
4.8
5.3
Input Voltage (V)
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1.2A/2A High-Efficiency,
SGM61012/SGM61022
Buck Converters with AHP-COT Mode
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25℃, VIN = 3.3V and VOUT = 1.2V, unless otherwise noted.
DSM Operation
PSM Operation
VSW
VSW
AC Coupled
AC Coupled
VOUT
VOUT
IL
IL
ILOAD = 2mA
ILOAD = 10mA
Time (20μs/div)
Time (5μs/div)
PWM Operation
PWM Operation
VSW
VSW
AC Coupled
AC Coupled
VOUT
IL
VOUT
IL
ILOAD = 2A
ILOAD = 1A
Time (200ns/div)
Load Transient
Time (200ns/div)
Load Transient
ILOAD
ILOAD
AC Coupled
AC Coupled
VOUT
VOUT
IL
IL
ILOAD = 10mA to 1A
ILOAD = 10mA to 2A
Time (50μs/div)
Time (50μs/div)
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1.2A/2A High-Efficiency,
SGM61012/SGM61022
Buck Converters with AHP-COT Mode
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25℃, VIN = 3.3V and VOUT = 1.2V, unless otherwise noted.
Start-up without Load
Start-up with Load
VEN
VPG
VEN
VPG
VOUT
VOUT
IL
IL
Time (100μs/div)
Time (100μs/div)
Line Transient
Short-Circuit Entry & Exit
VPG
VIN
VOUT
AC Coupled
VOUT
IL
VIN = 3.3V to 4.2V
Time (50μs /div)
Time (100μs/div)
Shutdown
VEN
VPG
VOUT
IL
Time (20ms/div)
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1.2A/2A High-Efficiency,
SGM61012/SGM61022
Buck Converters with AHP-COT Mode
FUNCTIONAL BLOCK DIAGRAM
VIN
EN_SD
EN
Shutdown
Thermal
Shutdown
Under-Voltage
Lockout
EN
VHCL
HCL
Mode Control
Deep Sleep
MODE
High-side
Current Limit
MIN_OFF
VIN
Adaptive
On-Time
Control
Logic
Gate
Driver
SW
GND
PG
SENSE
Ripple
SW
Injection
Comparator
Output
Discharge
LCL
0.45V
VLCL
Bandgap
Soft-Start
Low-side
Current Limit
SS
EA
ZCD
VZCD
FB
VPG
Figure 2. Block Diagram
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1.2A/2A High-Efficiency,
SGM61012/SGM61022
Buck Converters with AHP-COT Mode
DETAILED DESCRIPTION
power good output is required. When the device is
disabled or under-voltage lockout, the PG pin is driven
to low (see Table 1). The PG signal connected to the
EN pin of other converters can be used for multiple rails
sequences. Leave the PG pin floating when not in use.
Overview
The SGM61012 and SGM61022 are high-efficient Buck
converters with AHP-COT architecture and advanced
regulation topology.
At medium to heavy loads, the device works in pulse
width modulation (PWM) mode. At light load, it
automatically switches to power-save mode (PSM). In
PWM mode, the device works with a nominal switching
frequency of 2MHz. When the load current falls, the
device goes into PSM to achieve high efficiency with
reducing switching frequency and minimizing quiescent
current.
Table 1. Logic Table of PG Pin
Logic Status
Device Information
High Z
Low
V
FB ≥ VPG
√
Enable
(EN = High)
VFB ≤ VPG
√
Shutdown
(EN = Low)
√
√
√
UVLO
0.7V < VIN < VUVLO
TJ > TJSD
When pulling up the MODE pin, the device can enter
deep sleep mode automatically at very light load to
achieve high efficiency. If the circuit has no load current,
8.5μA (TYP) low quiescent current is sufficient to
maintain the output voltage. Deep sleep mode can
reduce the standby energy consumption of system.
During shutdown mode, the energy consumption falls
below 1μA.
Thermal
Shutdown
Power Supply
Removal
VIN < 0.7V
√
100% Duty Cycle
The device provides low input-to-output voltage drop by
going into 100% duty cycle mode. In this mode, the
high-side MOSFET is constantly turned on and the
low-side MOSFET is turned off. This function can
increase the operation time to the utmost extent for
battery powered applications. To maintain an
appropriate output voltage, the minimum input voltage
is calculated by:
Under-Voltage Lockout (UVLO)
The device implements the under-voltage lockout
(UVLO) with a 130mV (TYP) hysteresis. When the
input voltage falls below the VUVLO, it shuts down the
device.
(1)
V
= VOUT +IOUT_MAX × RDSON +RL
(
)
IN_MIN
Enable and Disable
where:
• VIN_MIN is the minimum input voltage.
• IOUT_MAX is the maximum output current.
• RDSON is the high-side MOSFET on-resistance.
• RL is the inductor ohmic resistance.
A logic high input to EN activates the device, and a
logic low disables the device. A 10kΩ resistor is
recommended to add between EN and VIN, and do not
leave it floating.
Power Good (PG)
Output Discharge
The power good output of SGM61012 and SGM61022
will be low in the condition that the output voltage less
than its nominal value. If the output exceeds 95% of the
regulated voltage, the power good is in high-impedance
state. If the output voltage is less than 90% of the
regulated voltage, the power good is driven to low.
Whenever the device is disabled by enable, thermal
shutdown or under-voltage lockout, the output is
discharged by the SW pin through a typical discharge
resistor of RDIS
.
The PG pin is an open-drain output with a maximum of
0.5mA sink current. A pull-up resistor connecting to
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1.2A/2A High-Efficiency,
SGM61012/SGM61022
Buck Converters with AHP-COT Mode
DETAILED DESCRIPTION (continued)
Soft-Start
Deep Sleep Mode (DSM)
When EN is set to logic high and after about 150μs
delay, the device starts switching and VOUT increases
with 600μs (TYP) internal soft-start circuit.
The SGM61012 and SGM61022 provide a deep sleep
mode function, which is enabled by setting MODE pin
high. The device enters into this mode when load
current decreases to about 6.5mA (1), and exits when
load current is greater than 15mA (1). Once enters deep
sleep mode, all other control blocks are shut down, and
only a dedicated low power consuming block monitors
the output voltage. In this mode, the quiescent current
consumption of the device is about 8.5µA (TYP), and
the output voltage is 2% higher than the setting voltage
approximately.
Inductor Current Limit
The device implements an inductor current limit if there
is over-current or short-circuit. Both the peak current of
high-side and valley current of low-side power
MOSFETs are limited to protect the device. The
high-side MOSFET is turned off and the low-side
MOSFET is turned on to reduce the inductor current
when the high-side switch current limit is triggered. The
low-side MOSFET is turned off and the high-side switch
is turned on again when the inductor current drops to
the low-side switch current limit. It repeats until the
inductor current falls below the high-side switch current
limit. The actual current limit value may larger than the
static current limit due to internal propagation delays.
Even in the deep sleep mode, the dynamic load
regulation of SGM61012 or SGM61022 is excellent.
NOTE: 1. Test condition: VIN = 3.6V, VOUT = 1.8V, L = 1µH.
Thermal Shutdown
To protect the device from overheating damage,
thermal protection is included in the device. If the
Power-Save Mode (PSM)
junction temperature exceeds the typical TJSD (+155℃
Once the load current decreases, setting MODE pin
low, the SGM61012 and SGM61022 will enter
power-save mode. Then, the device has a reduced
switching frequency and works with the minimum
quiescent current to keep high efficiency. In
power-save mode, the inductor current is discontinuous.
Then a fixed on-time architecture is activated and the
typical on-time is tON = 500ns × (VOUT/VIN).
TYP), the switching will stop. When the device
temperature drops below the threshold minus
hysteresis, the switching will resume automatically.
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1.2A/2A High-Efficiency,
SGM61012/SGM61022
Buck Converters with AHP-COT Mode
APPLICATION INFORMATION
The SGM61012 and SGM61022 are synchronous Buck converters with output voltage adjusted by feedback
dividers. Taking SGM61012 typical application as a reference, the following sections discuss the design of external
components and how to achieve the application.
VIN
Power Good
VIN
PG
2.3V to 5.5V
R3
180kΩ
10kΩ
1μH
C1
10μF
C2
0.1μF
VOUT
1.2V
EN
SW
SENSE
FB
SGM61012
R1
C3
20pF
C4
22μF
MODE
GND
R2
39.2kΩ
Figure 3. SGM61012 Typical Application Circuit
desired value. Calculate R1 and R2 with Equation 2.
Requirements
The design parameters given in Table 2 are used for
this design example.
R1
R2
R
1
(2)
VOUT = VFB × 1+
= 0.45V× 1+
R2
Table 2. Design Parameters
R2 should be less than 40kΩ for higher accuracy. Make
sure that the current flowing through R2 is at least 100
times greater than the current of FB pin. A lower value
of R2 increases the robustness against noise injection,
and higher values reduce the input current.
Design Parameter
Input Voltage
Example Value
2.3V to 5.5V
1.2V
Output Voltage
Output Ripple Voltage
Output Current (MAX)
< 20mV
1.2A
A feed-forward capacitor is recommended to improve
the performance of smooth transition into power-save
mode and reduce undershoot during load transient.
10pF to 20pF is enough for typical applications.
Design Details
Table 3 shows the components included in this
example.
Table 3. Components List
Output Filter
The output low pass filter is the combination of inductor
and output capacitor. Table 4 shows the suggested
value.
Reference
Description
Manufacturer
1µH, Power Inductor,
SGM61012 3A or SGM61022 4.5A
10μF, Ceramic Capacitor, 10V, X7R,
Size 0805
0.1μF, Ceramic Capacitor, 10V,
X7R, Size 0603
20pF, Ceramic Capacitor, 50V, C0G,
Size 0603
22μF, Ceramic Capacitor, 6.3V,
X7R, Size 0805
L1
Std
C1
C2
C3
C4
Std
Std
Std
Std
Table 4. Inductor and Capacitor Combinations
COUT (µF) (2)
L (µH)(1)
10
22
47
√
0.47
1
√
(3) (4)
√
√
√
√
Depending on the output voltage,
Chip Resistor, 1/16W, 1%,
Size 0603
R1
Std
2.2
√
39.2kΩ, Chip Resistor, 1/16W, 1%,
Size 0603
180kΩ, Chip Resistor, 1/16W, 1%,
Size 0603
R2
R3
Std
Std
NOTES:
1. Expected inductor tolerance and current de-rating.
Effective inductance has +20% and -30% variation.
2. Expected capacitance tolerance and bias voltage de-rating.
Effective capacitance has +20% and -50% variation.
3. “√” means the recommended filter combinations.
4. Filter combination in typical application.
Adjustable Output Voltage
An external resistor divider connected to FB pin is used
for setting the output voltage. Through adjusting R1 and
R2, the output voltage can be programmed to the
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14
1.2A/2A High-Efficiency,
SGM61012/SGM61022
Buck Converters with AHP-COT Mode
APPLICATION INFORMATION (continued)
Inductor Design
Capacitor Design
Equation 3 is conventionally used to calculate the
output inductance of a Buck converter. The inductor
should be selected by its value and the saturation
current. The saturation current of inductor should be
higher than IL_MAX in Equation 3, and sufficient margin
should be reserved. Typically, the current above
high-side current limit is enough, and a 10% to 30%
ripple current is selected to calculate the inductance.
Larger inductor can reduce the ripple current, but with
an increasing response time.
For input capacitor design, a X5R/X7R dielectric
ceramic capacitor should be selected for its low ESR
and high-frequency performance. 10μF is enough for
most applications. The voltage rating of input capacitor
must be considered for its significant bias effect. The
input ripple voltage can be calculated from Equation 4.
I
OUT ×D× (1− D)
ΔVIN
=
(4)
CIN × fSW
The ripple current rating of input capacitor should be
greater than ICIN_RMS in Equation 5 and the maximum
value occurs at 50% duty cycle. A 0.1μF capacitor is
suggested to add for further input decoupling of device.
ΔIL
IL_MAX = IOUT_MAX
+
2
VOUT
1−
V
(3)
IN
V
× ꢀV -V ꢁ
IN OUT
ΔIL = VOUT
×
OUT
�
�
ICIN_RMS = IOUT
×
= IOUT× D×ꢀ1-Dꢁ
(5)
L×fSW
V
× V
IN
IN
where:
For output capacitor design, output ripple, transient
response and loop stability should be considered.
Minimum capacitance of output ripple criteria can be
calculated from Equation 6.
• IOUT_MAX is the maximum output current.
• ΔIL is the inductor current ripple.
• fSW is the switching frequency.
• L is the inductor value.
∆I
L
COUT
>
(6)
8 × f
SW
× V
OUT_RIPPLE
Both the input and output capacitors should be placed
as close to VIN/Sense and GND pins as possible to
reduce noise caused by PCB parasitic parameters.
To simplify customer's design process, the inductor and
output capacitor combinations are recommended in
Table 4.
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15
1.2A/2A High-Efficiency,
SGM61012/SGM61022
Buck Converters with AHP-COT Mode
APPLICATION INFORMATION (continued)
Layout Considerations
Good PCB layout is the key factor for high performance
operation of a device regarding the stability, regulation,
efficiency and other performance measures.
low-side of the capacitors must be connected to GND
properly to avoid potential shift.
Signal traces are connected to the FB and SENSE
pins. Connect the inductor with a short trace. Keep
the traces away from SW nodes.
A list of guidelines for designing the PCB layout of
SGM61012/SGM61022 is provided below:
Place the power components close together and
Typical suggested layout is provided in Figure 4.
connect them with short and wide routes. The
Top Layer
Bottom Layer
Figure 4. PCB Layout
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (JUNE 2022) to REV.A
Page
Changed from product preview to production data.............................................................................................................................................All
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16
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-2×2-8AL
D
e
N8
D1
L
k
E1
E
N1
PIN 1#
DETAIL A
b
BOTTOM VIEW
TOP VIEW
SEATING PLANE
eee C
1.60
0.50
A
C
A2
A1
0.90 1.90
SIDE VIEW
ALTERNATE A-1 ALTERNATE A-2
0.25
0.50
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTION
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions In Millimeters
Symbol
MIN
MOD
0.750
-
MAX
0.800
0.050
A
A1
A2
b
0.700
0.000
0.203 REF
0.250
2.000
1.600
2.000
0.900
0.250
0.500
0.300
0.080
0.200
1.900
1.450
1.900
0.750
0.150
0.450
0.200
0.300
2.100
1.700
2.100
1.000
0.350
0.550
0.400
D
D1
E
E1
k
e
L
eee
NOTE: This drawing is subject to change without notice.
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PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TDFN-2×2-8AL
7″
9.5
2.30
2.30
1.10
4.0
4.0
2.0
8.0
Q1
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TX10000.000
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PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
7″
368
442
227
410
224
224
8
18
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TX20000.000
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