SGM6610 [SGMICRO]

10A Fully-Integrated Synchronous Boost Converter;
SGM6610
型号: SGM6610
厂家: Shengbang Microelectronics Co, Ltd    Shengbang Microelectronics Co, Ltd
描述:

10A Fully-Integrated Synchronous Boost Converter

文件: 总13页 (文件大小:752K)
中文:  中文翻译
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SGM6610  
10A Fully-Integrated  
Synchronous Boost Converter  
GENERAL DESCRIPTION  
FEATURES  
The SGM6610 is a high-efficient synchronous boost  
converter. The 2.7V to 12V operation input voltage is  
suitable for single-cell or two-cell Li-Ion batteries. This  
device is capable to provide 10A switch current and an  
output voltage range of 4.5V to 12.6V. The SGM6610  
has two operation modes, the pulse width modulation  
(PWM) mode and pulse frequency modulation (PFM).  
The PWM mode is applied at moderate to heavy loads.  
The PFM mode is applied at light load to improve the  
efficiency. An adjustable switching frequency of 200kHz  
to 2.2MHz can be operated in the PWM mode. The  
protection features include output over-voltage  
protection at 13.2V, cycle-by-cycle over-current  
protection and thermal shutdown. The device also  
involves the functions of programmable soft-start and  
adjustable switch peak current limit.  
2.7V to 12V Input Voltage Range  
4.5V to 12.6V Output Voltage Range  
10A Switch Current  
91% Peak Efficiency  
(VIN = 3.3V, VOUT = 9V, and IOUT = 3A)  
0.5μA Current into VIN Pin in Shutdown  
200kHz to 2.2MHz Adjustable Switching Frequency  
Adjustable Switch Peak Current Limit  
Programmable Soft-Start  
PFM Mode at Light Load  
13.2V Over-Voltage Protection  
Cycle-by-Cycle Over-Current Protection  
Thermal Shutdown  
Available in a Green TQFN-4.5×3.5-20L Package  
The SGM6610 is available in a Green TQFN-4.5×3.5-20L  
package. It operates over an ambient temperature  
range of -40to +85.  
APPLICATIONS  
Portable POS  
Bluetooth Speaker  
E-Cigarette  
Fast-Charging Power Bank  
SG Micro Corp  
DECEMBER 2021 - REV. A. 3  
www.sg-micro.com  
10A Fully-Integrated  
SGM6610  
Synchronous Boost Converter  
PACKAGE/ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESCRIPTION  
ORDERING  
NUMBER  
PACKAGE  
MARKING  
PACKING  
OPTION  
MODEL  
SGM6610  
YTQS20  
XXXXX  
SGM6610  
TQFN-4.5×3.5-20L  
SGM6610YTQS20G/TR  
Tape and Reel, 4000  
-40to +85℃  
MARKING INFORMATION  
NOTE: XXXXX = Date Code and Vendor Code.  
X X X X X  
Vendor Code  
Date Code - Week  
Date Code - Year  
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If  
you have additional comments or questions, please contact your SGMICRO representative directly.  
ABSOLUTE MAXIMUM RATINGS  
OVERSTRESS CAUTION  
BOOT Voltage ........................................... -0.3V to VSW + 6V  
VIN, SW, VOUT Voltages............................... -0.3V to 14.5V  
EN, VCC, FSW, SS, COMP Voltages.................. -0.3V to 6V  
ILIM, FB Voltages ................................................ -0.3V to 6V  
Junction Temperature.................................................+150℃  
Storage Temperature Range.......................-65to +150℃  
Lead Temperature (Soldering, 10s)............................+260℃  
ESD Susceptibility  
Stresses beyond those listed in Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to  
absolute maximum rating conditions for extended periods  
may affect reliability. Functional operation of the device at any  
conditions beyond those indicated in the Recommended  
Operating Conditions section is not implied.  
ESD SENSITIVITY CAUTION  
HBM.............................................................................2000V  
MM.................................................................................400V  
CDM ............................................................................1000V  
This integrated circuit can be damaged if ESD protections are  
not considered carefully. SGMICRO recommends that all  
integrated circuits be handled with appropriate precautions.  
Failureto observe proper handlingand installation procedures  
can cause damage. ESD damage can range from subtle  
performance degradation tocomplete device failure. Precision  
integrated circuits may be more susceptible to damage  
because even small parametric changes could cause the  
device not to meet the published specifications.  
RECOMMENDED OPERATING CONDITIONS  
Inductance, Effective Value, L ..................... 0.22μH to 4.7μH  
Input Capacitance, Effective Value, CIN ............... 10μF (MIN)  
Output Capacitance, Effective Value, COUT..6.8μF to 1000μF  
Input Voltage Range............................................2.7V to 12V  
Output Voltage Range ......................................4.5V to 12.6V  
Operating Ambient Temperature Range.........-40to +85℃  
Operating Junction Temperature Range.......-40to +125℃  
DISCLAIMER  
SG Micro Corp reserves the right to make any change in  
circuit design, or specifications without prior notice.  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2021  
2
10A Fully-Integrated  
SGM6610  
Synchronous Boost Converter  
PIN CONFIGURATION  
(TOP VIEW)  
1
20  
2
3
4
5
6
7
8
9
19  
EN  
FSW  
SW  
ILIM  
18  
COMP  
17  
FB  
16  
SW  
VOUT  
PGND  
15  
SW  
VOUT  
14  
SW  
VOUT  
13  
BOOT  
VIN  
IC  
12  
NC  
10  
11  
TQFN-4.5×3.5-20L  
PIN DESCRIPTION  
PIN  
NAME  
I/O  
FUNCTION  
Output of the Internal Regulator. The VCC pin connects a ceramic capacitor (> 1.0μF) to  
ground.  
1
VCC  
O
Enable Logic Input. Logic high makes the circuit enabled, and logic low makes it disabled  
and the device enters shutdown mode.  
2
EN  
FSW  
SW  
I
I
3
Put a resistor between this pin and the AGND pin to program the switching frequency.  
Switching Node Pin of the Converter. Connect to the drain of the internal low-side power  
MOSFET and source of the internal high-side power MOSFET.  
4, 5, 6, 7  
I
Power Supply for High-side MOSFET Gate Driver. Strongly recommend to apply a ceramic  
capacitor of 0.1μF between this pin and SW pin.  
8
BOOT  
VIN  
O
I
9
10  
IC Power Supply Input.  
SS  
O
I
Soft-Start Programming Pin.  
No Connection inside the Device. To achieve good thermal dissipation, connect the NC pins  
to ground plane on the PCB.  
11, 12  
13  
NC  
IC  
Internal Connection. Leave it floating or connect to VCC.  
Boost Converter Output.  
14, 15, 16  
17  
VOUT  
FB  
O
I
Output Voltage Feedback. An external resistor divider programs the output voltage.  
Output of the Internal Error Amplifier. Connect a loop compensation network between  
COMP and the AGND.  
Adjustable Switch Peak Current Limit. Connect an external resistor between this pin and the  
AGND.  
18  
COMP  
ILIM  
AGND  
PGND  
O
O
19  
20  
Signal Ground of the IC.  
Exposed  
Pad  
Power Ground of the IC. Connect to the source of the low-side MOSFET.  
NOTE: I = input, O = output.  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2021  
3
10A Fully-Integrated  
SGM6610  
Synchronous Boost Converter  
ELECTRICAL CHARACTERISTICS  
(Minimum and maximum values are at VIN = 2.7V to 5.5V and Full = -40to +85. Typical values are at VIN = 3.6V and TA =  
+25. L = 1.2μH, COUT = 47μF, unless otherwise specified noted.)  
PARAMETER  
SYMBOL  
CONDITIONS  
TEMP  
MIN  
TYP  
MAX  
UNITS  
Power Supply  
Input Voltage Range  
VIN  
Full  
2.7  
12  
V
V
VIN rising  
VIN falling  
+25  
+25℃  
+25℃  
+25℃  
2.5  
2.4  
100  
2.1  
0.22  
80  
2.65  
VIN Under-Voltage Lockout Threshold  
VIN_UVLO  
VIN Under-Voltage Lockout Hysteresis  
VCC Under-Voltage Lockout Threshold  
VIN_HYS  
VCC_UVLO VCC falling  
mV  
V
IC enabled, VEN = 2V, no load,  
RILIM = 100kΩ , VFB = 1.23V,  
VOUT = 12V  
VIN Pin  
VOUT Pin  
0.4  
Operating Quiescent Current  
IQ  
+25℃  
μA  
130  
IC disabled, VEN = 0V, no load,  
no feedback resistor divider  
connected to the VOUT pin  
Shutdown Current into the VIN Pin  
ISHDN  
VCC  
+25℃  
+25℃  
0.5  
5
1.2  
μA  
VCC Regulation  
IVCC = 5mA, VIN = 8V  
V
EN Input  
EN High Threshold Voltage  
EN Low Threshold Voltage  
EN Internal Pull-Down Resistance  
Output  
VENH  
VENL  
REN  
VCC = 5V  
VCC = 5V  
VCC = 5V  
Full  
Full  
1.3  
V
V
0.4  
+25℃  
800  
kΩ  
Output Voltage Range  
VOUT  
VREF  
Full  
4.5  
12.6  
V
V
PWM mode  
PFM mode  
VFB = 1.2V  
Full  
1.180  
1.204  
1.206  
1.234  
Reference Voltage at the FB Pin  
+25℃  
+25℃  
+25℃  
FB Pin Leakage Current  
Soft-Start Charging Current  
Error Amplifier  
ILKG_FB  
ISS  
0.1  
μA  
μA  
4
COMP Pin Sink Current  
COMP Pin Source Current  
ISINK  
ISOURCE  
VCCLPH  
VCCLPL  
GEA  
VFB = VREF + 100mV, VCOMP = 1.2V +25℃  
120  
18  
μA  
μA  
V
VFB = VREF - 100mV, VCOMP = 1.2V  
VFB = 1.1V, RILIM = 100kΩ  
VFB = 1.3V, RILIM = 100kΩ  
VCOMP = 1.2V  
+25℃  
+25℃  
+25℃  
+25℃  
High Clamp Voltage at the COMP Pin  
Low Clamp Voltage at the COMP Pin  
Error Amplifier Transconductance  
Power Switch  
2
0.4  
150  
V
μA/V  
High-side MOSFET On-Resistance  
Low-side MOSFET On-Resistance  
Current Limit  
VCC = 5V  
VCC = 5V  
+25℃  
+25℃  
13  
11  
16.5  
13.5  
mΩ  
mΩ  
RDS(ON)  
Switch Peak Current Limit  
ILIM  
RILIM = 100kΩ, VCC = 5V  
+25℃  
+25℃  
9.3  
11.3  
13.4  
A
V
Reference Voltage at the ILIM Pin  
VILIM  
1.208  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2021  
4
10A Fully-Integrated  
SGM6610  
Synchronous Boost Converter  
ELECTRICAL CHARACTERISTICS (continued)  
(Minimum and maximum values are at VIN = 2.7V to 5.5V and Full = -40to +85. Typical values are at VIN = 3.6V and TA =  
+25. L = 1.2μH, COUT = 47μF, unless otherwise specified noted.)  
PARAMETER  
Switching Frequency  
SYMBOL  
CONDITIONS  
TEMP  
MIN  
TYP  
MAX  
UNITS  
RFREQ = 301kΩ, VIN = 3.6V,  
VOUT = 12V  
RFREQ = 301kΩ, VIN = 3.6V,  
VOUT = 12V  
Switching Frequency  
Minimum On-Time  
fSW  
+25℃  
+25℃  
500  
120  
kHz  
ns  
tON_MIN  
Protection  
Output Over-Voltage Protection Threshold  
Output Over-Voltage Protection Hysteresis  
Thermal Shutdown  
VOVP  
VOUT rising  
Full  
12.83  
13.2  
0.15  
13.55  
V
V
VOVP_HYS VOUT falling below VOVP  
+25℃  
Thermal Shutdown Threshold  
Thermal Shutdown Hysteresis  
TSD  
TA rising  
155  
15  
TSD_HYS  
TA falling below TSD  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2021  
5
10A Fully-Integrated  
SGM6610  
Synchronous Boost Converter  
TYPICAL PERFORMANCE CHARACTERISTICS  
Efficiency vs. Output Current  
Efficiency vs. Output Current  
100  
90  
80  
70  
60  
50  
40  
30  
20  
100  
90  
80  
70  
60  
50  
40  
30  
20  
VIN = 3.6V  
PFM  
VOUT = 9V  
PFM  
VIN = 3V  
VOUT = 5V  
V
V
IN = 3.6V  
IN = 4.2V  
V
V
OUT = 9V  
OUT = 12V  
0.0001  
0.001  
0.01  
0.1  
1
10  
0.0001  
0.001  
0.01  
0.1  
1
10  
Output Current (A)  
Output Current (A)  
Current Limit vs. Setting Resistance  
Switching Frequency vs. Setting Resistance  
14  
12  
10  
8
2500  
2000  
1500  
1000  
500  
6
4
2
0
0
80  
120 160 200 240 280 320 360  
0
100 200 300 400 500 600 700 800 900  
Resistance (kΩ)  
Resistance (kΩ)  
Reference Voltage vs. Temperature  
Quiescent Current vs. Temperature  
1.210  
1.209  
1.208  
1.207  
1.206  
1.205  
1.204  
1.203  
1.202  
1.201  
1.200  
140  
120  
100  
80  
60  
40  
20  
0
-40 -20  
0
20 40 60 80 100 120  
-40  
-20  
0
20  
40  
60  
80  
100  
Temperature ()  
Temperature ()  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2021  
6
 
10A Fully-Integrated  
SGM6610  
Synchronous Boost Converter  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
Shutdown Current vs. Temperature  
Operation Range  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
13  
12  
11  
10  
9
VIN = 9V  
8
7
Operation Range  
6
5
4
3
0
2
4
6
8
-40  
-20  
0
20  
40  
60  
80  
100  
Load Current (A)  
Temperature ()  
Switching Waveforms in CCM  
VIN = 3.6V, EN = 3V, VOUT = 9V, IOUT = 2.5A  
Switching Waveforms in DCM  
VIN = 3.6V, VEN = 3V, VOUT = 9V, IOUT = 0.1A  
VOUT  
VOUT  
AC Coupled  
AC Coupled  
IL  
IL  
SW  
SW  
Time (2μs/div)  
Time (1μs/div)  
Switching Waveforms in PFM Mode  
Startup Waveforms  
VIN = 3.6V, VEN = 3V, VOUT = 9V, IOUT = 0.01A  
VIN = 3.6V, VEN = 3V, VOUT = 9V, ROUT = 3.6Ω  
VOUT  
EN  
AC Coupled  
IL  
VOUT  
SW  
IL  
Time (20μs/div)  
Time (2ms/div)  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2021  
7
10A Fully-Integrated  
SGM6610  
Synchronous Boost Converter  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
Shutdown Waveforms  
Load Transient  
VIN = 3.6V, VEN = 3V, VOUT = 9V, IOUT = 1A to 2A  
EN  
VIN = 3.6V, VEN = 3V, VOUT = 9V, ROUT = 3.6Ω  
VOUT  
IOUT  
IL  
VOUT  
AC Coupled  
Time (100μs/div)  
Time (500μs/div)  
Line Transient  
VIN = 3.3V to 3.6V, VEN = 3V, VOUT = 9V, IOUT = 1A  
VIN  
VOUT  
AC Coupled  
Time (500μs/div)  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2021  
8
10A Fully-Integrated  
SGM6610  
Synchronous Boost Converter  
PCB LAYOUT  
Figure 1. Top Layer  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2021  
9
10A Fully-Integrated  
SGM6610  
Synchronous Boost Converter  
REVISION HISTORY  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
DECEMBER 2021 ‒ REV.A.2 to REV.A.3  
Page  
Updated the Typical Performance Characteristics section ................................................................................................................................6-8  
OCTOBER 2021 ‒ REV.A.1 to REV.A.2  
Page  
Updated the Enable and Startup section............................................................................................................................................................10  
SEPTEMBER 2018 ‒ REV.A to REV.A.1  
Page  
Changed MODE pin to IC pin ............................................................................................................................................................................All  
Changes from Original (NOVEMBER 2017) to REV.A  
Page  
Changed from product preview to production data.............................................................................................................................................All  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2021  
10  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
TQFN-4.5×3.5-20L  
C0.300  
N1  
k
e1  
D
N20  
N19  
N2  
D1  
E1  
E
e
N11  
N10  
b
L1  
L
D3  
D2  
TOP VIEW  
BOTTOM VIEW  
4.1  
2.7  
0.70  
2.05  
3.05  
3.7  
5.1  
A
A1  
0.5  
A2  
SIDE VIEW  
0.25  
0.20  
1.5  
RECOMMENDED LAND PATTERN (Unit: mm)  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
0.800  
0.050  
MIN  
0.028  
0.000  
MAX  
0.031  
0.002  
A
A1  
A2  
D
0.700  
0.000  
0.203 REF  
0.008 REF  
3.400  
1.950  
0.650  
0.250  
4.400  
2.950  
3.600  
2.150  
0.850  
0.450  
4.600  
3.150  
0.134  
0.077  
0.026  
0.010  
0.173  
0.116  
0.142  
0.085  
0.033  
0.018  
0.181  
0.124  
D1  
D2  
D3  
E
E1  
k
0.325 REF  
0.013 REF  
b
0.200  
0.300  
0.224  
0.300  
0.500  
0.376  
0.008  
0.012  
0.009  
0.012  
0.020  
0.015  
L
L1  
e
0.500 BSC  
1.500 BSC  
0.020 BSC  
0.060 BSC  
e1  
NOTE: This drawing is subject to change without notice.  
SG Micro Corp  
TX00138.000  
www.sg-micro.com  
PACKAGE INFORMATION  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
P2  
P0  
W
Q2  
Q4  
Q2  
Q4  
Q2  
Q4  
Q1  
Q3  
Q1  
Q3  
Q1  
Q3  
B0  
Reel Diameter  
P1  
A0  
K0  
Reel Width (W1)  
DIRECTION OF FEED  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF TAPE AND REEL  
Reel Width  
Reel  
Diameter  
A0  
B0  
K0  
P0  
P1  
P2  
W
Pin1  
Package Type  
W1  
(mm)  
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant  
TQFN-4.5×3.5-20L  
13″  
12.4  
3.75  
4.75  
0.95  
4.0  
8.0  
2.0  
12.0  
Q1  
SG Micro Corp  
TX10000.000  
www.sg-micro.com  
PACKAGE INFORMATION  
CARTON BOX DIMENSIONS  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF CARTON BOX  
Length  
(mm)  
Width  
(mm)  
Height  
(mm)  
Reel Type  
Pizza/Carton  
13″  
386  
280  
370  
5
SG Micro Corp  
www.sg-micro.com  
TX20000.000  

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