SI5375-EVB [SILICON]
4-PLL ANY-FREQUENCY PRECISION CLOCK MULTIPLIER/JITTER ATTENUATOR;![SI5375-EVB](http://pdffile.icpdf.com/pdf2/p00344/img/icpdf/SI5375_2119456_icpdf.jpg)
型号: | SI5375-EVB |
厂家: | ![]() |
描述: | 4-PLL ANY-FREQUENCY PRECISION CLOCK MULTIPLIER/JITTER ATTENUATOR 衰减器 |
文件: | 总54页 (文件大小:272K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Si5375
4-PLL ANY-FREQUENCY PRECISION CLOCK
MULTIPLIER/JITTER ATTENUATOR
Features
Highly integrated, 4–PLL clock Integrated loop filter with
multiplier/jitter attenuator
programmable bandwidth as low
as 60 Hz
Four independent DSPLLs
support any-frequency synthesis Simultaneous free-run and
and jitter attenuation
synchronous operation
Four inputs/four outputs
Automatic/manual hitless input
clock switching
Each DSPLL can generate any
frequency from 2 kHz to
808 MHz from a 2 kHz to
710 MHz input
Selectable output clock signal
format (LVPECL, LVDS, CML,
CMOS)
Ordering Information:
See page 48.
Ultra-low jitter clock outputs:
350 fs rms (12 kHz– 20 MHz)
and 410 fs rms (50 kHz–80 MHz)
typical
LOL and interrupt alarm outputs
2
I C programmable
Single 1.8 V ±5% or 2.5 V ±10%
operation with high PSRR on-
chip voltage regulator
Meets ITU-T G.8251 and
Telcordia GR-253-CORE OC-192
jitter specifications
10x10 mm PBGA
Applications
High density any-port, any-
protocol, any-frequency line
cards
1/2/4/8/10G Fibre Channel
GbE/10GbE Synchronous Ethernet
Carrier Ethernet, multi-service
ITU-T G.709 OTN custom FEC
10/40/100G
switches and routers
MSPP, ROADM, P-OTS,
OC-48/192, STM-16/64
muxponders
Description
The Si5375 is a highly-integrated, 4-PLL, jitter-attenuating precision clock
multiplier for applications requiring sub 1 ps jitter performance. Each of the
DSPLL® clock multiplier engines accepts an input clock ranging from 2 kHz to
710 MHz and generates an output clock ranging from 2 kHz to 808 MHz. The
device provides virtually any frequency translation combination across this
operating range. For asynchronous, free-running clock generation
applications, the Si5375’s reference oscillator can be used as a clock source
for any of the four DSPLLs. The Si5375 input clock frequency and clock
multiplication ratio are programmable through an I2C interface. The Si5375 is
based on Silicon Laboratories' third-generation DSPLL® technology, which
provides any-frequency synthesis and jitter attenuation in a highly-integrated
PLL solution that eliminates the need for external VCXO and loop filter
components. Each DSPLL loop bandwidth is digitally-programmable,
providing jitter performance optimization at the application level. The device
operates from a single 1.8 or 2.5 V supply with on-chip voltage regulators with
excellent PSRR. The Si5375 is ideal for providing clock multiplication and
jitter attenuation in high port count optical line cards requiring independent
timing domains.
Rev. 1.0 8/12
Copyright © 2012 by Silicon Laboratories
Si5375
Si5375
Functional Block Diagram
PLL Bypass
Input Stage
Synthesis Stage
Output Stage
CKIN1P_A
÷ N31
Input
CKIN1N_A
Monitor
PLL Bypass
CKOUT1P_A
CKOUT1N_A
f3
fOSC
®
DSPLL
÷ NC1
÷ NC1_HS
÷ NC1_HS
÷ NC1_HS
A
÷ N32
÷ N2
PLL Bypass
CKIN1P_B
÷ N31
Input
Monitor
CKIN1N_B
PLL Bypass
CKOUT1P_B
CKOUT1N_B
f3
fOSC
®
DSPLL
÷ NC1
B
÷ N32
÷ N2
PLL Bypass
CKIN1P_C
÷ N31
Input
Monitor
CKIN1N_C
PLL Bypass
CKOUT1P_C
CKOUT1N_C
fOSC
f3
®
DSPLL
÷ NC1
C
÷ N32
÷ N2
PLL Bypass
CKIN1P_D
÷ N31
Input
CKIN1N_D
Monitor
PLL Bypass
CKOUT1P_D
CKOUT1N_D
fOSC
f3
®
DSPLL
÷ NC1_HS
÷ NC1
D
÷ N32
÷ N2
RSTL_q
VDD_q
GND
High PSRR
Voltage Regulator
Status / Control
CS_q
OSC_P/N
Low Jitter
SCL SDA
IRQ_q
LOL_q
XO or Clock
2
Rev. 1.0
Si5375
TABLE OF CONTENTS
Section
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
3. Typical Phase Noise Plot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
5. Si5375 Application Examples and Suggestions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
5.1. Schematic and PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
5.2. Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
5.3. SCL Leakage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
5.4. RSTL_x Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
5.5. Reference Oscillator Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
5.6. Alarms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
5.7. OSC_P and OSC_N Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
6. Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
7. Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
7.1. ICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
8. Pin Descriptions: Si5375 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
9. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
10. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
11. Recommended PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
12. Top Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
12.1. Si5375 Top Marking (PBGA, Lead-Free) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
12.2. Top Marking Explanation (PBGA, Lead-Free) . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
12.3. Si5375 Top Marking (PBGA, Lead-Finish) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
12.4. Top Marking Explanation (PBGA, Lead-Finish) . . . . . . . . . . . . . . . . . . . . . . . . . . .52
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
Rev. 1.0
3
Si5375
1. Electrical Specifications
Table 1. Recommended Operating Conditions
Parameter
Symbol
Test Condition
Min
–40
Typ
25
Max
85
Unit
°C
V
T
Ambient Temperature
A
2.5 V Nominal
1.8 V Nominal
2.25
1.71
2.5
1.8
2.75
1.89
Supply Voltage during
Normal Operation
V
DD
V
Note: All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.
Typical values apply at nominal supply voltages and an operating temperature of 25 ºC unless otherwise stated.
V
SIGNAL +
Single-Ended
Peak-to-Peak Voltage
V
ICM , VOCM
Differential I/Os
VISE,VOSE
SIGNAL –
(SIGNAL +) – (SIGNAL –)
VICM, VOCM
Differential Peak-to-Peak Voltage
V ,VOD
ID
t
SIGNAL +
SIGNAL –
VID = (SIGNAL+) – (SIGNAL–)
Figure 1. Differential Voltage Characteristics
80%
20%
CKIN, CKOUT
tF
tR
Figure 2. Rise/Fall Time Characteristics
4
Rev. 1.0
Si5375
Table 2. DC Characteristics
(VDD = 1.8 ± 5%, 2.5 ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
LVPECL Format
622.08 MHz Out
—
870
980
mA
All CKOUTs Enabled
1
I
CMOS Format
19.44 MHz Out
Supply Current
DD
—
—
780
660
880
—
mA
mA
All CKOUTs Enabled
Disable Mode
2
CKINn Input Pins
Input Common Mode
Voltage (Input Thresh-
old Voltage)
1.8 V ± 5%
2.5 V ± 10%
Single-ended
0.9
1
—
—
40
1.4
1.7
60
V
V
V
ICM
CKN
20
k
Input Resistance
RIN
f
f
f
f
< 212.5 MHz
See Figure 1.
CKIN
0.2
0.25
0.2
—
—
—
—
—
—
—
—
V
V
V
V
PP
PP
PP
PP
Single-Ended Input
Voltage Swing
(See Absolute Specs)
V
ISE
> 212.5 MHz
See Figure 1.
CKIN
< 212.5 MHz
See Figure 1.
CKIN
Differential Input
Voltage Swing
(See Absolute Specs)
V
ID
> 212.5 MHz
See Figure 1.
CKIN
0.25
3,4
Output Clocks (CKOUTn)
LVPECL 100 load
V
1.42
–
DD
CKO
—
—
V
–1.25
DD
V
Common Mode
VCM
line-to-line
LVPECL 100 load
Differential Output
Swing
CKO
1.1
0.5
350
—
1.9
0.93
500
—
V
VD
PP
PP
line-to-line
LVPECL 100 load
Single Ended Output
Swing
CKO
—
V
VSE
line-to-line
CML 100 load
Differential Output
Voltage
CKO
425
mV
PP
VD
line-to-line
CML 100 load
Common Mode Output
Voltage
CKO
V
–0.36
DD
V
VCM
line-to-line
Notes:
1. Current draw is independent of supply voltage.
2. No under- or overshoot is allowed.
3. LVPECL outputs require nominal VDD = 2.5 V.
4. LVPECL, CML, LVDS and low-swing LVDS measured with Fo = 622.08 MHz.
Rev. 1.0
5
Si5375
Table 2. DC Characteristics (Continued)
(VDD = 1.8 ± 5%, 2.5 ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
LVDS
100 load line-to-line
500
700
900
mV
mV
PP
PP
Differential Output
Voltage
CKO
VD
Low Swing LVDS
100 load line-to-line
350
1.125
—
425
1.2
500
LVDS 100 load
Common Mode Output
Voltage
CKO
1.275
V
VCM
line-to-line
Differential Output
Resistance
CKO
CML, LVPECL, LVDS
CMOS
200
—
—
0.4
—
V
V
RD
CKO
—
Output Voltage Low
VOLLH
VOHLH
V
= 1.71 V
0.8 x
DD
CKO
—
Output Voltage High
CMOS
ICMOS[1:0] = 11
= 1.8 V
V
DD
—
7.5
5.5
3.5
1.75
20
—
—
—
—
—
—
—
—
mA
mA
mA
mA
mA
mA
mA
mA
V
DD
ICMOS[1:0] = 10
= 1.8 V
—
—
—
—
—
—
—
V
DD
ICMOS[1:0] = 01
= 1.8 V
V
DD
Output Drive Current
(CMOS driving into
ICMOS[1:0] = 00
= 1.8 V
CKO
or CKO
for output low
for output
V
VOL
DD
CKO
IO
VOH
ICMOS[1:0] = 11
= 2.5 V
high. CKOUT+ and
CKOUT– shorted
externally)
V
DD
ICMOS[1:0] = 10
= 2.5 V
15
V
DD
ICMOS[1:0] = 01
= 2.5 V
10
V
DD
ICMOS[1:0] = 00
= 2.5 V
5
V
DD
Notes:
1. Current draw is independent of supply voltage.
2. No under- or overshoot is allowed.
3. LVPECL outputs require nominal VDD = 2.5 V.
4. LVPECL, CML, LVDS and low-swing LVDS measured with Fo = 622.08 MHz.
6
Rev. 1.0
Si5375
Table 2. DC Characteristics (Continued)
(VDD = 1.8 ± 5%, 2.5 ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
2-Level LVCMOS Input Pins
V
V
V
V
= 1.71 V
= 2.25 V
= 1.89 V
= 2.25 V
—
—
—
—
—
—
0.5
0.7
—
V
V
V
V
DD
DD
DD
DD
V
Input Voltage Low
IL
1.4
1.8
V
Input Voltage High
IH
—
LVCMOS Output Pins
Output Voltage Low
IO = 2 mA
= 1.71 V
—
—
—
—
—
—
0.4
0.4
—
V
V
V
V
V
V
DD
V
OL
IO = 2 mA
= 2.25 V
Output Voltage Low
Output Voltage High
DD
IO = –2 mA
= 1.71 V
V
–
DD
0.4
V
DD
V
OH
IO = –2 mA
= 2.25 V
V
–
DD
0.4
—
Output Voltage High
V
DD
Notes:
1. Current draw is independent of supply voltage.
2. No under- or overshoot is allowed.
3. LVPECL outputs require nominal VDD = 2.5 V.
4. LVPECL, CML, LVDS and low-swing LVDS measured with Fo = 622.08 MHz.
Rev. 1.0
7
Si5375
Table 3. AC Characteristics
(VDD = 1.8 ± 5%, 2.5 ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
1
Single-Ended Reference Clock Input Pin OSC_P (OSC_N with Cap to GND)
RATE_REG = 0101 or
0110, ac coupled
OSC_P to OSC_N
Resistance
OSC
OSC
—
100
—
—
RIN
RATE_REG = 0101 or
0110, ac coupled
0.5
1.2
V
Input Voltage Swing
VPP
PP
1
Differential Reference Clock Input Pins (OSC_P/OSC_N)
RATE_REG = 0101 or
OSC
0.5
0.002
40
—
—
—
2.4
710
60
V
Input Voltage Swing
VPP
PP
0110, ac coupled
CKINn Input Pins
CKN
MHz
%
Input Frequency
F
Whichever is smaller
(i.e., the 40% / 60%
limitation applies only
to high frequency
clocks)
Input Duty Cycle
(Minimum Pulse
Width)
CKN
DC
2
—
—
—
11
ns
ns
20–80%
See Figure 2
CKN
—
Input Rise/Fall Time
TRF
CKOUTn Output Pins
(See ordering section for speed grade vs frequency limits)
Output Frequency
(Output not config-
ured for CMOS or
Disabled)
CKO
0.002
—
808
MHz
F
F
Maximum Output
Frequency in CMOS
Format
CKO
CKO
—
—
—
—
—
230
—
212.5
350
8
MHz
ps
Output not configured for
CMOS or Disabled
See Figure 2
Output Rise/Fall
(20–80 %) @
622.08 MHz output
TRF
TRF
TRF
CMOS Output
Output Rise/Fall
(20–80%) @
212.5 MHz output
CKO
CKO
V
= 1.71
= 5 pF
ns
DD
C
LOAD
CMOS Output
Output Rise/Fall
(20–80%) @
212.5 MHz output
V
= 2.25
= 5 pF
—
2
ns
DD
C
LOAD
Notes:
1. A crystal may not be used in place of an oscillator.
2. Input to output skew after an ICAL is not controlled and can be any value.
8
Rev. 1.0
Si5375
Table 3. AC Characteristics (Continued)
(VDD = 1.8 ± 5%, 2.5 ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
100 Load
Line-to-Line
Measured at 50% Point
(differential)
Output Duty Cycle
Uncertainty @
622.08 MHz
CKO
—
—
±40
ps
DC
LVCMOS Input Pins
Minimum Reset Pulse
Width
t
1
—
—
—
µs
RSTMN
Reset to Microproces-
sor Access Ready
t
—
10
ms
READY
LVCMOS Output Pins
C
= 20pf
LOAD
t
—
—
25
—
—
ns
Rise/Fall Times
RF
See Figure 2
From last CKINn to
Internal detection of LOSn
N3 ≠ 1
LOS
4.5 x N3
—
T
CKIN
LOSn Trigger Window
TRIG
LOS to LOL
Fold = Fnew
Stable OSC_P, OSC_N
reference
Time to Clear LOL
after LOS Cleared
t
—
—
10
ms
CLRLOL
2
Device Skew
Max phase changes from
–40 to +85 °C
Phase Change due to
Temperature Variation
t
300
500
ps
TEMP
Notes:
1. A crystal may not be used in place of an oscillator.
2. Input to output skew after an ICAL is not controlled and can be any value.
Rev. 1.0
9
Si5375
Table 4. Microprocessor Control
(VDD = 1.8 ± 5%, 2.5 ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
2
I C Bus Lines (SDA, SCL)
Input Voltage Low
VIL
—
—
—
—
—
0.25 x V
V
V
V
V
I2C
DD
Input Voltage High
VIH
0.7 x V
0.1 x V
V
DD
I2C
DD
V
= 1.8V
= 2.5
—
Hysteresis of Schmitt
trigger inputs
DD
DD
VHYS
I2C
V
0.05 x V
—
DD
DD
V
= 1.8 V
DD
—
—
—
0.2 x V
V
V
DD
IO = 3 mA
Output Voltage Low
VOL
I2C
V
= 2.5
DD
—
0.4
IO = 3 mA
10
Rev. 1.0
Si5375
Table 5. Performance Specifications
VDD = 1.8 V ±5% or 2.5 V ±10%, TA = –40 to 85 °C
Parameter
PLL Performance*
Lock Time
Symbol
Test Condition
Min
Typ
Max
Unit
t
Start of ICAL to of LOL
—
—
35
200
0.05
—
1200
—
ms
ps
LOCKMP
After clock switch
t
Output Clock Phase Change
Closed Loop Jitter Peaking
Jitter Tolerance
P_STEP
f3 128 kHz
J
—
0.1
—
dB
PK
Jitter Frequency Loop Band-
ns
pk-pk
J
5000/BW
TOL
width
1 kHz Offset
10 kHz Offset
100 kHz Offset
1 MHz Offset
—
—
—
—
–106
–114
–116
–132
—
—
—
—
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Phase Noise
fout = 622.08 MHz
CKO
PN
Phase Noise
@ 100 kHz Offset
SP
—
—
–88
–70
—
—
dBc
dBc
Subharmonic Noise
Spurious Noise
SUBH
SPUR
Max spur @ n x F3
(n 1, n x F3 < 100 MHz)
SP
f
= f
= 622.08 MHz,
IN
OUT
BW = 120 Hz
LVPECL output
12 kHz–20 MHz
J
—
—
350
410
410
—
fs rms
fs rms
GEN
Jitter Generation
50 kHz–80 MHz
*Note: fin = fout = 622.08 MHz; BW = 120 Hz; LVDS.
Rev. 1.0
11
Si5375
Table 6. Thermal Characteristics1,2
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Maximum Junction
Temperature
—
125
—
°C
Thermal Resistance
Junction to Ambient
Still Air
—
—
—
—
16
14
13
12
—
—
—
—
°C/W
JA
Air Flow 1 m/s
Air Flow 2 m/s
Air Flow 3 m/s
Thermal Resistance
Junction to Case
Still Air
—
3.4
—
°C/W
JC
Notes:
1. In most circumstances the Si5375 does not require special thermal management. A system level thermal analysis is
strongly recommend. Contact Silicon Labs applications for further details if required.
2. Thermal characteristic for the 80-pin Si5375 on an 8-layer PCB.
Table 7. Absolute Maximum Ratings
Parameter
DC Supply Voltage
Symbol
Value
Unit
V
V
–0.5 to 2.8
DD
V
–0.3 to (V + 0.3)
V
LVCMOS Input Voltage
DIG
DD
CKN
0 to V
V
CLKIN1P/N_q
VIN
DD
OSC
0 to 1.2
V
OSC_P, OSC_N Voltage Limits
Operating Junction Temperature
Storage Temperature Range
VIN
T
–55 to 150
–55 to 150
°C
°C
JCT
T
STG
ESD HBM Tolerance (100 pF, 1.5 k); All pins
except CKINnP/N-q
2
kV
V
ESD MM Tolerance; All pins except
CKINnP/N_q
200
700
ESD HBM Tolerance (100 pF, 1.5 k);
CKINnP/N_q
V
V
125
ESD MM Tolerance; CKINnP/N_q
Latch-Up Tolerance
JESD78 Compliant
Note: Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be
restricted to the conditions as specified in the operation sections of this data sheet. Exposure to absolute maximum
rating conditions for extended periods of time may affect device reliability.
12
Rev. 1.0
Si5375
2. Typical Application Schematic
OTU
10GE
XFP
XFP
XFP
XFP
XFP
XFP
XFP
XFP
SONET
OTU
Si5375
DSPLL
FPGA
DSPLL
DSPLL
DSPLL
Cross Point Switch
XO
Figure 3. Typical Application Schematic
Rev. 1.0
13
Si5375
3. Typical Phase Noise Plot
622.08 MHz input
641.52 MHz output
321 fs RMS jitter (12 kHz to 20 MHz)
Figure 4. Si5375 Phase Noise Plot
14
Rev. 1.0
Si5375
4. Functional Description
PLL Bypass
Input Stage
Synthesis Stage
Output Stage
CKIN1P_A
CKIN1N_A
÷ N31
Input
Monitor
PLL Bypass
CKOUT1P_A
CKOUT1N_A
f3
fOSC
®
DSPLL
÷ NC1_HS
÷ NC1_HS
÷ NC1_HS
÷ NC1
A
÷ N32
÷ N2
PLL Bypass
CKIN1P_B
CKIN1N_B
÷ N31
÷ N32
Input
Monitor
PLL Bypass
CKOUT1P_B
CKOUT1N_B
f3
fOSC
®
®
®
DSPLL
B
÷ NC1
÷ N2
PLL Bypass
CKIN1P_C
CKIN1N_C
÷ N31
÷ N32
Input
Monitor
PLL Bypass
CKOUT1P_C
CKOUT1N_C
fOSC
f3
DSPLL
C
÷ NC1
÷ N2
PLL Bypass
CKIN1P_D
CKIN1N_D
÷ N31
÷ N32
Input
Monitor
PLL Bypass
CKOUT1P_D
CKOUT1N_D
fOSC
÷ NC1_HS
f3
DSPLL
D
÷ NC1
÷ N2
RSTL_q
CS_q
VDD_q
GND
High PSRR
Voltage Regulator
Status / Control
OSC_P/N
Low Jitter
SCL SDA LOL_q IRQ_q
XO or Clock
Figure 5. Functional Block Diagram
The Si5375 is a highly integrated jitter-attenuating clock multiplier that integrates four fully independent DSPLLs
and provides ultra-low jitter generation with less than 410 fs RMS. The device accepts clock inputs ranging from
2 kHz to 710 MHz and generates independent, synchronous clock outputs ranging from 2 kHz to 808 MHz for each
DSPLL. Virtually any frequency translation (M/N) combination across its operating range is supported. The Si5375
supports a digitally programmable loop bandwidth that can range from 60 Hz to 8.4 kHz requiring no external loop
filter components. An external single-ended or differential reference clock or XO is required for the device to enable
ultra-low jitter generation and jitter attenuation. The Si5375 uses this external reference clock as both a jitter and
holdover reference. The reference clock can be either single-ended or differential and should be connected to the
OSC_P pin (and the OSC_N pin for differential signaling). Because there is very little jitter attenuation from the
OSC_P and OSC_N pins to the output clocks, a low-jitter reference clock is strongly recommended. The stability
during holdover is determined by the stability of the reference clock. For more details, see the description of
RATE_REG (register 2 on page 12) and the Any-Frequency Precision Clocks Family Reference Manual, which can
be downloaded from http://www.silabs.com/timing. The reference oscillator can be internally routed into CKIN2_q,
so free-running clock generation is supported for each DSPLL offering simultaneous synchronous and
2
asynchronous operation. Configuration and control of the Si5375 is primarily handled through the I C interface.
The device monitors each input clock for Loss-of-Signal (LOS) and provides a LOS alarm when missing pulses on
any of the input clocks are detected. The device monitors the lock status of each DSPLL and provides a Loss-of-
Lock (LOL) alarm when the DSPLL is unlocked. The lock detect algorithm continuously monitors the phase of the
selected input clock in relation to the phase of the feedback clock. The Si5375 provides a VCO freeze capability
that allows the device to continue generation of a stable output clock when the input reference is lost.
The output drivers are configurable to support common signal formats, such as LVPECL, LVDS, CML, and CMOS
loads. If the CMOS signal format is selected, each differential output buffer generates two in-phase CMOS clocks
at the same frequency. For system-level debugging, a bypass mode drives the clock output directly from the
selected input clock, bypassing the internal DSPLL.
Silicon Laboratories offers a PC-based software utility, Si537xDSPLLsim that can be used to determine valid
frequency plans and loop bandwidth settings to simplify device setup. Si537xDSPLLsim provides the optimum
input, output, and feedback divider values for a given input frequency and clock multiplication ratio that minimizes
phase noise. This utility can be downloaded from http://www.silabs.com/timing. For further assistance, refer to the
Si53xx Any-Frequency Precision Clocks Family Reference Manual.
Rev. 1.0
15
Si5375
5. Si5375 Application Examples and Suggestions
5.1. Schematic and PCB Layout
For a typical application schematic and PCB layout, see the Si537x-EVB Evaluation Board User's Guide, which
can be downloaded from www.silabs.com/timing.
In order to preserve the ultra low jitter of the Si5375 in applications where the four different DSPLL's are each
operating at different frequency, special care and attention must be paid to the PCB layout. The following is a list of
rules that should be observed:
1. The four V supplies should be isolated from one another with four ferrite beads. They should be
DD
separately bypassed with capacitors that are located very close to the Si5375 device.
2. Use a solid and undisturbed ground plane for the Si5375 and all of the clock input and output return paths.
3. For applications that wish to logically connect the four RESET signals, do not tie them together underneath
the BGA package. Instead connect them outside of the BGA footprint.
4. As much as is possible, do not route clock input and output signals underneath the BGA package. The
clock output signals should go directly outwards from the BGA footprint.
5. Avoid placing the OSC_P and OSC_N signals on the same layer as the clock outputs. Add grounded guard
traces surrounding the OSC_P and OSC_N signals.
6. Where possible, place the CKOUT and CKIN signals on separate PCB layers with a ground layer between
them. The use of ground guard traces between all clock inputs and outputs is recommended.
For more information, see the Si537x-EVB Evaluation Board User's Guide and Appendix I of the Si53xx Reference
Manual, Rev 0.5 or higher.
5.2. Thermal Considerations
The Si5375 dissipates a significant amount of heat and it is important to take this into consideration when designing
the Si5375 operating environment. Among other issues, high die temperatures can result in increased jitter and
decreased long term reliability. It is therefore recommended that one or more of the following occur:
1. Use a heat sink: A heat sink example is Aavid part number 375324B00035G.
2. Use a V voltage of 1.8 V.
DD
3. Limit the ambient temperature to significantly less that 85 °C.
4. Implement very good air flow.
5.3. SCL Leakage
2
When selecting pull up resistors for the two I C signals, note that there is an internal pull down resistor of 18 k
from the SCL pin to ground. This comment does not apply to the SDA pin.
5.4. RSTL_x Pins
It is recommended that the four RSTL_x pins (RSTL_A, RSTL_B, RSTL_C and RSTL_D) be logically connected
together such that all four DSPLLs are either in or out of reset mode. When a DSPLL is in reset mode, its VCO will
not be locked to any signal and may drift across its operating range. If a drifting VCO has a frequency similar to that
of an operating VCO, there could be some crosstalk between the two VCOs. To avoid this from occurring during
device initialization, DSPLLsim loads each DSPLL with default Free Run frequency plans with VCO values apart
from one another. If the four RSTL_x pins are directly connected to one another, the connections should not be
made directly underneath the BGA package. Instead, the connections should be made outside the package
footprint.
16
Rev. 1.0
Si5375
5.5. Reference Oscillator Selection
Care should be taken during the selection of the external oscillator that is connected to the OSC_P and OSC_N
pins. There is no jitter attenuation from the OSC reference inputs to the output; so, to achieve low output jitter, a
low-jitter reference OSC must be used. Also, the output drift during holdover will be the same as the drift of the
OSC reference. For example, a Stratum 3 application will require an OSC reference source that has Stratum 3
stability (though Stratum 3 accuracy is not required).
The OSC frequency can be any value from 109 to 125.5 MHz. See the RATE_REG (reg 2) description. Alternately,
for applications with less demanding jitter requirements, the OSC frequency can be in the range from 37 to
41 MHz. For applications that use Free Run mode, the freedom to use any OSC frequency within these bands can
be used to select an OSC frequency that has an integer relationship to the desired output frequency, which will
make it easier to find a high-performance frequency plan.
If Free Run is not being used, an OSC frequency that is not integer-related to the output frequency is preferred. A
recommended choice for an external oscillator is the Silicon Labs 530HB121M109DG, which is a 2.5 V, CML
device with a temperature stability of 20 ppm. It was used to take the typical phase noise plot on page 14. For more
details and a more complete discussion of these topics, see the Si53xx Reference Manual.
5.6. Alarms
To assist in the programming of the IRQ_n pins, refer to the below diagram of the Si5375 alarm structure.
LOSx_INT
LOS1_INT
LOL_INT
LOSX_FLG
LOSX_MSK
in
in
in
out
out
out
Sticky
Write 0
to clear
INT_POL
IRQ_PIN
LOS1_FLG
LOS1_MSK
Sticky
E
IRQ_n
Write 0
to clear
LOL_FLG
LOL_MSK
Sticky
Write 0
to clear
Figure 6. Si5375 Alarm Structure
Rev. 1.0
17
Si5375
5.7. OSC_P and OSC_N Connection
Figures 7, 8, and 9 show examples of connecting various OSC reference sources to the OSC_P and OSC_N pins.
A crystal may not be used in place of an external oscillator.
Si5374
1.2 V
0.01 F
OSC-P
100
OSC-N
LVDS, LVPECL, CML, etc.
2.5 k
0.01 F
0.6 V
Figure 7. Differential OSC Reference Input Example for Si5375
Si5374
1.2 V
0.01 F
OSC-P
OSC-N
100
LVDS, LVPECL, CML, etc.
2.5 k
0.01 F
0.6 V
Figure 8. Single-Ended OSC Reference Input Example for Si5375
2.5 V
2.5 V
150
82
150
Si5374
OSC-P
1.2 V
10 nF
CMOS
XO
E5
E6
OSC-N
10 nF
0.6 V
Figure 9. Single-Ended, 2.5 V, CMOS XO Connection
18
Rev. 1.0
Si5375
6. Register Map
2
2
The Si5375 has four identical register maps for each DSPLL having a unique I C address. The I C address is
11010 [A1] [A0] for the entire device. Each corresponding DSPLL [A1] [A0] address is fixed as below.
[A1] [A0]
DSPLLA:
DSPLLB:
DSPLLC:
DSPLLD:
0
0
1
1
0
1
0
1
Note: The Si5375 register map is similar to the Si5319, although not identical.
All register bits that are not defined in this map should always be written with the specified Reset Values. Writing
values other than the specified Reset Values may result in undefined device behavior. Registers not listed, such as
Register 64, should never be written to.
Register
Address
D7
D6
D5
D4
D3
D2
D1
D0
0
FREE_RUN
CKOUT_
ALWAYS_
ON
BYPASS_
REG
2
3
BWSEL_REG[3:0]
RATE_REG [3:0]
VCO_
SQ_ICAL
FREEZE
5
ICMOS[1:0]
6
SFOUT_REG[2:0]
8
HLOG[1:0]
10
11
16
17
18
19
20
DSBL_ REG
PD_CK
CLAT[7:0]
FLAT[14:8]
FLAT[7:0]
VALTIME[1:0]
FLAT_VALID
LOCK[T2:0]
LOL_PIN
Write to 0
IRQ_PIN
INT_POL
21
22
Write to 0
Write to 0
LOL_POL
23
24
LOS_MSK LOSX_MSK
LOL_MSK
Rev. 1.0
19
Si5375
Register
D7
D6
D5
D4
D3
D2
D1
D0
Address
25
N1_HS[2:0]
31
NC1_LS[19:16]
32
NC1_LS[15:8]
33
NC1_LS[7:0]
40
N2_HS[2:0]
N2_LS[19:16]
41
N2_LS[15:8]
N2_LS[7:0]
42
43
N31[18:16]
44
N31[15:8]
N31[7:0]
45
46
N32[18:16]
47
N32[15:8]
N32[7:0]
48
128
OSC_ACTV CKACTV_
_REG
REG
129
130
131
132
134
135
136
138
LOS_INT
LOSX_INT
LOL_INT
LOS_FLG LOSX_FLG
LOL_FLG
PARTNUM_RO[11:4]
PARTNUM_RO[3:0]
ICAL
REVID_RO[3:0]
RST_REG
LOS_EN
[1:1]
139
LOS_EN
[0:0]
20
Rev. 1.0
Si5375
7. Register Descriptions
Register 0.
Bit
D7
D6
FREE_RUN CKOUT_ALWAYS_ON
R/W R/W
D5
D4
D3
D2
D1
BYPASS_REG
R/W
D0
Name
Type
R
R
R
R
R
Reset value = 0001 0100
Bit
7
Name
Function
Reserved
6
FREE_RUN
Free Run.
This bit configures free run operation. The OSC_P/N in internally routed to the
DSPLL. This allows the device to lock to its OSC reference.
0: Disable
1: Enable
5
CKOUT_ALWAYS_ON CKOUT Always On.
This will bypass the SQ_ICAL function. Output will be available even if SQ_ICAL
is on and ICAL is not complete or successful.
0: Squelch output until part is calibrated (ICAL).
1: Provide an output.
Notes:
1. The frequency may be significantly off until the part is calibrated.
2. Must be 1 to control output to output skew.
4:2
1
Reserved
BYPASS_REG
Bypass Register.
This bit enables or disables the PLL bypass mode. Use only when the device is
in digital hold or before the first ICAL. BYPASS mode is not supported with
CMOS clock outputs.
0: Normal operation
1: Bypass mode. Selected input clock is connected to CKOUT buffers, bypass-
ing PLL.
0
Reserved
Rev. 1.0
21
Si5375
Register 2.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
BWSEL_REG [3:0]
R/W
RATE_REG [3:0]
R/W
Type
Reset value = 0100 0010
Bit
Name
BWSEL_REG [3:0] BWSEL_REG.
Function
7:4
Selects nominal f3dB bandwidth for PLL. See the Si537xDSPLLsim software for
settings. After BWSEL_REG is written with a new value, an ICAL is required for
the change to take effect.
3:0
RATE_REG [3:0] RATE Setting for Oscillator.
Set these for the frequency of the oscillator connected to OSC_P/OSC_N pins.
An external oscillator or other clock source must be used. It is not possible to
use just a crystal.
Setting
Minimum
Recommended
Maximum
0101
37 MHz
40 MHz
41 MHz
0110
109 MHz
114.285 MHz
125.5 MHz
All others
reserved
22
Rev. 1.0
Si5375
Register 3.
Bit
D7
D6
D5
VCO_FREEZE
R/W
D4
SQ_ICAL
R/W
D3
D2
D1
D0
Name
Type
R
R
R
R
R
R
Reset value = 0000 0101
Bit
7:6
5
Name
Function
Reserved
VCO_FREEZE VCO_FREEZE.
Forces the part into VCO Freeze. This bit overrides all other manual and automatic
clock selection controls.
0: Normal operation.
1: Force VCO Freeze mode. Overrides all other settings and ignores the quality of all of
the input clocks.
4
SQ_ICAL
Reserved
SQ_ICAL.
This bit determines if the output clock will remain enabled or be squelched (disabled)
during an internal calibration.
0: Output clocks enabled during ICAL.
1: Output clocks disabled during ICAL.
3:0
Register 5.
Bit
D7
ICMOS [1:0]
R/W
D6
D5
D4
D3
D2
D1
D0
Name
Type
R
R
R
R
R
R
Reset value = 1110 1101
Bit
Name
Function
7:6
ICMOS [1:0] ICMOS [1:0].
When the output buffer is set to CMOS mode, these bits determine the output buffer drive
strength. These values assume CKOUT+ is tied to CKOUT–.
00: 8 mA
01: 16 mA
10: 24 mA
11: 32 mA
5:0
Reserved
Rev. 1.0
23
Si5375
Register 6.
Bit
D7
D6
D5
D4
D3
D2
D1
SFOUT_REG [2:0]
R/W
D0
Name
Type
R
R
R
R
R
Reset value = 0010 1101
Bit
7:3
2:0
Name
Function
Reserved
SFOUT_REG [2:0] SFOUT_REG [2:0].
Controls output signal format and disable for CKOUT1 output buffer.
000: Reserved
001: Disable
010: CMOS
011: Low swing LVDS
100: Reserved
101: LVPECL, only available when V = 2.5 V
DD
110: CML
111: LVDS
Register 8.
Bit
D7
D6
D5
HLOG_1[1:0]
R/W
D4
D3
D2
D1
D0
Name
Type
R
R
R
R
R
R
Reset value = 0000 0000
Bit
7:6
5:4
Name
Function
Reserved
HLOG_1 [1:0] HLOG_1 [1:0].
00: Normal operation
01: Holds CKOUT_n output at static logic 0. Entrance and exit from this state will occur
without glitches or runt pulses.
10: Holds CKOUT_n output at static logic 1. Entrance and exit from this state will occur
without glitches or runt pulses.
11: Reserved
3:0
Reserved
24
Rev. 1.0
Si5375
Register 10.
Bit
D7
D6
D5
D4
D3
D2
DSBL_REG
R/W
D1
D0
Name
Type
R
R
R
R
R
R
R
Reset value = 0000 0000
Bit
7:3
2
Name
Function
Reserved
DSBL_REG DSBL_REG.
This bit controls the powerdown of the CKOUT output buffer. If disable mode is selected,
the NC1 output divider is also powered down.
0: CKOUT enabled
1: CKOUT disabled
1:0
Reserved
Register 11.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
PD_CK
R/W
Name
Type
R
R
R
R
R
R
R
Reset value = 0100 0000
Bit
7:1
0
Name
Reserved
PD_CK
Function
PD_CK.
This bit controls the powerdown of the CKIN input buffer.
0: Enabled
1: Disabled
Rev. 1.0
25
Si5375
Register 16.
Bit
D7
D6
D5
D4
CLAT [7:0]
R/W
D3
D2
D1
D0
Name
Type
Reset value = 0000 0000
Bit
Name
Function
7:0
CLAT [7:0]
CLAT [7:0].
With INCDEC_PIN = 0, this register sets the phase delay for CKOUT in units of 1/Fosc.
This can take as long as 20 seconds.
01111111 = 127/Fosc (2s compliment)
00000000 = 0
10000000 = –128/Fosc (2s compliment)
Register 17.
Bit
D7
D6
D5
D4
D3
FLAT [14:8]
R/W
D2
D1
D0
Name
Type
FLAT_VALID
R/W
Reset value = 1000 0000
Bit
Name
FLAT_VALID FLAT_VALID.
Function
7
Before writing a new FLAT[14:0] value, this bit must be set to zero, which causes the
existing FLAT[14:0] value to be held internally for use while the new value is being
written. Once the new FLAT[14:0] value is completely written, set FLAT_VALID = 1 to
enable its use.
0: Memorize existing FLAT[14:0] value and ignore intermediate register values during
write of new FLAT[14:0] value.
1: Use FLAT[14:0] value directly from registers.
6:0
FLAT [14:8] FLAT [14:8].
Fine resolution control for overall device latency from input clocks to output clocks.
Positive values increase the skew. See DSPLLsim for details.
26
Rev. 1.0
Si5375
Register 18.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
FLAT [7:0]
R/W
Reset value = 0000 0000
Bit
Name
Function
7:0
FLAT [7:0]
FLAT [7:0].
Fine resolution control for overall device latency from input clocks to output clocks.
Positive values increase the skew. See DSPLLsim for details.
Register 19.
Bit
D7
D6
D5
D4
VALTIME [1:0]
R/W
D3
D2
D1
LOCKT [2:0]
R/W
D0
Name
Type
R
R
R
Reset value = 0010 1100
Bit
7:5
4:3
Name
Function
Reserved
VALTIME [1:0] VALTIME [1:0].
Sets amount of time for input clock to be valid before the associated alarm is removed.
00: 2 ms
01: 100 ms
10: 200 ms
11: 13 seconds
2:0
LOCKT [2:0] LOCKT [2:0].
Sets retrigger interval for one shot monitoring phase detector output. One shot is
triggered by phase slip in DSPLL.
000: 106 ms
001: 53 ms
010: 26.5 ms
011: 13.3 ms
100: 6.6 ms
101: 3.3 ms
110: 1.66 ms
111: .833 ms
Rev. 1.0
27
Si5375
Register 20.
Bit
D7
D6
D5
D4
D3
D2
D1
LOL_PIN
R/W
D0
IRQ_PIN
R/W
Name
Type
R
R
R
R
R
W
Reset value = 0011 1110
Bit
7:2
1
Name
Function
Reserved
LOL_PIN
Must write to 0 for normal operation.
LOL_PIN.
The LOL_INT status bit can be reflected on the LOL output pin.
0: LOL output pin tri-stated
1: LOL_INT status reflected to output pin
0
IRQ_PIN
IRQ_PIN.
Reflects the interrupt status on the IRQ output pin.
0: IRQ output pin is tri-stated.
1: Interrupt state reflected to output pin.
Register 21.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
W
W
R
R
R
R
R
R
Reset value = 1111 1111
Bit
7:6
5:0
Name
Function
Reserved
Reserved
Must write to 0 for normal operation.
28
Rev. 1.0
Si5375
Register 22.
Bit
D7
D6
D5
D4
D3
D2
D1
LOL_POL
R/W
D0
IRQ_POL
R/W
Name
Type
R
R
R
R
R
R
Reset value = 1101 1111
Bit
7:3
1
Name
Function
Reserved
LOL_POL
LOL_POL.
Sets the active polarity for the LOL status when reflected on the LOL_q output pin.
0: Active low
1: Active high
0
IRQ_POL
INT_POL.
Sets the active polarity for the interrupt status when reflected on the IRQ.
output pin.
0: Active low
1: Active high
Rev. 1.0
29
Si5375
Register 23.
Bit
D7
D6
D5
D4
D3
D2
D1
LOS_ MSK
R/W
D0
LOSX_ MSK
R/W
Name
Type
R
R
R
R
R
R
Reset value = 0001 1111
Bit
7:2
1
Name
Function
Reserved
LOS_MSK
LOS_MSK.
Determines if a LOS on CKIN_q (LOS_FLG) is used in the generation of an interrupt.
Writes to this register do not change the value held in the LOS_FLG register.
0: LOS1 alarm triggers active interrupt on IRQ_q output (if INT_PIN=1).
1: LOS_FLG ignored in generating interrupt output.
0
LOSX_MSK
LOSX_MSK.
Determines if a LOS on OSC is used in the generation of an interrupt. Writes to this
register do not change the value held in the LOSX_FLG register.
0: LOSX alarm triggers active interrupt on IRQ_q output (if INT_PIN=1).
1: LOSX_FLG ignored in generating interrupt output.
Register 24.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
LOL_MSK
R/W
Name
Type
R
R
R
R
R
R
R
Reset value = 0011 1111
Bit
7:1
0
Name
Function
Reserved
LOL_MSK
LOL_MSK.
Determines if the LOL_FLG is used in the generation of an interrupt. Writes to this
register do not change the value held in the LOL_FLG register.
0: LOL alarm triggers active interrupt on IRQ output (if IRQ_PIN=1).
1: LOL_FLG ignored in generating interrupt output.
30
Rev. 1.0
Si5375
Register 25.
Bit
D7
D6
N1_HS [2:0]
R/W
D5
D4
D3
D2
D1
D0
Name
Type
R
R
R
R
R
Reset value = 0010 0000
Bit
Name
Function
7:5
N1_HS [2:0] N1_HS [2:0].
Sets value for N1 high speed divider which drives NC1_LS (n = 1 to 2) low-speed divider.
000: N1 = 4 Note: Changing the coarse skew via the INC pin is disabled for this value.
001: N1 = 5
010: N1 = 6
011: N1 = 7
100: N1 = 8
101: N1 = 9
110: N1 = 10
111: N1 = 11
4:0
Reserved
Register 31.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
NC1_LS [19:16]
R/W
R
R
R
R
Reset value = 0000 0000
Bit
7:4
3:0
Name
Function
Reserved
NC1_LS [19:16] NC1_LS [19:16].
Sets value for NC1 low-speed divider, which drives CKOUTn_q output. Must be 0 or
odd.
00000000000000000000 = 1
00000000000000000001 = 2
00000000000000000011 = 4
00000000000000000101 = 6
...
20
11111111111111111111=2
20
Valid divider values=[1, 2, 4, 6, ..., 2 ]
Rev. 1.0
31
Si5375
Register 32.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
NC1_LS [15:8]
R/W
Reset value = 0000 0000
Bit
Name
Function
7:0
NC1_LS [15:8]
NC1_LS [15:8].
Sets value for NC1 low-speed divider, which drives CKOUTn_q output. Must be 0 or
odd.
00000000000000000000 = 1
00000000000000000001 = 2
00000000000000000011 = 4
00000000000000000101 = 6
...
20
11111111111111111111 = 2
20
Valid divider values = [1, 2, 4, 6, ..., 2 ]
Register 33.
Bit
D7
D6
D5
D4
NC1_LS [7:0]
R/W
D3
D2
D1
D0
Name
Type
Reset value = 0011 0001
Bit
Name
NC1_LS [7:0] NC1_LS [7:0].
Function
7:0
Sets value for NC1 low-speed divider, which drives CKOUTn_q output. Must be 0 or
odd.
00000000000000000000 = 1
00000000000000000001 = 2
00000000000000000011 = 4
00000000000000000101 = 6
...
20
11111111111111111111 = 2
20
Valid divider values = [1, 2, 4, 6, ..., 2 ]
32
Rev. 1.0
Si5375
Register 40.
Bit
D7
D6
N2_HS [2:0]
R/W
D5
D4
D3
D2
N2_LS [19:16]
R/W
D1
D0
Name
Type
R
Reset value = 1100 0000
Bit
Name
Function
7:5
N2_HS [2:0]
N2_HS [2:0].
Sets value for N2 high speed divider which drives N2_LS low-speed divider.
000: 4
001: 5
010: 6
011: 7
100: 8
101: 9
110: 10
111: 11
4
Reserved
3:0
N2_LS [19:16] N2_LS [19:16].
Sets value for N2 low-speed divider, which drives phase detector.
00000000000000000001 = 2
00000000000000000011 = 4
00000000000000000101 = 6
...
20
11111111111111111111 = 2
20
Valid divider values = [2, 4, 6, ..., 2 ]
Rev. 1.0
33
Si5375
Register 41.
Bit
D7
D6
D5
D4
N2_LS [15:8]
R/W
D3
D2
D1
D0
Name
Type
Reset value = 0000 0000
Bit
Name
N2_LS [15:8] N2_LS [15:8].
Function
7:0
Sets value for N2 low-speed divider, which drives phase detector.
00000000000000000001 = 2
00000000000000000011 = 4
00000000000000000101 = 6
...
20
11111111111111111111 = 2
20
Valid divider values = [2, 4, 6, ..., 2 ]
Register 42.
Bit
D7
D6
D5
D4
N2_LS [7:0]
R/W
D3
D2
D1
D0
Name
Type
Reset value = 1111 1001
Bit
Name
N2_LS [7:0] N2_LS [7:0].
Function
7:0
Sets value for N2 low-speed divider, which drives phase detector.
00000000000000000001 = 2
00000000000000000011 = 4
00000000000000000101 = 6
...
20
11111111111111111111 = 2
20
Valid divider values = [2, 4, 6, ..., 2 ]
34
Rev. 1.0
Si5375
Register 43.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
N31 [18:16]
R/W
R
R
R
R
R
Reset value = 0000 0000
Bit
7:3
2:0
Name
Function
Reserved
N31 [18:16] N31 [18:16].
Sets value for input divider for CKINn_q.
0000000000000000000 = 1
0000000000000000001 = 2
0000000000000000010 = 3
...
19
1111111111111111111 = 2
19
Valid divider values = [1, 2, 3, ..., 2 ]
Register 44.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
N31[15:8]
R/W
Reset value = 0000 0000
Bit
Name
Function
7:0
N31[15:8]
N31[15:8].
Sets value for input divider for CKIN1.
0000000000000000000 = 1
0000000000000000001 = 2
0000000000000000010 = 3
...
19
1111111111111111111 = 2
19
Valid divider values = [1, 2, 3, ..., 2 ]
Rev. 1.0
35
Si5375
Register 45.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
N31[7:0]
R/W
Reset value = 0000 1001
Bit
Name
Function
7:0
N31[7:0]
N31[7:0].
Sets value for input divider for CKIN1.
0000000000000000000 = 1
0000000000000000001 = 2
0000000000000000010 = 3
...
19
1111111111111111111 = 2
19
Valid divider values = [1, 2, 3, ..., 2 ]
Register 46.
Bit
D7
D6
D5
D4
D3
D2
D1
N32[18:16]
R/W
D0
Name
Type
R
R
R
R
R
Reset value = 0000 0000
Bit
7:3
2:0
Name
Function
Reserved
N32[18:16] N32[18:16].
Sets value for input divider for OSC clock input operation.
0000000000000000000 = 1
0000000000000000001 = 2
0000000000000000010 = 3
...
19
1111111111111111111 = 2
19
Valid divider values=[1, 2, 3, ..., 2 ]
36
Rev. 1.0
Si5375
Register 47.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
N32[15:8]
R/W
Reset value = 0000 0000
Bit
Name
Function
7:0
N32[15:8]
N32[15:8].
Sets value for input divider for OSC clock input operation.
0000000000000000000 = 1
0000000000000000001 = 2
0000000000000000010 = 3
...
19
1111111111111111111 = 2
19
Valid divider values = [1, 2, 3, ..., 2 ]
Register 48.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
N32[7:0]
R/W
Reset value = 0000 1001
Bit
Name
Function
7:0
N32[7:0]
N32[7:0].
Sets value for input divider for OSC clock input operation.
0000000000000000000 = 1
0000000000000000001 = 2
0000000000000000010 = 3
...
19
1111111111111111111 = 2
19
Valid divider values = [1, 2, 3, ..., 2 ]
Rev. 1.0
37
Si5375
Register 128.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
OSC_ACTV_REG CK_ACTV_REG
R
R
R
R
R
R
R
R
Reset value = 0010 0000
Bit
7:2
1
Name
Function
Reserved
OSC_ACTV_REG OSC_ACTV_REG.
Indicates if OSC is currently the active clock for PLL input.
CK_ACTV_REG CK_ACTV_REG.
Indicates if CKIN_q is currently the active clock for the PLL input.
0
0: CKIN_q is not the active input clock. Either it is not selected or LOS_INT is 1.
1: CKIN_q is the active input clock.
Register 129.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
LOS_INT LOSX_INT
R
R
R
R
R
R
R
R
Reset value = 0000 0110
Bit
7:2
1
Name
Function
Reserved
LOS_INT
LOS_INT.
Indicates the LOS status on CKINn_q.
0: Normal operation.
1: Internal loss-of-signal alarm on CKINn_q input.
0
LOSX_INT LOSX_INT.
Indicates the LOS status of the external reference on the OSC_P/N pins.
0: Normal operation.
1: Internal loss-of-signal alarm on OSC_P/N reference clock input.
38
Rev. 1.0
Si5375
Register 130.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
LOL_INT
R
Name CLATPROGRESS
Type
Reset value = 0000 0001
R
R
R
R
R
R
R
Bit
Name
CLATPROGRESS CLAT Progress.
Function
7
Indicates if the last change in the CLAT register has been processed.
0: Coarse skew adjustment not in progress.
1: Coarse skew adjustment in progress.
6:1
0
Reserved
LOL_INT
PLL Loss of Lock Status.
0: PLL locked.
1: PLL unlocked.
Register 131.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
LOS_FLG LOSX_FLG
R/W R/W
R
R
R
R
R
R
Reset value = 0001 1111
Bit
7:2
1
Name
Function
Reserved
LOS_FLG
CKINn_q Loss-of-Signal Flag.
0: Normal operation
1: Held version of LOS_INT. Generates active output interrupt if output interrupt pin is
enabled (INT_PIN = 1) and if not masked by LOS_MSK bit. Flag cleared by writing 0 to
this bit.
0
LOSX_FLG External Reference (Signal on Pins OSC_P/N) Loss-of-Signal Flag.
0: Normal operation
1: Held version of LOSX_INT. Generates active output interrupt if output interrupt pin is
enabled (INT_PIN = 1) and if not masked by LOSX_MSK bit. Flag cleared by writing 0 to
this bit.
Rev. 1.0
39
Si5375
Register 132.
Bit
D7
D6
D5
D4
D3
D2
D1
LOL_FLG
R/W
D0
Name
Type
R
R
R
R
R
R
R
Reset value = 0000 0010
Bit
7:2, 0
1
Name
Function
Reserved
LOL_FLG
PLL Loss of Lock Flag.
0: PLL locked
1: Held version of LOL_INT. Generates active output interrupt if output interrupt pin is
enabled (INT_PIN = 1) and if not masked by LOL_MSK bit. Flag cleared by writing 0 to
this bit.
Register 134.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
PARTNUM_RO [11:4]
R
Type
Reset value = 0000 0100
Bit
Name
Function
7:0
PARTNUM_RO [11:0] Device ID (1 of 2).
0000 0100 1011: Si5375
40
Rev. 1.0
Si5375
Register 135.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
PARTNUM_RO [3:0]
R
REVID_RO [3:0]
R
Type
Reset value = 1011 0010
Bit
Name
PARTNUM_RO [11:0] Device ID (2 of 2).
Function
7:4
0000 0100 1011: Si5375
3:0
REVID_RO [3:0]
Device Revision Level.
0010: Revision C
Others: Reserved.
Register 136.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name RST_REG
ICAL
R/W
Type
R/W
R
R
R
R
R
R
Reset value = 0000 0000
Bit
Name
Function
7
RST_REG
Internal Reset (Same as Pin Reset).
Note: The I2C port may not be accessed until 10 ms after RST_REG is asserted.
0: Normal operation.
1: Reset of all internal logic. Outputs disabled or tristated during reset.
6
ICAL
Start an Internal Calibration Sequence.
For proper operation, the device must go through an internal calibration sequence.
ICAL is a self-clearing bit. Writing a one to this location initiates an ICAL. The
calibration is complete once the LOL alarm goes low. A valid stable clock (within
100 ppm) must be present to begin ICAL.
Note: Any divider, CLKINn_RATE or BWSEL_REG changes require an ICAL to take
effect.
0: Normal operation.
1: Writing a "1" initiates internal self-calibration. Upon completion of internal self-cali-
bration, LOL will go low.
5:0
Reserved
Rev. 1.0
41
Si5375
Register 138.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
LOS_EN [1:1]
R/W
Name
Type
R
R
R
R
R
R
R
Reset value = 0000 1111
Bit
7:1
0
Name
Function
Reserved
LOS_EN [1:0] Enable CKINn_q LOS Monitoring on the Specified Input (1 of 2).
Note: LOS_EN is split between two registers.
00: Disable LOS monitoring.
01: Reserved.
10: Enable LOSA monitoring.
11: Enable LOS monitoring.
LOSA is a slower and less sensitive version of LOS.
Register 139.
Bit
D7
D6
D5
D4
LOS_EN [0:0]
R/W
D3
D2
D1
D0
Name
Type
R
R
R
R
R
R
R
Reset value = 1111 1111
Bit
7:5
4
Name
Function
Reserved
LOS_EN [1:0] Enable CKIN_q LOS Monitoring on the Specified Input (2 of 2).
Note: LOS_EN is split between two registers.
00: Disable LOS monitoring.
01: Reserved.
10: Enable LOSA monitoring.
11: Enable LOS monitoring.
LOSA is a slower and less sensitive version of LOS.
3:0
Reserved
42
Rev. 1.0
Si5375
7.1. ICAL
The device registers must be configured for the device operation. After device configuration, a calibration
procedure must be performed once a stable clock is applied to the selected CKINn input. The calibration process is
triggered by writing a “1” to bit D6 in register 136. See the Family Reference Manual for details. In addition, after a
successful calibration operation, changing any of the registers indicated in Table 8 requires that a calibration be
performed again by the same procedure (writing a “1” to bit D6 in register 136).
Table 8. ICAL-Sensitive Registers
Address
Register
BYPASS_REG
CKOUT_ALWAYS_ON
BSWEL_REG
RATE_REG
ICMOS
0
0
2
2
5
10
11
19
19
25
31
40
40
43
46
DSBL_REG
PD_CK
LOCKT
VALTIME
N1_HS
NC1_LS
N2_HS
N2_LS
N31
N32
Rev. 1.0
43
Si5375
8. Pin Descriptions: Si5375
9
8
7
6
5
4
3
2
1
CKOUT1P_B
GND
VDD_B
CS_CA_B
NC
NC
GND
CKOUT1N_A
A
B
C
D
E
F
CKOUT1N_B
GND
GND
CKIN1P_B
CKIN1N_B
VDD_A
LOL_B
IRQ_A
GND
NC
GND
CKOUT1P_A
VDD_A
GND
NC
NC
VDD_A
CKIN1P_A
NC
NC
IRQ_B
LOL_C
VDD_B
VDD_C
NC
RSTL_B
OSC_N
RSTL_C
VDD_B
OSC_P
VDD_C
RSTL_A
GND
NC
CKIN1N_A
LOL_A
CS_CA_A
VDD_D
VDD_D
NC
CS_CA_C
CKIN1N_C
RSTL_D
IRQ_D
NC
G
VDD_C
GND
CKIN1P_C
NC
SDA
IRQ_C
NC
SCL
NC
NC
GND
GND
GND
GND
CKOUT1N_D
CKOUT1P_D
GND
GND
GND
LOL_D
CKIN1N_D
CS_CA_D
CKIN1P_D
VDD_D
H
J
CKOUT1P_C CKOUT1N_C
NC
Bottom View
Figure 10. Si5375 Pin Configuration (Bottom View)
44
Rev. 1.0
Si5375
Table 9. Si5375 Pin Descriptions
Pin #
Pin Name
I/O
Signal
Level
Description
D4
D6
F6
F4
RSTL_A
RSTL_B
RSTL_C
RSTL_D
I
LVCMOS
External Reset.
Active low input that performs external hardware reset of all four
DSPLLs. Resets all internal logic to a known state and forces
the device registers to their default value. Clock outputs are tri-
stated during reset. The part must be programmed after a reset
or power-on to get a clock output. This pin has a weak pull-up.
B4
D8
H6
F2
IRQ_A
IRQ_B
IRQ_C
IRQ_D
O
LVCMOS
DSPLLq Interrupt Indicator.
This pin functions as a device interrupt output. The interrupt
output, IRQ_PINn must be set to 1. The pin functions as a
maskable interrupt output with active polarity controlled by the
IRQ_POLn register bit.
0 = CKINn present
1 = LOS on CKINn
The active polarity is controlled by CK_BAD_POL. If no function
is selected, the pin tri-states.
C1, C4, B5
A7, D5, D7
E7, F5, G9
E3, F3, J3
VDD_A
VDD_B
VDD_C
VDD_D
V
Supply
Supply.
DD
The device operates from a 1.8 or 2.5 V supply. A 0.1 µF bypass
capacitive is required for every VDD_q pin. Bypass capacitors
should be associated with the following VDD_q pins:
0.1 µF per V pin.
DD
Four 1.0 µF should also be placed as close to each V domain
DD
as is practical. See recommended layout.
E5
E6
OSC_P
OSC_N
I
Analog
External OSC.
An external low jitter reference clock should be connected to
these pins. See the any-frequency precision clocks family
reference manual for oscillator selection details.
Note: Internal register names are indicated by italics, e.g., IRQ_PIN. See Si5375 Register Map.
Rev. 1.0
45
Si5375
Table 9. Si5375 Pin Descriptions (Continued)
Pin #
Pin Name
I/O
Signal
Level
Description
B2
A3
B3
E4
C8
A8
B8
C9
H7
J7
H8
H9
G1
H2
J2
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Supply
Ground for each DSPLLq.
Must be connected to system ground. Minimize the ground path
impedance for optimal performance of this device. See
recommended layout.
G2
I
Multi
Clock Input for DSPLLq.
C2
D2
B7
B6
G8
F8
H3
H4
E2
C5
E8
H5
CKIN1P_A
CKIN1N_A
CKIN1P_B
CKIN1N_B
CKIN1P_C
CKIN1N_C
CKIN1P_D
CKIN1N_D
LOL_A
Differential input clock. This input can also be driven with a
single-ended signal. Input frequency range is 2 kHz to 710 MHz.
O
LVCMOS DSPLLq Loss of Lock Indicator.
These pins function as the active high PLL loss of lock indicator
LOL_B
if the LOL_PIN register bit is set to 1.
0 = PLL locked.
LOL_C
LOL_D
1 = PLL unlocked.
If LOL_PINn = 0, this pin will tri-state. Active polarity is
controlled by the LOL_POLn bit. The PLL lock status will always
be reflected in the LOL_INT read only register bit.
I
LVCMOS
DSPLLq Input Clock Select/Active Clock Indicator.
D1
A6
F9
J4
CS_CA_A
CS_CA_B
CS_CA_C
CS_CA_D
Input: This pin functions as the input clock selector between
CKIN and OSC.
0 = Select CKIN1.
1 = Select OSC (Internal).
Must be high or low. Do not float. If a DSPLL is not used, its
CS_CA_q pin should be tied high.
Note: Internal register names are indicated by italics, e.g., IRQ_PIN. See Si5375 Register Map.
46
Rev. 1.0
Si5375
Table 9. Si5375 Pin Descriptions (Continued)
Pin #
Pin Name
I/O
Signal
Level
Description
2
G5
SCL
I
LVCMOS
I C Serial Clock.
This pin functions as the serial clock input.
This pin has a weak pull-down.
2
G6
SDA
I/O LVCMOS
I C Serial Data.
2
I C pin functions as the bi-directional serial data port.
O
Multi
Output Clock for DSPLLq.
B1
A2
CKOUT1P_A
CKOUT1N_A
CKOUT1P_B
CKOUT1N_B
CKOUT1P_C
CKOUT1N_C
CKOUT1P_D
CKOUT1N_D
NC
Differential output clock with a frequency range of 0.002 to
808 MHz. Output signal format is selected by SFOUT_REG
register bits. Output is differential for LVPECL, LVDS, and CML
compatible modes. For CMOS format, both output pins drive in
phase single-ended clock outputs at the same frequency.
A9
B9
J9
J8
J1
H1
N/A
N/A
No Connection.
A4, A5
C3, C6
C7, D3
D9, E1
E9, F1
F7, G3
G4, G7
J5, J6
Leave floating. Make no external connections to this pin for
normal operation.
Note: Internal register names are indicated by italics, e.g., IRQ_PIN. See Si5375 Register Map.
Rev. 1.0
47
Si5375
9. Ordering Guide
Ordering Part
Number
Input/Output
PLL
Package
ROHS6
Pb-Free
Temperature
Range
Clocks
Bandwidth
Range
Si5375B-A-GL
Si5375B-A-BL
Si5375-EVB
4/4
60 Hz to 8.4 kHz
10x10 mm
80-PBGA
Yes
No
–40 to 85 °C
–40 to 85 °C
4/4
60 Hz to 8.4 kHz
10x10 mm
80-PBGA
Device Development Kit
48
Rev. 1.0
Si5375
10. Package Outline
Figure 11 illustrates the package details for the Si5375. Table 10 lists the values for the dimensions shown in the
illustration.
Figure 11. 80-Pin Plastic Ball Grid Array (PBGA)
Table 10. Package Dimensions
Symbol
Min
Nom
Max
Min
Nom
Max
A
1.22
1.39
1.56
E1
e
8.00 BSC
A1
0.40
0.50
0.60
1.00 BSC
A2
A3
0.32
0.46
0.50
0.36
0.53
0.40
0.60
0.70
aaa
bbb
ccc
ddd
eee
0.10
0.10
0.12
0.15
0.08
b
0.60
D
10.00 BSC
10.00 BSC
8.00 BSC
E
D1
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to JEDEC outline MO-192.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Components.
Rev. 1.0
49
Si5375
11. Recommended PCB Layout
Figure 12. PBGA Card Layout
Table 11. Layout Dimensions
Symbol
X
MIN
NOM
0.45
8.00
8.00
1.00
1.00
MAX
0.40
0.50
C1
C2
E1
E2
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between
the solder mask and the metal pad is to be 60 µm minimum, all the way around
the pad.
Stencil Design
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls
should be used to assure good solder paste release.
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1.
Card Assembly
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.
50
Rev. 1.0
Si5375
12. Top Markings
12.1. Si5375 Top Marking (PBGA, Lead-Free)
Figure 13. Si5375 Top Marking
12.2. Top Marking Explanation (PBGA, Lead-Free)
Mark Method:
Logo Size:
Laser
6.1 x 2.2 mm
Center-Justified
Font Size:
0.80 mm
Right-Justified
Line 1 Marking:
Line 2 Marking:
Device Part Number
Si5375B-A-GL
YY = Year
WW = Work Week
Assigned by the Assembly House.
Corresponds to the year and work
week of the mold date.
TTTTTT = Mfg Code
Pin 1 Identifier
Manufacturing Code from the
Assembly Purchase Order form.
Line 3 Marking:
Circle = 0.75 mm Diameter
Lower-Left Justified
“e1” Lead-free Finish Symbol
(Pb-free BGA Balls)
Circle = 1.4 mm Diameter
Center-Justified
Country of Origin
TW
Rev. 1.0
51
Si5375
12.3. Si5375 Top Marking (PBGA, Lead-Finish)
12.4. Top Marking Explanation (PBGA, Lead-Finish)
Mark Method:
Logo Size:
Laser
6.1 x 2.2 mm
Center-Justified
Font Size:
0.80 mm
Right-Justified
Line 1 Marking:
Line 2 Marking:
Device Part Number
Si5375B-A-BL, Pb finish
YY = Year
WW = Work Week
Assigned by the Assembly House.
Corresponds to the year and work
week of the mold date.
TTTTTT = Mfg Code
Pin 1 Identifier
Manufacturing Code from the
Assembly Purchase Order form.
Line 3 Marking:
Circle = 0.75 mm Diameter
Lower-Left Justified
“e0” Lead Finish Symbol
(SnPb BGA Balls)
Circle = 1.4 mm Diameter
Center-Justified
Country of Origin
TW
52
Rev. 1.0
Si5375
DOCUMENT CHANGE LIST
Revision 0.16 to Revision 0.2
Improved the Functional Block Diagram.
Added specifications for different output
formats.
Added 1.8 V operation.
Added 40 MHz reference oscillator.
Corrected Figure 11 title.
Added comments to BYPASS and SFOUT
registers.
Revision 0.2 to Revision 0.3
Expanded and improved the specification
tables.
Added comments on when a heat sink is
required.
Revision 0.3 to Revision 0.4
Added Silicon Labs logo to device top mark
Revision 0.4 to Revision 0.41
Corrected Register Map numbering.
Removed Register 185.
Revision 0.41 to Revision 0.45
Added comments indicating that a crystal may
not be used in place of an external oscillator.
Updated specification Tables 3, 4, and 5.
Added maximum jitter specifications to Table 5.
Added Thermal Characteristics table on
page 12.
Added Figure 3, “Typical Application
Schematic,” on page 13.
Added "5. Si5375 Application Examples and
Suggestions" on page 16.
Updated "7. Register Descriptions" on page 21.
Added a part number for the non-RoHS6 device
to "9. Ordering Guide" on page 48.
Added recommendations on the four reset pins
in "5.4. RSTL_x Pins" on page 16.
Added Lead-Finish top marking.
Revision 0.45 to Revision 1.0
Updated " Features" on page 1.
Minor corrections to Tables 2, 3, and 5.
Rev. 1.0
53
Si5375
CONTACT INFORMATION
Silicon Laboratories Inc.
400 West Cesar Chavez
Austin, TX 78701
Tel: 1+(512) 416-8500
Fax: 1+(512) 416-9669
Toll Free: 1+(877) 444-3032
Please visit the Silicon Labs Technical Support web page:
https://www.silabs.com/support/pages/contacttechnicalsupport.aspx
and register to submit a technical support request.
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice.
Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from
the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features
or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, rep-
resentation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation conse-
quential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to
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Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders.
54
Rev. 1.0
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