CXG1077TN [SONY]
SP4T Antenna Switch for GSM Dual band; SP4T天线开关，用于GSM双频
| 型号： | CXG1077TN |
| 厂家： | 
SONY CORPORATION |
| 描述： | SP4T Antenna Switch for GSM Dual band |
| 文件： | 总4页 (文件大小：53K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CXG1077TN
High Power SPDT Switch
Description
10 pin (Plastic)
The CXG1077TN is a SPDT (Single Pole Dual
Throw) antenna switch MMIC used in personal
communication handsets such as JCDMA.
This IC is designed using the Sony’s GaAs J-FET
process.
Features
• Low control voltage Vctl (H) =2.8 V
• Low control current Ictl=30 µA (Typ.) @2.8 V
Absolute Maximum Ratings (Ta=25 °C)
• Low insertion loss
0.35 dB (Typ.) @900 MHz
• Control voltage
Vctl
7
V
• High power handling P1dB: 33 dBm (Typ.) @900 MHz
• High intercept point Ip3=60 dBm (Typ.)
• Operating temperature Topr
–35 to +85
°C
• Storage temperature
Tstg –65 to +150 °C
• Small package
TSSOP-10pin
Operating Condition
Application
Control voltage
CTL (H)
CTL (L)
2.5 to 5
0 to 0.5
V
V
SPDT switch for digital cellular telephones such as
JCDMA handsets.
Structure
GaAs J-FET MMIC
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
—1—
E99408-TE
CXG1077TN
Block Diagram
VCTLA
High
VCTLB
Low
RF3
RF2
RF1-RF2 ON
RF1-RF3 OFF
RF1-RF2 OFF
RF1-RF3 ON
RF1
Low
High
Electrical Characteristics
(Ta=25 °C)
Symbol
IL
Condition
Min.
Typ.
0.35
0.5
22
Max.
Unit
dB
dB
dB
dB
1
2
0.6
0.8
Insertion loss
1
20
15
Isolation
ISO
VSWR
2fo, 3fo
IIP3
2
17
VSWR
1, 2
1
1.2
1.4
–30
–30
54
dBm
dBm
dBm
dBm
dBm
ns
Output harmonics
Input IP3
2
3
60
33
1
28
28
Input power for 1 dB compression
P1dB
2
33
Switching speed TSW
Control current
TSW
100
30
300
50
I CTL
µA
1 Pin=25 dBm, 900 MHz, CW, 0/2.8 V Control
2 Pin=25 dBm, 1.8 GHz, CW, 0/2.8 V Control
3 Pin=21 dBm (900 MHz) +21 dBm (901 MHz), 0/2.8 V Control
—2—
CXG1077TN
Package Outline/Pin Configuration
Unit : mm
RF2
CTLA
GND
GND
RF1
GND
GND
GND
RF3
10
CTLB
1
10pin TSSOP (PLASTIC)
Recommended Circuit
Rctl 1kΩ
C1 100pF
CTLA
5
4
3
2
1
6
7
RF2
C2 100pF
CXG1077TN
8
RF1
C2 100pF
51kΩ
9
Rctl 1kΩ
CTLB
10
RF3
C2 100pF
C1 100pF
When using the CXG1077TN, the following external components should be used:
C1: This is used for signal line filtering. 100 pF is recommended.
C2: This is used for RF De-coupling and must be used in all applications. 100 pF is recommended.
Rctl: This resistor is used to give improved ESD performance.
—3—
CXG1077TN
Package Outline Unit : mm
10PIN TSSOP(PLASTIC)
1.2MAX
2.8 ± 0.1
0.1
10
6
+ 0.15
0.1 – 0.05
5
1
0.5
0.25
0° to 10°
+ 0.08
0.22 – 0.07
0.1
M
A
(0.2)
+ 0.08
0.22 – 0.07
A
DETAIL
NOTE: Dimension “ ” does not include mold protrusion.
PACKAGE STRUCTURE
EPOXY RESIN
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
SOLDER PLATING
SONY CODE
EIAJ CODE
TSSOP-10P-L01
COPPER ALLOY
0.02g
JEDEC CODE
PACKAGE MASS
—4—
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