CXL5504P [SONY]

CMOS-CCD 1H Delay Line for NTSC; 对于NTSC CMOS , CCD 1H延时线
CXL5504P
型号: CXL5504P
厂家: SONY CORPORATION    SONY CORPORATION
描述:

CMOS-CCD 1H Delay Line for NTSC
对于NTSC CMOS , CCD 1H延时线

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CXL5504M/P  
CMOS-CCD 1H Delay Line for NTSC  
For the availability of this product, please contact the sales office.  
Description  
CXL5504M  
8 pin SOP (Plastic)  
CXL5504P  
8 pin DIP (Plastic)  
The CXL5504M/P are CMOS-CCD delay line ICs  
that provide 1H delay time for NTSC signals including  
the external low-pass filter.  
Features  
Single power supply (5V)  
Low power consumption 90mW (Typ.)  
Built-in peripheral circuits  
Clamp level of I/O signal can be selected  
Functions  
905-bit CCD register  
Clock driver  
Autobias circuit  
Input clamp circuit  
Sample and hold circuit  
Absolute Maximum Ratings (Ta = 25°C)  
Supply voltage  
VDD  
6
V
°C  
Operating temperature Topr  
Storage temperature Tstg  
Allowable power dissipation  
PD  
–10 to +60  
–55 to +150 °C  
Structure  
CXL5504M  
CXL5504P  
350  
480  
mW  
mW  
CMOS-CCD  
Recommended Operating Condition (Ta = 25°C)  
Supply voltage 5 ± 5%  
VDD  
V
Recommended Clock Conditions (Ta = 25°C)  
Input clock amplitude VCLK 0.4 to 1.0  
Vp-p  
(0.5Vp-p typ.)  
14.318182 MHz  
Input clock waveform Sine wave  
Clock frequency  
fCLK  
Input Signal Amplitude  
VSIG 500mVp-p (Typ.), 572mVp-p (Max.)  
(at internal clamp condition)  
Blook Diagram and Pin Configration (Top View)  
8
7
6
5
Autobias circuit  
Bias circuit  
Timing circuit  
Clock driver  
CCD  
(905bit)  
Bias circuit (A)  
Bias circuit (B)  
Output circuit  
(S/H 1bit)  
Clamp circuit  
1
I/O control  
2
3
4
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by  
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the  
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.  
– 1 –  
E89931C79-PS  
CXL5504M/P  
Pin Description  
Pin No.  
Symbol  
I/O  
I
Description  
Signal input  
Impedance  
IN  
> 10kat no clamp  
1
2
3
4
5
6
7
8
I/O2  
OUT  
VSS  
CLK  
I/O1  
VDD  
AB  
I
I/O control 2  
Signal output  
GND  
O
I
40 to 500Ω  
> 100kΩ  
Clock input  
I
I/O control 1  
Power supply (5V)  
Autobias DC output  
O
600 to 200kΩ  
Description of Function  
In the CXL5504M/P, the condition of I/O control pins (Pins 2 and 6) control the input signal clamp condition and  
the mode of the output signal with relation to its input signal.  
There are 2 modes for the I/O signal.  
Input waveform  
Output waveform  
(1) PN mode  
(Low level clamp/reverse phase output mode)  
Clamp  
level  
(2) NP mode  
(High level clamp/positive phase output mode)  
Clamp  
level  
I/O Control Pin  
(1) I/O1 (Pin 6)  
Control of the I/O signal condition  
DC open ..... Input signal is low level clamped and the output signal is inverted in relation to the input  
signal. As the pin is biased to 2.5V by means of the resistance inside the IC, a decoupling  
capacitor of around 1000pF is necessary.  
GND ............. Input signal is high level clamped and the output signal turns into an inverted signal.  
(2) I/O2 (Pin 2)  
Control of the input signal clamp condition  
0V ................. Internal clamp condition  
5V ................. Non internal clamp condition  
Center biased to approx. 2.1V by means of the IC internal resistance (several 10k).  
Usage in this mode is limited to APL 50% signals and in this mode, the maximum input  
signal amplitude is 200mVp-p.  
– 2 –  
CXL5504M/P  
Electrical Characteristics  
(Ta = 25°C, VDD = 5V, fCLK = 14.318182MHz, VCLK = 500mVp-p, Sine wave)  
See "Electrical Characteristics Test Circuit"  
Bias condition  
SW condition  
Vbias1 (V)  
(Note 1)  
Item  
Symbol  
Test condition  
Min. Typ. Max. Unit Note  
1 2  
3 4 5 6 7  
b b  
IDDPN  
IDDNP  
GLPN  
GLNP  
fPN  
Supply  
current  
— c b  
a —  
2
3
4
5
5
6
7
10  
–2  
–2  
0
18  
0
28  
2
mA  
dB  
a a  
b b  
a a  
b b  
a a  
b b  
a a  
b b  
a a  
b b  
a a  
b b  
a a  
Low  
frequency  
gain  
200kHz,  
500mVp-p,  
sine wave  
2.1  
a a b  
a b  
b b  
a c  
a c  
b a  
a d  
b
200kHz 3.57MHz,  
150mVp-p,  
sine wave  
Frequency  
response  
–1  
5
0
dB  
a a  
c
fNP  
DGPN  
DGNP  
DPPN  
DPNP  
CPPN  
CPNP  
SNPN  
a
5-staircase wave  
(See Note 5)  
Differential  
gain  
7
%
d
d
b
b
b
a
b
5-staircase wave  
(See Note 5)  
Differential  
phase  
0
5
7
degree  
VINPN + 0.5  
VINNP  
S/H pulse  
coupling  
No signal input  
52  
56  
350 mVp-p  
— c a  
50% white  
video signal  
a
dB  
S/N ratio  
e
b
SNNP (See Note 7)  
b
Notes  
(1) VINPN and VINNP are defined as follows.  
VINPN and VINNP are the input signal clamp levels of PN and NP modes clamping the video signal sync  
tip level.  
CXL5504  
1
Input  
(IN)  
VINPN  
VINNP  
Testing of VINPN and VINNP is executed with a voltmeter under the following SW conditions.  
SW condition  
Test  
point  
Item  
1
2
c
c
3
b
b
4
b
a
5
b
a
6
a
a
7
VINPN  
VINNP  
V1  
– 3 –  
CXL5504M/P  
(2) This is the IC supply current value during clock and signal input.  
(3) GLPN, GLNP are output gain of OUT pin when a 500mVp-p, 200kHz sine wave is fed to IN pin.  
(Example of calculation)  
OUT pin output voltage (PN mode) [mVp-p]  
GLPN = 20 log  
[dB]  
500 [mVp-p]  
(4) Indicates the dissipation at 3.57MHz in relation to 200kHz.  
From the output voltage at OUT pin when a 150mVp-p, 200kHz sine wave is fed to IN pin, and from the  
output voltage at OUT pin when a 150mVp-p, 3.57MHz sine wave is fed to same, calculation is made  
according to the following formula. The input part bias is tested at 2.1V.  
(Example of calculation)  
OUT pin otuput voltage (PN mode, 3.57MHz) [mVp-p]  
fPN = 20 log  
[dB]  
OUT pin output voltage (PN mode, 200kHz) [mVp-p]  
(5) The differential gain (DG) and the differential phase (DP), when the 5-staircase wave in the figure below is  
input are tested at the vector scope.  
143mV  
357mV  
500mV  
143mV  
1H 63.56µs  
Input waveform (Input waveform of NP mode is the inverted waveform in the figure above)  
(6) The internal clock component to the output signal during no-signal input and the leakage of that high  
harmonic component are tested. The input part bias is tested at VINPN + 0.5V and VINNP for PN and NP  
modes respectively.  
Test value  
(mVp-p)  
– 4 –  
CXL5504M/P  
(7) S/N ratio during a 50% white video signal input shown in figure below is tested at a video noise meter, in  
BPF 100kHz to 4MHz, Sub Carrier Trap mode.  
178mV  
321mV  
143mV  
1H 63.56µs  
Input waveform (Input waveform of NP mode is the inverted waveform in the figure above)  
Clock  
fsc (14.318182MHz) sine wave  
0.4 to 1.0Vp-p  
(0.5Vp-p typ.)  
– 5 –  
CXL5504M/P  
– 6 –  
CXL5504M/P  
– 7 –  
CXL5504M/P  
Example of Representative Characteristics  
Supply current vs. Ambient temprature  
Low frequency gain vs. Ambient temprature  
1
30  
0
20  
–1  
–2  
–3  
10  
–20  
0
20  
40  
60  
80  
–20  
0
20  
40  
60  
80  
Ambient temprature [°C]  
Ambient temprature [°C]  
Frequency response vs. Ambient temprature  
Differential gain vs. Ambient temprature  
0
10  
8
–1  
6
4
–2  
–3  
2
0
–20  
0
20  
40  
60  
80  
–20  
0
20  
40  
60  
80  
Ambient temprature [°C]  
Ambient temprature [°C]  
Supply current vs. Supply voltage  
Low frequency gain vs. Supply voltage  
30  
20  
10  
1
0
–1  
–2  
–3  
4.75  
5
5.25  
4.75  
5
5.25  
Supply voltage [V]  
Supply voltage [V]  
– 8 –  
CXL5504M/P  
Frequency response vs. Supply voltage  
Differential gain vs. Supply voltage  
0
10  
8
–1  
6
4
–2  
–3  
2
0
4.75  
5
5.25  
4.75  
5
5.25  
Supply voltage [V]  
Supply voltage [V]  
Frequency response  
2
0
–2  
–4  
–6  
10k  
100k  
1M  
10M  
Frequency [Hz]  
– 9 –  
CXL5504M/P  
Package Outline  
Unit: mm  
CXL5504M  
8PIN SOP (PLASTIC)  
+ 0.4  
1.85 – 0.15  
+ 0.4  
6.10.1  
8
5
0.15  
+ 0.2  
0.1– 0.05  
1
4
+ 0.1  
0.2 – 0.05  
0.45 ± 0.1  
1.27  
0.24  
M
PACKAGE STRUCTURE  
EPOXY RESIN  
PACKAGE MATERIAL  
LEAD TREATMENT  
LEAD MATERIAL  
SOLDER PLATING  
SONY CODE  
EIAJ CODE  
SOP-8P-L01  
SOP008-P-0300  
42/COPPER ALLOY  
0.1g  
PACKAGE MASS  
JEDEC CODE  
8PIN SOP (PLASTIC)  
S
6.2 ± 0.3  
0.15  
S
8
5
A
1
4
+ 0.05  
0.15 – 0.02  
0.4 ± 0.1  
1.27  
0.05 MIN  
M
S
0.13  
10° MAX  
DETAIL  
A
PACKAGE STRUCTURE  
EPOXY RESIN  
PACKAGE MATERIAL  
LEAD TREATMENT  
SONY CODE  
EIAJ CODE  
SOP-8P-L121  
PALLADIUM PLATING  
COPPER ALLOY  
0.1g  
SOP008-P-0300  
LEAD MATERIAL  
PACKAGE MASS  
JEDEC CODE  
– 10 –  
CXL5504M/P  
CXL5504P  
8PIN DIP (PLASTIC)  
+ 0.4  
9.4 – 0.1  
5
8
0° to 15°  
4
1
2.54  
0.5 ± 0.1  
1.2 ± 0.15  
PACKAGE STRUCTURE  
PACKAGE MATERIAL  
LEAD TREATMENT  
LEAD MATERIAL  
EPOXY RESIN  
SOLDER PLATING  
SONY CODE  
DIP-8P-01  
EIAJ CODE  
DIP008-P-0300  
COPPER ALLOY  
0.5g  
PACKAGE MASS  
JEDEC CODE  
– 11 –  

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